JP2005509298A - ポリマー界面を有する有機薄膜トランジスタ - Google Patents
ポリマー界面を有する有機薄膜トランジスタ Download PDFInfo
- Publication number
- JP2005509298A JP2005509298A JP2003543117A JP2003543117A JP2005509298A JP 2005509298 A JP2005509298 A JP 2005509298A JP 2003543117 A JP2003543117 A JP 2003543117A JP 2003543117 A JP2003543117 A JP 2003543117A JP 2005509298 A JP2005509298 A JP 2005509298A
- Authority
- JP
- Japan
- Prior art keywords
- polymer layer
- transistor
- polymer
- semiconductor layer
- organic semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
- H10K10/474—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising a multilayered structure
- H10K10/476—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising a multilayered structure comprising at least one organic layer and at least one inorganic layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/30—Coordination compounds
- H10K85/311—Phthalocyanine
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Thin Film Transistor (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/012,654 US6946676B2 (en) | 2001-11-05 | 2001-11-05 | Organic thin film transistor with polymeric interface |
| PCT/US2002/033872 WO2003041185A2 (en) | 2001-11-05 | 2002-10-23 | Organic thin film transistor with polymeric interface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005509298A true JP2005509298A (ja) | 2005-04-07 |
| JP2005509298A5 JP2005509298A5 (enExample) | 2006-01-05 |
Family
ID=21756035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003543117A Pending JP2005509298A (ja) | 2001-11-05 | 2002-10-23 | ポリマー界面を有する有機薄膜トランジスタ |
Country Status (6)
| Country | Link |
|---|---|
| US (3) | US6946676B2 (enExample) |
| EP (1) | EP1442484A2 (enExample) |
| JP (1) | JP2005509298A (enExample) |
| KR (1) | KR20050039731A (enExample) |
| AU (1) | AU2002337959A1 (enExample) |
| WO (1) | WO2003041185A2 (enExample) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006129718A1 (ja) * | 2005-05-31 | 2006-12-07 | Incorporated National University Iwate University | 有機薄膜トランジスタ |
| WO2007099690A1 (ja) * | 2006-02-28 | 2007-09-07 | Pioneer Corporation | 有機トランジスタ及びその製造方法 |
| JP2007251093A (ja) * | 2006-03-20 | 2007-09-27 | Nippon Zeon Co Ltd | ゲート絶縁膜、有機薄膜トランジスタ、該トランジスタの製造方法及び表示装置 |
| WO2008065927A1 (fr) * | 2006-11-27 | 2008-06-05 | Zeon Corporation | Transistor à film fin organique, élément électronique composite organique, procédé de fabrication d'un tel transistor et d'un tel élément, écran d'affichage et mémoire |
| JP2008244022A (ja) * | 2007-03-26 | 2008-10-09 | Kyushu Univ | 有機半導体素子およびその製造方法 |
| JP2009508321A (ja) * | 2005-06-01 | 2009-02-26 | プラスティック ロジック リミテッド | 層選択レーザーアブレーションパターニング |
| JP2009070942A (ja) * | 2007-09-12 | 2009-04-02 | Sony Corp | 有機トランジスタに用いる有機絶縁膜、および有機トランジスタとその製造方法 |
| JP2009200316A (ja) * | 2008-02-22 | 2009-09-03 | Sanyo Electric Co Ltd | 有機半導体素子及びその製造方法 |
| JP2010283332A (ja) * | 2009-05-07 | 2010-12-16 | Seiko Epson Corp | 有機トランジスター、有機トランジスターの製造方法、電気光学装置および電子機器 |
| JP2011517504A (ja) * | 2008-03-20 | 2011-06-09 | ファクルダージ デ シエンシアス イ テクノロジア ダ ユニベルシダデ ノバ デ リスボア | 能動半導体酸化物を用いるメモリを備える自立可能な接合電界効果型トランジスタにおける物理的支持体及び電荷蓄積媒体としての、天然セルロース系繊維、合成セルロース系繊維、又はそれらの組合せの使用及び製造方法 |
