US20050244291A1 - Pump and electronic apparatus having this pump - Google Patents
Pump and electronic apparatus having this pump Download PDFInfo
- Publication number
- US20050244291A1 US20050244291A1 US11/074,823 US7482305A US2005244291A1 US 20050244291 A1 US20050244291 A1 US 20050244291A1 US 7482305 A US7482305 A US 7482305A US 2005244291 A1 US2005244291 A1 US 2005244291A1
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- United States
- Prior art keywords
- pump
- rotary member
- disposed
- heat
- housing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D13/00—Pumping installations or systems
- F04D13/02—Units comprising pumps and their driving means
- F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
- F04D13/0673—Units comprising pumps and their driving means the pump being electrically driven the motor being of the inside-out type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a pump disposed in a liquid-cooling type cooling device which cools, using a liquid refrigerant, a heat generating element such as a central processing unit (CPU), and an electronic apparatus comprising this pump.
- a liquid-cooling type cooling device which cools, using a liquid refrigerant, a heat generating element such as a central processing unit (CPU), and an electronic apparatus comprising this pump.
- CPU central processing unit
- a pump described in Jpn. Pat. Appln. KOKAI Publication No. 2003-343492 has been known.
- This pump has a concave portion in one end face, and comprises a disc-shaped impeller having a plurality of vanes on the other end face.
- This impeller has a magnetic field generation portion on an inner periphery of the concave portion.
- the magnetic field generation portion is constituted by fixing an annular member comprising a permanent magnet onto the concave portion of the impeller formed of a resin.
- the impeller is formed of a plastic magnet, and a portion corresponding to the magnetic field generation portion is magnetized.
- a pump described in Jpn. Pat. Appln. KOKAI Publication No. 11-166500 has been known. It is known that this pump comprises a motor including a stator having a plurality of coils, and a rotor made of a permanent magnet.
- the stator is molded out of a resin to thereby constitute a molded stator.
- the rotor is molded out of a resin to thereby constitute a cylindrical molded rotor.
- the vanes constituting the impeller protrude from an outer periphery of the molded rotor.
- a heating amount during operation tends to increase with speeding-up of a process or multi-function.
- an electronic apparatus comprising a so-called liquid-cooling type cooling device has been put into practical use.
- the device cools the CPU by mean of a liquid refrigerant having a specific heat much higher than that of air.
- this cooling device there has been a demand for a pump which has a stable pumping performance and which is capable of cooling the heat generating element satisfactorily for an extend period.
- the pump is preferably constituted in such a manner as to rotate a rotary member such as an impeller by the motor having the stator and a rotor magnet constituted of a permanent magnet.
- a rotary member such as an impeller by the motor having the stator and a rotor magnet constituted of a permanent magnet.
- the pump in the pump constituted by fixing an annular member (rotor magnet) constituted of the permanent magnet to the concave portion of the impeller formed of a resin, the rotor magnet is exposed to the liquid refrigerant in a pump chamber. Therefore, in the pump constituted in this manner, the rotor magnet is easily corroded by the liquid refrigerant.
- the rotor magnet is corroded by the liquid refrigerant, there is a possibility that the performance of the motor drops, the liquid refrigerant is contaminated, and the cooling effect of the refrigerant drops.
- the stator is molded out of the resin, the vanes constituting the impeller are protruded on the outer periphery of the cylindrical molded rotor, and it is therefore difficult to miniaturize the pump. Therefore, it is difficult to mount the pump constituted in this manner onto the electronic apparatus constituted by arranging various components in a comparatively dense manner.
- FIG. 1 is a perspective view showing a portable computer according to a first embodiment of the present invention
- FIG. 2 is a perspective view of the portable computer of FIG. 1 as viewed from the side of a plurality of exhaust ports of the first housing;
- FIG. 3 is a plan view showing a cooling device contained in the first housing
- FIG. 4 is an exploded perspective view of a pump
- FIG. 5 is a perspective view of the pump in a state in which a second cover is omitted;
- FIG. 6 is a perspective view showing one example of another rotary member capable of being disposed in the pump
- FIG. 7 is a sectional view cut along line VII-VII in FIG. 3 ;
- FIG. 8 is a sectional view showing the positional relation ships between the pump and a CPU in a portable computer according to a second embodiment of the present invention.
- FIGS. 1 and 2 show a portable computer 1 which is an electronic apparatus.
- the portable computer 1 comprises a main unit 2 , and a display unit 3 .
- the main unit 2 comprises a first housing 10 having a flat box shape.
- the first housing 10 comprises a bottom wall 11 a , an upper wall 11 b , a front wall 11 c , right and left side walls 11 e , 11 d , and a rear wall 11 f.
- the upper wall 11 b has a palm rest 12 and a keyboard attaching portion 13 .
- the keyboard attaching portion 13 is disposed behind the palm rest 12 .
- a keyboard 14 is attached to the keyboard attaching portion 13 .
- the front wall 11 c , right and left side walls 11 e , 11 d , and rear wall 11 f constitute a peripheral wall along a peripheral direction of the first housing 10 .
- a plurality of exhaust ports 15 are formed in the peripheral wall of the first housing 10 , for example, the rear wall 11 f . These exhaust ports 15 are arranged in a row in a width direction of the first housing 10 .
- the display unit 3 comprises a second housing 20 having a flat box shape, and a liquid crystal display panel 21 which is a display panel.
- the liquid crystal display panel 21 is contained in the second housing 20 .
- the liquid crystal display panel 21 has a screen 21 a which displays an image.
- the screen 21 a of the liquid crystal display panel 21 is exposed to the outside of the second housing 20 through an opening 22 formed in the front surface of the second housing 20 .
- the second housing 20 is supported on a rear end portion of the first housing 10 via a hinge (not shown). Therefore, the display unit 3 is rotatable over a closed position in which the unit is reclined in such a manner as to cover the palm rest 12 and the keyboard 14 from above, and an opened position in which the unit rises in such a manner as to expose the palm rest 12 , keyboard 14 , and screen 21 a.
- a printed circuit board 30 is contained in the first housing 10 . As shown in FIG. 7 , the printed circuit board 30 is disposed parallel to the bottom wall 11 a of the first housing 10 .
- a CPU 31 which is a heat generating element is mounted on an upper surface of the printed circuit board 30 .
- the CPU 31 is constituted by a microprocessor which is the nucleus of the portable computer 1 .
- the CPU 31 has a base substrate 32 and an IC chip 33 disposed in a middle portion of the upper substrate of the base substrate 32 and having a flat square shape.
- the heat output of the IC chip 33 during operation is very large as a result at speeding-up of processing or increasing of functions, and cooling is required in order to maintain stable operation.
- a liquid-cooling type cooling device 40 which cools the CPU 31 using a liquid refrigerant such as an antifreeze liquid is mounted in this portable computer 1 .
- the cooling device 40 is contained in the first housing 10 .
- the cooling device 40 comprises a pump 100 which functions both as a heat receiving portion and a heat exchange unit, a heat radiating portion 50 , a circulation path 60 , an electromotive fan 70 and the like.
- the pump 100 forcedly circulates the liquid refrigerant in the circulation path 60 , and comprises a pump housing 101 which also functions as the heat receiving portion, a rotary member 102 , a motor 103 having a rotor magnet 103 a and a stator 103 b , and a control substrate 104 .
- the pump housing 101 comprises a housing main body 110 , a first cover 111 , and a second cover 112 .
- the housing body 110 has a flat box shape which is one size larger than the CPU 31 , and has a concave portion 113 opened upwards.
- the housing body 110 comprises a main portion 121 having a frame shape, and a heat receiving plate 122 which is a heat receiving portion to close a downward opened opening end of the main portion 121 in a liquid-tight manner. That is, the concave portion 113 is defined by an inner surface of the main portion 121 and an upper surface of the heat receiving plate 122 .
- the heat receiving plate 122 which also functions as the bottom wall of the concave portion 113 faces the CPU 31 .
- the lower surface of the heat receiving plate 122 forms a flat heat receiving surface 122 a .
- the heat receiving plate 122 is preferably formed of a metal material having high thermal conductivity such as copper, aluminum, and aluminum alloy.
- An O-ring 124 is disposed between the main portion 121 and the heat receiving plate 122 . It is to be noted that The housing body 110 may have an integral structure.
