JP2005315156A5 - - Google Patents

Download PDF

Info

Publication number
JP2005315156A5
JP2005315156A5 JP2004133533A JP2004133533A JP2005315156A5 JP 2005315156 A5 JP2005315156 A5 JP 2005315156A5 JP 2004133533 A JP2004133533 A JP 2004133533A JP 2004133533 A JP2004133533 A JP 2004133533A JP 2005315156 A5 JP2005315156 A5 JP 2005315156A5
Authority
JP
Japan
Prior art keywords
heating element
heat
receiving portion
pump
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004133533A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005315156A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004133533A priority Critical patent/JP2005315156A/ja
Priority claimed from JP2004133533A external-priority patent/JP2005315156A/ja
Priority to US11/084,654 priority patent/US7280357B2/en
Priority to CNB2005100685989A priority patent/CN100373294C/zh
Publication of JP2005315156A publication Critical patent/JP2005315156A/ja
Publication of JP2005315156A5 publication Critical patent/JP2005315156A5/ja
Pending legal-status Critical Current

Links

JP2004133533A 2004-04-28 2004-04-28 ポンプおよびポンプを備える電子機器 Pending JP2005315156A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004133533A JP2005315156A (ja) 2004-04-28 2004-04-28 ポンプおよびポンプを備える電子機器
US11/084,654 US7280357B2 (en) 2004-04-28 2005-03-18 Pump and electronic device having the pump
CNB2005100685989A CN100373294C (zh) 2004-04-28 2005-04-28 电子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004133533A JP2005315156A (ja) 2004-04-28 2004-04-28 ポンプおよびポンプを備える電子機器

Publications (2)

Publication Number Publication Date
JP2005315156A JP2005315156A (ja) 2005-11-10
JP2005315156A5 true JP2005315156A5 (enExample) 2007-05-17

Family

ID=35186852

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004133533A Pending JP2005315156A (ja) 2004-04-28 2004-04-28 ポンプおよびポンプを備える電子機器

Country Status (3)

Country Link
US (1) US7280357B2 (enExample)
JP (1) JP2005315156A (enExample)
CN (1) CN100373294C (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004246403A (ja) * 2003-02-10 2004-09-02 Toshiba Corp 情報処理装置、電子機器及び電子機器の冷却方法
JP2005315158A (ja) * 2004-04-28 2005-11-10 Toshiba Corp ポンプ、冷却装置、および電子機器
JP2006049382A (ja) * 2004-07-30 2006-02-16 Toshiba Corp 冷却装置及び電子機器
CN100493318C (zh) * 2005-11-08 2009-05-27 富准精密工业(深圳)有限公司 整合式液冷散热装置
US20070246205A1 (en) * 2006-04-25 2007-10-25 Shn-Yung Lee Heat dispensing device with radially flowing coolant
US7694721B2 (en) * 2006-08-31 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump
US8432695B2 (en) * 2006-09-19 2013-04-30 Nec Corporation Cooling device
US7729118B2 (en) * 2006-11-03 2010-06-01 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Miniature liquid cooling device having an integral pump
US7477517B2 (en) * 2007-01-29 2009-01-13 International Business Machines Corporation Integrated heat spreader and exchanger
US20090207568A1 (en) * 2008-02-18 2009-08-20 Haveri Heikki Antti Mikael Method and apparatus for cooling in miniaturized electronics
US7961469B2 (en) * 2009-03-31 2011-06-14 Apple Inc. Method and apparatus for distributing a thermal interface material
US9388811B2 (en) * 2009-06-23 2016-07-12 Asia Vital Components Co., Ltd. Micropump structure
US8405997B2 (en) * 2009-06-30 2013-03-26 Kabushiki Kaisha Toshiba Electronic apparatus
TW201228583A (en) * 2010-12-30 2012-07-01 Hon Hai Prec Ind Co Ltd Electronic device
US9689627B2 (en) * 2013-02-05 2017-06-27 Asia Vital Components Co., Ltd. Water-cooling device with waterproof stator and rotor pumping unit
US10107303B2 (en) * 2015-05-22 2018-10-23 Teza Technologies LLC Fluid cooled server and radiator
CN105263301B (zh) * 2015-11-12 2017-12-19 深圳市研派科技有限公司 一种液冷散热系统及其液体散热排
US20170164516A1 (en) * 2015-12-02 2017-06-08 Caterpillar Inc. Integrated Fluid Turbulator and Sealing System for Improved Thermal Management
CN109944806B (zh) * 2019-04-23 2024-08-13 迎新科技(中国)有限公司 并联双泵导液装置及其液冷散热系统
US10834850B2 (en) * 2019-01-23 2020-11-10 Dongguan Jianxin Electronic Technology Co., Ltd. Integrated radiator provided with water chamber, control panel and water pump
WO2024047226A1 (en) * 2022-09-02 2024-03-07 City, University of London Pump
GB202212766D0 (en) * 2022-09-02 2022-10-19 City Univ Of London Pump

