JP2014112072A5 - - Google Patents
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- Publication number
- JP2014112072A5 JP2014112072A5 JP2013129815A JP2013129815A JP2014112072A5 JP 2014112072 A5 JP2014112072 A5 JP 2014112072A5 JP 2013129815 A JP2013129815 A JP 2013129815A JP 2013129815 A JP2013129815 A JP 2013129815A JP 2014112072 A5 JP2014112072 A5 JP 2014112072A5
- Authority
- JP
- Japan
- Prior art keywords
- wire
- contact terminal
- opening
- layer
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000523 sample Substances 0.000 claims description 53
- 239000011347 resin Substances 0.000 claims description 36
- 229920005989 resin Polymers 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 31
- 238000004519 manufacturing process Methods 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 22
- 238000007689 inspection Methods 0.000 claims description 6
- 239000013013 elastic material Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 239000011889 copper foil Substances 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
- 238000000059 patterning Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013129815A JP6246507B2 (ja) | 2012-11-05 | 2013-06-20 | プローブカード及びその製造方法 |
| US14/064,608 US9488677B2 (en) | 2012-11-05 | 2013-10-28 | Probe card having a wiring substrate |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012243681 | 2012-11-05 | ||
| JP2012243681 | 2012-11-05 | ||
| JP2013129815A JP6246507B2 (ja) | 2012-11-05 | 2013-06-20 | プローブカード及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014112072A JP2014112072A (ja) | 2014-06-19 |
| JP2014112072A5 true JP2014112072A5 (enExample) | 2016-05-12 |
| JP6246507B2 JP6246507B2 (ja) | 2017-12-13 |
Family
ID=50621789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013129815A Active JP6246507B2 (ja) | 2012-11-05 | 2013-06-20 | プローブカード及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9488677B2 (enExample) |
| JP (1) | JP6246507B2 (enExample) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6092729B2 (ja) * | 2013-07-19 | 2017-03-08 | 新光電気工業株式会社 | プローブカード及びその製造方法 |
| JP6208486B2 (ja) * | 2013-07-19 | 2017-10-04 | 新光電気工業株式会社 | プローブカード及びその製造方法 |
| JP6455022B2 (ja) * | 2014-08-22 | 2019-01-23 | 大日本印刷株式会社 | プローブカード及びそれを用いた半導体装置の製造方法 |
| US11262384B2 (en) | 2016-12-23 | 2022-03-01 | Intel Corporation | Fine pitch probe card methods and systems |
| US11268983B2 (en) | 2017-06-30 | 2022-03-08 | Intel Corporation | Chevron interconnect for very fine pitch probing |
| US10775414B2 (en) | 2017-09-29 | 2020-09-15 | Intel Corporation | Low-profile gimbal platform for high-resolution in situ co-planarity adjustment |
| US11061068B2 (en) | 2017-12-05 | 2021-07-13 | Intel Corporation | Multi-member test probe structure |
| US11204555B2 (en) | 2017-12-28 | 2021-12-21 | Intel Corporation | Method and apparatus to develop lithographically defined high aspect ratio interconnects |
| US11073538B2 (en) | 2018-01-03 | 2021-07-27 | Intel Corporation | Electrical testing apparatus with lateral movement of a probe support substrate |
| US10488438B2 (en) | 2018-01-05 | 2019-11-26 | Intel Corporation | High density and fine pitch interconnect structures in an electric test apparatus |
| US10866264B2 (en) * | 2018-01-05 | 2020-12-15 | Intel Corporation | Interconnect structure with varying modulus of elasticity |
| US11543454B2 (en) | 2018-09-25 | 2023-01-03 | Intel Corporation | Double-beam test probe |
