JP2005501725A5 - - Google Patents
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- Publication number
- JP2005501725A5 JP2005501725A5 JP2003525081A JP2003525081A JP2005501725A5 JP 2005501725 A5 JP2005501725 A5 JP 2005501725A5 JP 2003525081 A JP2003525081 A JP 2003525081A JP 2003525081 A JP2003525081 A JP 2003525081A JP 2005501725 A5 JP2005501725 A5 JP 2005501725A5
- Authority
- JP
- Japan
- Prior art keywords
- diyl
- hydroxyphenyl
- composition
- electrical component
- cyclohexyl
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- -1 glycidyl ester Chemical class 0.000 claims 23
- 239000000203 mixture Substances 0.000 claims 12
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 125000003118 aryl group Chemical group 0.000 claims 5
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 125000000217 alkyl group Chemical group 0.000 claims 4
- 125000000753 cycloalkyl group Chemical group 0.000 claims 4
- 125000001072 heteroaryl group Chemical group 0.000 claims 4
- 125000000623 heterocyclic group Chemical group 0.000 claims 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims 3
- 125000004208 3-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C([H])C(*)=C1[H] 0.000 claims 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 125000004450 alkenylene group Chemical group 0.000 claims 2
- 125000002947 alkylene group Chemical group 0.000 claims 2
- 125000000732 arylene group Chemical group 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 125000005724 cycloalkenylene group Chemical group 0.000 claims 2
- 125000002993 cycloalkylene group Chemical group 0.000 claims 2
- 230000004907 flux Effects 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 229920000647 polyepoxide Polymers 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- POILWHVDKZOXJZ-ARJAWSKDSA-M (z)-4-oxopent-2-en-2-olate Chemical compound C\C([O-])=C\C(C)=O POILWHVDKZOXJZ-ARJAWSKDSA-M 0.000 claims 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 1
- CPHGOBGXZQKCKI-UHFFFAOYSA-N 4,5-diphenyl-1h-imidazole Chemical compound N1C=NC(C=2C=CC=CC=2)=C1C1=CC=CC=C1 CPHGOBGXZQKCKI-UHFFFAOYSA-N 0.000 claims 1
- WFCQTAXSWSWIHS-UHFFFAOYSA-N 4-[bis(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 WFCQTAXSWSWIHS-UHFFFAOYSA-N 0.000 claims 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- 239000004643 cyanate ester Substances 0.000 claims 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- JBFYUZGYRGXSFL-UHFFFAOYSA-N imidazolide Chemical compound C1=C[N-]C=N1 JBFYUZGYRGXSFL-UHFFFAOYSA-N 0.000 claims 1
- 229910001507 metal halide Inorganic materials 0.000 claims 1
- 150000005309 metal halides Chemical class 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims 1
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- GMMSTIGHDDLCMI-UHFFFAOYSA-N zinc;imidazol-3-ide Chemical compound [Zn+2].C1=C[N-]C=N1.C1=C[N-]C=N1 GMMSTIGHDDLCMI-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/946,013 US20030111519A1 (en) | 2001-09-04 | 2001-09-04 | Fluxing compositions |
| PCT/US2002/021206 WO2003020816A1 (en) | 2001-09-04 | 2002-07-03 | Fluxing compositions |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005501725A JP2005501725A (ja) | 2005-01-20 |
| JP2005501725A5 true JP2005501725A5 (enExample) | 2006-01-05 |
Family