Family Cites Families (123)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224053A (ja) * 1986-03-26 1987-10-02 Hitachi Ltd 冷却装置付半導体装置
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
US5089936A (en) * 1988-09-09 1992-02-18 Hitachi, Ltd. Semiconductor module
US5268817A (en) * 1990-04-27 1993-12-07 Kabushiki Kaisha Toshiba Portable computer with keyboard and having display with coordinate input tablet rotatably mounted to face either toward or away from keyboard when closed over keyboard
US5168926A (en) * 1991-09-25 1992-12-08 Intel Corporation Heat sink design integrating interface material
WO1994029901A1 (de) * 1993-06-07 1994-12-22 Melcher Ag Befestigungsvorrichtung für halbleiter-schaltelemente
JPH0749725A (ja) 1993-08-06 1995-02-21 Sharp Corp 情報処理装置
JP3385482B2 (ja) 1993-11-15 2003-03-10 株式会社日立製作所 電子機器
JP3392527B2 (ja) 1994-08-01 2003-03-31 富士通株式会社 ヒートシンクの取付構造及び固定具
US5594617A (en) * 1994-12-06 1997-01-14 Digital Equipment Corporation Rotating battery hinge for a notebook computer
JP3258198B2 (ja) 1995-04-28 2002-02-18 株式会社東芝 回路モジュールの冷却装置およびこの冷却装置を有する携帯形電子機器
DE69525081D1 (de) 1995-06-08 2002-02-28 Ibm Mechanische struktur einer informationsverarbeitungsvorrichtung
US6094180A (en) 1996-04-05 2000-07-25 Fakespace, Inc. Gimbal-mounted virtual reality display system
JPH104161A (ja) 1996-06-14 1998-01-06 Nippon Keiki Seisakusho:Kk ヒートシンク取り付け装置
JPH1055227A (ja) 1996-08-09 1998-02-24 Sharp Corp 情報処理装置
US5825087A (en) * 1996-12-03 1998-10-20 International Business Machines Corporation Integral mesh flat plate cooling module
JPH10261884A (ja) 1997-03-17 1998-09-29 Nec Home Electron Ltd 情報処理装置の冷却構造
JPH10303582A (ja) 1997-04-22 1998-11-13 Toshiba Corp 回路モジュールの冷却装置および回路モジュールを搭載した携帯形情報機器
US6026888A (en) * 1997-06-02 2000-02-22 Compaq Computer Corporation Molded heat exchanger structure for portable computer
WO1998059278A1 (en) * 1997-06-20 1998-12-30 Hitachi, Ltd. Display and display optical system
JPH1139058A (ja) 1997-07-14 1999-02-12 Ricoh Co Ltd ペン入力型電子機器
US6049469A (en) * 1997-08-20 2000-04-11 Dell Usa, L.P. Combination electromagnetic shield and heat spreader
US6005767A (en) 1997-11-14 1999-12-21 Vadem Portable computer having articulated display
US20020053421A1 (en) 1997-09-10 2002-05-09 Kabushiki Kaisha Toshiba Heat dissipating structure for electronic apparatus
KR100286375B1 (ko) 1997-10-02 2001-04-16 윤종용 전자 시스템의 방열장치 및 방열장치가 사용된 컴퓨터 시스템
US6049459A (en) 1997-11-17 2000-04-11 Lucent Technologies, Inc. Nesting clamps for electrical components
JPH11166500A (ja) 1997-12-03 1999-06-22 Toshiba Ave Co Ltd ポンプ
US6464195B1 (en) 1997-12-04 2002-10-15 Raymond Hildebrandt Ergonomic mounting for computer screen displays
US5903436A (en) * 1997-12-30 1999-05-11 Intel Corporation Emulative lid/heatspreader for processor die attached to an organic substrate
JP3366244B2 (ja) 1998-02-04 2003-01-14 富士通株式会社 電子機器
US6281573B1 (en) * 1998-03-31 2001-08-28 International Business Machines Corporation Thermal enhancement approach using solder compositions in the liquid state
US6148906A (en) * 1998-04-15 2000-11-21 Scientech Corporation Flat plate heat pipe cooling system for electronic equipment enclosure
US6288896B1 (en) * 1998-07-02 2001-09-11 Acer Incorporated Heat dissipation system for a laptop computer using a heat pipe
JP4128660B2 (ja) 1998-07-27 2008-07-30 株式会社東芝 電子機器
US6282082B1 (en) 1998-07-31 2001-08-28 Qubit, Llc Case for a modular tablet computer system
US6532152B1 (en) * 1998-11-16 2003-03-11 Intermec Ip Corp. Ruggedized hand held computer
US6377452B1 (en) 1998-12-18 2002-04-23 Furukawa Electric Co., Ltd. Heat pipe hinge structure for electronic device
US6483445B1 (en) 1998-12-21 2002-11-19 Intel Corporation Electronic device with hidden keyboard
GB2348459B (en) 1999-03-27 2003-03-19 Ibm Lid restraint for portable computer