| US10935573B2 (en) | 2018-09-28 | 2021-03-02 | Intel Corporation | Slip-plane MEMS probe for high-density and fine pitch interconnects |
| CN118102582A (zh) * | 2022-11-22 | 2024-05-28 | 庆鼎精密电子(淮安)有限公司 | 封装结构、封装基板及其制作方法 |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3911361A (en) * | 1974-06-28 | 1975-10-07 | Ibm | Coaxial array space transformer |
| US4566184A (en) * | 1981-08-24 | 1986-01-28 | Rockwell International Corporation | Process for making a probe for high speed integrated circuits |
| JPS59154054A (ja) * | 1983-02-23 | 1984-09-03 | Hitachi Ltd | ワイヤおよびそれを用いた半導体装置 |
| JPH05144895A (ja) * | 1991-11-20 | 1993-06-11 | Nec Yamagata Ltd | プローブカード |
| US20070228110A1 (en) * | 1993-11-16 | 2007-10-04 | Formfactor, Inc. | Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out |
| US5785538A (en) * | 1995-11-27 | 1998-07-28 | International Business Machines Corporation | High density test probe with rigid surface structure |
| JP3307823B2 (ja) * | 1996-02-23 | 2002-07-24 | 松下電器産業株式会社 | 電子部品検査用接触体の製造方法 |
| JP3128199B2 (ja) * | 1996-06-28 | 2001-01-29 | 信越ポリマー株式会社 | 検査用プローブ |
| US6100815A (en) * | 1997-12-24 | 2000-08-08 | Electro Scientific Industries, Inc. | Compound switching matrix for probing and interconnecting devices under test to measurement equipment |
| JP3302635B2 (ja) * | 1998-01-30 | 2002-07-15 | 信越ポリマー株式会社 | 電気コネクタ及びその製造方法 |
| JP2008076402A (ja) * | 1998-10-27 | 2008-04-03 | Matsushita Electric Ind Co Ltd | 検査用基板 |
| JP2001343426A (ja) * | 2000-05-31 | 2001-12-14 | Seiko Epson Corp | 半導体装置の検査方法 |
| JP2002184934A (ja) * | 2000-12-13 | 2002-06-28 | Shinko Electric Ind Co Ltd | 半導体装置及びその製造方法 |
| JP4014912B2 (ja) * | 2001-09-28 | 2007-11-28 | 株式会社ルネサステクノロジ | 半導体装置 |
| JP2005091065A (ja) * | 2003-09-16 | 2005-04-07 | Oki Electric Ind Co Ltd | 半導体装置への動作電圧供給装置及び動作電圧供給方法 |
| JP2006058157A (ja) * | 2004-08-20 | 2006-03-02 | Toyota Motor Corp | プローブカード |
| US7119571B2 (en) * | 2004-11-24 | 2006-10-10 | Applied Materials, Inc. | Test structure design for reliability test |
| US7030633B1 (en) * | 2004-12-03 | 2006-04-18 | Chunong Qiu | Four-terminal methods for resistivity measurement of semiconducting materials |
| US20070152685A1 (en) * | 2006-01-03 | 2007-07-05 | Formfactor, Inc. | A probe array structure and a method of making a probe array structure |
| JP4774071B2 (ja) * | 2007-04-05 | 2011-09-14 | ルネサスエレクトロニクス株式会社 | プローブ抵抗値測定方法、プローブ抵抗値測定用パッドを有する半導体装置 |
| JP2009192309A (ja) * | 2008-02-13 | 2009-08-27 | Shinko Electric Ind Co Ltd | 半導体検査装置 |
| TWI424165B (zh) * | 2009-04-09 | 2014-01-21 | Nhk Spring Co Ltd | 接觸探針及探針單元 |
| JP2011061112A (ja) * | 2009-09-14 | 2011-03-24 | Shinko Electric Ind Co Ltd | 半導体チップ積層体及び製造方法 |
| JP5465516B2 (ja) | 2009-12-08 | 2014-04-09 | 日本電子材料株式会社 | プローブ及びプローブの製造方法 |
| JP2011237391A (ja) | 2010-05-13 | 2011-11-24 | Renesas Electronics Corp | プローブカード |
| JP4919365B2 (ja) | 2010-12-16 | 2012-04-18 | ルネサスエレクトロニクス株式会社 | 半導体集積回路の製造方法 |
| JP6092729B2 (ja) * | 2013-07-19 | 2017-03-08 | 新光電気工業株式会社 | プローブカード及びその製造方法 |
| JP6208486B2 (ja) * | 2013-07-19 | 2017-10-04 | 新光電気工業株式会社 | プローブカード及びその製造方法 |
| JP6189187B2 (ja) * | 2013-11-19 | 2017-08-30 | 新光電気工業株式会社 | プローブカード及びプローブカードの製造方法 |
-
2013
- 2013-06-20 JP JP2013129815A patent/JP6246507B2/ja active Active
- 2013-10-28 US US14/064,608 patent/US9488677B2/en active Active
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