JP2005268503A - 光半導体装置の製造方法並びにそのパッケージ成型用治具の製造方法及び装置 - Google Patents
光半導体装置の製造方法並びにそのパッケージ成型用治具の製造方法及び装置 Download PDFInfo
- Publication number
- JP2005268503A JP2005268503A JP2004078316A JP2004078316A JP2005268503A JP 2005268503 A JP2005268503 A JP 2005268503A JP 2004078316 A JP2004078316 A JP 2004078316A JP 2004078316 A JP2004078316 A JP 2004078316A JP 2005268503 A JP2005268503 A JP 2005268503A
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- Prior art keywords
- package
- manufacturing
- jig
- optical semiconductor
- thermoplastic resin
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Links
- 238000000465 moulding Methods 0.000 title claims abstract description 92
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 59
- 239000004065 semiconductor Substances 0.000 title claims abstract description 36
- 238000000034 method Methods 0.000 title claims abstract description 33
- 230000003287 optical effect Effects 0.000 title claims abstract description 29
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 229920005992 thermoplastic resin Polymers 0.000 claims description 48
- 238000010438 heat treatment Methods 0.000 claims description 12
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 238000005266 casting Methods 0.000 abstract description 26
- 238000001746 injection moulding Methods 0.000 abstract description 13
- 230000007257 malfunction Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 25
- 229920000647 polyepoxide Polymers 0.000 description 25
- 239000011116 polymethylpentene Substances 0.000 description 8
- 229920000306 polymethylpentene Polymers 0.000 description 8
- 238000007789 sealing Methods 0.000 description 8
- 238000012545 processing Methods 0.000 description 6
- 239000002994 raw material Substances 0.000 description 6
- 238000007493 shaping process Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000007723 die pressing method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 229920006038 crystalline resin Polymers 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/40—Plastics, e.g. foam or rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Led Device Packages (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
【解決手段】 パッケージ成型用治具6として、熱可塑性樹脂シートを加熱した後に深絞り成形することにより、パッケージの外形に対応する凹部を有するパッケージ成型用治具を用いる。パッケージ成型用治具6は、製造しようとする光半導体装置のパッケージの外形に対応する形状のパンチとダイとを有する深絞り成形装置を具備した製造装置により連続的に製造される。
【選択図】 図1
Description
Claims (4)
- リードフレームのリード部の先端に光半導体素子を接続固定して、この光半導体素子とリード部の先端とを電気的に接続する工程と、
熱可塑性樹脂シートを加熱した後に深絞り成形されたことにより、パッケージの外形に対応する凹部を有するパッケージ成型用治具の凹部に、前記リード部の先端を挿入して位置決め固定し、かつ、この凹部にパッケージ用樹脂を充填する工程と、
を有することを特徴とする光半導体装置の製造方法。 - 前記熱可塑性樹脂シートが、複数の樹脂シートを重ね合わせてなることを特徴とする請求項1に記載の光半導体装置の製造方法。
- 熱可塑性樹脂シートを軟化点以上に加熱した後、パッケージの外形に対応する形状のパンチを用いて前記熱可塑性樹脂シートを深絞り成形することにより、パッケージの外形に対応する凹部を形成することを特徴とする光半導体装置のパッケージ成型用治具の製造方法。
- 熱可塑性樹脂シートを加熱する加熱装置と、
製造しようとする光半導体装置のパッケージの外形に対応する形状のパンチとダイとを有して、加熱された熱可塑性樹脂シートを深絞り成形する成形装置と、
を備えることを特徴とする光半導体装置のパッケージ成型用治具の製造装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004078316A JP4686132B2 (ja) | 2004-03-18 | 2004-03-18 | 保護カバー付き光半導体装置の製造方法 |
TW094106554A TWI264783B (en) | 2004-03-18 | 2005-03-04 | Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig |
US11/072,233 US7393706B2 (en) | 2004-03-18 | 2005-03-07 | Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig |
CNB2005100555044A CN100380617C (zh) | 2004-03-18 | 2005-03-14 | 光学半导体装置与封装制模具的制造方法以及封装制模具 |
KR1020050022019A KR100635401B1 (ko) | 2004-03-18 | 2005-03-17 | 광학 반도체 장치 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004078316A JP4686132B2 (ja) | 2004-03-18 | 2004-03-18 | 保護カバー付き光半導体装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005268503A true JP2005268503A (ja) | 2005-09-29 |
JP4686132B2 JP4686132B2 (ja) | 2011-05-18 |
Family
ID=34986879
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004078316A Expired - Fee Related JP4686132B2 (ja) | 2004-03-18 | 2004-03-18 | 保護カバー付き光半導体装置の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7393706B2 (ja) |
JP (1) | JP4686132B2 (ja) |
KR (1) | KR100635401B1 (ja) |
CN (1) | CN100380617C (ja) |
TW (1) | TWI264783B (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007329394A (ja) * | 2006-06-09 | 2007-12-20 | Hitachi Lighting Ltd | 光源モジュール、光源モジュールの製造方法および液晶表示装置 |
JP2008535237A (ja) * | 2005-11-09 | 2008-08-28 | アルティ エレクトロニクス カンパニー リミテッド | 側面発光ダイオード及びその製造方法 |
JP2009147285A (ja) * | 2007-12-14 | 2009-07-02 | Silitek Electronic Co Ltd | 電気光学半導体封止装置およびその封止方法 |
JP2011249433A (ja) * | 2010-05-25 | 2011-12-08 | Nichia Chem Ind Ltd | 発光装置及びその製造方法 |
JP2016173970A (ja) * | 2015-03-18 | 2016-09-29 | 名古屋油化株式会社 | カバー防曇処理用治具 |
KR102017730B1 (ko) * | 2018-03-02 | 2019-09-03 | 주식회사 세미콘라이트 | 반도체 발광소자용 예비 봉지재 제조방법 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100392880C (zh) * | 2005-11-28 | 2008-06-04 | 陈泽 | 发光二极管 |
DE102006046301A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Optisches Element, strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines optischen Elements |
TWM340555U (en) * | 2007-11-23 | 2008-09-11 | Everlight Electronics Co Ltd | Light emmitting diode device |
KR100948800B1 (ko) * | 2009-07-07 | 2010-03-30 | 동양산업(주) | 지그의 반전을 이용한 led모듈 제작방법 |
FR2949710B1 (fr) * | 2009-09-04 | 2011-11-25 | Lorraine Construction Aeronautique | Dispositif de moulage destine a recevoir des fibres et une resine par injection. |
CN102956758B (zh) * | 2011-08-22 | 2015-03-25 | 赛恩倍吉科技顾问(深圳)有限公司 | Led封装结构的制作方法 |
CN103762295B (zh) * | 2014-01-21 | 2016-06-01 | 韩刚 | 一种信号收发二极管的封装方法 |
CN110197867A (zh) | 2018-02-26 | 2019-09-03 | 世迈克琉明有限公司 | 半导体发光器件及其制造方法 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6222491A (ja) * | 1985-07-23 | 1987-01-30 | Toshiba Corp | 半導体発光装置 |
JPH07183440A (ja) * | 1993-11-09 | 1995-07-21 | Toshiba Corp | 半導体素子用リードフレーム及びキャスティングケース |
JPH07312446A (ja) * | 1994-05-17 | 1995-11-28 | Rohm Co Ltd | 発光ダイオードランプにおけるレンズ部の成形装置 |
JPH098357A (ja) * | 1995-06-16 | 1997-01-10 | Rohm Co Ltd | 発光装置およびその製造方法 |
JPH1191041A (ja) * | 1997-07-22 | 1999-04-06 | Nissha Printing Co Ltd | 絵付インサートフィルムおよび絵付インサート成形品の製造方法 |
JP2001172478A (ja) * | 1999-12-20 | 2001-06-26 | Nippon Zeon Co Ltd | 脂環式オレフィン重合体組成物 |
JP2004050642A (ja) * | 2002-07-19 | 2004-02-19 | Toyo Seikan Kaisha Ltd | 熱可塑性樹脂容器の製造方法 |
Family Cites Families (7)
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NL255403A (ja) * | 1957-11-08 | |||
US3764862A (en) * | 1972-10-19 | 1973-10-09 | Fairchild Camera Instr Co | Lead frame for light-emitting diodes |
JPH06283645A (ja) * | 1993-03-30 | 1994-10-07 | Sony Corp | 半導体装置 |
JP4316019B2 (ja) * | 1996-10-01 | 2009-08-19 | 株式会社東芝 | 半導体装置及び半導体装置製造方法 |
JP2002076233A (ja) * | 2000-09-04 | 2002-03-15 | Mitsubishi Electric Corp | 半導体装置 |
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2004
- 2004-03-18 JP JP2004078316A patent/JP4686132B2/ja not_active Expired - Fee Related
-
2005
- 2005-03-04 TW TW094106554A patent/TWI264783B/zh not_active IP Right Cessation
- 2005-03-07 US US11/072,233 patent/US7393706B2/en not_active Expired - Fee Related
- 2005-03-14 CN CNB2005100555044A patent/CN100380617C/zh not_active Expired - Fee Related
- 2005-03-17 KR KR1020050022019A patent/KR100635401B1/ko not_active IP Right Cessation
Patent Citations (7)
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JPS6222491A (ja) * | 1985-07-23 | 1987-01-30 | Toshiba Corp | 半導体発光装置 |
JPH07183440A (ja) * | 1993-11-09 | 1995-07-21 | Toshiba Corp | 半導体素子用リードフレーム及びキャスティングケース |
JPH07312446A (ja) * | 1994-05-17 | 1995-11-28 | Rohm Co Ltd | 発光ダイオードランプにおけるレンズ部の成形装置 |
JPH098357A (ja) * | 1995-06-16 | 1997-01-10 | Rohm Co Ltd | 発光装置およびその製造方法 |
JPH1191041A (ja) * | 1997-07-22 | 1999-04-06 | Nissha Printing Co Ltd | 絵付インサートフィルムおよび絵付インサート成形品の製造方法 |
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Cited By (7)
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JP2008535237A (ja) * | 2005-11-09 | 2008-08-28 | アルティ エレクトロニクス カンパニー リミテッド | 側面発光ダイオード及びその製造方法 |
JP2007329394A (ja) * | 2006-06-09 | 2007-12-20 | Hitachi Lighting Ltd | 光源モジュール、光源モジュールの製造方法および液晶表示装置 |
JP2009147285A (ja) * | 2007-12-14 | 2009-07-02 | Silitek Electronic Co Ltd | 電気光学半導体封止装置およびその封止方法 |
JP4691569B2 (ja) * | 2007-12-14 | 2011-06-01 | 旭麗電子有限公司 | 電気光学半導体封止装置およびその封止方法 |
JP2011249433A (ja) * | 2010-05-25 | 2011-12-08 | Nichia Chem Ind Ltd | 発光装置及びその製造方法 |
JP2016173970A (ja) * | 2015-03-18 | 2016-09-29 | 名古屋油化株式会社 | カバー防曇処理用治具 |
KR102017730B1 (ko) * | 2018-03-02 | 2019-09-03 | 주식회사 세미콘라이트 | 반도체 발광소자용 예비 봉지재 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR100635401B1 (ko) | 2006-10-19 |
TW200532821A (en) | 2005-10-01 |
US7393706B2 (en) | 2008-07-01 |
CN1670933A (zh) | 2005-09-21 |
KR20060043719A (ko) | 2006-05-15 |
TWI264783B (en) | 2006-10-21 |
CN100380617C (zh) | 2008-04-09 |
JP4686132B2 (ja) | 2011-05-18 |
US20050208690A1 (en) | 2005-09-22 |
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