JP2005249693A5 - - Google Patents
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- Publication number
- JP2005249693A5 JP2005249693A5 JP2004063228A JP2004063228A JP2005249693A5 JP 2005249693 A5 JP2005249693 A5 JP 2005249693A5 JP 2004063228 A JP2004063228 A JP 2004063228A JP 2004063228 A JP2004063228 A JP 2004063228A JP 2005249693 A5 JP2005249693 A5 JP 2005249693A5
- Authority
- JP
- Japan
- Prior art keywords
- inspected
- contact portion
- contact
- probe
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 claims 9
- 239000004020 conductor Substances 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 3
- 238000007689 inspection Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910003460 diamond Inorganic materials 0.000 claims 1
- 239000010432 diamond Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004063228A JP4723195B2 (ja) | 2004-03-05 | 2004-03-05 | プローブの製造方法 |
| US10/591,645 US7649369B2 (en) | 2004-03-05 | 2005-03-03 | Probe and method of manufacturing probe |
| CNB2005800071701A CN100442058C (zh) | 2004-03-05 | 2005-03-03 | 探针以及探针的制造方法 |
| EP05719913A EP1724594A1 (en) | 2004-03-05 | 2005-03-03 | Probe and probe manufacturing method |
| PCT/JP2005/003609 WO2005085877A1 (ja) | 2004-03-05 | 2005-03-03 | プローブ及びプローブの製造方法 |
| KR1020067017410A KR100835245B1 (ko) | 2004-03-05 | 2005-03-03 | 프로브 및 프로브의 제조 방법 |
| TW094106626A TW200540425A (en) | 2004-03-05 | 2005-03-04 | Test probe and manufacturing method of same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004063228A JP4723195B2 (ja) | 2004-03-05 | 2004-03-05 | プローブの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005249693A JP2005249693A (ja) | 2005-09-15 |
| JP2005249693A5 true JP2005249693A5 (enExample) | 2006-12-28 |
| JP4723195B2 JP4723195B2 (ja) | 2011-07-13 |
Family
ID=34918148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004063228A Expired - Fee Related JP4723195B2 (ja) | 2004-03-05 | 2004-03-05 | プローブの製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7649369B2 (enExample) |
| EP (1) | EP1724594A1 (enExample) |
| JP (1) | JP4723195B2 (enExample) |
| KR (1) | KR100835245B1 (enExample) |
| CN (1) | CN100442058C (enExample) |
| TW (1) | TW200540425A (enExample) |
| WO (1) | WO2005085877A1 (enExample) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4676224B2 (ja) * | 2005-03-23 | 2011-04-27 | 東京特殊電線株式会社 | プローブ針及びその製造方法 |
| JP4855757B2 (ja) * | 2005-10-19 | 2012-01-18 | 富士通株式会社 | カーボンナノチューブパッド及び電子デバイス |
| JP2008039639A (ja) * | 2006-08-08 | 2008-02-21 | Hioki Ee Corp | 接触式計測用プローブ |
| US7731503B2 (en) * | 2006-08-21 | 2010-06-08 | Formfactor, Inc. | Carbon nanotube contact structures |
| TW200815763A (en) * | 2006-09-26 | 2008-04-01 | Nihon Micronics Kabushiki Kaisha | Electrical test probe and electrical test probe assembly |
| KR100804738B1 (ko) * | 2007-01-16 | 2008-02-19 | 삼성전자주식회사 | 이온화 충돌 반도체 소자를 이용한 반도체 탐침 및 이를구비한 정보 저장 장치와 그의 제조 방법 |
