JP2010054463A - 半導体検査装置及びその製造方法 - Google Patents

半導体検査装置及びその製造方法 Download PDF

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Publication number
JP2010054463A
JP2010054463A JP2008222285A JP2008222285A JP2010054463A JP 2010054463 A JP2010054463 A JP 2010054463A JP 2008222285 A JP2008222285 A JP 2008222285A JP 2008222285 A JP2008222285 A JP 2008222285A JP 2010054463 A JP2010054463 A JP 2010054463A
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JP
Japan
Prior art keywords
inspection apparatus
substrate
semiconductor inspection
probe needle
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008222285A
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English (en)
Japanese (ja)
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JP2010054463A5 (enExample
Inventor
Yuichi Taguchi
裕一 田口
Akinori Shiraishi
晶紀 白石
Hiroshi Murayama
啓 村山
Mitsuhiro Aizawa
光浩 相澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2008222285A priority Critical patent/JP2010054463A/ja
Publication of JP2010054463A publication Critical patent/JP2010054463A/ja
Publication of JP2010054463A5 publication Critical patent/JP2010054463A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body

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  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2008222285A 2008-08-29 2008-08-29 半導体検査装置及びその製造方法 Pending JP2010054463A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008222285A JP2010054463A (ja) 2008-08-29 2008-08-29 半導体検査装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008222285A JP2010054463A (ja) 2008-08-29 2008-08-29 半導体検査装置及びその製造方法

Publications (2)

Publication Number Publication Date
JP2010054463A true JP2010054463A (ja) 2010-03-11
JP2010054463A5 JP2010054463A5 (enExample) 2011-07-28

Family

ID=42070535

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008222285A Pending JP2010054463A (ja) 2008-08-29 2008-08-29 半導体検査装置及びその製造方法

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JP (1) JP2010054463A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103869109A (zh) * 2012-12-12 2014-06-18 华邦电子股份有限公司 探针卡及其焊接方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09113537A (ja) * 1995-10-17 1997-05-02 Nippon Denshi Zairyo Kk 垂直作動型プローブカード
JPH1019931A (ja) * 1996-06-28 1998-01-23 Shin Etsu Polymer Co Ltd 検査用プローブ
JPH11211754A (ja) * 1998-01-30 1999-08-06 Shin Etsu Polymer Co Ltd 電気コネクタ及びその製造方法
JP2007003525A (ja) * 2005-06-23 2007-01-11 Feinmetall Gmbh 接触装置
JP2007512540A (ja) * 2003-11-26 2007-05-17 フォームファクター， インコーポレイテッド 垂直の電気的なフィードスルー構造を作る方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09113537A (ja) * 1995-10-17 1997-05-02 Nippon Denshi Zairyo Kk 垂直作動型プローブカード
JPH1019931A (ja) * 1996-06-28 1998-01-23 Shin Etsu Polymer Co Ltd 検査用プローブ
JPH11211754A (ja) * 1998-01-30 1999-08-06 Shin Etsu Polymer Co Ltd 電気コネクタ及びその製造方法
JP2007512540A (ja) * 2003-11-26 2007-05-17 フォームファクター， インコーポレイテッド 垂直の電気的なフィードスルー構造を作る方法
JP2007003525A (ja) * 2005-06-23 2007-01-11 Feinmetall Gmbh 接触装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103869109A (zh) * 2012-12-12 2014-06-18 华邦电子股份有限公司 探针卡及其焊接方法

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