JP6246507B2 - プローブカード及びその製造方法 - Google Patents

プローブカード及びその製造方法 Download PDF

Info

Publication number
JP6246507B2
JP6246507B2 JP2013129815A JP2013129815A JP6246507B2 JP 6246507 B2 JP6246507 B2 JP 6246507B2 JP 2013129815 A JP2013129815 A JP 2013129815A JP 2013129815 A JP2013129815 A JP 2013129815A JP 6246507 B2 JP6246507 B2 JP 6246507B2
Authority
JP
Japan
Prior art keywords
wire
layer
probe card
contact
contact terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013129815A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014112072A5 (enExample
JP2014112072A (ja
Inventor
亮 深澤
亮 深澤
堀内　道夫
道夫 堀内
徳武　安衛
安衛 徳武
勇一 松田
勇一 松田
光浩 相澤
光浩 相澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP2013129815A priority Critical patent/JP6246507B2/ja
Priority to US14/064,608 priority patent/US9488677B2/en
Publication of JP2014112072A publication Critical patent/JP2014112072A/ja
Publication of JP2014112072A5 publication Critical patent/JP2014112072A5/ja
Application granted granted Critical
Publication of JP6246507B2 publication Critical patent/JP6246507B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2013129815A 2012-11-05 2013-06-20 プローブカード及びその製造方法 Active JP6246507B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2013129815A JP6246507B2 (ja) 2012-11-05 2013-06-20 プローブカード及びその製造方法
US14/064,608 US9488677B2 (en) 2012-11-05 2013-10-28 Probe card having a wiring substrate

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012243681 2012-11-05
JP2012243681 2012-11-05
JP2013129815A JP6246507B2 (ja) 2012-11-05 2013-06-20 プローブカード及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014112072A JP2014112072A (ja) 2014-06-19
JP2014112072A5 JP2014112072A5 (enExample) 2016-05-12
JP6246507B2 true JP6246507B2 (ja) 2017-12-13

Family

ID=50621789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013129815A Active JP6246507B2 (ja) 2012-11-05 2013-06-20 プローブカード及びその製造方法

Country Status (2)

Country Link
US (1) US9488677B2 (enExample)
JP (1) JP6246507B2 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6092729B2 (ja) * 2013-07-19 2017-03-08 新光電気工業株式会社 プローブカード及びその製造方法
JP6208486B2 (ja) * 2013-07-19 2017-10-04 新光電気工業株式会社 プローブカード及びその製造方法
JP6455022B2 (ja) * 2014-08-22 2019-01-23 大日本印刷株式会社 プローブカード及びそれを用いた半導体装置の製造方法
US11262384B2 (en) 2016-12-23 2022-03-01 Intel Corporation Fine pitch probe card methods and systems
US11268983B2 (en) 2017-06-30 2022-03-08 Intel Corporation Chevron interconnect for very fine pitch probing
US10775414B2 (en) 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US11073538B2 (en) 2018-01-03 2021-07-27 Intel Corporation Electrical testing apparatus with lateral movement of a probe support substrate
US10488438B2 (en) 2018-01-05 2019-11-26 Intel Corporation High density and fine pitch interconnect structures in an electric test apparatus
US10866264B2 (en) * 2018-01-05 2020-12-15 Intel Corporation Interconnect structure with varying modulus of elasticity
US11543454B2 (en) 2018-09-25 2023-01-03 Intel Corporation Double-beam test probe
US10935573B2 (en) 2018-09-28 2021-03-02 Intel Corporation Slip-plane MEMS probe for high-density and fine pitch interconnects
CN118102582A (zh) * 2022-11-22 2024-05-28 庆鼎精密电子（淮安）有限公司 封装结构、封装基板及其制作方法

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3911361A (en) * 1974-06-28 1975-10-07 Ibm Coaxial array space transformer
US4566184A (en) * 1981-08-24 1986-01-28 Rockwell International Corporation Process for making a probe for high speed integrated circuits
JPS59154054A (ja) * 1983-02-23 1984-09-03 Hitachi Ltd ワイヤおよびそれを用いた半導体装置
JPH05144895A (ja) * 1991-11-20 1993-06-11 Nec Yamagata Ltd プローブカード
US20070228110A1 (en) * 1993-11-16 2007-10-04 Formfactor, Inc. Method Of Wirebonding That Utilizes A Gas Flow Within A Capillary From Which A Wire Is Played Out
US5785538A (en) * 1995-11-27 1998-07-28 International Business Machines Corporation High density test probe with rigid surface structure
JP3307823B2 (ja) * 1996-02-23 2002-07-24 松下電器産業株式会社 電子部品検査用接触体の製造方法
JP3128199B2 (ja) * 1996-06-28 2001-01-29 信越ポリマー株式会社 検査用プローブ
US6100815A (en) * 1997-12-24 2000-08-08 Electro Scientific Industries, Inc. Compound switching matrix for probing and interconnecting devices under test to measurement equipment
JP3302635B2 (ja) * 1998-01-30 2002-07-15 信越ポリマー株式会社 電気コネクタ及びその製造方法
JP2008076402A (ja) * 1998-10-27 2008-04-03 Matsushita Electric Ind Co Ltd 検査用基板
JP2001343426A (ja) * 2000-05-31 2001-12-14 Seiko Epson Corp 半導体装置の検査方法
JP2002184934A (ja) * 2000-12-13 2002-06-28 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP4014912B2 (ja) * 2001-09-28 2007-11-28 株式会社ルネサステクノロジ 半導体装置
JP2005091065A (ja) * 2003-09-16 2005-04-07 Oki Electric Ind Co Ltd 半導体装置への動作電圧供給装置及び動作電圧供給方法
JP2006058157A (ja) * 2004-08-20 2006-03-02 Toyota Motor Corp プローブカード
US7119571B2 (en) * 2004-11-24 2006-10-10 Applied Materials, Inc. Test structure design for reliability test
US7030633B1 (en) * 2004-12-03 2006-04-18 Chunong Qiu Four-terminal methods for resistivity measurement of semiconducting materials
US20070152685A1 (en) * 2006-01-03 2007-07-05 Formfactor, Inc. A probe array structure and a method of making a probe array structure
JP4774071B2 (ja) * 2007-04-05 2011-09-14 ルネサスエレクトロニクス株式会社 プローブ抵抗値測定方法、プローブ抵抗値測定用パッドを有する半導体装置
JP2009192309A (ja) * 2008-02-13 2009-08-27 Shinko Electric Ind Co Ltd 半導体検査装置
TWI424165B (zh) * 2009-04-09 2014-01-21 Nhk Spring Co Ltd 接觸探針及探針單元
JP2011061112A (ja) * 2009-09-14 2011-03-24 Shinko Electric Ind Co Ltd 半導体チップ積層体及び製造方法
JP5465516B2 (ja) 2009-12-08 2014-04-09 日本電子材料株式会社 プローブ及びプローブの製造方法
JP2011237391A (ja) 2010-05-13 2011-11-24 Renesas Electronics Corp プローブカード
JP4919365B2 (ja) 2010-12-16 2012-04-18 ルネサスエレクトロニクス株式会社 半導体集積回路の製造方法
JP6092729B2 (ja) * 2013-07-19 2017-03-08 新光電気工業株式会社 プローブカード及びその製造方法
JP6208486B2 (ja) * 2013-07-19 2017-10-04 新光電気工業株式会社 プローブカード及びその製造方法
JP6189187B2 (ja) * 2013-11-19 2017-08-30 新光電気工業株式会社 プローブカード及びプローブカードの製造方法

Also Published As

Publication number Publication date
US20140125372A1 (en) 2014-05-08
JP2014112072A (ja) 2014-06-19
US9488677B2 (en) 2016-11-08

Similar Documents

Publication Publication Date Title
JP6246507B2 (ja) プローブカード及びその製造方法
CN101308819B (zh) 半导体集成电路器件的制造方法及探针卡
KR101045671B1 (ko) 공간 변환기를 포함하는 프로브 카드
JP2013238578A (ja) プローブカード用空間変換器及びその製造方法
US9459289B2 (en) Probe card and method for manufacturing probe card
JP5276895B2 (ja) プローブカード及びその製造方法
JP4343256B1 (ja) 半導体装置の製造方法
JP5408602B2 (ja) 多層配線基板
JP4919365B2 (ja) 半導体集積回路の製造方法
TW201443455A (zh) 電子裝置之基板及包含其之電子裝置
JP2007212472A (ja) 半導体集積回路の製造方法及びプローブカード
JP6092729B2 (ja) プローブカード及びその製造方法
KR100906497B1 (ko) 프로브 카드용 프로브 기판, 프로브 카드 및 그 제조 방법
JP6208486B2 (ja) プローブカード及びその製造方法
KR100830352B1 (ko) 프로브 팁, 프로브 카드, 프로브 팁 제조 방법 및 프로브구조물 제조 방법
JP5068133B2 (ja) 半導体チップ積層構造体及び半導体装置
KR102276512B1 (ko) 전기 검사용 지그 및 그의 제조 방법
JP5164543B2 (ja) プローブカードの製造方法
KR100947916B1 (ko) 프로브 카드용 인쇄회로기판
KR101010672B1 (ko) 인터포져 유닛 및 인터포져 유닛의 제조 방법
JP2009122123A (ja) コンタクトプローブ
KR101786782B1 (ko) 패널 테스트용 필름
JP4716454B2 (ja) 半導体集積回路装置の製造方法
KR20130004754A (ko) 영상표시패널 검사용 프로브 유닛의 제작 방법 및 이에 의해 제작된 프로브 유닛
JP2011501185A (ja) 電気検査装置の製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160317

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160317

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170123

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20170131

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170301

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20170808

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170904

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20170911

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20171107

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20171115

R150 Certificate of patent or registration of utility model

Ref document number: 6246507

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150