JP2010527509A - アブレーション膜を用いたマイクロサイズデバイスの接続 - Google Patents

アブレーション膜を用いたマイクロサイズデバイスの接続 Download PDF

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Publication number
JP2010527509A
JP2010527509A JP2010504047A JP2010504047A JP2010527509A JP 2010527509 A JP2010527509 A JP 2010527509A JP 2010504047 A JP2010504047 A JP 2010504047A JP 2010504047 A JP2010504047 A JP 2010504047A JP 2010527509 A JP2010527509 A JP 2010527509A
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JP
Japan
Prior art keywords
channel
ablation
die
providing
connection
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Pending
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JP2010504047A
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English (en)
Japanese (ja)
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JP2010527509A5 (enExample
Inventor
ザキ アリ，モハマド
アクセル ストルト，ピーター
アレン ホーキンス，ギルバート
マイケル ステファニー，トーマス
Original Assignee
イーストマン コダック カンパニー
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Application filed by イーストマン コダック カンパニー filed Critical イーストマン コダック カンパニー
Publication of JP2010527509A publication Critical patent/JP2010527509A/ja
Publication of JP2010527509A5 publication Critical patent/JP2010527509A5/ja
Pending legal-status Critical Current

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    • H10W72/00—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H10W72/30—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/098—Arrangements not provided for in groups B81B2207/092 - B81B2207/097
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0562—Details of resist
    • H05K2203/0568—Resist used for applying paste, ink or powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1461—Applying or finishing the circuit pattern after another process, e.g. after filling of vias with conductive paste, after making printed resistors
    • H05K2203/1469—Circuit made after mounting or encapsulation of the components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H10W70/093—
    • H10W70/097—
    • H10W70/60—
    • H10W70/6528—
    • H10W72/01223—
    • H10W72/01308—
    • H10W72/073—
    • H10W72/07311—
    • H10W72/07331—
    • H10W72/853—
    • H10W90/00—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/94—Laser ablative material removal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2010504047A 2007-04-19 2008-04-04 アブレーション膜を用いたマイクロサイズデバイスの接続 Pending JP2010527509A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/737,187 US7696013B2 (en) 2007-04-19 2007-04-19 Connecting microsized devices using ablative films
PCT/US2008/004406 WO2008130493A2 (en) 2007-04-19 2008-04-04 Connecting microsized devices using ablative films

Publications (2)

Publication Number Publication Date
JP2010527509A true JP2010527509A (ja) 2010-08-12
JP2010527509A5 JP2010527509A5 (enExample) 2012-05-31

Family

ID=39643402

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010504047A Pending JP2010527509A (ja) 2007-04-19 2008-04-04 アブレーション膜を用いたマイクロサイズデバイスの接続

Country Status (5)

Country Link
US (3) US7696013B2 (enExample)
EP (1) EP2147463A2 (enExample)
JP (1) JP2010527509A (enExample)
CN (1) CN101681851A (enExample)
WO (1) WO2008130493A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020504438A (ja) * 2016-11-21 2020-02-06 スリーエム イノベイティブ プロパティズ カンパニー 回路ダイと相互接続部との間の自動位置合せ

Families Citing this family (8)

* Cited by examiner, † Cited by third party
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US9142475B2 (en) * 2013-08-13 2015-09-22 Intel Corporation Magnetic contacts
EP3127148A4 (en) * 2014-03-31 2017-11-15 Multerra Bio, Inc. Low-cost packaging for fluidic and device co-integration
WO2016048347A1 (en) 2014-09-26 2016-03-31 Intel Corporation Flexible packaging architecture
DE102016212666A1 (de) * 2016-07-12 2018-01-18 Schweizer Electronic Ag Verfahren zur Herstellung eines Leiterplattenelements und Leiterplattenelement
EP3355667A1 (de) 2017-01-30 2018-08-01 Siemens Aktiengesellschaft Verfahren zur herstellung einer elektrischen schaltung und elektrische schaltung
DE102017221544A1 (de) * 2017-11-30 2019-06-06 Contitech Antriebssysteme Gmbh Flexibles Produkt
US20190204505A1 (en) * 2017-12-30 2019-07-04 Texas Instruments Incorporated Additive photonic interconnects in microelectronic device
EP3797439A4 (en) * 2018-05-21 2022-03-02 3M Innovative Properties Company ULTRA-THIN AND FLEXIBLE DEVICES WITH CIRCUIT CHIPS

Citations (1)

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JP2006332615A (ja) * 2005-04-25 2006-12-07 Brother Ind Ltd パターン形成方法

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US5472539A (en) * 1994-06-06 1995-12-05 General Electric Company Methods for forming and positioning moldable permanent magnets on electromagnetically actuated microfabricated components
US6752966B1 (en) * 1999-09-10 2004-06-22 Caliper Life Sciences, Inc. Microfabrication methods and devices
US7235389B2 (en) 2001-04-23 2007-06-26 Samsung Electronics Co., Ltd. Molecular detection device and chip including MOSFET
DE10205127A1 (de) 2002-02-07 2003-08-28 Infineon Technologies Ag Halbleiterbauteil mit Sensor- bzw. Aktoroberfläche und Verfahren zu seiner Herstellung
US20060177349A1 (en) 2003-03-18 2006-08-10 Jacob Thaysen Chemical sensor
US7014727B2 (en) * 2003-07-07 2006-03-21 Potomac Photonics, Inc. Method of forming high resolution electronic circuits on a substrate
US7115514B2 (en) 2003-10-02 2006-10-03 Raydiance, Inc. Semiconductor manufacturing using optical ablation
US8142987B2 (en) 2004-04-10 2012-03-27 Eastman Kodak Company Method of producing a relief image for printing
US7951580B2 (en) * 2004-04-21 2011-05-31 The Regents Of The University Of California Automated, programmable, high throughput, multiplexed assay system for cellular and biological assays
DE102004041595A1 (de) 2004-04-30 2005-12-01 Markus Gruber Messzelle sowie Verfahren zum Herstellen einer Messzelle und Messvorrichtung zur Aufnahme einer derartigen Messzelle
US7629026B2 (en) 2004-09-03 2009-12-08 Eastman Kodak Company Thermally controlled fluidic self-assembly
US8796583B2 (en) * 2004-09-17 2014-08-05 Eastman Kodak Company Method of forming a structured surface using ablatable radiation sensitive material
US7687277B2 (en) 2004-12-22 2010-03-30 Eastman Kodak Company Thermally controlled fluidic self-assembly
GB2438768A (en) 2005-02-15 2007-12-05 Univ Singapore Microfluidics package and method of fabricating the same

Patent Citations (1)

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JP2006332615A (ja) * 2005-04-25 2006-12-07 Brother Ind Ltd パターン形成方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020504438A (ja) * 2016-11-21 2020-02-06 スリーエム イノベイティブ プロパティズ カンパニー 回路ダイと相互接続部との間の自動位置合せ
JP7190430B2 (ja) 2016-11-21 2022-12-15 スリーエム イノベイティブ プロパティズ カンパニー 回路ダイと相互接続部との間の自動位置合せ

Also Published As

Publication number Publication date
US7696013B2 (en) 2010-04-13
US20100112758A1 (en) 2010-05-06
CN101681851A (zh) 2010-03-24
WO2008130493A3 (en) 2009-03-19
US20100109168A1 (en) 2010-05-06
WO2008130493A2 (en) 2008-10-30
US20080258313A1 (en) 2008-10-23
EP2147463A2 (en) 2010-01-27

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