| JP2011243986A (ja) * | 2001-12-19 | 2011-12-01 | Merck Patent Gmbh | 有機誘電体を有する有機電界効果トランジスタ |
| JP2013543650A (ja) * | 2010-09-02 | 2013-12-05 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 電気デバイスのための中間層 |
| KR20150119010A (ko) * | 2013-02-08 | 2015-10-23 | 가부시키가이샤 구라레 | 다층 구조체 및 이의 제조 방법 |
Families Citing this family (83)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0024294D0 (en) * | 2000-10-04 | 2000-11-15 | Univ Cambridge Tech | Solid state embossing of polymer devices |
| US6998068B2 (en) * | 2003-08-15 | 2006-02-14 | 3M Innovative Properties Company | Acene-thiophene semiconductors |
| US6946676B2 (en) * | 2001-11-05 | 2005-09-20 | 3M Innovative Properties Company | Organic thin film transistor with polymeric interface |
| JP4136482B2 (ja) * | 2002-06-20 | 2008-08-20 | キヤノン株式会社 | 有機半導体素子、その製造方法および有機半導体装置 |
| DE10228772A1 (de) * | 2002-06-27 | 2004-01-15 | Infineon Technologies Ag | Verringerung des Kontaktwiderstandes in organischen Feldeffekttransistoren mit Palladiumkontakten durch Verwendung von Nitrilen und Isonitrilen |
| JP4635410B2 (ja) * | 2002-07-02 | 2011-02-23 | ソニー株式会社 | 半導体装置及びその製造方法 |
| US6784017B2 (en) * | 2002-08-12 | 2004-08-31 | Precision Dynamics Corporation | Method of creating a high performance organic semiconductor device |
| US7088145B2 (en) * | 2002-12-23 | 2006-08-08 | 3M Innovative Properties Company | AC powered logic circuitry |
| US7061570B2 (en) * | 2003-03-26 | 2006-06-13 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
| US7279777B2 (en) * | 2003-05-08 | 2007-10-09 | 3M Innovative Properties Company | Organic polymers, laminates, and capacitors |
| US7098525B2 (en) * | 2003-05-08 | 2006-08-29 | 3M Innovative Properties Company | Organic polymers, electronic devices, and methods |
| JP4470398B2 (ja) * | 2003-06-23 | 2010-06-02 | Tdk株式会社 | 電界効果トランジスタ |
| KR100995451B1 (ko) * | 2003-07-03 | 2010-11-18 | 삼성전자주식회사 | 다층 구조의 게이트 절연막을 포함하는 유기 박막 트랜지스터 |
| JP4228204B2 (ja) * | 2003-07-07 | 2009-02-25 | セイコーエプソン株式会社 | 有機トランジスタの製造方法 |
| US7109519B2 (en) * | 2003-07-15 | 2006-09-19 | 3M Innovative Properties Company | Bis(2-acenyl)acetylene semiconductors |
| US20070178710A1 (en) * | 2003-08-18 | 2007-08-02 | 3M Innovative Properties Company | Method for sealing thin film transistors |
| WO2005020342A1 (ja) * | 2003-08-22 | 2005-03-03 | Matsushita Electric Industrial Co., Ltd. | 縦型有機fet及びその製造方法 |
| JP2005072528A (ja) * | 2003-08-28 | 2005-03-17 | Shin Etsu Chem Co Ltd | 薄層電界効果トランジスター及びその製造方法 |
| WO2005031813A2 (en) * | 2003-09-24 | 2005-04-07 | E.I. Dupont De Nemours And Company | Method for forming pentacene film |
| JP2005136383A (ja) * | 2003-10-09 | 2005-05-26 | Canon Inc | 有機半導体素子、その製造方法および有機半導体装置 |
| US8450723B2 (en) | 2003-11-04 | 2013-05-28 | Alcatel Lucent | Apparatus having an aromatic dielectric and an aromatic organic semiconductor including an alkyl chain |
| US7767998B2 (en) * | 2003-12-04 | 2010-08-03 | Alcatel-Lucent Usa Inc. | OFETs with active channels formed of densified layers |
| US20050130422A1 (en) * | 2003-12-12 | 2005-06-16 | 3M Innovative Properties Company | Method for patterning films |
