JP2004526295A5 - - Google Patents

Download PDF

Info

Publication number
JP2004526295A5
JP2004526295A5 JP2002544763A JP2002544763A JP2004526295A5 JP 2004526295 A5 JP2004526295 A5 JP 2004526295A5 JP 2002544763 A JP2002544763 A JP 2002544763A JP 2002544763 A JP2002544763 A JP 2002544763A JP 2004526295 A5 JP2004526295 A5 JP 2004526295A5
Authority
JP
Japan
Prior art keywords
effect transistor
field effect
depth
conductivity type
trench
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002544763A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004526295A (ja
Filing date
Publication date
Priority claimed from US09/718,816 external-priority patent/US6555872B1/en
Application filed filed Critical
Publication of JP2004526295A publication Critical patent/JP2004526295A/ja
Publication of JP2004526295A5 publication Critical patent/JP2004526295A5/ja
Pending legal-status Critical Current

Links

JP2002544763A 2000-11-22 2001-11-08 トレンチゲートフェルミしきい値形電界効果トランジスタ及びその製造方法 Pending JP2004526295A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/718,816 US6555872B1 (en) 2000-11-22 2000-11-22 Trench gate fermi-threshold field effect transistors
PCT/US2001/046746 WO2002043117A2 (en) 2000-11-22 2001-11-08 Trench gate fermi-threshold field effect transistors and methods of fabricating the same

Publications (2)

Publication Number Publication Date
JP2004526295A JP2004526295A (ja) 2004-08-26
JP2004526295A5 true JP2004526295A5 (enExample) 2005-12-22

Family

ID=24887671

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002544763A Pending JP2004526295A (ja) 2000-11-22 2001-11-08 トレンチゲートフェルミしきい値形電界効果トランジスタ及びその製造方法

Country Status (7)

Country Link
US (1) US6555872B1 (enExample)
EP (1) EP1344257A2 (enExample)
JP (1) JP2004526295A (enExample)
KR (1) KR100840630B1 (enExample)
CN (1) CN1252831C (enExample)
AU (1) AU2002230624A1 (enExample)
WO (1) WO2002043117A2 (enExample)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6642577B2 (en) * 2000-03-16 2003-11-04 Denso Corporation Semiconductor device including power MOSFET and peripheral device and method for manufacturing the same
KR100459872B1 (ko) * 2003-05-07 2004-12-03 삼성전자주식회사 트렌치 게이트를 갖는 매몰 채널형 트랜지스터 및 그제조방법
KR100604816B1 (ko) * 2003-05-19 2006-07-28 삼성전자주식회사 집적 회로 소자 리세스 트랜지스터의 제조 방법 및 이에의해 제조된 집적회로 소자 리세스 트랜지스터
GB0314392D0 (en) * 2003-06-20 2003-07-23 Koninkl Philips Electronics Nv Trench mos structure
US7217976B2 (en) * 2004-02-09 2007-05-15 International Rectifier Corporation Low temperature process and structures for polycide power MOSFET with ultra-shallow source
KR100526891B1 (ko) 2004-02-25 2005-11-09 삼성전자주식회사 반도체 소자에서의 버티컬 트랜지스터 구조 및 그에 따른형성방법
JP2005285980A (ja) * 2004-03-29 2005-10-13 Sanyo Electric Co Ltd 半導体装置および半導体装置の製造方法
KR100549580B1 (ko) * 2004-06-24 2006-02-08 주식회사 하이닉스반도체 리세스 채널 구조를 갖는 반도체 소자의 제조 방법
DE102004063991B4 (de) 2004-10-29 2009-06-18 Infineon Technologies Ag Verfahren zur Herstellung von dotierten Halbleitergebieten in einem Halbleiterkörper eines lateralen Trenchtransistors
KR101258864B1 (ko) * 2004-12-07 2013-04-29 썬더버드 테크놀로지스, 인코포레이티드 긴장된 실리콘, 게이트 엔지니어링된 페르미-fet
US7271457B2 (en) * 2005-03-04 2007-09-18 Bae Systems Information And Electronic Systems Integration Inc. Abrupt channel doping profile for fermi threshold field effect transistors
JP5114829B2 (ja) * 2005-05-13 2013-01-09 ソニー株式会社 半導体装置およびその製造方法
US20070001199A1 (en) * 2005-06-30 2007-01-04 Thunderbird Technologies, Inc. Circuits and Integrated Circuits Including Field Effect Transistors Having Differing Body Effects
US8338887B2 (en) 2005-07-06 2012-12-25 Infineon Technologies Ag Buried gate transistor
US8110868B2 (en) 2005-07-27 2012-02-07 Infineon Technologies Austria Ag Power semiconductor component with a low on-state resistance
US8461648B2 (en) 2005-07-27 2013-06-11 Infineon Technologies Austria Ag Semiconductor component with a drift region and a drift control region
US7714352B2 (en) * 2006-02-09 2010-05-11 Nissan Motor Co., Ltd. Hetero junction semiconductor device
US7348629B2 (en) * 2006-04-20 2008-03-25 International Business Machines Corporation Metal gated ultra short MOSFET devices
US7956387B2 (en) * 2006-09-08 2011-06-07 Qimonda Ag Transistor and memory cell array
US8115251B2 (en) 2007-04-30 2012-02-14 International Business Machines Corporation Recessed gate channel with low Vt corner
US20090134476A1 (en) * 2007-11-13 2009-05-28 Thunderbird Technologies, Inc. Low temperature coefficient field effect transistors and design and fabrication methods
US20100123206A1 (en) * 2008-11-18 2010-05-20 Thunderbird Technologies, Inc. Methods of fabricating field effect transistors including titanium nitride gates over partially nitrided oxide and devices so fabricated
KR101097867B1 (ko) 2009-06-15 2011-12-23 주식회사 하이닉스반도체 반도체 소자의 제조방법
FR2958779B1 (fr) * 2010-04-07 2015-07-17 Centre Nat Rech Scient Point memoire ram a un transistor
US20130161734A1 (en) * 2011-12-22 2013-06-27 Nan Ya Technology Corporation Transistor structure and method for preparing the same
US8796751B2 (en) 2012-11-20 2014-08-05 Micron Technology, Inc. Transistors, memory cells and semiconductor constructions
JP6513450B2 (ja) * 2015-03-26 2019-05-15 三重富士通セミコンダクター株式会社 半導体装置
DE102015118616B3 (de) 2015-10-30 2017-04-13 Infineon Technologies Austria Ag Latchup-fester Transistor
JP6740986B2 (ja) * 2017-08-31 2020-08-19 株式会社デンソー 炭化珪素半導体装置およびその製造方法
TWI845679B (zh) * 2019-05-13 2024-06-21 以色列商普騰泰克斯有限公司 藉由測量及模擬來確定積體電路的未知偏誤及元件參數
CN112086511B (zh) 2019-06-13 2025-07-18 半导体元件工业有限责任公司 自对准沟槽mosfet接触件的系统和方法
US10892188B2 (en) * 2019-06-13 2021-01-12 Semiconductor Components Industries, Llc Self-aligned trench MOSFET contacts having widths less than minimum lithography limits
CN111767690B (zh) * 2020-06-23 2024-03-22 杰华特微电子股份有限公司 基于lvs工具的盆区检测方法
US11527626B2 (en) * 2020-10-30 2022-12-13 Monolithic Power Systems, Inc. Field-plate trench FET and associated method for manufacturing
WO2022215076A1 (en) 2021-04-07 2022-10-13 Proteantecs Ltd. Adaptive frequency scaling based on clock cycle time measurement
CN116417516A (zh) * 2021-12-31 2023-07-11 无锡华润上华科技有限公司 沟槽型dmos器件及其制备方法
US20230261113A1 (en) * 2022-02-17 2023-08-17 Tokyo Electron Limited 3d ufet device for advanced 3d integration
US12461143B2 (en) 2024-01-24 2025-11-04 Proteantecs Ltd. Integrated circuit margin measurement
CN119153539A (zh) * 2024-11-18 2024-12-17 珠海格力电子元器件有限公司 半导体结构以及半导体器件