- the first cover 111 formed of a resin closes the opening end of the concave portion 113 in a liquid-tight manner.
- An O-ring 123 is disposed between The housing body 110 and the first cover 111 .
- the upper surface of the first cover 111 has a stator containing concave portion 115 which contains the stator 103 b , and a control substrate containing concave portion 116 which contains the control substrate 104 .
- An inner portion of the pump housing 101 that is, a region surrounded with the concave portion 113 and the first cover 111 is partitioned into a pump chamber 118 , and a reserve tank 119 which accumulates the liquid refrigerant by an annular partition wall 117 .
- the partition wall 117 is formed integrally with The housing body 110 (main portion 121 in the present embodiment).
- the pump chamber 118 is disposed in the vicinity of one corner portion among four corner portions of the pump housing 101 . That is, the center position of the pump chamber 118 is eccentric with respect to that of the pump housing 101 .
- the reserve tank 119 is disposed in such a manner as to surround the pump chamber 118 from the remaining three corner portions among four corner portions of the pump housing 101 .
- a communication port 130 which allows communication between the pump chamber 118 and the reserve tank 119 is formed in the partition wall 117 .
- the housing body 110 (main portion 121 in the present embodiment) is provided with a suction tube 131 and a discharge tube 132 .
- the suction tube 131 and the discharge tube 132 are arranged horizontally with an interval therebetween.
- An upstream end of the suction tube 131 protrudes outwards via the side wall (main portion 121 in the present embodiment) of the housing body 110 .
- a downstream end of the suction tube 131 opens in the reserve tank 119 , and faces the communication port 130 of the partition wall 117 .
- the downstream end of the discharge tube 132 protrudes to the outside via the side wall (main portion 121 in the present embodiment) of The housing body 110 , and is aligned with the upstream end of the suction tube 131 .
- the upstream end of the discharge tube 132 opens into the pump chamber 118 through the partition wall 117 .
- the rotary member 102 has a disc-shaped rotary portion 102 b and a rotation shaft 102 a formed integrally with the rotary portion 102 b .
- the rotary portion 102 b has a surface (this surface will be hereinafter referred to as the lower surface) facing the heat receiving plate 122 , and a surface (this surface will be hereinafter referred to as the upper surface) 108 b opposite to the lower surface 108 a .
- the rotary member 102 is contained in the pump chamber 118 in a posture in which an axis of the rotation shaft 102 a crosses the heat receiving plate 122 , for example, at right angles.
- the rotation shaft 102 a is rotatably supported by the first cover 111 and the heat receiving plate 122 in a state in which the rotation shaft 102 a extends over the first cover 111 and the heat receiving plate 122 .
- the motor 103 rotates the rotary member 102 , and has a rotor magnet 103 a and a stator 103 b .
- the rotor magnet 103 a is constituted, for example, of an annular permanent magnet in which a plurality of cathodes and anodes are mutually magnetized.
- the rotor magnet 103 a is fixed to the rotary member 102 coaxially with the rotary member 102 , and contained in the pump chamber 118 .
- At least a region of the rotor magnet 103 a facing the pump chamber 118 in the outer surface of the magnet is covered with the rotary member 102 in such a manner that the magnet does not contact the liquid refrigerant in the pump chamber 118 .
- the whole region of the outer surface of the rotor magnet 103 a is covered with the rotary member 102 .
- the rotor magnet 103 a is disposed in such a manner as to extend along the peripheral edge of the upper surface 108 b of the rotary portion 102 b and to protrude upwards, and is covered with a part of the rotary member 102 .
- the rotary member 102 is molded/formed, for example, by inserting the rotor magnet 103 a.
- the rotary portion 102 b has a protruding portion 109 disposed along the peripheral edge of the upper surface 108 b and protruding in a direction (upward) opposite to a direction (downward) of the heat receiving plate 122 .
- the rotor magnet 103 a is disposed in the protruding portion 109 . It is to be noted that in the present embodiment, the rotor magnet 103 a is formed in such a manner that the length of the magnet in a direction crossing the rotation shaft 102 a at right angles is less than that in a direction parallel to the rotation shaft 102 a is shorter and a sectional shape is vertically long rectangular shape (see FIG. 7 ).
- the rotary member 102 has a stirring portion 107 for stirring the liquid refrigerant in the pump chamber 118 on at least one of the lower surface 108 a and the upper surface 108 b of the rotary portion 102 b .
- the stirring portion 107 is disposed on the lower surface 108 a of the rotary member 102 , the liquid refrigerant can be satisfactorily passed in the vicinity of the heat receiving plate 122 . Therefore, when the stirring portion 107 is disposed on the lower surface 108 a of the rotary member 102 , a cooling effect of the CPU 31 can be enhanced.
- the efficiency of the pump 100 can be raised.
- the stirring portion 107 may be disposed on at least the lower surface of the rotary member 102 .
- the portable computer 1 has been required to be made this. Therefore, when the pump 100 is mounted on an electronic apparatus as in the portable computer 1 , the pump is preferably as thin as possible.
- the stirring portion 107 may be disposed only on the lower surface of the rotary member 102 .
- the pump 100 can be made this as compared with a case where the stirring portions 107 are disposed on opposite surfaces (upper and lower surfaces) of the rotary member 102 .
- an impeller constituted by disposing the stirring portion 107 having a plurality of vanes 105 on the lower surface of the rotary portion 102 b is adopted as the rotary member 102 .
- a rotary member shown in FIG. 6 that is, the rotary member constituted by disposing the stirring portions 107 on the upper and lower surfaces of the rotary portion 102 b may be adopted.
- the stirring portion 107 is disposed on the upper surface 108 b of the rotary member 102
- the stirring portion 107 is preferably disposed on a tip surface of the protruding portion 109 as shown in FIG. 6
- the stirring portion 107 may be disposed in a region other than the tip surface of the protruding portion 109 .
- the rotary member 102 is not limited as long as the rotary member is capable of stirring a fluid such as a liquid refrigerant in the pump chamber 118 , and feeding the fluid to the outside of the pump chamber 118 from the inside of the pump chamber 118 . Therefore, the rotary member 102 is not limited to a member (impeller) comprising the stirring portion 107 having the vanes 105 .
- the rotary member 102 may comprise the stirring portion 107 having, for example, a plurality of concave portions 106 (see FIG. 6 ). Even when this rotary member 102 is adopted, the fluid in the pump chamber 118 can be stirred, and fed to the outside of the pump chamber 118 from the inside of the pump chamber 118 .
- the rotary member 102 may comprise the stirring portion 107 having, for example, a spirally formed groove.
- the stator 103 b constituting the motor 103 is contained in the stator containing concave portion 115 formed in the upper surface of the first cover 111 . Additionally, the stator 103 b needs to be disposed corresponding to the rotor magnet 103 a via the first cover 111 . Therefore, the stator containing concave portion 115 is disposed in a position facing the rotor magnet 103 a . The center position of the stator containing concave portion 115 is eccentric with respect to that of the first cover 111 .
- the control substrate containing concave portion 116 is disposed in a position avoiding the stator containing concave portion 115 .
- the opening of the concave portion 13 is closed by the first cover 111 , and accordingly the stator containing concave portion 115 is formed in such a manner as to enter the rotor magnet 103 a . That is, the stator 103 b is coaxially disposed inside the rotor magnet 103 a via the first cover 111 . The stator 103 b is electrically connected to the control substrate 104 .
- Electric conduction with respect to the stator 103 b is performed, for example, simultaneously with power supply to the portable computer 1 .
- a rotary magnet field is generated in the peripheral direction of the stator 103 b , and the magnet field is magnetically bonded to the rotor magnet 103 a .
- a rotary torque extending along the peripheral direction of the rotary member 102 is generated between the stator 103 b and the rotor magnet 103 a , and the rotary member 102 rotates.
- the second cover 112 is fixed to the upper surface of the first cover 111 .
- the stator 103 b and the control substrate 104 are covered with the second cover 112 .
- the second cover 112 is a cover for inhibiting leak or evaporation of the liquid refrigerant, and is formed by a metal material such as an aluminum alloy. It is to be noted that the second cover 112 may be omitted.
- the pump 100 constituted in this manner is placed on the printed circuit board 30 in such a manner as to cover the CPU 31 from above.
- the pump housing 101 of the pump 100 is fixed to the bottom wall 11 a of the first housing 10 together with the printed circuit board 30 .