| US7078937B2 (en) | 2003-12-17 | 2006-07-18 | 3M Innovative Properties Company | Logic circuitry powered by partially rectified ac waveform |
| JP4661065B2 (ja) * | 2004-03-22 | 2011-03-30 | セイコーエプソン株式会社 | 相補型有機半導体装置 |
| NO321555B1 (no) * | 2004-03-26 | 2006-05-29 | Thin Film Electronics Asa | Organisk elektronisk innretning og fremgangsmate til fremstilling av en slik innretning |
| KR100615216B1 (ko) * | 2004-04-29 | 2006-08-25 | 삼성에스디아이 주식회사 | 유기 억셉터막을 구비한 유기 박막 트랜지스터 |
| DE102004025423B4 (de) * | 2004-05-24 | 2008-03-06 | Qimonda Ag | Dünnfilm-Feldeffekt-Transistor mit Gate-Dielektrikum aus organischem Material und Verfahren zu dessen Herstellung |
| KR101039024B1 (ko) | 2004-06-14 | 2011-06-03 | 삼성전자주식회사 | 유기 반도체를 이용한 박막 트랜지스터 표시판 및 그 제조방법 |
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| KR100637204B1 (ko) * | 2005-01-15 | 2006-10-23 | 삼성에스디아이 주식회사 | 박막 트랜지스터, 그 제조 방법 및 이를 구비한 평판 표시장치 |
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| US7282735B2 (en) * | 2005-03-31 | 2007-10-16 | Xerox Corporation | TFT having a fluorocarbon-containing layer |
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| US20060231829A1 (en) * | 2005-04-13 | 2006-10-19 | Xerox Corporation | TFT gate dielectric with crosslinked polymer |
| US20070075308A1 (en) | 2005-09-30 | 2007-04-05 | Florian Dotz | Active semiconductor devices |
| KR100719566B1 (ko) * | 2005-10-22 | 2007-05-17 | 삼성에스디아이 주식회사 | 유기 박막 트랜지스터, 및 이를 구비한 평판 표시 장치 |
| KR101213871B1 (ko) * | 2005-12-15 | 2012-12-18 | 엘지디스플레이 주식회사 | 박막 트랜지스터 어레이 기판 및 그 제조 방법 |
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| US8138075B1 (en) | 2006-02-06 | 2012-03-20 | Eberlein Dietmar C | Systems and methods for the manufacture of flat panel devices |
| US20070193026A1 (en) * | 2006-02-23 | 2007-08-23 | Chun Christine Dong | Electron attachment assisted formation of electrical conductors |
| JP5062435B2 (ja) * | 2006-02-27 | 2012-10-31 | 株式会社村田製作所 | 電界効果トランジスタ |
| JP4887848B2 (ja) * | 2006-03-15 | 2012-02-29 | セイコーエプソン株式会社 | 回路基板、電気光学装置および電子機器 |
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| US8388790B2 (en) * | 2006-07-21 | 2013-03-05 | Leonhard Kurz Stiftung & Co. Kg | Multilayered body comprising an electroconductive polymer layer and method for the production thereof |
| DE102006033887B4 (de) * | 2006-07-21 | 2015-04-09 | Leonhard Kurz Gmbh & Co. Kg | Verfahren zur Herstellung eines Mehrschichtkörpers mit leitfähiger Polymerschicht |
| US20080224127A1 (en) * | 2006-08-22 | 2008-09-18 | Marks Tobin J | Gate dielectric structures, organic semiconductors, thin film transistors and related methods |
| KR100737383B1 (ko) * | 2006-09-11 | 2007-07-09 | 한국전자통신연구원 | 절연막, 이를 이용한 유기박막 트랜지스터 및 제조방법 |
| KR20080040119A (ko) * | 2006-11-02 | 2008-05-08 | 삼성전자주식회사 | 디클로로포스포릴기를 함유하는 자기조립단분자막 형성화합물을 이용한 유기박막 트랜지스터의 제조방법 |
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| JP5320746B2 (ja) * | 2007-03-28 | 2013-10-23 | 凸版印刷株式会社 | 薄膜トランジスタ |
| JP2008244362A (ja) * | 2007-03-28 | 2008-10-09 | Seiko Epson Corp | 半導体装置の製造方法、半導体装置、半導体回路、電気光学装置および電子機器 |
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| CN102119164A (zh) * | 2008-06-19 | 2011-07-06 | 3M创新有限公司 | 可溶液处理的有机半导体 |