| JP2008235555A (ja) * | 2007-03-20 | 2008-10-02 | Shinko Electric Ind Co Ltd | 電子装置の製造方法及び基板及び半導体装置 |
| KR100799166B1 (ko) * | 2007-07-02 | 2008-01-29 | 이재하 | 프로브 배열체의 제조방법 |
| WO2009084770A1 (en) | 2007-12-28 | 2009-07-09 | Phicom Corporation | Contact tip structure of a connecting element |
| CN101526555B (zh) * | 2008-03-04 | 2011-12-07 | 跃沄科技有限公司 | 一种制探针的方法 |
| JPWO2010007816A1 (ja) * | 2008-07-18 | 2012-01-05 | 東京エレクトロン株式会社 | プローブ |
| JP5325085B2 (ja) * | 2009-12-24 | 2013-10-23 | 日本碍子株式会社 | 接続装置 |
| KR101047550B1 (ko) | 2010-07-02 | 2011-07-07 | 주식회사 아이에스시테크놀러지 | 탐침부를 가지는 도전성 접속부재 및 그 도전성 접속부재를 제조하는 방법 |
| WO2012002763A2 (en) | 2010-07-02 | 2012-01-05 | Jae Hak Lee | Test probe for test and fabrication method thereof |
| CN102610941A (zh) * | 2011-01-19 | 2012-07-25 | 富士康(昆山)电脑接插件有限公司 | 测试连接器 |
| JP5688064B2 (ja) | 2012-11-02 | 2015-03-25 | 本田技研工業株式会社 | 半導体素子検査装置及び検査方法 |
| CN103091617B (zh) * | 2013-01-29 | 2017-08-15 | 无锡华润上华科技有限公司 | 一种半导体测试方法 |
| JP5936579B2 (ja) * | 2013-05-08 | 2016-06-22 | 本田技研工業株式会社 | 電流印加装置 |
| EP2894483B1 (en) * | 2014-01-09 | 2018-06-27 | Multitest elektronische Systeme GmbH | Contact tip and contact element and method of producing the same |
| US10732201B2 (en) * | 2014-04-13 | 2020-08-04 | Infineon Technologies Ag | Test probe and method of manufacturing a test probe |
| TWI564569B (zh) * | 2015-09-21 | 2017-01-01 | 旺矽科技股份有限公司 | 探針結構及其製造方法 |
| CN106443188B (zh) * | 2016-11-09 | 2020-08-25 | 武汉新芯集成电路制造有限公司 | 一种电阻量测探头 |
| KR101962702B1 (ko) * | 2017-06-28 | 2019-03-27 | 주식회사 아이에스시 | 포고핀용 탐침부재, 이의 제조 방법 및 이를 포함하는 포고핀 |
| KR101976702B1 (ko) * | 2017-08-31 | 2019-05-09 | 주식회사 아이에스시 | 탄소나노튜브가 포함된 검사용 소켓 |
| CN108279368A (zh) * | 2018-01-23 | 2018-07-13 | 德淮半导体有限公司 | 测试机台及测试方法 |
| JP7497629B2 (ja) * | 2020-07-03 | 2024-06-11 | 富士電機株式会社 | 半導体チップの試験装置および試験方法 |
| CN116263473A (zh) * | 2021-12-13 | 2023-06-16 | 合肥本源量子计算科技有限责任公司 | 探针装置、超导量子比特结电阻测量装置、系统及方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE68917231T2 (de) * | 1988-05-18 | 1994-12-15 | Canon Kk | Sondenkarte, Verfahren zur Messung eines zu messenden Teiles mit derselben und elektrischer Schaltungsteil. |
| US5419807A (en) * | 1993-09-03 | 1995-05-30 | Micron Technology, Inc. | Method of providing electrical interconnect between two layers within a silicon substrate, semiconductor apparatus, and method of forming apparatus for testing semiconductor circuitry for operability |
| US5483741A (en) * | 1993-09-03 | 1996-01-16 | Micron Technology, Inc. | Method for fabricating a self limiting silicon based interconnect for testing bare semiconductor dice |
| JP3460094B2 (ja) * | 1994-02-21 | 2003-10-27 | 株式会社呉英製作所 | Icパッケージ検査用ソケットの電極部形成方法 |
| JPH0968546A (ja) * | 1995-08-31 | 1997-03-11 | Nitto Denko Corp | テストヘッド構造およびその製造方法 |
| JPH09196969A (ja) * | 1996-01-23 | 1997-07-31 | Nitto Denko Corp | プローブ構造 |