ID=25483831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003525081A Ceased JP2005501725A (ja) | 2001-09-04 | 2002-07-03 | フラックス組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20030111519A1 (enExample) |
| EP (1) | EP1423467A1 (enExample) |
| JP (1) | JP2005501725A (enExample) |
| KR (1) | KR20040044530A (enExample) |
| CN (1) | CN1549843A (enExample) |
| WO (1) | WO2003020816A1 (enExample) |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AU2003234394A1 (en) * | 2002-05-23 | 2003-12-12 | 3M Innovative Properties Company | Nanoparticle filled underfill |
| US6796482B2 (en) * | 2002-10-31 | 2004-09-28 | Freescale Semiconductor, Inc. | Phase separated system for fluxing |
| US7004375B2 (en) * | 2003-05-23 | 2006-02-28 | National Starch And Chemical Investment Holding Corporation | Pre-applied fluxing underfill composition having pressure sensitive adhesive properties |
| JP4170839B2 (ja) * | 2003-07-11 | 2008-10-22 | 日東電工株式会社 | 積層シート |
| US7213739B2 (en) * | 2004-04-02 | 2007-05-08 | Fry's Metals, Inc. | Underfill fluxing curative |
| US20060025509A1 (en) * | 2004-07-29 | 2006-02-02 | Ruzhi Zhang | Fluxing no-flow underfill composition containing benzoxazines |
| US7247683B2 (en) * | 2004-08-05 | 2007-07-24 | Fry's Metals, Inc. | Low voiding no flow fluxing underfill for electronic devices |
| US7687119B2 (en) * | 2005-04-04 | 2010-03-30 | Henkel Ag & Co. Kgaa | Radiation-curable desiccant-filled adhesive/sealant |
| US20060223978A1 (en) * | 2005-04-04 | 2006-10-05 | Shengqian Kong | Radiation- or thermally-curable oxetane barrier sealants |
| US20060223937A1 (en) * | 2005-04-04 | 2006-10-05 | Herr Donald E | Radiation curable cycloaliphatic barrier sealants |
| JP4883996B2 (ja) * | 2005-05-24 | 2012-02-22 | 四国化成工業株式会社 | 水溶性プレフラックス及びその利用 |
| US20060272747A1 (en) * | 2005-06-03 | 2006-12-07 | Renyi Wang | Fluxing compositions |
| US20070049665A1 (en) * | 2005-08-25 | 2007-03-01 | Musa Osama M | Quinolinols and quinolinol derivatives as adhesion promoters in die attach adhesives |
| US7378523B2 (en) * | 2005-08-25 | 2008-05-27 | National Starch And Chemical Investment Holding Corporation | Quinolinols as fluxing and accelerating agents for underfill compositions |
| US20130131007A1 (en) | 2005-09-07 | 2013-05-23 | Bebaas, Inc. | Vitamin b12 compositions |
| US7468407B2 (en) * | 2005-09-26 | 2008-12-23 | National Starch And Chemical Investment Holding Copporation | Metal salts of quinolinols and quinolinol derivatives in curable compositions |
| US20070095432A1 (en) * | 2005-11-02 | 2007-05-03 | National Starch And Chemical Investment Holding Corporation | Fluxing compositions containing benzotriazoles |
| JP4757070B2 (ja) * | 2006-03-27 | 2011-08-24 | 富士通株式会社 | 半田付け用フラックス及び半導体素子の接合方法 |
| US8597785B2 (en) * | 2006-10-03 | 2013-12-03 | Sumitomo Bakelite Co., Ltd. | Adhesive film |
| JP2008179698A (ja) * | 2007-01-24 | 2008-08-07 | Fujifilm Corp | レーザー分解用樹脂組成物およびそれを用いるパターン形成材料 |
| EP2195350B1 (en) * | 2007-09-14 | 2013-07-24 | 3M Innovative Properties Company | Ultra low viscosity iodine containing amorphous fluoropolymers |
| US20090283144A1 (en) * | 2008-05-14 | 2009-11-19 | 3M Innovative Properties Company | Solar concentrating mirror |
| US20090283133A1 (en) * | 2008-05-14 | 2009-11-19 | 3M Innovative Properties Company | Solar concentrating mirror |
