TW593548B - Siloxane resins - Google Patents

Siloxane resins Download PDF

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Publication number
TW593548B
TW593548B TW91116734A TW91116734A TW593548B TW 593548 B TW593548 B TW 593548B TW 91116734 A TW91116734 A TW 91116734A TW 91116734 A TW91116734 A TW 91116734A TW 593548 B TW593548 B TW 593548B
Authority
TW
Taiwan
Prior art keywords
resin
group
siloxane
coating
units
Prior art date
Application number
TW91116734A
Other languages
English (en)
Chinese (zh)
Inventor
Ronald Paul Boisvert
Duane Ray Bujalski
Kai Su
Original Assignee
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning filed Critical Dow Corning
Application granted granted Critical
Publication of TW593548B publication Critical patent/TW593548B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326—Deposition processes
    • H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/665—Porous materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6684—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen
    • H10P14/6686—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69—Inorganic materials
    • H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249967—Inorganic matrix in void-containing component
    • Y10T428/249969—Of silicon-containing material [e.g., glass, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/24999—Inorganic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Silicon Polymers (AREA)
  • Paints Or Removers (AREA)
  • Formation Of Insulating Films (AREA)
TW91116734A 2001-07-26 2002-07-26 Siloxane resins TW593548B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/915,902 US6872456B2 (en) 2001-07-26 2001-07-26 Siloxane resins

Publications (1)

Publication Number Publication Date
TW593548B true TW593548B (en) 2004-06-21

Family

ID=25436405

Family Applications (1)

Application Number Title Priority Date Filing Date
TW91116734A TW593548B (en) 2001-07-26 2002-07-26 Siloxane resins

Country Status (9)

Country Link
US (1) US6872456B2 (https=)
EP (1) EP1412434B1 (https=)
JP (1) JP4411067B2 (https=)
KR (1) KR20040023683A (https=)
CN (1) CN1535300A (https=)
AT (1) ATE399822T1 (https=)
DE (1) DE60227373D1 (https=)
TW (1) TW593548B (https=)
WO (1) WO2003010246A1 (https=)

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Publication number Priority date Publication date Assignee Title
US7404990B2 (en) * 2002-11-14 2008-07-29 Air Products And Chemicals, Inc. Non-thermal process for forming porous low dielectric constant films
US6940173B2 (en) * 2003-01-29 2005-09-06 International Business Machines Corporation Interconnect structures incorporating low-k dielectric barrier films
TW200628981A (en) * 2004-09-29 2006-08-16 Sumitomo Bakelite Co Semiconductor device
TW200619843A (en) * 2004-10-20 2006-06-16 Sumitomo Bakelite Co Semiconductor wafer and semiconductor device
WO2006049720A1 (en) * 2004-11-02 2006-05-11 Dow Corning Corporation Resist composition
KR20090034953A (ko) * 2006-08-04 2009-04-08 다우 코닝 코포레이션 실리콘 수지 및 실리콘 조성물
TWI434891B (zh) * 2007-02-22 2014-04-21 賽倫斯股份有限公司 積體電路用高矽含量矽氧烷聚合物
EP2121808A1 (en) * 2007-02-27 2009-11-25 AZ Electronic Materials USA Corp. Silicon-based antifrelective coating compositions
DE102008000353A1 (de) * 2008-02-20 2009-08-27 Wacker Chemie Ag Härtbare Polymerabmischungen
US20100291475A1 (en) * 2009-05-12 2010-11-18 Chenghong Li Silicone Coating Compositions
US20110111239A1 (en) * 2009-11-10 2011-05-12 Hemant Dandekar Sol-gel coating for steel and cast iron substrates and methods of making and using same
EP2707417A4 (en) * 2011-05-11 2015-01-07 Henkel China Co Ltd SILICONE RESIN WITH IMPROVED BARRIER PROPERTIES
CN109054560A (zh) * 2018-08-07 2018-12-21 常州工程职业技术学院 一种电工钢用绝缘涂料

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US3615272A (en) * 1968-11-04 1971-10-26 Dow Corning Condensed soluble hydrogensilsesquioxane resin
US3730743A (en) * 1970-08-24 1973-05-01 Stauffer Chemical Co Zinc dust coating composition
US3965136A (en) * 1975-09-24 1976-06-22 Olin Corporation Alkoxysilane cluster compounds and their preparation
US4329485A (en) * 1981-06-29 1982-05-11 Olin Corporation Process for preparing alkoxysilane cluster compounds by reacting a trialkoxysilanol with a triamidosilane
US4756977A (en) * 1986-12-03 1988-07-12 Dow Corning Corporation Multilayer ceramics from hydrogen silsesquioxane
JP3134297B2 (ja) * 1990-08-29 2001-02-13 日立化成工業株式会社 シリカ系被膜形成用塗布液およびシリカ系被膜の製造法
JP2669988B2 (ja) * 1992-02-06 1997-10-29 沖電気工業株式会社 ポリ（アルコキシシロキサン）の製造方法
JP2726363B2 (ja) 1992-06-03 1998-03-11 沖電気工業株式会社 シリコーン樹脂及びこれを用いた組成物
JPH06326202A (ja) * 1993-03-16 1994-11-25 Showa Denko Kk 半導体及びその絶縁膜または平坦化膜の形成方法
TW257785B (https=) * 1993-05-17 1995-09-21 Dow Corning
JP2893104B2 (ja) * 1994-03-14 1999-05-17 直弘 曽我 有機官能基の結合した無機系多孔質体の製造方法
JP3445831B2 (ja) * 1994-06-28 2003-09-08 ジーイー東芝シリコーン株式会社 シリコーン樹脂組成物
JP3435325B2 (ja) * 1997-02-13 2003-08-11 株式会社東芝 低誘電率珪素酸化膜の形成方法
US6048804A (en) 1997-04-29 2000-04-11 Alliedsignal Inc. Process for producing nanoporous silica thin films
JPH1121510A (ja) * 1997-06-30 1999-01-26 Dow Corning Asia Ltd 撥水性被膜形成用シリコーンレジン及びその組成物
JP4025389B2 (ja) * 1997-07-15 2007-12-19 旭化成株式会社 有機−無機複合体および無機多孔質体
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Also Published As

Publication number Publication date
DE60227373D1 (de) 2008-08-14
US6872456B2 (en) 2005-03-29
EP1412434B1 (en) 2008-07-02
WO2003010246A1 (en) 2003-02-06
CN1535300A (zh) 2004-10-06
ATE399822T1 (de) 2008-07-15
KR20040023683A (ko) 2004-03-18
EP1412434A1 (en) 2004-04-28
JP4411067B2 (ja) 2010-02-10
JP2004536924A (ja) 2004-12-09
US20030087082A1 (en) 2003-05-08

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