- the bottom wall 11 a has boss portions 17 in positions corresponding to four corner portions of the pump housing 101 .
- the boss portions 17 protrudes upwards from the bottom wall 11 a .
- the printed circuit board 30 is superimposed upon the tip surfaces of the boss portions 17 .
- reference numeral 34 in FIG. 7 denotes a reinforcing plate which reinforces the printed circuit board 30 from the lower surface.
- the pump 100 is attached to the bottom wall 11 a of the first housing 10 in such a manner as to cover the CPU 31 from above by the following attaching mechanism.
- Concave portions 141 are disposed in four corner portions of the pump housing 101 .
- a bottom wall (corner portions of the heat receiving plate 122 ) which defines the concave portions 141 has through holes 142 through which cylindrical inserts 143 are passed.
- the inserts 143 have protruding portions 143 a protruding outwards in a horizontal direction along a peripheral direction on upper ends of the inserts.
- the inserts 143 have groove portions 143 b extending along the peripheral direction.
- the pump 100 is pressed onto the CPU 31 as follows by this attaching mechanism.
- the inserts 143 are passed through coil springs 144 .
- This insert 143 is inserted from the upward opened opening end of the concave portion 141 of the first cover 111 , and the groove portion 143 b is positioned below the heat receiving surface 122 a of the pump 100 .
- a C-ring 145 to prevent dropping is fitted in the groove portion 143 b . Accordingly, the inserts 143 are attached to the pump 100 while the protruding portions 143 a are urged by the coil springs 144 in a direction detached from the bottom wall defining the concave portions 141 .
- a conductive grease (not shown) is applied to the upper surface of the IC chip 33 or a region of the heat receiving surface 122 a corresponding to the IC chip 33 , and the heat receiving surface 122 a of the pump housing 101 is disposed facing the IC chip 33 .
- Screws 146 passed through the inserts 143 are screwed into the boss portions 17 on the printed circuit board 30 . Accordingly, the inserts 143 are fixed to the boss portions 17 , and the pump 100 is pressed onto the IC chip 33 by elasticity of the coil spring 146 . Accordingly, the IC chip 33 is thermally connected to the heat receiving surface 122 a of the pump housing 101 via the conductive grease.
- the pump 100 is fixed onto the printed circuit board 30 in such a manner that a center (center of the heat receiving surface 122 a ) of the pump housing 101 agrees with that of the IC chip 33 .
- the center (rotation shaft 102 a ) of the rotary member 102 is eccentric from that of the pump housing 101 . Therefore, the center of the IC chip 33 is eccentric from that of the rotary member 102 facing the chip via the pump housing 101 . Consequently, more heat from the IC chip 33 can be absorbed by the liquid refrigerant.
- the IC chip 33 is preferably disposed facing a position where the liquid refrigerant flows fast via the pump housing 101 .
- a flow of the liquid refrigerant generated by rotation of the rotor magnet 103 a becomes fast away from the center of the rotary member 102 . Therefore, by the constitution, more heat from the IC chip 33 can be absorbed by the liquid refrigerant.
- the heat radiating portion 50 comprises a heat radiating portion main body 51 and a plurality of heat emitting fins 57 thermally connected to the heat radiating portion main body 51 .
- the heat radiating portion main body 51 comprises a substantially U-shape pipe in which the liquid refrigerant flows.
- the heat radiating portion main body 51 has a refrigerant inlet 54 and a refrigerant outlet (not shown, disposed inside the drawing surface from the refrigerant inlet in FIG. 3 ) in such a manner that the refrigerant flows inside. That is, one opening end of the substantially U-shaped pipe constitutes the refrigerant inlet 54 , and the other opening end constitutes the refrigerant outlet. That is, the pipe (heat radiating portion main body 51 ) of the heat radiating portion 50 constitutes a part of the circulation path 60 (the circulation path 60 will be described later in detail).
- the heat radiating portion main body 51 is contained in the first housing 10 in a posture (transversely reclined posture) obtained by rotating the substantially U-shaped pipe by 90° in such a manner that the refrigerant inlet 54 is disposed above and the refrigerant outlet is disposed below.
- the heat emitting fins 57 are formed, for example, of metal materials superior in thermal conductivity, such as aluminum alloy and copper.
- the heat emitting fins 57 are formed in square plate shapes.
- the heat emitting fins 57 are arranged parallel to one another at intervals.
- the respective heat emitting fins 57 are soldered to the heat radiating portion main body 51 .
- the heat radiating portion 50 is contained in the first housing 10 in a posture in which the heat emitting fins 57 are disposed facing the exhaust ports 15 of the first housing 10 .
- a pair of brackets 58 are soldered to the heat radiating portion 50 .
- These brackets 58 are fixed to the boss portions (not shown) protruding from the bottom wall 11 a of the first housing 10 by screws.
- the heat radiating portion 50 is fixed to the bottom wall 11 a of the first housing 10 .
- the circulation path 60 comprises a first tube 61 , a second tube 62 , and the pipe (heat radiating portion main body 51 ) of the heat radiating portion 50 . That is, the heat radiating portion main body 51 functions as both the heat radiating portion 50 and the circulation path 60 .
- the first tube 61 connects the discharge tube 132 of the pump 100 to the refrigerant inlet 54 of the heat radiating portion 50 .
- the second tube 62 connects the suction tube 131 of the pump 100 to the refrigerant outlet of the heat radiating portion 50 . Therefore, the liquid refrigerant is circulated between the pump 100 and the heat radiating portion 50 through the first tube 61 and second tube 62 .
- the electromotive fan 70 feeds cooling air to the heat radiating portion 50 , and is disposed immediately before the heat radiating portion 50 .
- the electromotive fan 70 comprises a fan casing 71 and a centrifugal impeller 72 contained in the fan casing 71 .
- the fan casing 71 has a discharge port 71 a which discharges the cooling air.
- the discharge port 71 a is connected to the heat radiating portion 50 via a duct 73 .
- the impeller 72 is rotated/driven by a motor (not shown), for example, when the power supply of the portable computer 1 is turned on, or the temperature of the CPU 31 reaches a predetermined temperature. Accordingly, cooling air is supplied to the heat radiating portion 50 from the discharge port 71 a of the fan casing 71 .
- the IC chip 33 of the CPU 31 generates heat.
- the heat generated by the IC chip 33 is conducted to the pump housing 101 via the heat receiving surface 122 a of the pump 100 . Since the concave portion 113 (pump chamber 118 and reserve tank 119 ) of the pump housing 101 is filled with the liquid refrigerant, the liquid refrigerant absorbs much heat conducted to the pump housing 101 .
- the electric conduction to the stator 103 b of the motor 103 is performed, for example, simultaneously with the turning-on of the power supply to the portable computer 1 . Accordingly, a rotation torque is generated between the stator 103 b and the rotor magnet 103 a , and the rotor magnet 103 a rotates together with the rotary member 102 .
- the rotary member 102 rotates, the liquid refrigerant in the pump chamber 118 is pressurized, discharged from the discharge tube 132 , and guided into the heat radiating portion 50 from the refrigerant inlet 54 via the first tube 61 .
- the liquid refrigerant heated by heat exchange in the pump housing 101 circulates toward the refrigerant outlet from the refrigerant inlet 54 in the heat radiating portion 50 , and the heat from the IC chip 33 absorbed by the liquid refrigerant is conducted to the heat emitting fins 57 in the process.
- the cooling air blows toward the heat radiating portion 50 from the discharge port 71 a of the fan casing 71 .
- This cooling air passes among the heat emitting fins 57 disposed adjacent to one another. Accordingly, the heat emitting fins 57 and the heat radiating portion main body 51 are cooled, and much of heat conducted to the heat emitting fins 57 or the heat radiating portion main body 51 rides on the flow of the cooling air, and is discharged to the outside of the first housing 10 from the exhaust ports 15 .
- the liquid refrigerant cooled by the heat radiating portion 50 is guided to the suction tube 131 of the pump housing 101 via the second tube 62 .
- This liquid refrigerant is returned to the reserve tank 119 from the suction tube 131 .
- the liquid refrigerant returned to the reserve tank 119 absorbs the heat from the IC chip 33 again while sucked into the pump chamber 118 .