| WO2010005710A1 (en) * | 2008-06-16 | 2010-01-14 | 3M Innovative Properties Company | Toughened curable compositions |
| US8334170B2 (en) * | 2008-06-27 | 2012-12-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for stacking devices |
| WO2010078105A1 (en) | 2008-12-30 | 2010-07-08 | 3M Innovative Properties Company | Broadband reflectors, concentrated solar power systems, and methods of using the same |
| KR101197193B1 (ko) * | 2010-01-05 | 2012-11-02 | 도레이첨단소재 주식회사 | 비유동성 언더필용 수지 조성물, 그를 이용한 비유동성 언더필 필름 및 그 비유동성 언더필 필름의 제조방법 |
| TWI500467B (zh) * | 2010-01-08 | 2015-09-21 | Arakawa Chem Ind | 無鉛焊劑用助熔劑組成物及無鉛焊劑膏 |
| US8070044B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Polyamine flux composition and method of soldering |
| US8070043B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
| US8070046B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Amine flux composition and method of soldering |
| US8070047B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
| US8070045B1 (en) * | 2010-12-02 | 2011-12-06 | Rohm And Haas Electronic Materials Llc | Curable amine flux composition and method of soldering |
| JP5856747B2 (ja) * | 2011-03-28 | 2016-02-10 | ハリマ化成株式会社 | はんだ付け用フラックスおよびはんだペースト組成物 |
| JP4897932B1 (ja) * | 2011-05-25 | 2012-03-14 | ハリマ化成株式会社 | はんだペースト用フラックスおよびはんだペースト |
| WO2013012587A2 (en) | 2011-07-15 | 2013-01-24 | 3M Innovative Properties Company | Semiconductor package resin composition and usage method thereof |
| US8434667B2 (en) | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Polyamine, carboxylic acid flux composition and method of soldering |
| US8434666B2 (en) | 2011-09-30 | 2013-05-07 | Rohm And Haas Electronic Materials Llc | Flux composition and method of soldering |
| US8430295B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable flux composition and method of soldering |
| US8430294B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Amine, carboxylic acid flux composition and method of soldering |
| US8430293B2 (en) | 2011-09-30 | 2013-04-30 | Rohm And Haas Electronic Materials Llc | Curable amine, carboxylic acid flux composition and method of soldering |
| JP2014091744A (ja) | 2012-10-31 | 2014-05-19 | 3M Innovative Properties Co | アンダーフィル組成物、半導体装置およびその製造方法 |
| CN103056560B (zh) * | 2012-12-28 | 2015-03-11 | 深圳市美克科技有限公司 | 软钎焊助焊剂 |
| US9631065B2 (en) * | 2013-03-12 | 2017-04-25 | Intel Corporation | Methods of forming wafer level underfill materials and structures formed thereby |
| CN104646861A (zh) * | 2013-11-25 | 2015-05-27 | 刘现梅 | 一种含有噻二唑衍生物的助焊剂 |
| EP3230331A1 (en) | 2014-12-08 | 2017-10-18 | 3M Innovative Properties Company | Compositions based on acrylic block copolymer blends |
| JP6709221B2 (ja) | 2014-12-08 | 2020-06-10 | スリーエム イノベイティブ プロパティズ カンパニー | アクリル系ポリビニルアセタールフィルム及び組成物 |
| CN107001761B (zh) | 2014-12-08 | 2020-06-16 | 3M创新有限公司 | 丙烯酸聚乙烯醇缩醛膜、组合物以及热粘结性制品 |
| EP3393795A2 (en) | 2015-12-22 | 2018-10-31 | 3M Innovative Properties Company | Acrylic films comprising a structured layer |
| AU2016378200B2 (en) | 2015-12-22 | 2019-08-15 | 3M Innovative Properties Company | Acrylic polyvinyl acetal graphic films |
| JP7030054B2 (ja) | 2015-12-22 | 2022-03-04 | スリーエム イノベイティブ プロパティズ カンパニー | 接着剤層を備えたアクリルポリビニルアセタールフィルム |
