CN1630048A - 半导体封装件模制系统的多余物等分离装置 - Google Patents

半导体封装件模制系统的多余物等分离装置 Download PDF

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CN1630048A
CN1630048A CNA200410061697XA CN200410061697A CN1630048A CN 1630048 A CN1630048 A CN 1630048A CN A200410061697X A CNA200410061697X A CN A200410061697XA CN 200410061697 A CN200410061697 A CN 200410061697A CN 1630048 A CN1630048 A CN 1630048A
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李守权
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SK Hynix Inc
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Abstract

一种半导体封装件模制系统的多余物等分离装置，其是分离通过模制半导体芯片而与引线框连结的多余物等的装置。其具有：下板，其放置与引线框连结的多余物等；上板，其按压放置在所述下板上的引线框的多余物等，以把多余物等从所述引线框分离。并且，还具有：引导销，其设置为贯通所述上板，在所述上板按压多余物等时，共同按压多余物等；传感器，其在所述引导销运动的路径上配置，用于检测所述引导销运动。从而，在分离多余物等时，通过伴随所述引导销的运动而进行检测，就可以立即确认到在模制中不完全填充的缺陷。

Description

半导体封装件模制系统的多余物等分离装置
技术领域
本发明涉及半导体封装件模制系统的多余物等分离装置，具体地说，涉及通过模制半导体芯片，分离与引线框连结的多余物等装置。
背景技术
在半导体封装中的模制工序为了从外部保护半导体芯片，而在实施线焊接后，把半导体芯片用热固性树脂(例如环氧树脂)等模制物质包围的工序。即，由于通过所述模制工序把模制物质包围半导体芯片，所以可以保护半导体芯片不受外部污染源的污染和冲击等。
此时，在进行模制工序时，产生副产品多余物等，即，如图1所示，在具有半导体芯片1的引线框2上形成连结作为副产品多余物等3的结构。这是因为用于模制的模具具有形成所述多余物等的结构。
对此，如图2所示，使用多余物等分离装置，把所述多余物等3等从引线框2分离。首先，把与所述引线框2连结的多余物等3置于下板21上。然后，使用上板22压所述多余物3等。此时，压所述多余物3等是由连接在上板22的缸体的上下运动进行。这样，所述多余物3等受压折断，从而使其从所述引线框2分离。
此时，在进行模制时，有时会产生模制物质不能完全填充，而产生缺陷。然而，早期发现该缺陷是很困难的。即在完成所述模制后，需要通过实施使用X射线等的另一工序来确认所述缺陷。
从而，在现有技术中由于不能早期确认模制的缺陷，存在制造半导体器件生产率低的问题。
发明内容
本发明的目的在于提供半导体封装模制系统的多余物等分离装置，其在半导体封装的模制中，可以确认由不完全填充模制物质而产生的缺陷。
为达到所述目的，本发明的多余物等分离装置具有：下板，其放置与引线框连结的多余物等(cull)等；上板，其按压在所述下板上放置的引线框的多余物等，以把多余物等从所述引线框分离；引导销，其与所述上板贯通设置，在所述上板按压多余物等时，共同压多余物等；传感器，其在所述引导销运动的路径上配置，用于检测所述引导销运动。
此时，所述传感器最好设在所述引导销运动路径的所述上板的上面，且是接收与发射光元件。
另外，本发明还提供具有引导销和传感器的夹紧分离装置。从而，在分离多余物等时，通过伴随所述引导销的运动而进行检测，就可以立即确认到在模制中不完全填充的缺陷。因此，就没有必要再另外进行确认在所述模制中不完全填充的缺陷。
这样，本发明在从引导框分离多余物等时，可以立即确认具有缺陷原因的多余物等。另外，可以不使用别的装置确认缺陷。为此，本发明具有提高制造半导体装置的生产率的效果。
上面已说明了本发明理想实施例，本技术领域中专业技术人员在不脱离本发明的指导思想及范围内可以对本发明进行各种修改和变更。
附图说明
图1是表示模制半导体封装件形态的示意图；
图2是表示现有的半导体封装件模制系统的多余物等分离装置示意图；
图3(A)、图3(B)表示使用本发明一实施例的半导体封装件模制系统的多余物等分离装置状态示意图。
具体实施方式
以下参照附图详细说明本发明理想的实施方式。
图3(A)和图3(B)表示使用本发明一实施例的半导体封装件模制系统的多余物等分离装置状态示意图。
参照图3(A)，所述多余物等分离装置具有上板32和下板30。在此，所述下板30是放置与引线框连结的多余物31等的部件；所述上板32是按压放置在所述下板30的多余物31等的部件等。此时，所述上板32构成用缸体(图中未示出)按压所述多余物31等。这样，在多余物31等放置在所述下板30的状态，通过使用上板32按压所述多余物31等，通过所述按压来折断分离所述多余物31等。
另外，在所述上板32设置贯通所述上板32的引导销33。在此，所述引导销33在所述上板32按压多余物31等时同时按压多余物31等。从而，所述引导销33具有止动器和弹簧。另外，在所述引导销运动路径，即在设置所述引导销33的上板32的入口部设置接受与发射光那样的传感器34。从而，可以检测所述引导销33的运动。
这样，通过设置所述引导销33和传感器34。如图3(A)所示，使用所述上板32按压多余物31等时，所述引导销33也按压所述多余物31等。此时，在所述多余物31等在完全填充模制物质状态成形时，所述引导销没有其他的运动。即，沿所述上板32运动，进行与此相伴的分离多余物31等运动。为此，所述传感器34不进行任何运动。
但是，当如图3(B)所示，所述多余物31等在模制物质不完全填充状态成形时，使用所述上板32进行分离多余物31等时，所述引导销33在按压状态下使所述多余物31等折断。这样，所述引导销33向下板方向运动。此时，所述传感器34进行操作，通过检测得到结果。
从而，在分离多余物等时，就立即知道所述多余物31等在模制物质不完全填充的缺陷。此时，在所述模制物质没有完全填充时，通常所述多余物31等形成为厚度薄的状态。为此，用所述引导销33按压就容易折断，因此可以确认多余物31等的缺陷状态。

