JP2004536924A5 - - Google Patents
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- Publication number
- JP2004536924A5 JP2004536924A5 JP2003515600A JP2003515600A JP2004536924A5 JP 2004536924 A5 JP2004536924 A5 JP 2004536924A5 JP 2003515600 A JP2003515600 A JP 2003515600A JP 2003515600 A JP2003515600 A JP 2003515600A JP 2004536924 A5 JP2004536924 A5 JP 2004536924A5
- Authority
- JP
- Japan
- Prior art keywords
- sio
- siloxane
- units
- group
- carbon atoms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 claims 13
- 239000011347 resin Substances 0.000 claims 12
- 229920005989 resin Polymers 0.000 claims 12
- 238000000034 method Methods 0.000 claims 10
- 125000004432 carbon atom Chemical group C* 0.000 claims 9
- -1 siloxane unit Chemical group 0.000 claims 8
- 125000000217 alkyl group Chemical group 0.000 claims 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims 6
- 239000011342 resin composition Substances 0.000 claims 6
- 229910000077 silane Inorganic materials 0.000 claims 6
- 239000000758 substrate Substances 0.000 claims 6
- 239000011248 coating agent Substances 0.000 claims 4
- 238000000576 coating method Methods 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 4
- 239000008199 coating composition Substances 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 150000004756 silanes Chemical class 0.000 claims 2
- 125000000547 substituted alkyl group Chemical group 0.000 claims 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/915,902 US6872456B2 (en) | 2001-07-26 | 2001-07-26 | Siloxane resins |
| PCT/US2002/023152 WO2003010246A1 (en) | 2001-07-26 | 2002-07-16 | Siloxane resins |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004536924A JP2004536924A (ja) | 2004-12-09 |
| JP2004536924A5 true JP2004536924A5 (https=) | 2006-01-05 |
| JP4411067B2 JP4411067B2 (ja) | 2010-02-10 |
Family
ID=25436405
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003515600A Expired - Fee Related JP4411067B2 (ja) | 2001-07-26 | 2002-07-16 | シロキサン樹脂 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6872456B2 (https=) |
| EP (1) | EP1412434B1 (https=) |
| JP (1) | JP4411067B2 (https=) |
| KR (1) | KR20040023683A (https=) |
| CN (1) | CN1535300A (https=) |
| AT (1) | ATE399822T1 (https=) |
| DE (1) | DE60227373D1 (https=) |
| TW (1) | TW593548B (https=) |
| WO (1) | WO2003010246A1 (https=) |
Families Citing this family (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7404990B2 (en) * | 2002-11-14 | 2008-07-29 | Air Products And Chemicals, Inc. | Non-thermal process for forming porous low dielectric constant films |
| US6940173B2 (en) * | 2003-01-29 | 2005-09-06 | International Business Machines Corporation | Interconnect structures incorporating low-k dielectric barrier films |
| TW200628981A (en) * | 2004-09-29 | 2006-08-16 | Sumitomo Bakelite Co | Semiconductor device |
| TW200619843A (en) * | 2004-10-20 | 2006-06-16 | Sumitomo Bakelite Co | Semiconductor wafer and semiconductor device |
| KR101247545B1 (ko) * | 2004-11-02 | 2013-03-26 | 다우 코닝 코포레이션 | 레지스트 조성물 |
| EP2046893A2 (en) * | 2006-08-04 | 2009-04-15 | Dow Corning Corporation | Silicone resin and silicone composition |
| TWI434891B (zh) * | 2007-02-22 | 2014-04-21 | 賽倫斯股份有限公司 | 積體電路用高矽含量矽氧烷聚合物 |
| KR101523393B1 (ko) * | 2007-02-27 | 2015-05-27 | 이엠디 퍼포먼스 머티리얼스 코프. | 규소를 주성분으로 하는 반사 방지 코팅 조성물 |
| DE102008000353A1 (de) * | 2008-02-20 | 2009-08-27 | Wacker Chemie Ag | Härtbare Polymerabmischungen |
| US20100291475A1 (en) * | 2009-05-12 | 2010-11-18 | Chenghong Li | Silicone Coating Compositions |
| US20110111239A1 (en) * | 2009-11-10 | 2011-05-12 | Hemant Dandekar | Sol-gel coating for steel and cast iron substrates and methods of making and using same |
| CN103534296A (zh) * | 2011-05-11 | 2014-01-22 | 汉高股份有限公司 | 具有改善的阻隔性的聚硅氧烷树脂 |