| JP2019502574A (ja) | 2015-12-22 | 2019-01-31 | スリーエム イノベイティブ プロパティズ カンパニー | 第２の層を備えたアクリルポリビニルアセタールフィルム |
| WO2017214007A1 (en) | 2016-06-07 | 2017-12-14 | 3M Innovative Properties Company | Acrylic polyvinyl acetal film for a light directing article |
| JP7344471B2 (ja) | 2018-04-26 | 2023-09-14 | 三菱瓦斯化学株式会社 | 樹脂組成物、積層体、樹脂組成物層付き半導体ウェハ、樹脂組成物層付き半導体搭載用基板、及び半導体装置 |
| TWI801565B (zh) * | 2018-04-26 | 2023-05-11 | 日商三菱瓦斯化學股份有限公司 | 樹脂組成物、疊層體、附樹脂組成物層之半導體晶圓、附樹脂組成物層之半導體搭載用基板、以及半導體裝置 |
| US11618109B2 (en) * | 2020-06-30 | 2023-04-04 | Electronics And Telecommunications Research Institute | Wire for electric bonding |
| CN114105812B (zh) * | 2020-08-26 | 2024-07-05 | 中国石油化工股份有限公司 | 一种利用氯丙烯副产1,2-二氯丙烷合成n,n’-双水杨叉-1,2-丙二胺的方法 |
| CN113579442B (zh) * | 2021-09-27 | 2022-02-08 | 新恒汇电子股份有限公司 | 双界面模块电学连接材料及其制备方法和应用 |
| CN115975087B (zh) * | 2023-01-04 | 2023-12-19 | 哈尔滨工业大学（威海） | 一种功能性席夫碱高分子聚合物及其制备方法与应用 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3791027A (en) * | 1971-06-30 | 1974-02-12 | Ibm | Soldering method |
| DE2245559A1 (de) * | 1972-09-16 | 1974-04-04 | Basf Ag | Verfahren zum verkleben oder be-schichten von metallen |
| US4611046A (en) * | 1985-03-15 | 1986-09-09 | Ford Motor Company | Hydroxyl terminated azomethines and high glass transition temperature polyether products produced therefrom |
| US4737564A (en) * | 1987-06-25 | 1988-04-12 | Ashland Oil, Inc. | Polyphenate salts of triethylene diamine and their use in polymerizing a polyisocyanate and a polyepoxide |
| US5376403A (en) * | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
| US5062902A (en) * | 1990-03-30 | 1991-11-05 | Air Products And Chemicals, Inc. | Fluxing agents comprising β-diketone and β-ketoimine ligands and a process for using the same |
| US5128746A (en) * | 1990-09-27 | 1992-07-07 | Motorola, Inc. | Adhesive and encapsulant material with fluxing properties |
| KR100254927B1 (ko) * | 1994-12-07 | 2000-05-01 | 오까베 히로시 | 납땜용 플럭스, 땜납 페이스트 및 이것을 사용한 납땜 방법 |
| US5648407A (en) * | 1995-05-16 | 1997-07-15 | Minnesota Mining And Manufacturing Company | Curable resin sols and fiber-reinforced composites derived therefrom |
| US6121689A (en) * | 1997-07-21 | 2000-09-19 | Miguel Albert Capote | Semiconductor flip-chip package and method for the fabrication thereof |
| US5814401A (en) * | 1997-02-04 | 1998-09-29 | Motorola, Inc. | Selectively filled adhesive film containing a fluxing agent |
| US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
| US5883193A (en) * | 1997-07-01 | 1999-03-16 | Minnesota Mining And Manufacturing Company | Adhesive compositions with durability under conditions of high humidity |
| US6017634A (en) * | 1997-07-21 | 2000-01-25 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive |
-
2001
- 2001-09-04 US US09/946,013 patent/US20030111519A1/en not_active Abandoned
-
2002
- 2002-07-03 EP EP02740016A patent/EP1423467A1/en not_active Withdrawn
- 2002-07-03 WO PCT/US2002/021206 patent/WO2003020816A1/en not_active Ceased
- 2002-07-03 CN CNA028171438A patent/CN1549843A/zh active Pending
- 2002-07-03 KR KR10-2004-7003183A patent/KR20040044530A/ko not_active Ceased
- 2002-07-03 JP JP2003525081A patent/JP2005501725A/ja not_active Ceased
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