JP2010527509A5 - - Google Patents

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Publication number
JP2010527509A5
JP2010527509A5 JP2010504047A JP2010504047A JP2010527509A5 JP 2010527509 A5 JP2010527509 A5 JP 2010527509A5 JP 2010504047 A JP2010504047 A JP 2010504047A JP 2010504047 A JP2010504047 A JP 2010504047A JP 2010527509 A5 JP2010527509 A5 JP 2010527509A5
Authority
JP
Japan
Prior art keywords
providing
ablation
die
channel
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010504047A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010527509A (ja
Filing date
Publication date
Priority claimed from US11/737,187 external-priority patent/US7696013B2/en
Application filed filed Critical
Publication of JP2010527509A publication Critical patent/JP2010527509A/ja
Publication of JP2010527509A5 publication Critical patent/JP2010527509A5/ja
Pending legal-status Critical Current

Links

JP2010504047A 2007-04-19 2008-04-04 アブレーション膜を用いたマイクロサイズデバイスの接続 Pending JP2010527509A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/737,187 US7696013B2 (en) 2007-04-19 2007-04-19 Connecting microsized devices using ablative films
PCT/US2008/004406 WO2008130493A2 (en) 2007-04-19 2008-04-04 Connecting microsized devices using ablative films

Publications (2)

Publication Number Publication Date
JP2010527509A JP2010527509A (ja) 2010-08-12
JP2010527509A5 true JP2010527509A5 (enExample) 2012-05-31

Family

ID=39643402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010504047A Pending JP2010527509A (ja) 2007-04-19 2008-04-04 アブレーション膜を用いたマイクロサイズデバイスの接続

Country Status (5)

Country Link
US (3) US7696013B2 (enExample)
EP (1) EP2147463A2 (enExample)
JP (1) JP2010527509A (enExample)
CN (1) CN101681851A (enExample)
WO (1) WO2008130493A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9142475B2 (en) * 2013-08-13 2015-09-22 Intel Corporation Magnetic contacts
CN106463463B (zh) * 2014-03-31 2019-07-26 穆尔泰拉生物公司 用于流体元件和设备协整的低成本封装
KR102157942B1 (ko) 2014-09-26 2020-09-21 인텔 코포레이션 플렉시블 패키징 아키텍처
DE102016212666A1 (de) * 2016-07-12 2018-01-18 Schweizer Electronic Ag Verfahren zur Herstellung eines Leiterplattenelements und Leiterplattenelement
EP3542398A4 (en) * 2016-11-21 2020-12-02 3M Innovative Properties Company AUTOMATIC REGISTRATION BETWEEN CIRCUIT CHIPS AND INTERCONNECTIONS
EP3355667A1 (de) * 2017-01-30 2018-08-01 Siemens Aktiengesellschaft Verfahren zur herstellung einer elektrischen schaltung und elektrische schaltung
DE102017221544A1 (de) * 2017-11-30 2019-06-06 Contitech Antriebssysteme Gmbh Flexibles Produkt
US20190204505A1 (en) * 2017-12-30 2019-07-04 Texas Instruments Incorporated Additive photonic interconnects in microelectronic device
WO2019224670A1 (en) * 2018-05-21 2019-11-28 3M Innovative Properties Company Ultrathin and flexible devices including circuit dies

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5472539A (en) * 1994-06-06 1995-12-05 General Electric Company Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated components
US6752966B1 (en) * 1999-09-10 2004-06-22 Caliper Life Sciences, Inc. Microfabrication methods and devices
WO2002086162A1 (en) 2001-04-23 2002-10-31 Samsung Electronics Co., Ltd. Molecular detection chip including mosfet, molecular detection device employing the chip, and molecular detection method using the device
DE10205127A1 (de) * 2002-02-07 2003-08-28 Infineon Technologies Ag Halbleiterbauteil mit Sensor- bzw. Aktoroberfläche und Verfahren zu seiner Herstellung
EP1604197A2 (en) 2003-03-18 2005-12-14 Cantion A/S A cantilever array chemical sensor
US7014727B2 (en) * 2003-07-07 2006-03-21 Potomac Photonics, Inc. Method of forming high resolution electronic circuits on a substrate
US7115514B2 (en) * 2003-10-02 2006-10-03 Raydiance, Inc. Semiconductor manufacturing using optical ablation
US8142987B2 (en) * 2004-04-10 2012-03-27 Eastman Kodak Company Method of producing a relief image for printing
US7951580B2 (en) * 2004-04-21 2011-05-31 The Regents Of The University Of California Automated, programmable, high throughput, multiplexed assay system for cellular and biological assays
DE102004041595A1 (de) * 2004-04-30 2005-12-01 Markus Gruber Messzelle sowie Verfahren zum Herstellen einer Messzelle und Messvorrichtung zur Aufnahme einer derartigen Messzelle
US7629026B2 (en) * 2004-09-03 2009-12-08 Eastman Kodak Company Thermally controlled fluidic self-assembly
US8796583B2 (en) * 2004-09-17 2014-08-05 Eastman Kodak Company Method of forming a structured surface using ablatable radiation sensitive material
US7687277B2 (en) * 2004-12-22 2010-03-30 Eastman Kodak Company Thermally controlled fluidic self-assembly
GB2438768A (en) 2005-02-15 2007-12-05 Univ Singapore Microfluidics package and method of fabricating the same
JP2006332615A (ja) * 2005-04-25 2006-12-07 Brother Ind Ltd パターン形成方法

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