| CN109054560A (zh) * | 2018-08-07 | 2018-12-21 | 常州工程职业技术学院 | 一种电工钢用绝缘涂料 |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3615272A (en) | 1968-11-04 | 1971-10-26 | Dow Corning | Condensed soluble hydrogensilsesquioxane resin |
| US3730743A (en) * | 1970-08-24 | 1973-05-01 | Stauffer Chemical Co | Zinc dust coating composition |
| US3965136A (en) * | 1975-09-24 | 1976-06-22 | Olin Corporation | Alkoxysilane cluster compounds and their preparation |
| US4329485A (en) * | 1981-06-29 | 1982-05-11 | Olin Corporation | Process for preparing alkoxysilane cluster compounds by reacting a trialkoxysilanol with a triamidosilane |
| US4756977A (en) | 1986-12-03 | 1988-07-12 | Dow Corning Corporation | Multilayer ceramics from hydrogen silsesquioxane |
| JP3134297B2 (ja) * | 1990-08-29 | 2001-02-13 | 日立化成工業株式会社 | シリカ系被膜形成用塗布液およびシリカ系被膜の製造法 |
| JP2669988B2 (ja) * | 1992-02-06 | 1997-10-29 | 沖電気工業株式会社 | ポリ（アルコキシシロキサン）の製造方法 |
| JP2726363B2 (ja) | 1992-06-03 | 1998-03-11 | 沖電気工業株式会社 | シリコーン樹脂及びこれを用いた組成物 |
| JPH06326202A (ja) * | 1993-03-16 | 1994-11-25 | Showa Denko Kk | 半導体及びその絶縁膜または平坦化膜の形成方法 |
| TW257785B (https=) | 1993-05-17 | 1995-09-21 | Dow Corning | |
| JP2893104B2 (ja) * | 1994-03-14 | 1999-05-17 | 直弘 曽我 | 有機官能基の結合した無機系多孔質体の製造方法 |
| JP3445831B2 (ja) * | 1994-06-28 | 2003-09-08 | ジーイー東芝シリコーン株式会社 | シリコーン樹脂組成物 |
| JP3435325B2 (ja) | 1997-02-13 | 2003-08-11 | 株式会社東芝 | 低誘電率珪素酸化膜の形成方法 |
| US6048804A (en) | 1997-04-29 | 2000-04-11 | Alliedsignal Inc. | Process for producing nanoporous silica thin films |
| JPH1121510A (ja) * | 1997-06-30 | 1999-01-26 | Dow Corning Asia Ltd | 撥水性被膜形成用シリコーンレジン及びその組成物 |
| JP4025389B2 (ja) * | 1997-07-15 | 2007-12-19 | 旭化成株式会社 | 有機−無機複合体および無機多孔質体 |
| ATE280806T1 (de) | 1997-07-15 | 2004-11-15 | Asahi Chemical Ind | Zusammensetzungen aus alkoxysilan und organischem polymer zur herstellung von dünnen isolierenden schichten und deren verwendung |
| US6231989B1 (en) | 1998-11-20 | 2001-05-15 | Dow Corning Corporation | Method of forming coatings |
| JP3733824B2 (ja) * | 1999-08-12 | 2006-01-11 | Ｊｓｒ株式会社 | シリカ系被膜形成用塗布液の製造方法 |
| US6197913B1 (en) | 1999-08-26 | 2001-03-06 | Dow Corning Corporation | Method for making microporous silicone resins with narrow pore-size distributions |
| JP2001115021A (ja) * | 1999-10-18 | 2001-04-24 | Asahi Kasei Corp | シリカ前駆体／有機ポリマー組成物 |
| EP1095958B1 (en) | 1999-10-25 | 2006-02-08 | Dow Corning Corporation | Soluble silicone resin compositions |
| US6232424B1 (en) | 1999-12-13 | 2001-05-15 | Dow Corning Corporation | Soluble silicone resin compositions having good solution stability |
| US6313045B1 (en) | 1999-12-13 | 2001-11-06 | Dow Corning Corporation | Nanoporous silicone resins having low dielectric constants and method for preparation |
| US6359096B1 (en) | 1999-10-25 | 2002-03-19 | Dow Corning Corporation | Silicone resin compositions having good solution solubility and stability |
| US6143360A (en) | 1999-12-13 | 2000-11-07 | Dow Corning Corporation | Method for making nanoporous silicone resins from alkylydridosiloxane resins |
-
2001
- 2001-07-26 US US09/915,902 patent/US6872456B2/en not_active Expired - Fee Related
-
2002
- 2002-07-16 AT AT02750218T patent/ATE399822T1/de not_active IP Right Cessation
- 2002-07-16 EP EP20020750218 patent/EP1412434B1/en not_active Expired - Lifetime
- 2002-07-16 KR KR10-2004-7001129A patent/KR20040023683A/ko not_active Withdrawn
- 2002-07-16 DE DE60227373T patent/DE60227373D1/de not_active Expired - Lifetime
- 2002-07-16 CN CNA028146980A patent/CN1535300A/zh active Pending
- 2002-07-16 WO PCT/US2002/023152 patent/WO2003010246A1/en not_active Ceased
- 2002-07-16 JP JP2003515600A patent/JP4411067B2/ja not_active Expired - Fee Related
- 2002-07-26 TW TW91116734A patent/TW593548B/zh not_active IP Right Cessation
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