JP2005315156A - ポンプおよびポンプを備える電子機器 - Google Patents

ポンプおよびポンプを備える電子機器 Download PDF

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Publication number
JP2005315156A
JP2005315156A JP2004133533A JP2004133533A JP2005315156A JP 2005315156 A JP2005315156 A JP 2005315156A JP 2004133533 A JP2004133533 A JP 2004133533A JP 2004133533 A JP2004133533 A JP 2004133533A JP 2005315156 A JP2005315156 A JP 2005315156A
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JP
Japan
Prior art keywords
heating element
heat
region
heat receiving
pump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004133533A
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English (en)
Japanese (ja)
Other versions
JP2005315156A5 (enExample
Inventor
Kentaro Tomioka
健太郎 富岡
Yukihiko Hata
由喜彦 畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP2004133533A priority Critical patent/JP2005315156A/ja
Priority to US11/084,654 priority patent/US7280357B2/en
Priority to CNB2005100685989A priority patent/CN100373294C/zh
Publication of JP2005315156A publication Critical patent/JP2005315156A/ja
Publication of JP2005315156A5 publication Critical patent/JP2005315156A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
    • F04D29/5866—Cooling at last part of the working fluid in a heat exchanger
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/586—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps
    • F04D29/588—Cooling; Heating; Diminishing heat transfer specially adapted for liquid pumps cooling or heating the machine
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2004133533A 2004-04-28 2004-04-28 ポンプおよびポンプを備える電子機器 Pending JP2005315156A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004133533A JP2005315156A (ja) 2004-04-28 2004-04-28 ポンプおよびポンプを備える電子機器
US11/084,654 US7280357B2 (en) 2004-04-28 2005-03-18 Pump and electronic device having the pump
CNB2005100685989A CN100373294C (zh) 2004-04-28 2005-04-28 电子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004133533A JP2005315156A (ja) 2004-04-28 2004-04-28 ポンプおよびポンプを備える電子機器

Publications (2)

Publication Number Publication Date
JP2005315156A true JP2005315156A (ja) 2005-11-10
JP2005315156A5 JP2005315156A5 (enExample) 2007-05-17

Family

ID=35186852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004133533A Pending JP2005315156A (ja) 2004-04-28 2004-04-28 ポンプおよびポンプを備える電子機器

Country Status (3)

Country Link
US (1) US7280357B2 (enExample)
JP (1) JP2005315156A (enExample)
CN (1) CN100373294C (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004246403A (ja) * 2003-02-10 2004-09-02 Toshiba Corp 情報処理装置、電子機器及び電子機器の冷却方法
JP2005315158A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置、および電子機器
JP2006049382A (ja) * 2004-07-30 2006-02-16 Toshiba Corp 冷却装置及び電子機器
CN100493318C (zh) * 2005-11-08 2009-05-27 富准精密工业(深圳)有限公司 整合式液冷散热装置
US20070246205A1 (en) * 2006-04-25 2007-10-25 Shn-Yung Lee Heat dispensing device with radially flowing coolant
US7694721B2 (en) * 2006-08-31 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump
EP2065935B1 (en) * 2006-09-19 2017-11-29 NEC Corporation Cooling apparatus
US7729118B2 (en) * 2006-11-03 2010-06-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump
US7477517B2 (en) * 2007-01-29 2009-01-13 International Business Machines Corporation Integrated heat spreader and exchanger
US20090207568A1 (en) * 2008-02-18 2009-08-20 Haveri Heikki Antti Mikael Method and apparatus for cooling in miniaturized electronics
US7961469B2 (en) * 2009-03-31 2011-06-14 Apple Inc. Method and apparatus for distributing a thermal interface material
US9388811B2 (en) * 2009-06-23 2016-07-12 Asia Vital Components Co., Ltd. Micropump structure
US8405997B2 (en) * 2009-06-30 2013-03-26 Kabushiki Kaisha Toshiba Electronic apparatus
TW201228583A (en) * 2010-12-30 2012-07-01 Hon Hai Prec Ind Co Ltd Electronic device
US9689627B2 (en) * 2013-02-05 2017-06-27 Asia Vital Components Co., Ltd. Water-cooling device with waterproof stator and rotor pumping unit
US10107303B2 (en) * 2015-05-22 2018-10-23 Teza Technologies LLC Fluid cooled server and radiator
CN105263301B (zh) * 2015-11-12 2017-12-19 深圳市研派科技有限公司 一种液冷散热系统及其液体散热排
US20170164516A1 (en) * 2015-12-02 2017-06-08 Caterpillar Inc. Integrated Fluid Turbulator and Sealing System for Improved Thermal Management
CN109944806B (zh) * 2019-04-23 2024-08-13 迎新科技(中国)有限公司 并联双泵导液装置及其液冷散热系统
US10834850B2 (en) * 2019-01-23 2020-11-10 Dongguan Jianxin Electronic Technology Co., Ltd. Integrated radiator provided with water chamber, control panel and water pump
EP4581672A1 (en) * 2022-09-02 2025-07-09 City St George's, University of London Pump
GB202212766D0 (en) * 2022-09-02 2022-10-19 City Univ Of London Pump

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JPS62224053A (ja) * 1986-03-26 1987-10-02 Hitachi Ltd 冷却装置付半導体装置
JP2001041198A (ja) * 2000-01-01 2001-02-13 Toshiba Home Technology Corp ファンモータ

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US20050243520A1 (en) 2005-11-03
CN1690440A (zh) 2005-11-02
US7280357B2 (en) 2007-10-09

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