JP2005339496A - メモリカード - Google Patents
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- JP2005339496A JP2005339496A JP2004257244A JP2004257244A JP2005339496A JP 2005339496 A JP2005339496 A JP 2005339496A JP 2004257244 A JP2004257244 A JP 2004257244A JP 2004257244 A JP2004257244 A JP 2004257244A JP 2005339496 A JP2005339496 A JP 2005339496A
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- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45B—WALKING STICKS; UMBRELLAS; LADIES' OR LIKE FANS
- A45B25/00—Details of umbrellas
- A45B25/06—Umbrella runners
- A45B25/08—Devices for fastening or locking
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K13/00—Conveying record carriers from one station to another, e.g. from stack to punching mechanism
- G06K13/02—Conveying record carriers from one station to another, e.g. from stack to punching mechanism the record carrier having longitudinal dimension comparable with transverse dimension, e.g. punched card
- G06K13/06—Guiding cards; Checking correct operation of card-conveying mechanisms
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07732—Physical layout of the record carrier the record carrier having a housing or construction similar to well-known portable memory devices, such as SD cards, USB or memory sticks
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
- G06K19/07741—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K7/00—Methods or arrangements for sensing record carriers, e.g. for reading patterns
- G06K7/0013—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers
- G06K7/0021—Methods or arrangements for sensing record carriers, e.g. for reading patterns by galvanic contacts, e.g. card connectors for ISO-7816 compliant smart cards or memory cards, e.g. SD card readers for reading/sensing record carriers having surface contacts
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- A—HUMAN NECESSITIES
- A45—HAND OR TRAVELLING ARTICLES
- A45B—WALKING STICKS; UMBRELLAS; LADIES' OR LIKE FANS
- A45B2200/00—Details not otherwise provided for in A45B
- A45B2200/10—Umbrellas; Sunshades
- A45B2200/1081—Umbrella handles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06555—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking
- H01L2225/06562—Geometry of the stack, e.g. form of the devices, geometry to facilitate stacking at least one device in the stack being rotated or offset
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/948—Contact or connector with insertion depth limiter
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
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- Artificial Intelligence (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Credit Cards Or The Like (AREA)
Abstract
【解決手段】 マルチファンクションメモリカード1は、カード本体1Aとこれを収容するキャップ1Bとで構成されている。カード本体1Aは、配線基板の主面に実装された複数個の半導体チップを封止するモールド樹脂からなる。カード本体1Aは、配線基板の裏面を外側に向けた状態でキャップ1Bに収容される。キャップ1Bの両側面には、カードの表裏の向きが逆に挿入されるのを防ぐガイド溝が設けてある。また、キャップ1Bの後端部には前後の向きが逆に挿入されるのを防ぐ凸部1Cが設けてある。
【選択図】 図1
Description
本実施の形態のメモリカードは、メモリ機能の他にセキュリティ機能を備えた超小型、大容量のマルチファンクションメモリカードであり、例えば第三世代携帯電話機などのメモリカードスロットに装着して使用されるものである。
図19および図20は、本実施の形態のマルチファンクションメモリカードの外観を示す平面図であり、図19は外部接続端子形成面(裏面)、図20はその反対側の面(表面)を示している。
