JP2005183913A - 半導体パッケージモールディングシステムのカル分離装置 - Google Patents
半導体パッケージモールディングシステムのカル分離装置 Download PDFInfo
- Publication number
- JP2005183913A JP2005183913A JP2004188919A JP2004188919A JP2005183913A JP 2005183913 A JP2005183913 A JP 2005183913A JP 2004188919 A JP2004188919 A JP 2004188919A JP 2004188919 A JP2004188919 A JP 2004188919A JP 2005183913 A JP2005183913 A JP 2005183913A
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- Prior art keywords
- cull
- pilot pin
- upper plate
- molding
- molding system
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 title claims abstract description 27
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 238000000926 separation method Methods 0.000 claims description 13
- 230000007547 defect Effects 0.000 abstract description 7
- 230000002950 deficient Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 239000012778 molding material Substances 0.000 description 8
- 230000007257 malfunction Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000006227 byproduct Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002594 fluoroscopy Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/38—Cutting-off equipment for sprues or ingates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49815—Disassembling
- Y10T29/49821—Disassembling by altering or destroying work part or connector
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53048—Multiple station assembly or disassembly apparatus
- Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53061—Responsive to work or work-related machine element
- Y10T29/53065—Responsive to work or work-related machine element with means to fasten by deformation
- Y10T29/5307—Self-piercing work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53274—Means to disassemble electrical device
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
【解決手段】リードフレームに結合しているカル31等が置かれる下部プレート30と、前記リードフレームからカルを分離させるために前記下部プレートに置かれたリードフレームのカルを押える上部プレート32とを含み、前記上部プレートを貫通するように設けられ、前記上部プレートがカルを押える時、共にカルを押えるパイロットピン33と前記パイロットピンが動く経路上に設けられ、前記パイロットピンの動きをセンシングするためのセンサー34とを含み、前記パイロットピンの動きに伴うセンシングによりモールディングで完全に充填できなかった不良部を直ちに確認することができる。
【選択図】図3
Description
その際、モールディング工程を実施すると、カルという副産物が生じる。即ち、図1に示すように、半導体チップ1を有するリードフレーム2は副産物としてのカル3に結合された形態で形成される。これは、モールディングのための金型がカルを形成する構造を有するためである。
従って、従来はモールディングでの不具合が早期に確認できないことにより、半導体装置の製造に係る生産性が低下する問題があった。
このように、本発明によると、更にパイロットピン及びセンサーを含むチャック分離装置を提供する。従って、パイロットピンの動きによるセンシングによりモールディングで充填が完全にできなかった不具合をカルを分離する時、直ちに確認することができる。そのため、モールディングで充填が完全にできなかった部分の不具合の確認を別途に実施する必要がない。
図3(a)、(b)は、本発明の一実施の形態に係る半導体パッケージモールディングシステムのカル分離装置の使用状態を示す概略図である。
図3(a)を参照すると、カル分離装置は、上部プレート32と下部プレート30とを含む。ここで、下部プレート30はリードフレームに結合しているカル31が置かれる部材であり、上部プレート32は、下部プレート30に置かれたカル31を押える部材である。その際、上部プレート32は、シリンダ(図示していない)によりカル31を押えられるように構成される。これによって、下部プレート30にカル31を置いた状態で上部プレート32を使用してカル31を押えることによって、押えによる折りによりカル31が分離される。
以上、本発明の望ましい実施の形態を説明したが、当業者は特許請求範囲に記載された技術的思想の範囲内で、本発明を多様に修正及び変更することができることは明らかである。
31 カル
32 上部プレート
33 パイロットピン
34 センサー
Claims (2)
- リードフレームに結合されているカル(cull)が置かれる下部プレートと、
前記リードフレームからカルを分離させるために前記下部プレートに置かれたリードフレームのカルを押える上部プレートと、
前記上部プレートを貫通するように設けられ、前記上部プレートがカルを押える時、共にカルを押えるパイロットピンと、
前記パイロットピンが動く経路上に設けられ、前記パイロットピンの動きをセンシングするためのセンサーとを含むことを特徴とする半導体パッケージモールディングシステムのカル分離装置。 - 前記センサーは前記パイロットピンが動く経路の前記上部プレートの上面に設けられ、かつ、受発光素子であることを特徴とする半導体パッケージモールディングシステムのカル分離装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030091410A KR100631940B1 (ko) | 2003-12-15 | 2003-12-15 | 반도체 패키지 몰딩 시스템의 컬 분리 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005183913A true JP2005183913A (ja) | 2005-07-07 |
JP4535789B2 JP4535789B2 (ja) | 2010-09-01 |