| KR101004734B1 (ko) * | 2008-07-29 | 2011-01-04 | 한국전자통신연구원 | 표면 에너지 제어를 이용한 유기 박막 트랜지스터 제조방법 |
| US7863694B2 (en) * | 2008-10-14 | 2011-01-04 | Xerox Corporation | Organic thin film transistors |
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| US8779415B2 (en) | 2012-11-08 | 2014-07-15 | Eastman Kodak Company | Devices containing organic polymeric multi-metallic composites |
| US9721697B2 (en) | 2012-11-08 | 2017-08-01 | Eastman Kodak Company | Organic polymeric bi-metallic composites |
| CN104968495B (zh) * | 2013-02-08 | 2018-04-10 | 株式会社可乐丽 | 电子装置 |
| WO2014206916A1 (en) * | 2013-06-27 | 2014-12-31 | Basf Se | Metathesis polymers as dielectrics |
| CN106688050B (zh) | 2014-06-11 | 2018-09-18 | 伊斯曼柯达公司 | 具有带含硫代硫酸盐聚合物的电介质层的器件 |
| KR102450399B1 (ko) * | 2015-10-06 | 2022-09-30 | 삼성전자주식회사 | 박막 트랜지스터, 그 제조 방법, 그리고 상기 박막 트랜지스터를 포함하는 전자 장치 |
| US11857997B2 (en) * | 2020-06-18 | 2024-01-02 | International Business Machines Corporation | Metal surface protection |
Citations (9)
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| JP2013118390A (ja) * | 2005-06-01 | 2013-06-13 | Plastic Logic Ltd | 層選択レーザーアブレーションパターニング |
| WO2007099690A1 (ja) * | 2006-02-28 | 2007-09-07 | Pioneer Corporation | 有機トランジスタ及びその製造方法 |
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| WO2008065927A1 (fr) * | 2006-11-27 | 2008-06-05 | Zeon Corporation | Transistor à film fin organique, élément électronique composite organique, procédé de fabrication d'un tel transistor et d'un tel élément, écran d'affichage et mémoire |
| JP2008244022A (ja) * | 2007-03-26 | 2008-10-09 | Kyushu Univ | 有機半導体素子およびその製造方法 |
| JP2009070942A (ja) * | 2007-09-12 | 2009-04-02 | Sony Corp | 有機トランジスタに用いる有機絶縁膜、および有機トランジスタとその製造方法 |
| JP2009200316A (ja) * | 2008-02-22 | 2009-09-03 | Sanyo Electric Co Ltd | 有機半導体素子及びその製造方法 |
| JP2011517504A (ja) * | 2008-03-20 | 2011-06-09 | ファクルダージ デ シエンシアス イ テクノロジア ダ ユニベルシダデ ノバ デ リスボア | 能動半導体酸化物を用いるメモリを備える自立可能な接合電界効果型トランジスタにおける物理的支持体及び電荷蓄積媒体としての、天然セルロース系繊維、合成セルロース系繊維、又はそれらの組合せの使用及び製造方法 |
| JP2010283332A (ja) * | 2009-05-07 | 2010-12-16 | Seiko Epson Corp | 有機トランジスター、有機トランジスターの製造方法、電気光学装置および電子機器 |
| JP2013543650A (ja) * | 2010-09-02 | 2013-12-05 | メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフツング | 電気デバイスのための中間層 |
| US9583713B2 (en) | 2010-09-02 | 2017-02-28 | Merck Patent Gmbh | Interlayer for electronic devices |
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| KR20150119010A (ko) * | 2013-02-08 | 2015-10-23 | 가부시키가이샤 구라레 | 다층 구조체 및 이의 제조 방법 |
| JPWO2014122942A1 (ja) * | 2013-02-08 | 2017-01-26 | 株式会社クラレ | 多層構造体およびその製造方法 |
| KR102303879B1 (ko) * | 2013-02-08 | 2021-09-24 | 주식회사 쿠라레 | 다층 구조체 및 이의 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20030102471A1 (en) | 2003-06-05 |
| US7352038B2 (en) | 2008-04-01 |
| US6946676B2 (en) | 2005-09-20 |
| US7352000B2 (en) | 2008-04-01 |
| EP1442484A2 (en) | 2004-08-04 |
| KR20050039731A (ko) | 2005-04-29 |
| AU2002337959A1 (en) | 2003-05-19 |
| US20060006381A1 (en) | 2006-01-12 |
| US20060011909A1 (en) | 2006-01-19 |
| WO2003041185A3 (en) | 2003-11-06 |
| WO2003041185A2 (en) | 2003-05-15 |
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