図31は、規格の異なる異種メモリカードとの互換性を持たせるために、外部接続端子5の配置を変えた本実施の形態のマルチファンクションメモリカードの平面図、図32および図33は、このマルチファンクションメモリカードを装着するアダプタの平面図であり、図32は表面側、図33は裏面(外部接続端子形成面)を示している。
1A カード本体
1B キャップ
1C 凸部
2 配線基板
3C、3F、3M 半導体チップ
4 モールド樹脂
5 外部接続端子
6 ボンディングワイヤ
7 テスト端子
9 長溝
10 コネクタ
11 端子
12 ガイド溝
13 天板
14 切り欠き
15 ノッチ溝
16 カム
17 抜け防止溝
18 抜け防止爪
20 接着剤
21 突起
22 治具
30 アダプタ
31 外部接続端子
32 切り欠き
33 コネクタ
34 切り欠き
35 端子
36 配線
37 保護チップ
Claims (23)
- 一面に複数の外部接続端子が形成された配線基板の他面に実装された半導体チップが樹脂によって封止されてなる板状のカード本体と、
一面に前記カード本体を収容する溝が形成された板状のキャップ体とからなり、
前記カード本体は、前記配線基板の前記一面が露出するように、前記キャップ体の前記溝内に収容され、
カード挿入時に後端部となる前記キャップ体の一辺には、前記一面上に突出する凸部が形成されているメモリカード。 - 前記半導体チップは、電気的に消去および書き込み可能な不揮発性メモリが形成された第1の半導体チップと、前記不揮発性メモリに対するメモリインタフェース動作を制御するインタフェースコントローラが形成された第2の半導体チップとを含み、
前記第2の半導体チップと、前記第1の半導体チップとが積層された状態で前記配線基板の前記他面に実装されている請求項1記載のメモリカード。 - 前記半導体チップは、前記インタフェースコントローラから与えられた動作コマンドに従ってセキュリティー処理を行うセキュリティーコントローラとしてのICカードマイコンが形成された第3の半導体チップをさらに含む請求項2記載のメモリカード。
- 前記キャップ体は、前記半導体チップを封止する前記樹脂よりもコネクタ端子との摩擦抵抗の低い樹脂からなる請求項1記載のメモリカード。
- 前記キャップ体は、熱可塑性樹脂からなり、前記複数個の半導体チップを封止する前記樹脂は、熱硬化性樹脂からなる請求項4記載のメモリカード。
- 前記配線基板に形成された前記複数の外部接続端子は、カード挿入方向と直交する方向に沿って配列された第1の端子群と、前記カード挿入方向と直交する方向に沿って配列されると共に、前記カード挿入方向に沿って前記第1の端子群と前後して配列される第2の端子群とからなる請求項1記載のメモリカード。
- カード挿入時に先端部となる前記キャップ体の先端は、その断面形状がラウンド状あるいは面取り状に形成されており、
前記キャップ体の一面上に形成された前記凸部の角部は、その断面形状がラウンド状あるいは面取り状に形成されており、
前記キャップ体の先端は、前記凸部の角部に比較して、より大きくラウンド状あるいは面取り状に加工されている請求項1記載のメモリカード。 - 前記キャップ体の側部には、前記一面の幅と他面の幅とが異なるように階段状のガイド溝が形成され、
前記キャップ体の側部に形成された前記ガイド溝は、前記一面の幅が前記他面の幅よりも広くなるように形成されている請求項7記載のメモリカード。 - 前記キャップ体の一辺の両コーナー部の曲率半径は、カード挿入時に後端部となる前記他の一辺の両コーナー部の曲率半径よりも大きい請求項1記載のメモリカード。
- 前記キャップ体の一辺の両コーナー部の曲率半径は、前記キャップ体の両側部に形成された前記ガイド溝の幅よりも大きい請求項8記載のメモリカード。
- 前記キャップ体の両側部には、前記一面の幅と他面の幅とが異なるように階段状のガイド溝が形成され、
前記キャップ体の両側部に形成された前記ガイド溝のそれぞれの一端は、前記ラウンド加工が施された両コーナー部まで延在し、前記ガイド溝のそれぞれの一端の曲率半径は、前記両側部における前記ガイド溝の幅よりも大きい請求項10記載のメモリカード。 - カード挿入時に先端部となる前記キャップ体の前記一辺に沿って面取り加工が施されている請求項10記載のメモリカード。
- 前記面取り加工は、前記キャップ体の両面に施されている請求項12記載のメモリカード。
- 前記キャップ体の前記凸部に面取り加工が施されており、前記キャップ体の前記一辺に施された前記面取り加工の面取り長さは、前記凸部に施された前記面取り加工の面取り長さよりも大きい請求項12記載のメモリカード。
- 前記キャップ体の両側部に形成された前記ガイド溝の一部にノッチ溝が形成されている請求項8記載のメモリカード。
- カード挿入時に先端部となる前記キャップ体の一辺に沿ってラウンド加工が施されている請求項1記載のメモリカード。
- 前記配線基板に形成された前記複数の外部接続端子は、カード挿入方向と直交する方向に沿って配列された第1の端子群と、前記カード挿入方向と直交する方向に沿って配列されると共に、前記カード挿入方向に沿って前記第1の端子群と前後して配列される第2の端子群とからなり、前記ノッチ溝と前記第2の端子群との距離は、前記ノッチ溝と前記第1の端子群との距離よりも小さいことを特徴とする請求項15記載のメモリカード。
- 前記ノッチ溝は、前記キャップ体の両側部に一つずつ形成されており、前記一対のノッチ溝は、前記キャップ体の後端部から等距離の位置に配置されている請求項17記載のメモリカード。
- 前記キャップ体の両側部に形成された前記ガイド溝の一部には、コネクタからの脱落を防止するための抜け防止溝が形成されている請求項8記載のメモリカード。
- 前記カード本体は、かしめ方式によって前記キャップ体の前記溝内に収容されている請求項1記載のメモリカード。
- 前記メモリカードが装着されるコネクタと、配線を介して前記カード本体の外部接続端子に電気的に接続される外部接続端子とを有するアダプタをさらに備えた請求項1記載のメモリカード。
- 前記アダプタは、アダプタ挿入方向と直交する方向の一辺に、前記コネクタの開口部が配置されている請求項21記載のメモリカード。
- 前記アダプタには、前記コネクタに装着された前記メモリカード内の半導体チップに電源を供給する電源供給用素子が内蔵されている請求項21記載のメモリカード。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004257244A JP4651332B2 (ja) | 2004-04-26 | 2004-09-03 | メモリカード |
EP05252083A EP1591949A3 (en) | 2004-04-26 | 2005-04-01 | Memory card |
CN2009101514548A CN101620687B (zh) | 2004-04-26 | 2005-04-25 | 存储卡 |
CN 200510066246 CN1744110B (zh) | 2004-04-26 | 2005-04-25 | 存储卡 |
US11/113,188 US7291903B2 (en) | 2004-04-26 | 2005-04-25 | Memory card |
KR1020050033908A KR20060045823A (ko) | 2004-04-26 | 2005-04-25 | 메모리 카드 |