- the heat from the IC chip 33 is successively transferred to the heat radiating portion 50 , rides on the flow of the cooling air passing through the heat radiating portion 50 , and is discharged to the outside of the first housing 10 .
- the pump 100 of the present embodiment comprises the heat receiving plate 122 thermally connected to the heat generating element comprising the CPU 31 , and the pump housing 101 having the pump chamber 118 in which the liquid refrigerant is contained. That is, the pump 100 has a function of the heat receiving portion, and that of the heat exchange unit. Therefore, the pump 100 can be preferably used in the above-described cooling device 40 mounted on the portable computer 1 .
- the rotary member 102 formed of a resin is molded and formed by covering the rotor magnet 103 a . Therefore, the rotor magnet 103 a does not contact the liquid refrigerant in the pump chamber 118 . Therefore, the rotor magnet 103 a can be inhibited from being corroded by the liquid refrigerant. Consequently, a drop in the performance of the motor 103 caused by corrosion of the rotor magnet 103 a by the liquid refrigerant, or a drop in the cooling effect by contamination of the liquid refrigerant can be inhibited. Therefore, according to the pump 100 , the heat generating element like the CPU 31 can be satisfactorily cooled for an extended period.
- the pump 100 comprises the rotary member 102 having the stirring portion 107 for stirring the liquid refrigerant in the pump chamber 118 on one surface of the lower surface 108 a and the upper surface 108 b . Therefore, the pump 100 can be formed to be thin as compared with the pump comprising the impeller on whose peripheral surface the vanes are disposed.
- the stirring portion 107 for stirring the liquid refrigerant in the pump chamber 118 is disposed only on the lower surface 108 a of the rotary member 102 . Therefore, the pump 100 can efficiently cool the heat generating element like the CPU 31 , and can be formed to be thinner as compared with a case where the stirring portion 107 is disposed on the lower surface 108 a and the upper surface 108 b of the rotary member 102 .
- the protruding portion 109 is disposed along the peripheral edge of the upper surface 108 b of the rotary portion 102 b of the rotary member 102 , and protrudes upwards.
- the rotor magnet 103 a is disposed in the protruding portion 109 . Therefore, when the stator 103 b is disposed in the protruding portion 109 , the motor 103 can be easily constituted by the rotor magnet 103 a and the stator 103 b . Therefore, even when the rotor magnet 103 a is disposed in the rotary member 102 , the rotary member 102 can be satisfactorily rotated.
- the portable computer 1 of the present embodiment comprises the heat radiating portion 50 which discharges the heat of the CPU 31 ; the pump 100 which feeds the refrigerant to the heat radiating portion 50 ; and the circulation path 60 which circulates the liquid refrigerant between the pump 100 and the heat radiating portion 50 and which transfers the heat from the CPU to the heat radiating portion 50 via the liquid refrigerant. Therefore, the CPU 31 can be satisfactorily cooled by the portable computer 1 of the present embodiment for an extended period.
- a second embodiment of the present invention will be described with reference to FIG. 8 .
- a pump 100 disposed in a portable computer 1 of the present embodiment is different from the pump 100 of the first embodiment in a sectional shape of a rotor magnet 103 a . That is, in the present embodiment, the rotor magnet 103 a is formed in such a manner as to have a flat rectangular sectional shape of the magnet, whose length in a direction crossing a rotation shaft 102 a at right angles is greater than that in a direction parallel to the rotation shaft 102 a . It is to be noted that another constitution is the same as that of the first embodiment including portions (not shown), and therefore denoted with the same reference numerals, and redundant description is omitted.
- the rotor magnet 103 a is formed in such a manner as to have a flat rectangular sectional shape whose length in a direction crossing the rotation shaft 102 a at right angles is greater than that in a direction parallel to the rotation shaft 102 a .
- a protruding height of a protruding portion 109 of a rotary member 102 can be reduced. Therefore, according to the pump 100 of the present embodiment, a heat generating element like a CPU 31 can be satisfactorily cooled for an extended period in the same manner as in the pump 100 of the first embodiment. Therefore, the pump can be formed to be thin as compared with the pump 100 of the first embodiment.
- the heat generating element like the CPU 31 can be satisfactorily cooled for an extended period in the same manner as in the portable computer 1 of the first embodiment, and can be made thin as compared with the portable computer 1 of the first embodiment.
- the stirring portion 107 is disposed only on the lower surface 108 a of the rotary member 102 , but the stirring portion 107 may be disposed on at least one of the lower surface 108 a and the upper surface 108 b of the rotary member 102 . That is, the stirring portion 107 may be disposed only on the upper surface 108 b of the rotary member 102 .
- the pump of the present invention can be broadly used not only in an electronic apparatus like the portable computer and the cooling device mounted in the apparatus but also in another apparatus.
- the electronic apparatus of the present invention is not limited to a portable computer, and can be broadly used in a heat generating element and the apparatus comprising the cooling device which cools the heat generating element.
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
Abstract
A pump includes: a housing having a heating receiving portion thermally connected to a heat generating element and a pump chamber; a stator; and a rotary member disposed in the pump chamber, and having a stirring portion which stirs a fluid in the pump chamber and a magnet contained within the rotary member.
Description
- This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2004-133537, filed Apr. 28, 2004, the entire contents of which are incorporated herein by reference.
- 1. Field
- The present invention relates to a pump disposed in a liquid-cooling type cooling device which cools, using a liquid refrigerant, a heat generating element such as a central processing unit (CPU), and an electronic apparatus comprising this pump.
- 2. Description of the Related Art
- As a pump, a pump described in Jpn. Pat. Appln. KOKAI Publication No. 2003-343492 has been known. This pump has a concave portion in one end face, and comprises a disc-shaped impeller having a plurality of vanes on the other end face. This impeller has a magnetic field generation portion on an inner periphery of the concave portion. The magnetic field generation portion is constituted by fixing an annular member comprising a permanent magnet onto the concave portion of the impeller formed of a resin. As to the magnetic field generation portion, the impeller is formed of a plastic magnet, and a portion corresponding to the magnetic field generation portion is magnetized.
- As another pump, a pump described in Jpn. Pat. Appln. KOKAI Publication No. 11-166500 has been known. It is known that this pump comprises a motor including a stator having a plurality of coils, and a rotor made of a permanent magnet. The stator is molded out of a resin to thereby constitute a molded stator. The rotor is molded out of a resin to thereby constitute a cylindrical molded rotor. The vanes constituting the impeller protrude from an outer periphery of the molded rotor.
- Additionally, in the central processing unit (CPU) for use in an electronic apparatus, a heating amount during operation tends to increase with speeding-up of a process or multi-function. As this thermal countermeasure, in recent years, an electronic apparatus comprising a so-called liquid-cooling type cooling device has been put into practical use. The device cools the CPU by mean of a liquid refrigerant having a specific heat much higher than that of air. In this cooling device, there has been a demand for a pump which has a stable pumping performance and which is capable of cooling the heat generating element satisfactorily for an extend period.
- To obtain a stable performance as the pump, the pump is preferably constituted in such a manner as to rotate a rotary member such as an impeller by the motor having the stator and a rotor magnet constituted of a permanent magnet. However, as described in the Jpn. Pat. Appln. KOKAI Publication No. 2003-343492, in the pump constituted by fixing an annular member (rotor magnet) constituted of the permanent magnet to the concave portion of the impeller formed of a resin, the rotor magnet is exposed to the liquid refrigerant in a pump chamber. Therefore, in the pump constituted in this manner, the rotor magnet is easily corroded by the liquid refrigerant. When the rotor magnet is corroded by the liquid refrigerant, there is a possibility that the performance of the motor drops, the liquid refrigerant is contaminated, and the cooling effect of the refrigerant drops.
- Moreover, in the pump described in the Jpn. Pat. Appln. KOKAI Publication No. 11-166500, the stator is molded out of the resin, the vanes constituting the impeller are protruded on the outer periphery of the cylindrical molded rotor, and it is therefore difficult to miniaturize the pump. Therefore, it is difficult to mount the pump constituted in this manner onto the electronic apparatus constituted by arranging various components in a comparatively dense manner.
- The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention, and together with the general description given above and the detailed description of the embodiments given below, serve to explain the principles of the invention.
