JP2005311288A - 基板接合装置及び方法 - Google Patents
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Abstract
【解決手段】 基板接合装置11をクリーンブース12内に設置し、一軸ロボット46及び五軸ロボット47によってウエハ25及びガラス基板33を搬送する。転写ステーション91は、フイルム供給部113から接着剤の塗布された転写フイルム112を取り出し、ガラス基板33に押し付けて接着剤を転写する。剥離ステーション92は、ガラス基板33から転写フイルム112を剥離する。接合ステーション57は、ウエハ25とガラス基板33とを位置合せし、かつ接合面の平行度を調整して接合する。ウエハ25とガラス基板33と転写フイルム112とのハンドリング及び接合作業は、基板接合装置11がクリーンルーム12内で行なうため、異物の付着等による得率の低下は発生しない。
【選択図】 図3
Description
3 固体撮像素子チップ
4 スペーサー
5 カバーガラス
6 固体撮像素子
8 接着剤
11 基板接合装置
12 クリーンブース
15 制御コンピュータ
25 ウエハ
26 ウエハ供給部
33 ガラス基板
34 ガラス基板供給部
39 接合基板
40 接合基板排出部
46 一軸ロボット
47 五軸ロボット
53 アライメントステーション
57 接合ステーション
60 ウエハ用台板
61 下側接合ユニット
62 ガラス用台板
63 上側接合ユニット
66〜68 昇降用アクチュエータ
69〜71 加圧力調整シリンダ
72 XYθテーブル
73〜75 台板支持機構
91 転写ステーション
92 剥離ステーション
96 基板撮像カメラ
98 画像処理装置
102〜104 基板間隔撮像カメラ
105〜107 ライト
112 転写フイルム
113 フイルム供給部
114 転写ユニット
116 転写用台板
153 粘着テープ
160 剥離ローラ
171 外形測定器
176,177 レーザー変位計
186 球面軸
187 球面軸受
189 エアーポンプ
200 照明ステーション
Claims (23)
- 多数の素子が形成された半導体基板と、各素子を封止する封止基板とを接合し、各素子ごとに個片化されるように半導体基板と封止基板とを裁断して形成されるチップサイズパッケージの製造に用いられ、該半導体基板と封止基板とを接合する接合装置であって、
前記半導体基板と封止基板とを供給する基板供給部と、
接着剤が塗布された弾性体状の転写板を供給する転写板供給部と、
転写板の接着剤が塗布された面と、封止基板の接合面とを重ね合わせて加圧する転写板加圧部と、
転写板を封止基板から剥離して、該封止基板上に接着剤の層を転写形成する転写板剥離部と、
半導体基板と封止基板との接合面の平行度を調整する平行度調整手段と、
半導体基板と封止基板との位置を調整し、重ね合わせて接合する基板接合部と、
半導体基板と封止基板と転写板とを各部の間で搬送する基板搬送手段とを設けたことを特徴とする基板接合装置。 - 前記素子は固体撮像素子であり、前記封止基板は透明な材質で形成されていることを特徴とする請求項1記載の基板接合装置。
- 前記転写板剥離部は、
作業位置にある封止基板の一端部に近接して配置された剥離ローラと、
この剥離ローラに掛けられて転写板の一端部に粘着する長尺の粘着テープと、
剥離ローラを該一端部から反対側の他端部に向けて移動させるローラ移動手段と、
このローラ移動手段による剥離ローラの移動と同時に、剥離された転写板が封止基板の接合面に対して一定の角度を保つように粘着テープを巻き取る巻取り手段とを備えたことを特徴とする請求項1または2記載の基板接合装置。 - 前記封止基板の接合面方向で剥離ローラを移動させ、この剥離ローラと転写板との間隔を調整するローラ間隔調整手段を設けたことを特徴とする請求項3記載の基板接合装置。
- 前記剥離ローラに掛けられた粘着テープの外周面と転写板との間隔は、転写板の剥離時に0.1mm以下となるようにしたことを特徴とする請求項3または4記載の基板接合装置。
- 前記剥離ローラの直径は、15〜20mmであることを特徴とする請求項3ないし5いずれか記載の基板接合装置。
- 前記転写板として、帯電防止処理されたプラスチックフイルムを用いたことを特徴とする請求項1ないし6いずれか記載の基板接合装置。
- 前記転写板加圧部において、緩衝材を介して転写板を加圧することを特徴とする請求項1ないし7いずれか記載の基板接合装置。
- 前記緩衝材として、ASKER−C 20〜40の硬度を有するスポンジゴムを用いたことを特徴とする請求項8記載の基板接合装置。
- 前記平行度調整手段は、
半導体基板と封止基板との対面された両接合面の複数位置の間隔の長さをそれぞれ測定する複数の基板間隔測定手段と、
これらの基板間隔測定手段の測定結果に基づいて、半導体基板または封止基板の傾きを変化させる基板傾斜変更手段とを備えたことを特徴とする請求項1ないし9いずれか記載の基板接合装置。 - 前記基板間隔測定手段は、
半導体基板と封止基板との対面された両接合面の間を透過光によって照明する透過光照明手段と、
この透過光照明手段によって照明された半導体基板と封止基板との間を撮像する基板間隔撮像手段とからなり、
各基板間隔撮像手段の撮像データを解析して、半導体基板と封止基板との両接合面の複数位置の間隔の長さを算出する基板間隔算出手段を備えたことを特徴とする請求項10記載の基板接合装置。 - 前記透過光照明手段は、集光角度が1°以下であることを特徴とする請求項11記載の基板接合装置。