Claims (2)

1、一种半导体封装件模制系统的多余物等分离装置，其特征在于，具有：下板，其放置与引线框连结的多余物(cull)等；上板，其按压在所述下板上放置的引线框的多余物等，以把多余物等从所述引线框分离；引导销，其与所述上板贯通设置，在所述上板按压多余物等时，共同按压多余物等；传感器，其在所述引导销运动的路径上配置，用于检测所述引导销运动。
2、如权利要求1所述的半导体封装件模制系统的多余物等分离装置，其特征在于，所述传感器设在所述引导销运动路径的所述上板的上面，且是接收与发射光元件。
CNB200410061697XA 2003-12-15 2004-06-30 半导体封装件模制系统的多余物分离装置 Expired - Fee Related CN100346458C (zh)

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100631940B1 (ko) * 2003-12-15 2006-10-04 주식회사 하이닉스반도체 반도체 패키지 몰딩 시스템의 컬 분리 장치
US8292613B2 (en) * 2010-03-01 2012-10-23 Asm Technology Singapore Pte Ltd Runner system for supplying molding compound
CN106548963B (zh) * 2016-10-27 2019-01-15 中国科学院长春光学精密机械与物理研究所 芯片与芯片座分离装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6198521A (ja) * 1984-10-19 1986-05-16 Hitachi Ltd 成形装置
JPS62124747A (ja) 1985-11-25 1987-06-06 Sharp Corp 自動モ−ルド装置に於けるカルブレイク方法
JPS62212112A (ja) * 1986-03-14 1987-09-18 Matsushita Electric Works Ltd 電子部品封止成形における成形金型装置へのリ−ドフレ−ム投入装置
JPH02307627A (ja) 1989-05-22 1990-12-20 Matsushita Electric Ind Co Ltd リードフレーム打ち抜き装置
JP2511049Y2 (ja) * 1990-11-15 1996-09-18 株式会社東芝 コ―ルドスラグ除去装置
GB2252746B (en) * 1991-01-17 1995-07-12 Towa Corp A method of molding resin to seal an electronic part on a lead frame and apparatus therefor
KR950000048Y1 (ko) * 1991-12-23 1995-01-07 금성일렉트론 주식회사 오토 몰드시스템의 불완전 성형감지장치
JPH0661281A (ja) 1992-08-10 1994-03-04 Matsushita Electron Corp 半導体封止カルカット装置
JP3578354B2 (ja) 1994-03-07 2004-10-20 株式会社ルネサステクノロジ ゲートブレイク方法
US5520874A (en) * 1994-09-29 1996-05-28 Texas Instruments Incorporated Compressible mold plunger
JP2942505B2 (ja) * 1996-11-21 1999-08-30 住友重機械工業株式会社 ゲートブレーク装置
JP3282988B2 (ja) * 1997-05-01 2002-05-20 アピックヤマダ株式会社 樹脂モールド方法及び樹脂モールド装置
JP3102473B2 (ja) * 1997-09-05 2000-10-23 日本電気株式会社 半導体装置の樹脂封止装置
JP2000299329A (ja) 1999-04-12 2000-10-24 Mitsubishi Electric Corp 樹脂パッケージ型半導体装置の製造装置及び製造方法
JP2000349109A (ja) * 1999-06-07 2000-12-15 Mitsui High Tec Inc 基板のカル分離装置
US6523254B1 (en) * 2000-04-19 2003-02-25 Micron Technology, Inc. Method for gate blocking x-outs during a molding process
JP3897961B2 (ja) * 2000-07-14 2007-03-28 株式会社東芝 樹脂成形装置
JP2002043343A (ja) * 2000-07-25 2002-02-08 Mitsubishi Electric Corp 半導体装置の樹脂封止金型及び半導体装置の樹脂封止方法、並びに樹脂封止半導体装置の離型方法
KR100631940B1 (ko) * 2003-12-15 2006-10-04 주식회사 하이닉스반도체 반도체 패키지 몰딩 시스템의 컬 분리 장치

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US7299544B2 (en) 2007-11-27
KR100631940B1 (ko) 2006-10-04
KR20050059696A (ko) 2005-06-21
CN100346458C (zh) 2007-10-31
US20050125996A1 (en) 2005-06-16

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