-
FIG. 1 is a perspective view showing a portable computer according to a first embodiment of the present invention; -
FIG. 2 is a perspective view of the portable computer ofFIG. 1 as viewed from the side of a plurality of exhaust ports of the first housing; -
FIG. 3 is a plan view showing a cooling device contained in the first housing; -
FIG. 4 is an exploded perspective view of a pump; -
FIG. 5 is a perspective view of the pump in a state in which a second cover is omitted; -
FIG. 6 is a perspective view showing one example of another rotary member capable of being disposed in the pump; -
FIG. 7 is a sectional view cut along line VII-VII inFIG. 3 ; and -
FIG. 8 is a sectional view showing the positional relation ships between the pump and a CPU in a portable computer according to a second embodiment of the present invention. - A first embodiment of the present invention will be described hereinafter with reference to FIGS. 1 to 7.
FIGS. 1 and 2 show a portable computer 1 which is an electronic apparatus. The portable computer 1 comprises amain unit 2, and adisplay unit 3. Themain unit 2 comprises afirst housing 10 having a flat box shape. Thefirst housing 10 comprises abottom wall 11 a, anupper wall 11 b, afront wall 11 c, right andleft side walls rear wall 11 f. - As shown in
FIG. 1 , theupper wall 11 b has apalm rest 12 and akeyboard attaching portion 13. Thekeyboard attaching portion 13 is disposed behind thepalm rest 12. Akeyboard 14 is attached to thekeyboard attaching portion 13. Thefront wall 11 c, right andleft side walls rear wall 11 f constitute a peripheral wall along a peripheral direction of thefirst housing 10. - As shown in
FIG. 2 , a plurality ofexhaust ports 15 are formed in the peripheral wall of thefirst housing 10, for example, therear wall 11 f. Theseexhaust ports 15 are arranged in a row in a width direction of thefirst housing 10. - As shown in
FIG. 1 , thedisplay unit 3 comprises asecond housing 20 having a flat box shape, and a liquidcrystal display panel 21 which is a display panel. The liquidcrystal display panel 21 is contained in thesecond housing 20. The liquidcrystal display panel 21 has ascreen 21 a which displays an image. Thescreen 21 a of the liquidcrystal display panel 21 is exposed to the outside of thesecond housing 20 through anopening 22 formed in the front surface of thesecond housing 20. - The
second housing 20 is supported on a rear end portion of thefirst housing 10 via a hinge (not shown). Therefore, thedisplay unit 3 is rotatable over a closed position in which the unit is reclined in such a manner as to cover thepalm rest 12 and thekeyboard 14 from above, and an opened position in which the unit rises in such a manner as to expose thepalm rest 12,keyboard 14, andscreen 21 a. - As shown in
FIG. 3 , a printedcircuit board 30 is contained in thefirst housing 10. As shown inFIG. 7 , the printedcircuit board 30 is disposed parallel to thebottom wall 11 a of thefirst housing 10. ACPU 31 which is a heat generating element is mounted on an upper surface of the printedcircuit board 30. TheCPU 31 is constituted by a microprocessor which is the nucleus of the portable computer 1. - The
CPU 31 has abase substrate 32 and anIC chip 33 disposed in a middle portion of the upper substrate of thebase substrate 32 and having a flat square shape. The heat output of theIC chip 33 during operation is very large as a result at speeding-up of processing or increasing of functions, and cooling is required in order to maintain stable operation. - As shown in
FIG. 3 , a liquid-coolingtype cooling device 40 which cools theCPU 31 using a liquid refrigerant such as an antifreeze liquid is mounted in this portable computer 1. Thecooling device 40 is contained in thefirst housing 10. Thecooling device 40 comprises apump 100 which functions both as a heat receiving portion and a heat exchange unit, aheat radiating portion 50, acirculation path 60, anelectromotive fan 70 and the like. - As shown in
FIGS. 4, 5 , and 7, thepump 100 forcedly circulates the liquid refrigerant in thecirculation path 60, and comprises apump housing 101 which also functions as the heat receiving portion, arotary member 102, amotor 103 having arotor magnet 103 a and astator 103 b, and acontrol substrate 104. - The
pump housing 101 comprises a housingmain body 110, afirst cover 111, and asecond cover 112. Thehousing body 110 has a flat box shape which is one size larger than theCPU 31, and has aconcave portion 113 opened upwards. - The
housing body 110 comprises amain portion 121 having a frame shape, and aheat receiving plate 122 which is a heat receiving portion to close a downward opened opening end of themain portion 121 in a liquid-tight manner. That is, theconcave portion 113 is defined by an inner surface of themain portion 121 and an upper surface of theheat receiving plate 122. Theheat receiving plate 122 which also functions as the bottom wall of theconcave portion 113 faces theCPU 31. The lower surface of theheat receiving plate 122 forms a flatheat receiving surface 122 a. Theheat receiving plate 122 is preferably formed of a metal material having high thermal conductivity such as copper, aluminum, and aluminum alloy. An O-ring 124 is disposed between themain portion 121 and theheat receiving plate 122. It is to be noted that Thehousing body 110 may have an integral structure. - The
first cover 111 formed of a resin closes the opening end of theconcave portion 113 in a liquid-tight manner. An O-ring 123 is disposed between Thehousing body 110 and thefirst cover 111. The upper surface of thefirst cover 111 has a stator containingconcave portion 115 which contains thestator 103 b, and a control substrate containingconcave portion 116 which contains thecontrol substrate 104. - An inner portion of the
pump housing 101, that is, a region surrounded with theconcave portion 113 and thefirst cover 111 is partitioned into apump chamber 118, and areserve tank 119 which accumulates the liquid refrigerant by anannular partition wall 117. Thepartition wall 117 is formed integrally with The housing body 110 (main portion 121 in the present embodiment). - The
pump chamber 118 is disposed in the vicinity of one corner portion among four corner portions of thepump housing 101. That is, the center position of thepump chamber 118 is eccentric with respect to that of thepump housing 101. Thereserve tank 119 is disposed in such a manner as to surround thepump chamber 118 from the remaining three corner portions among four corner portions of thepump housing 101. Acommunication port 130 which allows communication between thepump chamber 118 and thereserve tank 119 is formed in thepartition wall 117. - The housing body 110 (
main portion 121 in the present embodiment) is provided with asuction tube 131 and adischarge tube 132. Thesuction tube 131 and thedischarge tube 132 are arranged horizontally with an interval therebetween. An upstream end of thesuction tube 131 protrudes outwards via the side wall (main portion 121 in the present embodiment) of thehousing body 110. A downstream end of thesuction tube 131 opens in thereserve tank 119, and faces thecommunication port 130 of thepartition wall 117. - The downstream end of the
discharge tube 132 protrudes to the outside via the side wall (main portion 121 in the present embodiment) of Thehousing body 110, and is aligned with the upstream end of thesuction tube 131. The upstream end of thedischarge tube 132 opens into thepump chamber 118 through thepartition wall 117. - As best shown in
FIG. 7 , therotary member 102 has a disc-shapedrotary portion 102 b and arotation shaft 102 a formed integrally with therotary portion 102 b. Therotary portion 102 b has a surface (this surface will be hereinafter referred to as the lower surface) facing theheat receiving plate 122, and a surface (this surface will be hereinafter referred to as the upper surface) 108 b opposite to thelower surface 108 a. Therotary member 102 is contained in thepump chamber 118 in a posture in which an axis of therotation shaft 102 a crosses theheat receiving plate 122, for example, at right angles. Moreover, as to therotary member 102, therotation shaft 102 a is rotatably supported by thefirst cover 111 and theheat receiving plate 122 in a state in which therotation shaft 102 a extends over thefirst cover 111 and theheat receiving plate 122. - The
motor 103 rotates therotary member 102, and has arotor magnet 103 a and astator 103 b. Therotor magnet 103 a is constituted, for example, of an annular permanent magnet in which a plurality of cathodes and anodes are mutually magnetized. Therotor magnet 103 a is fixed to therotary member 102 coaxially with therotary member 102, and contained in thepump chamber 118. At least a region of therotor magnet 103 a facing thepump chamber 118 in the outer surface of the magnet is covered with therotary member 102 in such a manner that the magnet does not contact the liquid refrigerant in thepump chamber 118. In the present embodiment, the whole region of the outer surface of therotor magnet 103 a is covered with therotary member 102. - In detail, the
rotor magnet 103 a is disposed in such a manner as to extend along the peripheral edge of theupper surface 108 b of therotary portion 102 b and to protrude upwards, and is covered with a part of therotary member 102. Therotary member 102 is molded/formed, for example, by inserting therotor magnet 103 a. - That is, the
rotary portion 102 b has a protrudingportion 109 disposed along the peripheral edge of theupper surface 108 b and protruding in a direction (upward) opposite to a direction (downward) of theheat receiving plate 122. Therotor magnet 103 a is disposed in the protrudingportion 109. It is to be noted that in the present embodiment, therotor magnet 103 a is formed in such a manner that the length of the magnet in a direction crossing therotation shaft 102 a at right angles is less than that in a direction parallel to therotation shaft 102 a is shorter and a sectional shape is vertically long rectangular shape (seeFIG. 7 ). - The
rotary member 102 has a stirringportion 107 for stirring the liquid refrigerant in thepump chamber 118 on at least one of thelower surface 108 a and theupper surface 108 b of therotary portion 102 b. When the stirringportion 107 is disposed on thelower surface 108 a of therotary member 102, the liquid refrigerant can be satisfactorily passed in the vicinity of theheat receiving plate 122. Therefore, when the stirringportion 107 is disposed on thelower surface 108 a of therotary member 102, a cooling effect of theCPU 31 can be enhanced. When the stirringportion 107 is disposed on theupper surface 108 b of therotary member 102, the efficiency of thepump 100 can be raised. - As the
pump 100 disposed in thecooling device 40, a pump having a high cooling efficiency is preferable. In this case, the stirringportion 107 may be disposed on at least the lower surface of therotary member 102. In general, the portable computer 1 has been required to be made this. Therefore, when thepump 100 is mounted on an electronic apparatus as in the portable computer 1, the pump is preferably as thin as possible. In this case, the stirringportion 107 may be disposed only on the lower surface of therotary member 102. Thus, thepump 100 can be made this as compared with a case where the stirringportions 107 are disposed on opposite surfaces (upper and lower surfaces) of therotary member 102. - In the present embodiment, as shown in
FIGS. 4 and 7 , an impeller constituted by disposing the stirringportion 107 having a plurality ofvanes 105 on the lower surface of therotary portion 102 b is adopted as therotary member 102. - It is to be noted that as the
rotary member 102, a rotary member shown inFIG. 6 , that is, the rotary member constituted by disposing the stirringportions 107 on the upper and lower surfaces of therotary portion 102 b may be adopted. When the stirringportion 107 is disposed on theupper surface 108 b of therotary member 102, the stirringportion 107 is preferably disposed on a tip surface of the protrudingportion 109 as shown inFIG. 6 , and the stirringportion 107 may be disposed in a region other than the tip surface of the protrudingportion 109. - Moreover, the
rotary member 102 is not limited as long as the rotary member is capable of stirring a fluid such as a liquid refrigerant in thepump chamber 118, and feeding the fluid to the outside of thepump chamber 118 from the inside of thepump chamber 118. Therefore, therotary member 102 is not limited to a member (impeller) comprising the stirringportion 107 having thevanes 105. Therotary member 102 may comprise the stirringportion 107 having, for example, a plurality of concave portions 106 (seeFIG. 6 ). Even when thisrotary member 102 is adopted, the fluid in thepump chamber 118 can be stirred, and fed to the outside of thepump chamber 118 from the inside of thepump chamber 118. Therotary member 102 may comprise the stirringportion 107 having, for example, a spirally formed groove. - The
stator 103 b constituting themotor 103 is contained in the stator containingconcave portion 115 formed in the upper surface of thefirst cover 111. Additionally, thestator 103 b needs to be disposed corresponding to therotor magnet 103 a via thefirst cover 111. Therefore, the stator containingconcave portion 115 is disposed in a position facing therotor magnet 103 a. The center position of the stator containingconcave portion 115 is eccentric with respect to that of thefirst cover 111. The control substrate containingconcave portion 116 is disposed in a position avoiding the stator containingconcave portion 115. - The opening of the
concave portion 13 is closed by thefirst cover 111, and accordingly the stator containingconcave portion 115 is formed in such a manner as to enter therotor magnet 103 a. That is, thestator 103 b is coaxially disposed inside therotor magnet 103 a via thefirst cover 111. Thestator 103 b is electrically connected to thecontrol substrate 104. - Electric conduction with respect to the
stator 103 b is performed, for example, simultaneously with power supply to the portable computer 1. By the electric conduction, a rotary magnet field is generated in the peripheral direction of thestator 103 b, and the magnet field is magnetically bonded to therotor magnet 103 a. As a result, a rotary torque extending along the peripheral direction of therotary member 102 is generated between thestator 103 b and therotor magnet 103 a, and therotary member 102 rotates. - The
second cover 112 is fixed to the upper surface of thefirst cover 111. Thestator 103 b and thecontrol substrate 104 are covered with thesecond cover 112. Thesecond cover 112 is a cover for inhibiting leak or evaporation of the liquid refrigerant, and is formed by a metal material such as an aluminum alloy. It is to be noted that thesecond cover 112 may be omitted. - The
pump 100 constituted in this manner is placed on the printedcircuit board 30 in such a manner as to cover theCPU 31 from above. As shown inFIG. 7 , thepump housing 101 of thepump 100 is fixed to thebottom wall 11 a of thefirst housing 10 together with the printedcircuit board 30. Thebottom wall 11 a hasboss portions 17 in positions corresponding to four corner portions of thepump housing 101. Theboss portions 17 protrudes upwards from thebottom wall 11 a. The printedcircuit board 30 is superimposed upon the tip surfaces of theboss portions 17. It is to be noted thatreference numeral 34 inFIG. 7 denotes a reinforcing plate which reinforces the printedcircuit board 30 from the lower surface. - The
pump 100 is attached to thebottom wall 11 a of thefirst housing 10 in such a manner as to cover theCPU 31 from above by the following attaching mechanism.Concave portions 141 are disposed in four corner portions of thepump housing 101. A bottom wall (corner portions of the heat receiving plate 122) which defines theconcave portions 141 has throughholes 142 through whichcylindrical inserts 143 are passed. Theinserts 143 have protrudingportions 143 a protruding outwards in a horizontal direction along a peripheral direction on upper ends of the inserts. Theinserts 143 havegroove portions 143 b extending along the peripheral direction. - The
pump 100 is pressed onto theCPU 31 as follows by this attaching mechanism. First, theinserts 143 are passed through coil springs 144. Thisinsert 143 is inserted from the upward opened opening end of theconcave portion 141 of thefirst cover 111, and thegroove portion 143 b is positioned below theheat receiving surface 122 a of thepump 100. A C-ring 145 to prevent dropping is fitted in thegroove portion 143 b. Accordingly, theinserts 143 are attached to thepump 100 while the protrudingportions 143 a are urged by the coil springs 144 in a direction detached from the bottom wall defining theconcave portions 141. - A conductive grease (not shown) is applied to the upper surface of the
IC chip 33 or a region of theheat receiving surface 122 a corresponding to theIC chip 33, and theheat receiving surface 122 a of thepump housing 101 is disposed facing theIC chip 33.Screws 146 passed through theinserts 143 are screwed into theboss portions 17 on the printedcircuit board 30. Accordingly, theinserts 143 are fixed to theboss portions 17, and thepump 100 is pressed onto theIC chip 33 by elasticity of thecoil spring 146. Accordingly, theIC chip 33 is thermally connected to theheat receiving surface 122 a of thepump housing 101 via the conductive grease. - In this portable computer 1, the
pump 100 is fixed onto the printedcircuit board 30 in such a manner that a center (center of theheat receiving surface 122 a) of thepump housing 101 agrees with that of theIC chip 33. On the other hand, the center (rotation shaft 102 a) of therotary member 102 is eccentric from that of thepump housing 101. Therefore, the center of theIC chip 33 is eccentric from that of therotary member 102 facing the chip via thepump housing 101. Consequently, more heat from theIC chip 33 can be absorbed by the liquid refrigerant. That is, to absorb more heat from theIC chip 33 by the liquid refrigerant, theIC chip 33 is preferably disposed facing a position where the liquid refrigerant flows fast via thepump housing 101. A flow of the liquid refrigerant generated by rotation of therotor magnet 103 a becomes fast away from the center of therotary member 102. Therefore, by the constitution, more heat from theIC chip 33 can be absorbed by the liquid refrigerant. - As shown in
FIG. 3 , theheat radiating portion 50 comprises a heat radiating portionmain body 51 and a plurality ofheat emitting fins 57 thermally connected to the heat radiating portionmain body 51. The heat radiating portionmain body 51 comprises a substantially U-shape pipe in which the liquid refrigerant flows. The heat radiating portionmain body 51 has arefrigerant inlet 54 and a refrigerant outlet (not shown, disposed inside the drawing surface from the refrigerant inlet inFIG. 3 ) in such a manner that the refrigerant flows inside. That is, one opening end of the substantially U-shaped pipe constitutes therefrigerant inlet 54, and the other opening end constitutes the refrigerant outlet. That is, the pipe (heat radiating portion main body 51) of theheat radiating portion 50 constitutes a part of the circulation path 60 (thecirculation path 60 will be described later in detail). - The heat radiating portion
main body 51 is contained in thefirst housing 10 in a posture (transversely reclined posture) obtained by rotating the substantially U-shaped pipe by 90° in such a manner that therefrigerant inlet 54 is disposed above and the refrigerant outlet is disposed below. Theheat emitting fins 57 are formed, for example, of metal materials superior in thermal conductivity, such as aluminum alloy and copper. Theheat emitting fins 57 are formed in square plate shapes. Theheat emitting fins 57 are arranged parallel to one another at intervals. The respectiveheat emitting fins 57 are soldered to the heat radiating portionmain body 51. - The