- 前記基板間隔撮像手段は、撮像レンズにテレセントリックレンズを用いていることを特徴とする請求項11または12記載の基板接合装置。
- 前記基板間隔測定手段は、半導体基板と封止基板との対面された両接合面の所定位置の間隔を測定するレーザー測定器からなることを特徴とする請求項10記載の基板接合装置。
- 前記平行度調整手段は、
半導体基板と封止基板との各接合面の複数位置で、予め設定された基準位置に対する変位量をそれぞれ測定する複数の変位量測定手段と、
これらの変位量測定手段の測定結果に基づいて、半導体基板または封止基板の傾きを変化させる基板傾斜変更手段とを備えたことを特徴とする請求項1ないし9いずれか記載の基板接合装置。 - 前記基板傾斜変更手段は、
各測定手段の各測定位置に対応して配置され、半導体基板または封止基板の所定位置を接合面に直交する方向で移動させる複数のアクチュエータと、
各測定手段の測定結果に基づいて各アクチュエータを制御するアクチュエータ制御手段と、
半導体基板と封止基板との接合時に、一方の基板に倣って他方の基板が揺動できるように該他方の基板を支持するとともに、この他方の基板の揺動基準をその基板の接合面と同一平面上とする基板支持手段とを備えたことを特徴とする請求項10ないし15いずれか記載の基板接合装置。 - 前記平行度調整手段は、
半導体基板または封止基板が保持された台板を揺動自在に、または固定して保持する台板保持機構からなり、
該台板を揺動自在とした状態で半導体基板と封止基板とを当接させ、一方の基板に倣って台板に保持された他方の基板が揺動した後で、台板を固定することを特徴とする請求項1ないし9いずれか記載の基板接合装置。 - 前記台板保持機構は、
台板に一体に設けられた略半球形状の球面軸と、
この球面軸を収納する球面軸受部と、
球面軸と球面軸受部との間にエアーを充填して球面軸受部に対し球面軸を揺動自在とし、かつ球面軸と球面軸受部との間からエアーを吸引して球面軸受部に対し球面軸を固定するエアーポンプとを備えたことを特徴とする請求項17記載の基板接合装置。 - 前記転写板に塗布される接着剤として光遅延硬化型の接着剤を用い、かつ封止基板への接着剤の転写の前に、転写板に塗布された光遅延硬化型接着剤に光を照射して硬化を開始させる照明部を設けたことを特徴とする請求項1ないし18いずれか記載の基板接合装置。
- 多数の素子が形成された半導体基板と、各素子を封止する封止基板とを接合し、各素子ごとに個片化されるように半導体基板と封止基板とを裁断して形成されるチップサイズパッケージの製造に用いられ、該半導体基板と封止基板とを接合する方法であって、
半導体基板を供給する工程と、
封止基板を供給する工程と、
接着剤が塗布された弾性体状の転写板を供給する工程と、
転写板の接着剤が塗布された面と、封止基板の接合面とを重ね合わせて加圧する工程と、
封止基板から転写板をその一端側から一定の曲率で剥離し、該封止基板上に接着剤の層を転写形成する工程と、
半導体基板と封止基板との接合面の平行度を調整する工程と、
半導体基板と封止基板との位置を調整し、重ね合わせて接合する工程とを含むことを特徴とする基板接合方法。 - 前記半導体基板と封止基板との接合面の平行度を調整する工程は、半導体基板と封止基
板との対面された両接合面の複数位置の間隔の長さをそれぞれ測定する工程と、
これらの測定結果に基づいて、半導体基板または封止基板の傾きを変化させる工程とを含むことを特徴とする請求項20記載の基板接合方法。 - 前記半導体基板と封止基板との接合面の間隔の長さを測定する工程は、半導体基板と封止基板との両接合面を所定の間隔で対面させる工程と、
半導体基板と封止基板との間の複数位置を透過光によって照明して撮像する工程と、
撮像データを解析して両接合面の間の複数位置の間隔の長さを算出する工程とを含むことを特徴とする請求項21記載の基板接合方法。 - 前記基板の傾きを変化させる工程は、半導体基板と封止基板との接合時に、一方の基板の傾斜に倣うように、他方の基板をその接合面上で揺動させる工程を含むことを特徴とする請求項21または22記載の基板接合方法。
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US10/594,069 US7678211B2 (en) | 2004-03-26 | 2005-03-23 | Device and method for joining substrates |
KR1020067019857A KR101058441B1 (ko) | 2004-03-26 | 2005-03-23 | 기판 접합 장치 및 방법 |
EP05721648A EP1735829B1 (en) | 2004-03-26 | 2005-03-23 | Device and method for joining substrates |
PCT/JP2005/005999 WO2005093826A1 (en) | 2004-03-26 | 2005-03-23 | Device and method for joining substrates |
TW094109231A TWI363429B (en) | 2004-03-26 | 2005-03-25 | Device and method for joining substrates |
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