JP2005159103A - 半導体装置およびその製造方法 - Google Patents

半導体装置およびその製造方法 Download PDF

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Publication number
JP2005159103A
JP2005159103A JP2003396996A JP2003396996A JP2005159103A JP 2005159103 A JP2005159103 A JP 2005159103A JP 2003396996 A JP2003396996 A JP 2003396996A JP 2003396996 A JP2003396996 A JP 2003396996A JP 2005159103 A JP2005159103 A JP 2005159103A
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JP
Japan
Prior art keywords
back surface
sealing body
chip mounting
resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003396996A
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English (en)
Japanese (ja)
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JP2005159103A5 (enExample
Inventor
Tadatoshi Danno
忠敏 団野
Hiromi Taya
博美 田谷
Yoshiharu Shimizu
嘉治 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2003396996A priority Critical patent/JP2005159103A/ja
Priority to US10/983,706 priority patent/US7282396B2/en
Priority to KR20040097986A priority patent/KR101054540B1/ko
Publication of JP2005159103A publication Critical patent/JP2005159103A/ja
Publication of JP2005159103A5 publication Critical patent/JP2005159103A5/ja
Priority to US11/853,798 priority patent/US20080006916A1/en
Priority to US12/277,144 priority patent/US7691677B2/en
Priority to US12/624,342 priority patent/US7833833B2/en
Priority to US12/624,309 priority patent/US8053875B2/en
Priority to US13/101,199 priority patent/US8513785B2/en
Priority to KR1020110061983A priority patent/KR101267148B1/ko
Priority to KR1020110061982A priority patent/KR101054602B1/ko
Priority to KR1020110091315A priority patent/KR101131353B1/ko
Priority to KR1020120002527A priority patent/KR101267140B1/ko
Priority to US13/562,639 priority patent/US8592961B2/en
Priority to KR1020120085661A priority patent/KR101277391B1/ko
Priority to KR1020130001922A priority patent/KR101398311B1/ko
Priority to US14/070,676 priority patent/US9024419B2/en
Priority to US14/702,969 priority patent/US9425165B2/en
Priority to US15/236,143 priority patent/US9806035B2/en
Priority to US15/729,374 priority patent/US10249595B2/en
Priority to US16/290,804 priority patent/US10998288B2/en
Pending legal-status Critical Current

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    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
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    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2003396996A 2003-11-27 2003-11-27 半導体装置およびその製造方法 Pending JP2005159103A (ja)

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JP2003396996A JP2005159103A (ja) 2003-11-27 2003-11-27 半導体装置およびその製造方法
US10/983,706 US7282396B2 (en) 2003-11-27 2004-11-09 Method of manufacturing a semiconductor device including using a sealing resin to form a sealing body
KR20040097986A KR101054540B1 (ko) 2003-11-27 2004-11-26 반도체 장치 및 그 제조 방법
US11/853,798 US20080006916A1 (en) 2003-11-27 2007-09-11 Method of Manufacturing a Semiconductor Device
US12/277,144 US7691677B2 (en) 2003-11-27 2008-11-24 Method of manufacturing a semiconductor device
US12/624,342 US7833833B2 (en) 2003-11-27 2009-11-23 Method of manufacturing a semiconductor device
US12/624,309 US8053875B2 (en) 2003-11-27 2009-11-23 Method of manufacturing a semiconductor device
US13/101,199 US8513785B2 (en) 2003-11-27 2011-05-05 Method of manufacturing a semiconductor device
KR1020110061983A KR101267148B1 (ko) 2003-11-27 2011-06-24 반도체 장치
KR1020110061982A KR101054602B1 (ko) 2003-11-27 2011-06-24 반도체 장치의 제조 방법
KR1020110091315A KR101131353B1 (ko) 2003-11-27 2011-09-08 반도체 장치
KR1020120002527A KR101267140B1 (ko) 2003-11-27 2012-01-09 반도체 장치
US13/562,639 US8592961B2 (en) 2003-11-27 2012-07-31 Method of manufacturing a semiconductor device
KR1020120085661A KR101277391B1 (ko) 2003-11-27 2012-08-06 반도체 장치
KR1020130001922A KR101398311B1 (ko) 2003-11-27 2013-01-08 반도체 장치
US14/070,676 US9024419B2 (en) 2003-11-27 2013-11-04 Method of manufacturing semiconductor device
US14/702,969 US9425165B2 (en) 2003-11-27 2015-05-04 Method of manufacturing semiconductor device
US15/236,143 US9806035B2 (en) 2003-11-27 2016-08-12 Semiconductor device
US15/729,374 US10249595B2 (en) 2003-11-27 2017-10-10 Method of manufacturing a semiconductor device
US16/290,804 US10998288B2 (en) 2003-11-27 2019-03-01 Method of manufacturing a semiconductor device

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JP6416291B2 (ja) * 2015-01-22 2018-11-07 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
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JP2018157222A (ja) * 2013-04-16 2018-10-04 ローム株式会社 半導体装置
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US20160351512A1 (en) 2016-12-01
US9806035B2 (en) 2017-10-31
US20090075427A1 (en) 2009-03-19
US7282396B2 (en) 2007-10-16
US20100068852A1 (en) 2010-03-18
US9024419B2 (en) 2015-05-05
US20180047677A1 (en) 2018-02-15
US20110204502A1 (en) 2011-08-25
US20140054759A1 (en) 2014-02-27
KR20130018968A (ko) 2013-02-25
KR20120008086A (ko) 2012-01-25
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US7833833B2 (en) 2010-11-16
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US9425165B2 (en) 2016-08-23
US20050116327A1 (en) 2005-06-02
KR101267148B1 (ko) 2013-05-27
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US20190198477A1 (en) 2019-06-27
US20100065951A1 (en) 2010-03-18
US7691677B2 (en) 2010-04-06
US10998288B2 (en) 2021-05-04
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KR101131353B1 (ko) 2012-04-04
US8592961B2 (en) 2013-11-26
US20130020691A1 (en) 2013-01-24
US20080006916A1 (en) 2008-01-10
US8513785B2 (en) 2013-08-20
US8053875B2 (en) 2011-11-08
US20150235987A1 (en) 2015-08-20
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