heat radiating portion 50 is contained in thefirst housing 10 in a posture in which theheat emitting fins 57 are disposed facing theexhaust ports 15 of thefirst housing 10. A pair ofbrackets 58 are soldered to theheat radiating portion 50. Thesebrackets 58 are fixed to the boss portions (not shown) protruding from thebottom wall 11 a of thefirst housing 10 by screws. Thus, theheat radiating portion 50 is fixed to thebottom wall 11 a of thefirst housing 10. - The
circulation path 60 comprises afirst tube 61, asecond tube 62, and the pipe (heat radiating portion main body 51) of theheat radiating portion 50. That is, the heat radiating portionmain body 51 functions as both theheat radiating portion 50 and thecirculation path 60. Thefirst tube 61 connects thedischarge tube 132 of thepump 100 to therefrigerant inlet 54 of theheat radiating portion 50. Thesecond tube 62 connects thesuction tube 131 of thepump 100 to the refrigerant outlet of theheat radiating portion 50. Therefore, the liquid refrigerant is circulated between thepump 100 and theheat radiating portion 50 through thefirst tube 61 andsecond tube 62. - The
electromotive fan 70 feeds cooling air to theheat radiating portion 50, and is disposed immediately before theheat radiating portion 50. Theelectromotive fan 70 comprises afan casing 71 and acentrifugal impeller 72 contained in thefan casing 71. Thefan casing 71 has adischarge port 71 a which discharges the cooling air. Thedischarge port 71 a is connected to theheat radiating portion 50 via aduct 73. - The
impeller 72 is rotated/driven by a motor (not shown), for example, when the power supply of the portable computer 1 is turned on, or the temperature of theCPU 31 reaches a predetermined temperature. Accordingly, cooling air is supplied to theheat radiating portion 50 from thedischarge port 71 a of thefan casing 71. - Next, an operation of the
cooling device 40 will be described. - During the use of the portable computer 1, the
IC chip 33 of theCPU 31 generates heat. The heat generated by theIC chip 33 is conducted to thepump housing 101 via theheat receiving surface 122 a of thepump 100. Since the concave portion 113 (pump chamber 118 and reserve tank 119) of thepump housing 101 is filled with the liquid refrigerant, the liquid refrigerant absorbs much heat conducted to thepump housing 101. - The electric conduction to the
stator 103 b of themotor 103 is performed, for example, simultaneously with the turning-on of the power supply to the portable computer 1. Accordingly, a rotation torque is generated between thestator 103 b and therotor magnet 103 a, and therotor magnet 103 a rotates together with therotary member 102. When therotary member 102 rotates, the liquid refrigerant in thepump chamber 118 is pressurized, discharged from thedischarge tube 132, and guided into theheat radiating portion 50 from therefrigerant inlet 54 via thefirst tube 61. The liquid refrigerant heated by heat exchange in thepump housing 101 circulates toward the refrigerant outlet from therefrigerant inlet 54 in theheat radiating portion 50, and the heat from theIC chip 33 absorbed by the liquid refrigerant is conducted to theheat emitting fins 57 in the process. - When the
impeller 72 of theelectromotive fan 70 rotates during the use of the portable computer 1, the cooling air blows toward theheat radiating portion 50 from thedischarge port 71 a of thefan casing 71. This cooling air passes among theheat emitting fins 57 disposed adjacent to one another. Accordingly, theheat emitting fins 57 and the heat radiating portionmain body 51 are cooled, and much of heat conducted to theheat emitting fins 57 or the heat radiating portionmain body 51 rides on the flow of the cooling air, and is discharged to the outside of thefirst housing 10 from theexhaust ports 15. - The liquid refrigerant cooled by the
heat radiating portion 50 is guided to thesuction tube 131 of thepump housing 101 via thesecond tube 62. This liquid refrigerant is returned to thereserve tank 119 from thesuction tube 131. The liquid refrigerant returned to thereserve tank 119 absorbs the heat from theIC chip 33 again while sucked into thepump chamber 118. When this cycle is repeated, the heat from theIC chip 33 is successively transferred to theheat radiating portion 50, rides on the flow of the cooling air passing through theheat radiating portion 50, and is discharged to the outside of thefirst housing 10. - As described above, the
pump 100 of the present embodiment comprises theheat receiving plate 122 thermally connected to the heat generating element comprising theCPU 31, and thepump housing 101 having thepump chamber 118 in which the liquid refrigerant is contained. That is, thepump 100 has a function of the heat receiving portion, and that of the heat exchange unit. Therefore, thepump 100 can be preferably used in the above-describedcooling device 40 mounted on the portable computer 1. - Moreover, in the
pump 100, at least the region of therotor magnet 103 a facing thepump chamber 118 is covered with therotary member 102. Concretely, therotary member 102 formed of a resin is molded and formed by covering therotor magnet 103 a. Therefore, therotor magnet 103 a does not contact the liquid refrigerant in thepump chamber 118. Therefore, therotor magnet 103 a can be inhibited from being corroded by the liquid refrigerant. Consequently, a drop in the performance of themotor 103 caused by corrosion of therotor magnet 103 a by the liquid refrigerant, or a drop in the cooling effect by contamination of the liquid refrigerant can be inhibited. Therefore, according to thepump 100, the heat generating element like theCPU 31 can be satisfactorily cooled for an extended period. - Additionally, the
pump 100 comprises therotary member 102 having the stirringportion 107 for stirring the liquid refrigerant in thepump chamber 118 on one surface of thelower surface 108 a and theupper surface 108 b. Therefore, thepump 100 can be formed to be thin as compared with the pump comprising the impeller on whose peripheral surface the vanes are disposed. - Furthermore, in the
pump 100, the stirringportion 107 for stirring the liquid refrigerant in thepump chamber 118 is disposed only on thelower surface 108 a of therotary member 102. Therefore, thepump 100 can efficiently cool the heat generating element like theCPU 31, and can be formed to be thinner as compared with a case where the stirringportion 107 is disposed on thelower surface 108 a and theupper surface 108 b of therotary member 102. - Moreover, in the
pump 100, the protrudingportion 109 is disposed along the peripheral edge of theupper surface 108 b of therotary portion 102 b of therotary member 102, and protrudes upwards. Moreover, therotor magnet 103 a is disposed in the protrudingportion 109. Therefore, when thestator 103 b is disposed in the protrudingportion 109, themotor 103 can be easily constituted by therotor magnet 103 a and thestator 103 b. Therefore, even when therotor magnet 103 a is disposed in therotary member 102, therotary member 102 can be satisfactorily rotated. - Furthermore, the portable computer 1 of the present embodiment comprises the
heat radiating portion 50 which discharges the heat of theCPU 31; thepump 100 which feeds the refrigerant to theheat radiating portion 50; and thecirculation path 60 which circulates the liquid refrigerant between thepump 100 and theheat radiating portion 50 and which transfers the heat from the CPU to theheat radiating portion 50 via the liquid refrigerant. Therefore, theCPU 31 can be satisfactorily cooled by the portable computer 1 of the present embodiment for an extended period. - A second embodiment of the present invention will be described with reference to
FIG. 8 . - A
pump 100 disposed in a portable computer 1 of the present embodiment is different from thepump 100 of the first embodiment in a sectional shape of arotor magnet 103 a. That is, in the present embodiment, therotor magnet 103 a is formed in such a manner as to have a flat rectangular sectional shape of the magnet, whose length in a direction crossing arotation shaft 102 a at right angles is greater than that in a direction parallel to therotation shaft 102 a. It is to be noted that another constitution is the same as that of the first embodiment including portions (not shown), and therefore denoted with the same reference numerals, and redundant description is omitted. - In the
pump 100 of the present embodiment, therotor magnet 103 a is formed in such a manner as to have a flat rectangular sectional shape whose length in a direction crossing therotation shaft 102 a at right angles is greater than that in a direction parallel to therotation shaft 102 a. Thus, a protruding height of a protrudingportion 109 of arotary member 102 can be reduced. Therefore, according to thepump 100 of the present embodiment, a heat generating element like aCPU 31 can be satisfactorily cooled for an extended period in the same manner as in thepump 100 of the first embodiment. Therefore, the pump can be formed to be thin as compared with thepump 100 of the first embodiment. - Moreover, according to the portable computer 1 of the present embodiment, the heat generating element like the
CPU 31 can be satisfactorily cooled for an extended period in the same manner as in the portable computer 1 of the first embodiment, and can be made thin as compared with the portable computer 1 of the first embodiment. - It is to be noted that in the
pumps 100 of the first and second embodiments, the stirringportion 107 is disposed only on thelower surface 108 a of therotary member 102, but the stirringportion 107 may be disposed on at least one of thelower surface 108 a and theupper surface 108 b of therotary member 102. That is, the stirringportion 107 may be disposed only on theupper surface 108 b of therotary member 102. - Moreover, the pump of the present invention can be broadly used not only in an electronic apparatus like the portable computer and the cooling device mounted in the apparatus but also in another apparatus. Furthermore, the electronic apparatus of the present invention is not limited to a portable computer, and can be broadly used in a heat generating element and the apparatus comprising the cooling device which cools the heat generating element.
Claims (8)
1. A pump comprising:
a housing having a heat receiving portion thermally connected to a heat generating element, and a pump chamber;
a stator; and
a rotary member disposed in the pump chamber, and having a stirring portion which stirs a fluid in the pump chamber and a magnet contained within the rotary member.
2. The pump according to claim 1 wherein the rotary member has a shaft, and is disposed in the pump chamber in such a posture that an axis of the shaft crosses the heat receiving portion.
3. The pump according to claim 2 wherein the magnet is formed in such a manner as to have a rectangular sectional shape whose length in a direction crossing the shaft at right angles is longer than that in a direction parallel to the shaft.
4. The pump according to claim 3 wherein
the rotary member has a disc-shaped rotary portion,
the rotary portion has a protruding portion disposed along a peripheral edge of a surface opposite to the surface facing the heat receiving portion and protruded in a direction opposite to that of the heat receiving portion,
the magnet is disposed in the protruding portion.
5. An electronic apparatus comprising:
a housing having a heat generating element; and
a cooling device including a heat radiating portion, a circulation path thermally connected to the heat radiating portion, and a pump forcedly circulating a fluid in the circulation path and having a heat receiving portion thermally connected to the heat generating element,
wherein the pump comprises:
a pump housing having the heat receiving portion and a pump chamber;
a stator; and
a rotary member having a stirring portion to stir the fluid in the pump chamber, and a magnet contained within the rotary member, the rotary member feeding the fluid into the circulation path.
6. The electronic apparatus according to claim 5 wherein
the rotary member has a shaft, and is disposed in the pump chamber in such a posture that an axis of the shaft crosses the heat receiving portion.
7. The electronic apparatus according to claim 6 wherein
the magnet is formed in such a manner as to have a rectangular sectional shape whose length in a direction crossing the shaft at right angles is longer than that in a direction parallel to the shaft.
8. The electronic apparatus according to claim 7 wherein
the rotary member has a disc-shaped rotary portion,
the rotary portion has a protruding portion disposed along a peripheral edge of a surface opposite to the surface facing the heat receiving portion and protruded in a direction opposite to that of the heat receiving portion,
the magnet is disposed in the protruding portion.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004133537A JP2005315159A (en) | 2004-04-28 | 2004-04-28 | Pump and electronic equipment |
JP2004-133537 | 2004-04-28 |
Publications (1)
Publication Number | Publication Date |
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US20050244291A1 true US20050244291A1 (en) | 2005-11-03 |
Family
ID=35187277
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/074,823 Abandoned US20050244291A1 (en) | 2004-04-28 | 2005-03-07 | Pump and electronic apparatus having this pump |
Country Status (3)
Country | Link |
---|---|
US (1) | US20050244291A1 (en) |
JP (1) | JP2005315159A (en) |
CN (1) | CN1690438A (en) |
Cited By (7)
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US20070125522A1 (en) * | 2005-12-05 | 2007-06-07 | Nvidia Corporation | Embedded heat pipe in a hybrid cooling system |
US20070211432A1 (en) * | 2006-03-08 | 2007-09-13 | Foxconn Technology Co.,Ltd. | Heat dissipating device for computer add-on cards |
US20070280837A1 (en) * | 2006-06-06 | 2007-12-06 | Nidec Sankyo Corporation | Vortex pump |
US20080186677A1 (en) * | 2004-04-12 | 2008-08-07 | Zoran Stefanoski | System For Efficiently Cooling A Processor |
CN109372755A (en) * | 2018-12-19 | 2019-02-22 | 华中科技大学 | A kind of outer motor ultrathin centrifugal pump of inner impeller |
US20220173632A1 (en) * | 2020-11-27 | 2022-06-02 | Aac Microtech (Changzhou) Co., Ltd. | Micro Water Pump and Electronic Device Using Same |
CN116292390A (en) * | 2023-05-15 | 2023-06-23 | 合肥联宝信息技术有限公司 | Electronic equipment and fan thereof |
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JP5058896B2 (en) * | 2008-06-26 | 2012-10-24 | 日立オートモティブシステムズ株式会社 | Electric centrifugal pump |
KR101454326B1 (en) | 2013-05-10 | 2014-10-28 | 잘만테크 주식회사 | Pump for water cooler |
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Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080186677A1 (en) * | 2004-04-12 | 2008-08-07 | Zoran Stefanoski | System For Efficiently Cooling A Processor |
US7542292B2 (en) | 2004-04-12 | 2009-06-02 | Nvidia Corporation | System for efficiently cooling a processor |
US20070125522A1 (en) * | 2005-12-05 | 2007-06-07 | Nvidia Corporation | Embedded heat pipe in a hybrid cooling system |
US7551442B2 (en) * | 2005-12-05 | 2009-06-23 | Nvidia Corporation | Embedded heat pipe in a hybrid cooling system |
US20070211432A1 (en) * | 2006-03-08 | 2007-09-13 | Foxconn Technology Co.,Ltd. | Heat dissipating device for computer add-on cards |
US7365989B2 (en) * | 2006-03-08 | 2008-04-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipating device for computer add-on cards |
US20070280837A1 (en) * | 2006-06-06 | 2007-12-06 | Nidec Sankyo Corporation | Vortex pump |
CN109372755A (en) * | 2018-12-19 | 2019-02-22 | 华中科技大学 | A kind of outer motor ultrathin centrifugal pump of inner impeller |
US20220173632A1 (en) * | 2020-11-27 | 2022-06-02 | Aac Microtech (Changzhou) Co., Ltd. | Micro Water Pump and Electronic Device Using Same |
CN116292390A (en) * | 2023-05-15 | 2023-06-23 | 合肥联宝信息技术有限公司 | Electronic equipment and fan thereof |
Also Published As
Publication number | Publication date |
---|---|
CN1690438A (en) | 2005-11-02 |
JP2005315159A (en) | 2005-11-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: KABUSHIKI KAISHA TOSHIBA, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:TOMIOKA, KENTARO;HATA, YUKIHIKO;REEL/FRAME:016367/0473 Effective date: 20050301 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |