JP2010199142A5 - - Google Patents

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Publication number
JP2010199142A5
JP2010199142A5 JP2009039448A JP2009039448A JP2010199142A5 JP 2010199142 A5 JP2010199142 A5 JP 2010199142A5 JP 2009039448 A JP2009039448 A JP 2009039448A JP 2009039448 A JP2009039448 A JP 2009039448A JP 2010199142 A5 JP2010199142 A5 JP 2010199142A5
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JP
Japan
Prior art keywords
capillary
bonding
pressure contact
initial ball
scrubbing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009039448A
Other languages
English (en)
Japanese (ja)
Other versions
JP4595018B2 (ja
JP2010199142A (ja
Filing date
Publication date
Priority claimed from JP2009039448A external-priority patent/JP4595018B2/ja
Priority to JP2009039448A priority Critical patent/JP4595018B2/ja
Application filed filed Critical
Priority to PCT/JP2010/050910 priority patent/WO2010095490A1/ja
Priority to SG2011060969A priority patent/SG173828A1/en
Priority to CN201080008761.1A priority patent/CN102326241B/zh
Publication of JP2010199142A publication Critical patent/JP2010199142A/ja
Publication of JP2010199142A5 publication Critical patent/JP2010199142A5/ja
Publication of JP4595018B2 publication Critical patent/JP4595018B2/ja
Application granted granted Critical
Priority to US13/214,682 priority patent/US8292160B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009039448A 2009-02-23 2009-02-23 半導体装置の製造方法およびボンディング装置 Active JP4595018B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2009039448A JP4595018B2 (ja) 2009-02-23 2009-02-23 半導体装置の製造方法およびボンディング装置
PCT/JP2010/050910 WO2010095490A1 (ja) 2009-02-23 2010-01-25 半導体装置の製造方法およびボンディング装置
SG2011060969A SG173828A1 (en) 2009-02-23 2010-01-25 Method for manufacturing semiconductor device, and bonding apparatus
CN201080008761.1A CN102326241B (zh) 2009-02-23 2010-01-25 半导体装置的制造方法以及焊接装置
US13/214,682 US8292160B2 (en) 2009-02-23 2011-08-22 Method of manufacturing semiconductor device, and bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009039448A JP4595018B2 (ja) 2009-02-23 2009-02-23 半導体装置の製造方法およびボンディング装置

Publications (3)

Publication Number Publication Date
JP2010199142A JP2010199142A (ja) 2010-09-09
JP2010199142A5 true JP2010199142A5 (enExample) 2010-10-21
JP4595018B2 JP4595018B2 (ja) 2010-12-08

Family

ID=42633776

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009039448A Active JP4595018B2 (ja) 2009-02-23 2009-02-23 半導体装置の製造方法およびボンディング装置

Country Status (5)

Country Link
US (1) US8292160B2 (enExample)
JP (1) JP4595018B2 (enExample)
CN (1) CN102326241B (enExample)
SG (1) SG173828A1 (enExample)
WO (1) WO2010095490A1 (enExample)

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Publication number Priority date Publication date Assignee Title
DE102011080534A1 (de) * 2011-08-05 2013-02-07 Hesse & Knipps Gmbh Verfahren zum Ultraschallbonden
TWI541920B (zh) * 2013-07-23 2016-07-11 矽品精密工業股份有限公司 打線結構之製法
MY171264A (en) 2014-03-28 2019-10-07 Nxp Usa Inc Wire bonding method employing two scrub settings
USD771168S1 (en) 2014-10-31 2016-11-08 Coorstek, Inc. Wire bonding ceramic capillary
USD797171S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797826S1 (en) 2015-02-03 2017-09-19 Coorstek, Inc. Ceramic bonding tool with textured tip
USD797172S1 (en) 2015-02-03 2017-09-12 Coorstek, Inc. Ceramic bonding tool with textured tip
USD753739S1 (en) 2015-04-17 2016-04-12 Coorstek, Inc. Wire bonding wedge tool
USD868123S1 (en) 2016-12-20 2019-11-26 Coorstek, Inc. Wire bonding wedge tool
JP6688725B2 (ja) * 2016-12-26 2020-04-28 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
CN112437974B (zh) * 2018-06-06 2025-02-14 德州仪器公司 半导体裸片的球接合附接
US11205937B2 (en) * 2018-07-18 2021-12-21 Asm Technology Singapore Pte Ltd Driving system having reduced vibration transmission
US11404393B2 (en) 2018-08-23 2022-08-02 Kaijo Corporation Wire bonding method and wire bonding device
US11901329B2 (en) * 2019-06-17 2024-02-13 Kaijo Corporation Wire bonding method and wire bonding apparatus
CN117020481A (zh) * 2023-07-14 2023-11-10 凌波微步半导体设备(常熟)有限公司 一种用于焊接研磨工艺的焊接方法、装置及终端设备

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