TWI264783B - Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig - Google Patents

Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig

Info

Publication number
TWI264783B
TWI264783B TW094106554A TW94106554A TWI264783B TW I264783 B TWI264783 B TW I264783B TW 094106554 A TW094106554 A TW 094106554A TW 94106554 A TW94106554 A TW 94106554A TW I264783 B TWI264783 B TW I264783B
Authority
TW
Taiwan
Prior art keywords
molding jig
package molding
manufacturing
optical semiconductor
semiconductor device
Prior art date
Application number
TW094106554A
Other languages
English (en)
Other versions
TW200532821A (en
Inventor
Masaki Adachi
Masaharu Yamanaka
Fumihide Nagashima
Tatsuhiko Nagafuchi
Takao Abe
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Publication of TW200532821A publication Critical patent/TW200532821A/zh
Application granted granted Critical
Publication of TWI264783B publication Critical patent/TWI264783B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
    • B29C33/40—Plastics, e.g. foam or rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/02—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles
    • B29C39/10—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor for making articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. casting around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Led Device Packages (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
TW094106554A 2004-03-18 2005-03-04 Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig TWI264783B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004078316A JP4686132B2 (ja) 2004-03-18 2004-03-18 保護カバー付き光半導体装置の製造方法

Publications (2)

Publication Number Publication Date
TW200532821A TW200532821A (en) 2005-10-01
TWI264783B true TWI264783B (en) 2006-10-21

Family

ID=34986879

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094106554A TWI264783B (en) 2004-03-18 2005-03-04 Method of manufacturing optical semiconductor device, package molding jig, method of manufacturing package molding jig and manufacturing apparatus for package molding jig

Country Status (5)

Country Link
US (1) US7393706B2 (zh)
JP (1) JP4686132B2 (zh)
KR (1) KR100635401B1 (zh)
CN (1) CN100380617C (zh)
TW (1) TWI264783B (zh)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100637476B1 (ko) * 2005-11-09 2006-10-23 알티전자 주식회사 측면발광 다이오드 및 그 제조방법
CN100392880C (zh) * 2005-11-28 2008-06-04 陈泽 发光二极管
JP2007329394A (ja) * 2006-06-09 2007-12-20 Hitachi Lighting Ltd 光源モジュール、光源モジュールの製造方法および液晶表示装置
DE102006046301A1 (de) * 2006-09-29 2008-04-03 Osram Opto Semiconductors Gmbh Optisches Element, strahlungsemittierendes Bauelement und Verfahren zur Herstellung eines optischen Elements
TWM340555U (en) * 2007-11-23 2008-09-11 Everlight Electronics Co Ltd Light emmitting diode device
TW200926450A (en) * 2007-12-14 2009-06-16 Silitek Electronic Gz Co Ltd Optical semiconductor packaging structure and its packaging method
KR100948800B1 (ko) * 2009-07-07 2010-03-30 동양산업(주) 지그의 반전을 이용한 ｌｅｄ모듈 제작방법
FR2949710B1 (fr) * 2009-09-04 2011-11-25 Lorraine Construction Aeronautique Dispositif de moulage destine a recevoir des fibres et une resine par injection.
JP5556369B2 (ja) * 2010-05-25 2014-07-23 日亜化学工業株式会社 発光装置及びそれを用いた表示装置
CN102956758B (zh) * 2011-08-22 2015-03-25 赛恩倍吉科技顾问（深圳）有限公司 Led封装结构的制作方法
CN103762295B (zh) * 2014-01-21 2016-06-01 韩刚 一种信号收发二极管的封装方法
JP6487734B2 (ja) * 2015-03-18 2019-03-20 名古屋油化株式会社 カバー防曇処理用治具
KR102017730B1 (ko) * 2018-03-02 2019-09-03 주식회사 세미콘라이트 반도체 발광소자용 예비 봉지재 제조방법
CN110197867A (zh) 2018-02-26 2019-09-03 世迈克琉明有限公司 半导体发光器件及其制造方法

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Publication number Priority date Publication date Assignee Title
NL255403A (zh) * 1957-11-08
US3764862A (en) * 1972-10-19 1973-10-09 Fairchild Camera Instr Co Lead frame for light-emitting diodes
JPS6222491A (ja) * 1985-07-23 1987-01-30 Toshiba Corp 半導体発光装置
JPH06283645A (ja) * 1993-03-30 1994-10-07 Sony Corp 半導体装置
JPH07183440A (ja) * 1993-11-09 1995-07-21 Toshiba Corp 半導体素子用リードフレーム及びキャスティングケース
JP3326275B2 (ja) * 1994-05-17 2002-09-17 ローム株式会社 発光ダイオードランプにおけるレンズ部用合成樹脂製成形型の成形方法
JPH098357A (ja) * 1995-06-16 1997-01-10 Rohm Co Ltd 発光装置およびその製造方法
JP4316019B2 (ja) * 1996-10-01 2009-08-19 株式会社東芝 半導体装置及び半導体装置製造方法
JP3598220B2 (ja) * 1997-07-22 2004-12-08 日本写真印刷株式会社 絵付インサートフィルムおよび絵付インサート成形品の製造方法
JP2001172478A (ja) * 1999-12-20 2001-06-26 Nippon Zeon Co Ltd 脂環式オレフィン重合体組成物
JP2002076233A (ja) * 2000-09-04 2002-03-15 Mitsubishi Electric Corp 半導体装置
JP2003266530A (ja) * 2002-03-18 2003-09-24 Sumitomo Bakelite Co Ltd 照明器具用反射板部品
JP2004050642A (ja) * 2002-07-19 2004-02-19 Toyo Seikan Kaisha Ltd 熱可塑性樹脂容器の製造方法
JP3870867B2 (ja) * 2002-07-19 2007-01-24 東洋製罐株式会社 熱可塑性樹脂容器の製造方法

Also Published As

Publication number Publication date
KR100635401B1 (ko) 2006-10-19
TW200532821A (en) 2005-10-01
US7393706B2 (en) 2008-07-01
CN1670933A (zh) 2005-09-21
KR20060043719A (ko) 2006-05-15
JP2005268503A (ja) 2005-09-29
CN100380617C (zh) 2008-04-09
JP4686132B2 (ja) 2011-05-18
US20050208690A1 (en) 2005-09-22

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees