JP2004536910A5 - - Google Patents
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- Publication number
- JP2004536910A5 JP2004536910A5 JP2003512357A JP2003512357A JP2004536910A5 JP 2004536910 A5 JP2004536910 A5 JP 2004536910A5 JP 2003512357 A JP2003512357 A JP 2003512357A JP 2003512357 A JP2003512357 A JP 2003512357A JP 2004536910 A5 JP2004536910 A5 JP 2004536910A5
- Authority
- JP
- Japan
- Prior art keywords
- atoms
- group
- hydroxyethyl
- integer
- cycloalkylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000000203 mixture Substances 0.000 claims description 52
- 238000004140 cleaning Methods 0.000 claims description 51
- 125000003118 aryl group Chemical group 0.000 claims description 34
- 238000005260 corrosion Methods 0.000 claims description 33
- 230000007797 corrosion Effects 0.000 claims description 33
- 125000000217 alkyl group Chemical group 0.000 claims description 31
- 230000002401 inhibitory effect Effects 0.000 claims description 30
- 150000001875 compounds Chemical class 0.000 claims description 28
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 24
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 20
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 18
- 239000002904 solvent Substances 0.000 claims description 17
- 239000012453 solvate Substances 0.000 claims description 15
- HXJUTPCZVOIRIF-UHFFFAOYSA-N sulfolane Chemical compound O=S1(=O)CCCC1 HXJUTPCZVOIRIF-UHFFFAOYSA-N 0.000 claims description 12
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 229910021529 ammonia Inorganic materials 0.000 claims description 10
- 230000000269 nucleophilic effect Effects 0.000 claims description 7
- -1 silicate compound Chemical class 0.000 claims description 7
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 150000007522 mineralic acids Chemical class 0.000 claims description 5
- 150000007524 organic acids Chemical class 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 4
- 238000001465 metallisation Methods 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- 239000002738 chelating agent Substances 0.000 claims description 3
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims description 2
- 125000005842 heteroatom Chemical group 0.000 claims 80
- 229910052757 nitrogen Inorganic materials 0.000 claims 80
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 80
- 125000004437 phosphorous atom Chemical group 0.000 claims 80
- 229910052717 sulfur Inorganic materials 0.000 claims 80
- 229910052760 oxygen Inorganic materials 0.000 claims 70
- 125000004434 sulfur atom Chemical group 0.000 claims 70
- 125000004430 oxygen atom Chemical group O* 0.000 claims 60
- 125000000732 arylene group Chemical group 0.000 claims 40
- 125000002993 cycloalkylene group Chemical group 0.000 claims 40
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical group OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 36
- 238000000034 method Methods 0.000 claims 31
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims 30
- 125000000753 cycloalkyl group Chemical group 0.000 claims 30
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims 30
- 229910052739 hydrogen Inorganic materials 0.000 claims 30
- 239000001257 hydrogen Substances 0.000 claims 30
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 30
- 125000002947 alkylene group Chemical group 0.000 claims 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 18
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims 16
- WDQFELCEOPFLCZ-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrolidin-2-one Chemical compound OCCN1CCCC1=O WDQFELCEOPFLCZ-UHFFFAOYSA-N 0.000 claims 12
- TWYIPMITVXPNEM-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrolidine-2,5-dione Chemical compound OCCN1C(=O)CCC1=O TWYIPMITVXPNEM-UHFFFAOYSA-N 0.000 claims 10
- HXKKHQJGJAFBHI-UHFFFAOYSA-N 1-aminopropan-2-ol Chemical compound CC(O)CN HXKKHQJGJAFBHI-UHFFFAOYSA-N 0.000 claims 10
- GIAFURWZWWWBQT-UHFFFAOYSA-N 2-(2-aminoethoxy)ethanol Chemical compound NCCOCCO GIAFURWZWWWBQT-UHFFFAOYSA-N 0.000 claims 10
- KKFDCBRMNNSAAW-UHFFFAOYSA-N 2-(morpholin-4-yl)ethanol Chemical compound OCCN1CCOCC1 KKFDCBRMNNSAAW-UHFFFAOYSA-N 0.000 claims 10
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 claims 10
- 229940058020 2-amino-2-methyl-1-propanol Drugs 0.000 claims 10
- LTACQVCHVAUOKN-UHFFFAOYSA-N 3-(diethylamino)propane-1,2-diol Chemical compound CCN(CC)CC(O)CO LTACQVCHVAUOKN-UHFFFAOYSA-N 0.000 claims 10
- PVCJKHHOXFKFRP-UHFFFAOYSA-N N-acetylethanolamine Chemical compound CC(=O)NCCO PVCJKHHOXFKFRP-UHFFFAOYSA-N 0.000 claims 10
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 claims 10
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 claims 10
- CBTVGIZVANVGBH-UHFFFAOYSA-N aminomethyl propanol Chemical compound CC(C)(N)CO CBTVGIZVANVGBH-UHFFFAOYSA-N 0.000 claims 10
- 239000006184 cosolvent Substances 0.000 claims 10
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims 10
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims 10
- RJLKIAGOYBARJG-UHFFFAOYSA-N 1,3-dimethylpiperidin-2-one Chemical compound CC1CCCN(C)C1=O RJLKIAGOYBARJG-UHFFFAOYSA-N 0.000 claims 8
- 125000004432 carbon atom Chemical group C* 0.000 claims 6
- 150000003839 salts Chemical class 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 239000002253 acid Substances 0.000 claims 2
- 230000000536 complexating effect Effects 0.000 claims 2
- 238000004377 microelectronic Methods 0.000 claims 2
- FCKYPQBAHLOOJQ-UWVGGRQHSA-N 2-[[(1s,2s)-2-[bis(carboxymethyl)amino]cyclohexyl]-(carboxymethyl)amino]acetic acid Chemical compound OC(=O)CN(CC(O)=O)[C@H]1CCCC[C@@H]1N(CC(O)=O)CC(O)=O FCKYPQBAHLOOJQ-UWVGGRQHSA-N 0.000 claims 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims 1
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 claims 1
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- NECRQCBKTGZNMH-UHFFFAOYSA-N 3,5-dimethylhex-1-yn-3-ol Chemical compound CC(C)CC(C)(O)C#C NECRQCBKTGZNMH-UHFFFAOYSA-N 0.000 description 2
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 2
- 239000012964 benzotriazole Substances 0.000 description 2
- KWIUHFFTVRNATP-UHFFFAOYSA-N glycine betaine Chemical compound C[N+](C)(C)CC([O-])=O KWIUHFFTVRNATP-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000012038 nucleophile Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- HMBHAQMOBKLWRX-UHFFFAOYSA-N 2,3-dihydro-1,4-benzodioxine-3-carboxylic acid Chemical compound C1=CC=C2OC(C(=O)O)COC2=C1 HMBHAQMOBKLWRX-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 1
- GQWNECFJGBQMBO-UHFFFAOYSA-N Molindone hydrochloride Chemical compound Cl.O=C1C=2C(CC)=C(C)NC=2CCC1CN1CCOCC1 GQWNECFJGBQMBO-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 230000002219 ammoniagenic effect Effects 0.000 description 1
- 239000000908 ammonium hydroxide Substances 0.000 description 1
- 239000003125 aqueous solvent Substances 0.000 description 1
- 229960003237 betaine Drugs 0.000 description 1
- 229940075419 choline hydroxide Drugs 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 150000002443 hydroxylamines Chemical class 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000007344 nucleophilic reaction Methods 0.000 description 1
- 239000003495 polar organic solvent Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US30403601P | 2001-07-09 | 2001-07-09 | |
| PCT/US2002/021375 WO2003006598A1 (en) | 2001-07-09 | 2002-07-08 | Ammonia-free alkaline microelectronic cleaning compositions with improved substrate compatibility |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008280900A Division JP4753986B2 (ja) | 2001-07-09 | 2008-10-31 | 基板適合性が改善されたアンモニア不含アルカリ性マイクロエレクトロニクス洗浄組成物の使用 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004536910A JP2004536910A (ja) | 2004-12-09 |
| JP2004536910A5 true JP2004536910A5 (enExample) | 2006-07-13 |
| JP4256258B2 JP4256258B2 (ja) | 2009-04-22 |
Family
ID=23174755
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003512357A Expired - Fee Related JP4256258B2 (ja) | 2001-07-09 | 2002-07-08 | 基板適合性が改善されたアンモニア不含アルカリ性マイクロエレクトロニクス洗浄組成物 |
| JP2008280900A Expired - Fee Related JP4753986B2 (ja) | 2001-07-09 | 2008-10-31 | 基板適合性が改善されたアンモニア不含アルカリ性マイクロエレクトロニクス洗浄組成物の使用 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008280900A Expired - Fee Related JP4753986B2 (ja) | 2001-07-09 | 2008-10-31 | 基板適合性が改善されたアンモニア不含アルカリ性マイクロエレクトロニクス洗浄組成物の使用 |
Country Status (22)
| Country | Link |
|---|---|
| US (1) | US20040220065A1 (enExample) |
| EP (1) | EP1404797B1 (enExample) |
| JP (2) | JP4256258B2 (enExample) |
| KR (1) | KR101009550B1 (enExample) |
| CN (1) | CN100410359C (enExample) |
| AT (1) | ATE355356T1 (enExample) |
| AU (1) | AU2002326341A1 (enExample) |
| BR (1) | BR0210888A (enExample) |
| CA (1) | CA2452885C (enExample) |
| DE (1) | DE60218468T2 (enExample) |
| DK (1) | DK1404797T3 (enExample) |
| ES (1) | ES2282453T3 (enExample) |
| IL (2) | IL159762A0 (enExample) |
| IN (1) | IN2004CH00044A (enExample) |
| MY (1) | MY131912A (enExample) |
| NO (1) | NO20040068L (enExample) |
| PL (1) | PL199523B1 (enExample) |
| PT (1) | PT1404797E (enExample) |
| RS (1) | RS51832B (enExample) |
| TW (1) | TWI262946B (enExample) |
| WO (1) | WO2003006598A1 (enExample) |
| ZA (1) | ZA200400067B (enExample) |
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| US7129199B2 (en) * | 2002-08-12 | 2006-10-31 | Air Products And Chemicals, Inc. | Process solutions containing surfactants |
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| JP4282054B2 (ja) * | 2002-09-09 | 2009-06-17 | 東京応化工業株式会社 | デュアルダマシン構造形成プロセスに用いられる洗浄液および基板の処理方法 |
| US20040220066A1 (en) * | 2003-05-01 | 2004-11-04 | Rohm And Haas Electronic Materials, L.L.C. | Stripper |
| US7442675B2 (en) | 2003-06-18 | 2008-10-28 | Tokyo Ohka Kogyo Co., Ltd. | Cleaning composition and method of cleaning semiconductor substrate |
| US6930017B2 (en) | 2003-08-21 | 2005-08-16 | Micron Technology, Inc. | Wafer Cleaning method and resulting wafer |
| JP2005075924A (ja) * | 2003-08-29 | 2005-03-24 | Neos Co Ltd | シリカスケール除去剤 |
| KR100593668B1 (ko) | 2004-01-20 | 2006-06-28 | 삼성전자주식회사 | 세정액 조성물 및 이를 이용한 반도체 장치의 세정방법 |
| EP1715510B2 (en) * | 2004-02-09 | 2016-02-24 | Mitsubishi Chemical Corporation | Substrate cleaning liquid for semiconductor device and cleaning method |
| US7498295B2 (en) | 2004-02-12 | 2009-03-03 | Air Liquide Electronics U.S. Lp | Alkaline chemistry for post-CMP cleaning comprising tetra alkyl ammonium hydroxide |
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| US8338087B2 (en) * | 2004-03-03 | 2012-12-25 | Advanced Technology Materials, Inc | Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate |
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- 2002-07-05 MY MYPI20022557A patent/MY131912A/en unknown
- 2002-07-08 JP JP2003512357A patent/JP4256258B2/ja not_active Expired - Fee Related
- 2002-07-08 IL IL15976202A patent/IL159762A0/xx active IP Right Grant
- 2002-07-08 WO PCT/US2002/021375 patent/WO2003006598A1/en not_active Ceased
- 2002-07-08 DE DE60218468T patent/DE60218468T2/de not_active Expired - Lifetime
- 2002-07-08 BR BR0210888-7A patent/BR0210888A/pt not_active IP Right Cessation
- 2002-07-08 CN CNB028138767A patent/CN100410359C/zh not_active Expired - Lifetime
- 2002-07-08 RS YU1204A patent/RS51832B/sr unknown
- 2002-07-08 PT PT02761045T patent/PT1404797E/pt unknown
- 2002-07-08 EP EP02761045A patent/EP1404797B1/en not_active Expired - Lifetime
- 2002-07-08 PL PL367434A patent/PL199523B1/pl not_active IP Right Cessation
- 2002-07-08 DK DK02761045T patent/DK1404797T3/da active
- 2002-07-08 US US10/482,876 patent/US20040220065A1/en not_active Abandoned
- 2002-07-08 CA CA2452885A patent/CA2452885C/en not_active Expired - Fee Related
- 2002-07-08 AU AU2002326341A patent/AU2002326341A1/en not_active Abandoned
- 2002-07-08 AT AT02761045T patent/ATE355356T1/de active
- 2002-07-08 KR KR1020047000268A patent/KR101009550B1/ko not_active Expired - Lifetime
- 2002-07-08 ES ES02761045T patent/ES2282453T3/es not_active Expired - Lifetime
- 2002-07-09 TW TW091115178A patent/TWI262946B/zh not_active IP Right Cessation
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2004
- 2004-01-06 ZA ZA200400067A patent/ZA200400067B/en unknown
- 2004-01-07 IL IL159762A patent/IL159762A/en not_active IP Right Cessation
- 2004-01-08 NO NO20040068A patent/NO20040068L/no not_active Application Discontinuation
- 2004-01-08 IN IN44CH2004 patent/IN2004CH00044A/en unknown
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2008
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