| JP2796070B2 (ja) | 1995-04-28 | 1998-09-10 | 松下電器産業株式会社 | プローブカードの製造方法 |
| US5763879A (en) * | 1996-09-16 | 1998-06-09 | Pacific Western Systems | Diamond probe tip |
| JP2944537B2 (ja) * | 1996-10-14 | 1999-09-06 | 山一電機株式会社 | 電子部品接触用フレキシブル配線板 |
| JPH10132854A (ja) | 1996-10-29 | 1998-05-22 | Matsushita Electron Corp | コンタクタ及びコンタクタの形成方法 |
| JPH10221370A (ja) * | 1997-01-31 | 1998-08-21 | Mitsubishi Materials Corp | コンタクトプローブおよびその製造方法、並びにコンタクトプローブを備えたプローブ装置 |
| US5894161A (en) * | 1997-02-24 | 1999-04-13 | Micron Technology, Inc. | Interconnect with pressure sensing mechanism for testing semiconductor wafers |
| JPH1123615A (ja) * | 1997-05-09 | 1999-01-29 | Hitachi Ltd | 接続装置および検査システム |
| DE69837690T2 (de) * | 1997-07-24 | 2007-12-27 | Mitsubishi Denki K.K. | Gerät zur Entfernung von an einer Prüfspitzenendfläche haftenden Fremdstoffen |
| JPH1151970A (ja) | 1997-07-31 | 1999-02-26 | Nec Corp | プローブカード |
| JPH1197494A (ja) * | 1997-09-18 | 1999-04-09 | Hitachi Ltd | 半導体装置およびその製造方法 |
| WO1999015908A1 (fr) * | 1997-09-19 | 1999-04-01 | Hitachi, Ltd. | Procede de fabrication de dispositif de circuit integre a semi-conducteurs |
| US6285201B1 (en) * | 1997-10-06 | 2001-09-04 | Micron Technology, Inc. | Method and apparatus for capacitively testing a semiconductor die |
| US6246245B1 (en) * | 1998-02-23 | 2001-06-12 | Micron Technology, Inc. | Probe card, test method and test system for semiconductor wafers |
| JP4084498B2 (ja) * | 1998-10-27 | 2008-04-30 | 松下電器産業株式会社 | 検査用基板 |
| JP4361161B2 (ja) | 1999-04-06 | 2009-11-11 | 日東電工株式会社 | 異方導電性コネクター |
| US6352454B1 (en) * | 1999-10-20 | 2002-03-05 | Xerox Corporation | Wear-resistant spring contacts |
| JP2002131334A (ja) * | 2000-10-24 | 2002-05-09 | Nec Yamaguchi Ltd | プローブ針、プローブカード、及びプローブカードの作製方法 |
| US7015707B2 (en) * | 2002-03-20 | 2006-03-21 | Gabe Cherian | Micro probe |
| US7112974B1 (en) * | 2002-05-23 | 2006-09-26 | Cypress Semiconductor Corporation | Proble for testing integrated circuits |
| JP3771907B2 (ja) | 2002-05-27 | 2006-05-10 | 山一電機株式会社 | 電極の回復処理方法 |
| KR100373762B1 (en) * | 2002-09-25 | 2003-02-26 | Uk Ki Lee | Method for manufacturing cavity-type micro-probe using mems technology and micro-probe according to the same |
-
2004
- 2004-03-05 JP JP2004063228A patent/JP4723195B2/ja not_active Expired - Fee Related
-
2005
- 2005-03-03 WO PCT/JP2005/003609 patent/WO2005085877A1/ja not_active Ceased
- 2005-03-03 EP EP05719913A patent/EP1724594A1/en not_active Withdrawn
- 2005-03-03 KR KR1020067017410A patent/KR100835245B1/ko not_active Expired - Fee Related
- 2005-03-03 US US10/591,645 patent/US7649369B2/en not_active Expired - Fee Related
- 2005-03-03 CN CNB2005800071701A patent/CN100442058C/zh not_active Expired - Fee Related
- 2005-03-04 TW TW094106626A patent/TW200540425A/zh not_active IP Right Cessation
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