Family
ID=34651461
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004188919A Expired - Fee Related JP4535789B2 (ja) | 2003-12-15 | 2004-06-25 | 半導体パッケージモールディングシステムのカル分離方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7299544B2 (ja) |
JP (1) | JP4535789B2 (ja) |
KR (1) | KR100631940B1 (ja) |
CN (1) | CN100346458C (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100631940B1 (ko) * | 2003-12-15 | 2006-10-04 | 주식회사 하이닉스반도체 | 반도체 패키지 몰딩 시스템의 컬 분리 장치 |
US8292613B2 (en) * | 2010-03-01 | 2012-10-23 | Asm Technology Singapore Pte Ltd | Runner system for supplying molding compound |
CN106548963B (zh) * | 2016-10-27 | 2019-01-15 | 中国科学院长春光学精密机械与物理研究所 | 芯片与芯片座分离装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0476036U (ja) * | 1990-11-15 | 1992-07-02 | ||
JPH0562042U (ja) * | 1991-12-23 | 1993-08-13 | 金星エレクトロン株式会社 | 自動成形システムの不良成形品感知装置 |
JPH10154718A (ja) * | 1996-11-21 | 1998-06-09 | Sumitomo Heavy Ind Ltd | ゲートブレーク装置 |
JPH1187382A (ja) * | 1997-09-05 | 1999-03-30 | Nec Corp | 半導体装置の樹脂封止装置 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6198521A (ja) * | 1984-10-19 | 1986-05-16 | Hitachi Ltd | 成形装置 |
JPS62124747A (ja) | 1985-11-25 | 1987-06-06 | Sharp Corp | 自動モ−ルド装置に於けるカルブレイク方法 |
JPS62212112A (ja) * | 1986-03-14 | 1987-09-18 | Matsushita Electric Works Ltd | 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入装置 |
JPH02307627A (ja) | 1989-05-22 | 1990-12-20 | Matsushita Electric Ind Co Ltd | リードフレーム打ち抜き装置 |
GB2252746B (en) * | 1991-01-17 | 1995-07-12 | Towa Corp | A method of molding resin to seal an electronic part on a lead frame and apparatus therefor |
JPH0661281A (ja) | 1992-08-10 | 1994-03-04 | Matsushita Electron Corp | 半導体封止カルカット装置 |
JP3578354B2 (ja) | 1994-03-07 | 2004-10-20 | 株式会社ルネサステクノロジ | ゲートブレイク方法 |
US5520874A (en) * | 1994-09-29 | 1996-05-28 | Texas Instruments Incorporated | Compressible mold plunger |
JP3282988B2 (ja) * | 1997-05-01 | 2002-05-20 | アピックヤマダ株式会社 | 樹脂モールド方法及び樹脂モールド装置 |
JP2000299329A (ja) | 1999-04-12 | 2000-10-24 | Mitsubishi Electric Corp | 樹脂パッケージ型半導体装置の製造装置及び製造方法 |
JP2000349109A (ja) * | 1999-06-07 | 2000-12-15 | Mitsui High Tec Inc | 基板のカル分離装置 |
US6523254B1 (en) * | 2000-04-19 | 2003-02-25 | Micron Technology, Inc. | Method for gate blocking x-outs during a molding process |
JP3897961B2 (ja) * | 2000-07-14 | 2007-03-28 | 株式会社東芝 | 樹脂成形装置 |
JP2002043343A (ja) * | 2000-07-25 | 2002-02-08 | Mitsubishi Electric Corp | 半導体装置の樹脂封止金型及び半導体装置の樹脂封止方法、並びに樹脂封止半導体装置の離型方法 |
KR100631940B1 (ko) * | 2003-12-15 | 2006-10-04 | 주식회사 하이닉스반도체 | 반도체 패키지 몰딩 시스템의 컬 분리 장치 |
-
2003
- 2003-12-15 KR KR1020030091410A patent/KR100631940B1/ko not_active IP Right Cessation
-
2004
- 2004-06-24 US US10/875,477 patent/US7299544B2/en active Active
- 2004-06-25 JP JP2004188919A patent/JP4535789B2/ja not_active Expired - Fee Related
- 2004-06-30 CN CNB200410061697XA patent/CN100346458C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0476036U (ja) * | 1990-11-15 | 1992-07-02 | ||
JPH0562042U (ja) * | 1991-12-23 | 1993-08-13 | 金星エレクトロン株式会社 | 自動成形システムの不良成形品感知装置 |
JPH10154718A (ja) * | 1996-11-21 | 1998-06-09 | Sumitomo Heavy Ind Ltd | ゲートブレーク装置 |
JPH1187382A (ja) * | 1997-09-05 | 1999-03-30 | Nec Corp | 半導体装置の樹脂封止装置 |
Also Published As
Publication number | Publication date |
---|---|
KR100631940B1 (ko) | 2006-10-04 |
US20050125996A1 (en) | 2005-06-16 |
JP4535789B2 (ja) | 2010-09-01 |
CN1630048A (zh) | 2005-06-22 |
KR20050059696A (ko) | 2005-06-21 |
CN100346458C (zh) | 2007-10-31 |
US7299544B2 (en) | 2007-11-27 |
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