JP4203782B2 (ja) * 1999-05-19 2009-01-07 ソニー株式会社 情報処理装置及びバッテリ
KR100553677B1 (ko) * 1999-06-11 2006-02-24 삼성전자주식회사 커버를 지지하기 위한 구조를 갖는 휴대용 컴퓨터
US6231371B1 (en) 1999-06-25 2001-05-15 Hewlett-Packard Company Docking station for multiple devices
JP4270667B2 (ja) 1999-08-17 2009-06-03 株式会社東芝 回路部品の冷却装置および電子機器
JP3283853B2 (ja) 1999-09-17 2002-05-20 米沢日本電気株式会社 ドッキングステーション
US6166907A (en) 1999-11-26 2000-12-26 Chien; Chuan-Fu CPU cooling system
US6570764B2 (en) * 1999-12-29 2003-05-27 Intel Corporation Low thermal resistance interface for attachment of thermal materials to a processor die
JP2001041198A (ja) * 2000-01-01 2001-02-13 Toshiba Home Technology Corp ファンモータ
US6196850B1 (en) 2000-02-10 2001-03-06 International Business Machines Corporation Rotatable docking station for an electronic device
JP2001230356A (ja) 2000-02-17 2001-08-24 Showa Denko Kk クリップ付き放熱器
JP2001251079A (ja) 2000-03-03 2001-09-14 Diamond Electric Mfg Co Ltd ヒートパイプを用いたヒートシンクとヒートパイプの製造方法
US6418017B1 (en) 2000-03-30 2002-07-09 Hewlett-Packard Company Heat dissipating chassis member
US6430038B1 (en) 2000-04-18 2002-08-06 Hewlett-Packard Company Computer with articulated mechanism
US6437973B1 (en) 2000-04-18 2002-08-20 Hewlett-Packard Company Modular mechanism for movable display
JP2001318732A (ja) * 2000-05-09 2001-11-16 Sony Corp 情報処理装置
US6313990B1 (en) 2000-05-25 2001-11-06 Kioan Cheon Cooling apparatus for electronic devices
JP3302350B2 (ja) 2000-06-29 2002-07-15 株式会社東芝 電子機器
US6327145B1 (en) * 2000-09-01 2001-12-04 Intel Corporation Heat sink with integrated fluid circulation pump
US6296048B1 (en) 2000-09-08 2001-10-02 Powerwave Technologies, Inc. Heat sink assembly
JP2002099356A (ja) 2000-09-21 2002-04-05 Toshiba Corp 電子機器用冷却装置および電子機器
US6469893B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
US6396687B1 (en) 2000-10-13 2002-05-28 Dell Products, L.P. Rotating portable computer docking station
JP2002151638A (ja) 2000-11-08 2002-05-24 Hitachi Ltd 電子機器の冷却装置
US6408937B1 (en) * 2000-11-15 2002-06-25 Sanjay K. Roy Active cold plate/heat sink
JP3607608B2 (ja) 2000-12-19 2005-01-05 株式会社日立製作所 ノート型パソコンの液冷システム
US6717798B2 (en) 2001-03-22 2004-04-06 Intel Corporation Docking digital picture displays
US6798429B2 (en) * 2001-03-29 2004-09-28 Intel Corporation Intuitive mobile device interface to virtual spaces
US20020141159A1 (en) 2001-03-29 2002-10-03 Bloemen James Andrew Sealed and passively cooled telecommunications customer service terminal
JP2002344186A (ja) 2001-05-15 2002-11-29 Sharp Corp 電子機器
US6741470B2 (en) * 2001-06-01 2004-05-25 Intel Corporation Reusable thermal solution attachment mechanism and methods of using same
FR2827115B1 (fr) 2001-07-06 2003-09-05 Alstom Coffre pour convertisseur de puissance
TW558611B (en) 2001-07-18 2003-10-21 Matsushita Electric Industrial Co Ltd Small pump, cooling system and portable equipment
US6873521B2 (en) 2001-07-24 2005-03-29 Hewlett-Packard Development Company, L.P. Multiple environment foldable computer
US6480373B1 (en) 2001-07-24 2002-11-12 Compaq Information Technologies Group, L.P. Multifunctional foldable computer
JP2003044169A (ja) 2001-07-31 2003-02-14 Casio Comput Co Ltd 電子機器
JP4512296B2 (ja) 2001-08-22 2010-07-28 株式会社日立製作所 可搬型情報処理装置の液冷システム
JP3925126B2 (ja) 2001-08-28 2007-06-06 日産自動車株式会社 燃料電池
JP2003078270A (ja) 2001-09-07 2003-03-14 Hitachi Ltd 電子装置
JP3946018B2 (ja) 2001-09-18 2007-07-18 株式会社日立製作所 液冷却式回路装置
US6752204B2 (en) * 2001-09-18 2004-06-22 Intel Corporation Iodine-containing thermal interface material
JP3519710B2 (ja) 2001-09-21 2004-04-19 株式会社東芝 冷却装置及び冷却装置を内蔵した電子機器
TW561226B (en) * 2001-09-25 2003-11-11 Matsushita Electric Industrial Co Ltd Ultra-thin pump and cooling system including the pump
JP3741092B2 (ja) 2001-09-25 2006-02-01 松下電器産業株式会社 超薄型ポンプとこれを備えた冷却システム
JP2003223238A (ja) 2002-01-28 2003-08-08 Internatl Business Mach Corp <Ibm> コンピュータ装置、モニタユニットおよび対面ユニットの支持構造物
JP3961843B2 (ja) 2002-02-08 2007-08-22 株式会社日立製作所 液体冷却システムを有する小型電子計算機
US6926070B2 (en) * 2002-03-22 2005-08-09 Intel Corporation System and method for providing cooling systems with heat exchangers
US6741465B2 (en) * 2002-03-29 2004-05-25 Intel Corporation Cooling method and apparatus for handheld devices
US6668911B2 (en) * 2002-05-08 2003-12-30 Itt Manufacturing Enterprises, Inc. Pump system for use in a heat exchange application
US7209355B2 (en) * 2002-05-15 2007-04-24 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US20030214786A1 (en) * 2002-05-15 2003-11-20 Kyo Niwatsukino Cooling device and an electronic apparatus including the same
JP3431024B1 (ja) 2003-01-15 2003-07-28 松下電器産業株式会社 冷却装置
JP3452059B1 (ja) 2002-05-15 2003-09-29 松下電器産業株式会社 冷却装置とそれを備えた電子機器
US6839234B2 (en) * 2002-05-15 2005-01-04 Matsushita Electric Industrial Co., Ltd. Cooling device and an electronic apparatus including the same
US6652223B1 (en) * 2002-05-30 2003-11-25 Sunonwealth Electric Machine Industry Fan structure having horizontal convection
JP4168669B2 (ja) 2002-05-31 2008-10-22 松下電工株式会社 薄型ポンプ
DE10225993A1 (de) * 2002-06-12 2003-12-24 Bosch Gmbh Robert Kühlkörper
US6856506B2 (en) 2002-06-19 2005-02-15 Motion Computing Tablet computing device with three-dimensional docking support
US6674642B1 (en) * 2002-06-27 2004-01-06 International Business Machines Corporation Liquid-to-air cooling system for portable electronic and computer devices
US6757170B2 (en) * 2002-07-26 2004-06-29 Intel Corporation Heat sink and package surface design
JP2004071882A (ja) * 2002-08-07 2004-03-04 Toshiba Corp 電子機器
JP3629257B2 (ja) * 2002-08-30 2005-03-16 株式会社東芝 電子機器
US6894899B2 (en) * 2002-09-13 2005-05-17 Hong Kong Cheung Tat Electrical Co. Ltd. Integrated fluid cooling system for electronic components
JP3600606B2 (ja) * 2002-09-20 2004-12-15 株式会社東芝 電子機器
US6788530B2 (en) 2002-09-24 2004-09-07 International Business Machines Corporation User friendly computer equipment, monitor unit, and monitor unit setting base
US6829139B1 (en) * 2002-10-01 2004-12-07 Danger, Inc. Adjustable data processing display
JP2004139187A (ja) 2002-10-15 2004-05-13 Toshiba Corp 電子機器
EP1333492B1 (en) * 2002-11-08 2006-03-01 Agilent Technologies Inc. a Delaware Corporation Cooling a microchip on a circuit board
JP3981628B2 (ja) * 2002-11-28 2007-09-26 株式会社東芝 冷却用ポンプ並びに電気機器及びパーソナルコンピュータ
TW545104B (en) * 2002-11-28 2003-08-01 Quanta Comp Inc Cooling apparatus
JP2003216278A (ja) 2002-12-10 2003-07-31 Toshiba Corp 電子機器
US6924978B2 (en) * 2002-12-27 2005-08-02 Intel Corporation Method and system for computer system ventilation
TW551790U (en) 2002-12-31 2003-09-01 Hon Hai Prec Ind Co Ltd Securing device
US7079394B2 (en) * 2003-01-08 2006-07-18 Lenovo (Singapore) Pte. Ltd. Compact cooling device
JP2004246403A (ja) * 2003-02-10 2004-09-02 Toshiba Corp 情報処理装置、電子機器及び電子機器の冷却方法
US6702007B1 (en) * 2003-04-30 2004-03-09 Kuan-Da Pan Heat sink structure
JP2004348650A (ja) 2003-05-26 2004-12-09 Toshiba Corp 電子機器
US7055581B1 (en) * 2003-06-24 2006-06-06 Roy Sanjay K Impeller driven active heat sink
US7035090B2 (en) 2003-09-04 2006-04-25 Kabushiki Kaisha Toshiba Interlocking mechanism for a display
JP2005107122A (ja) 2003-09-30 2005-04-21 Toshiba Corp 電子機器
US7019979B2 (en) * 2003-11-21 2006-03-28 Waffer Technology Corp. Heat dissipating device having improved fastening structure
US7095614B2 (en) * 2004-04-20 2006-08-22 International Business Machines Corporation Electronic module assembly
CN2701074Y (zh) * 2004-04-29 2005-05-18 鸿富锦精密工业(深圳)有限公司 液冷散热装置
US7124811B2 (en) * 2004-12-31 2006-10-24 Intel Corporation Systems for integrated pump and cold plate
US7077189B1 (en) * 2005-01-21 2006-07-18 Delphi Technologies, Inc. Liquid cooled thermosiphon with flexible coolant tubes

Similar Documents

Publication Publication Date Title
JP2005315156A5 (enExample)
JP2005317746A5 (enExample)
JP3594238B2 (ja) 電子機器用冷却装置及び電子機器
US20040250993A1 (en) Heat-dissipating device
EP1650799A3 (en) Heat radiating apparatus
JP3521423B2 (ja) ファンモータ
JP2014181682A5 (enExample)
CN101950197A (zh) 一种计算机电源
KR200467728Y1 (ko) 복수의 열전도 파이프를 구비한 방열 장치
RU2002107437A (ru) Электронное устройство с выделяющими тепло компонентами и поглощающими тепло элементами
CN109152273B (zh) 电子装置
KR100939992B1 (ko) 전기전자기기의 냉각장치 및 이를 장착한 전기전자기기
WO2006095436A1 (ja) 吸熱部材、冷却装置及び電子機器
JP4397114B2 (ja) 電子機器の冷却装置
CN106647114A (zh) 摄像模组
JP2005315157A5 (enExample)
TWM325532U (en) System module without fan for heat dissipation
JP2006233836A (ja) ポンプ
JP2002064167A (ja) 冷却装置
JPH10173371A (ja) 電子機器の筐体構造
CN206251554U (zh) 壳体、散热组件和移动终端
CN212623529U (zh) 一种摄影机散热装置
JPH11318695A (ja) 家庭用加熱機器
JP2003243860A (ja) 電子機器
JP3960102B2 (ja) 冷却モジュール