TW094113342A TW200606730A (en) | 2004-04-26 | 2005-04-26 | Memory card |
US11/864,073 US20080025003A1 (en) | 2004-04-26 | 2007-09-28 | Memory card |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004129602 | 2004-04-26 | ||
JP2004257244A JP4651332B2 (ja) | 2004-04-26 | 2004-09-03 | メモリカード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005339496A true JP2005339496A (ja) | 2005-12-08 |
JP4651332B2 JP4651332B2 (ja) | 2011-03-16 |
Family
ID=34940694
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004257244A Expired - Fee Related JP4651332B2 (ja) | 2004-04-26 | 2004-09-03 | メモリカード |
Country Status (5)
Country | Link |
---|---|
US (2) | US7291903B2 (ja) |
EP (1) | EP1591949A3 (ja) |
JP (1) | JP4651332B2 (ja) |
KR (1) | KR20060045823A (ja) |
TW (1) | TW200606730A (ja) |
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- 2005-04-25 US US11/113,188 patent/US7291903B2/en not_active Expired - Fee Related
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Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
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US8110434B2 (en) | 2006-03-31 | 2012-02-07 | Kabushiki Kaisha Toshiba | Semiconductor device and memory card using the same |
US7679174B1 (en) | 2006-03-31 | 2010-03-16 | Kabushiki Kaisha Toshiba | Semiconductor device and memory card using the same |
JP2008084263A (ja) * | 2006-09-29 | 2008-04-10 | Renesas Technology Corp | メモリカードおよびその製造方法 |
JP2008146120A (ja) * | 2006-12-06 | 2008-06-26 | Sony Corp | メモリカード |
JP2008310400A (ja) * | 2007-06-12 | 2008-12-25 | Disco Abrasive Syst Ltd | メモリカードの製造方法 |
KR100994092B1 (ko) | 2007-10-05 | 2010-11-15 | 알프스 덴키 가부시키가이샤 | 전자 기능 카드 및 카드 커넥터 |
US7989960B2 (en) | 2008-02-08 | 2011-08-02 | Renesas Electronics Corporation | Semiconductor device |
US8319352B2 (en) | 2008-02-08 | 2012-11-27 | Renesas Electronics Corporation | Semiconductor device |
US8754534B2 (en) | 2008-02-08 | 2014-06-17 | Renesas Electronics Corporation | Semiconductor device |
US9377825B2 (en) | 2008-02-08 | 2016-06-28 | Renesas Electronics Corporation | Semiconductor device |
JP2011118905A (ja) * | 2009-12-07 | 2011-06-16 | Samsung Electronics Co Ltd | メモリカード及び電子機器 |
US8995118B2 (en) | 2009-12-07 | 2015-03-31 | Samsung Electronics Co., Ltd. | Memory cards and electronic machines |
US9048557B2 (en) | 2009-12-07 | 2015-06-02 | Samsung Electronics Co., Ltd. | Memory cards and electronic machines |
US9293854B2 (en) | 2009-12-07 | 2016-03-22 | Samsung Electronics Co., Ltd. | Memory cards and electronic machines |
JP2012023390A (ja) * | 2011-09-22 | 2012-02-02 | Renesas Electronics Corp | 電子装置 |
KR20200025539A (ko) * | 2018-08-30 | 2020-03-10 | 삼성전자주식회사 | 정전기 방지 구조물을 포함하는 솔리드 스테이트 드라이브 장치 |
KR102547948B1 (ko) * | 2018-08-30 | 2023-06-26 | 삼성전자주식회사 | 정전기 방지 구조물을 포함하는 솔리드 스테이트 드라이브 장치 |
Also Published As
Publication number | Publication date |
---|---|
US20080025003A1 (en) | 2008-01-31 |
KR20060045823A (ko) | 2006-05-17 |
US20050253239A1 (en) | 2005-11-17 |
EP1591949A2 (en) | 2005-11-02 |
JP4651332B2 (ja) | 2011-03-16 |
TW200606730A (en) | 2006-02-16 |
US7291903B2 (en) | 2007-11-06 |
EP1591949A3 (en) | 2008-06-18 |
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