JP2010054463A5 - - Google Patents

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Publication number
JP2010054463A5
JP2010054463A5 JP2008222285A JP2008222285A JP2010054463A5 JP 2010054463 A5 JP2010054463 A5 JP 2010054463A5 JP 2008222285 A JP2008222285 A JP 2008222285A JP 2008222285 A JP2008222285 A JP 2008222285A JP 2010054463 A5 JP2010054463 A5 JP 2010054463A5
Authority
JP
Japan
Prior art keywords
substrate
hole
bonding
semiconductor inspection
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008222285A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010054463A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2008222285A priority Critical patent/JP2010054463A/ja
Priority claimed from JP2008222285A external-priority patent/JP2010054463A/ja
Publication of JP2010054463A publication Critical patent/JP2010054463A/ja
Publication of JP2010054463A5 publication Critical patent/JP2010054463A5/ja
Pending legal-status Critical Current

Links

JP2008222285A 2008-08-29 2008-08-29 半導体検査装置及びその製造方法 Pending JP2010054463A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008222285A JP2010054463A (ja) 2008-08-29 2008-08-29 半導体検査装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008222285A JP2010054463A (ja) 2008-08-29 2008-08-29 半導体検査装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2010054463A JP2010054463A (ja) 2010-03-11
JP2010054463A5 true JP2010054463A5 (enExample) 2011-07-28

Family

ID=42070535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008222285A Pending JP2010054463A (ja) 2008-08-29 2008-08-29 半導体検査装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP2010054463A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103869109B (zh) * 2012-12-12 2017-10-10 华邦电子股份有限公司 探针卡及其焊接方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09113537A (ja) * 1995-10-17 1997-05-02 Nippon Denshi Zairyo Kk 垂直作動型プローブカード
JP3128199B2 (ja) * 1996-06-28 2001-01-29 信越ポリマー株式会社 検査用プローブ
JP3302635B2 (ja) * 1998-01-30 2002-07-15 信越ポリマー株式会社 電気コネクタ及びその製造方法
KR20060105033A (ko) * 2003-11-26 2006-10-09 폼팩터, 인코포레이티드 수직 관통 구조를 제조하는 방법
EP1737075B1 (de) * 2005-06-23 2017-03-08 Feinmetall GmbH Kontaktiervorrichtung

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