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3975221A (en) 1973-08-29 1976-08-17 American Micro-Systems, Inc. Low capacitance V groove MOS NOR gate and method of manufacture
US4835585A (en) 1984-11-26 1989-05-30 American Telephone And Telegraph Company, At&T Bell Laboratories Trench gate structures
US4735918A (en) 1985-05-24 1988-04-05 Hughes Aircraft Company Vertical channel field effect transistor
JPS63287064A (ja) 1987-05-19 1988-11-24 Fujitsu Ltd Mis形半導体装置およびその製造方法
KR0173111B1 (ko) 1988-06-02 1999-02-01 야마무라 가쯔미 트렌치 게이트 mos fet
US4990974A (en) 1989-03-02 1991-02-05 Thunderbird Technologies, Inc. Fermi threshold field effect transistor
US5108938A (en) 1989-03-21 1992-04-28 Grumman Aerospace Corporation Method of making a trench gate complimentary metal oxide semiconductor transistor
US5206182A (en) * 1989-06-08 1993-04-27 United Technologies Corporation Trench isolation process
US5369295A (en) * 1992-01-28 1994-11-29 Thunderbird Technologies, Inc. Fermi threshold field effect transistor with reduced gate and diffusion capacitance
US5440160A (en) * 1992-01-28 1995-08-08 Thunderbird Technologies, Inc. High saturation current, low leakage current fermi threshold field effect transistor
JP2899122B2 (ja) 1991-03-18 1999-06-02 キヤノン株式会社 絶縁ゲートトランジスタ及び半導体集積回路
US5814869A (en) 1992-01-28 1998-09-29 Thunderbird Technologies, Inc. Short channel fermi-threshold field effect transistors
US5543654A (en) * 1992-01-28 1996-08-06 Thunderbird Technologies, Inc. Contoured-tub fermi-threshold field effect transistor and method of forming same
US5367186A (en) * 1992-01-28 1994-11-22 Thunderbird Technologies, Inc. Bounded tub fermi threshold field effect transistor
US5194923A (en) 1992-01-28 1993-03-16 Thunderbird Technologies, Inc. Fermi threshold field effect transistor with reduced gate and diffusion capacitance
US5510630A (en) * 1993-10-18 1996-04-23 Westinghouse Electric Corporation Non-volatile random access memory cell constructed of silicon carbide
US5434435A (en) 1994-05-04 1995-07-18 North Carolina State University Trench gate lateral MOSFET
US5698884A (en) 1996-02-07 1997-12-16 Thunderbird Technologies, Inc. Short channel fermi-threshold field effect transistors including drain field termination region and methods of fabricating same
US5960270A (en) 1997-08-11 1999-09-28 Motorola, Inc. Method for forming an MOS transistor having a metallic gate electrode that is formed after the formation of self-aligned source and drain regions
TW432636B (en) 1997-09-26 2001-05-01 Thunderbird Tech Inc Metal gate fermi-threshold field effect transistor
US5937297A (en) 1998-06-01 1999-08-10 Chartered Semiconductor Manufacturing, Ltd. Method for making sub-quarter-micron MOSFET

Similar Documents

Publication Publication Date Title
JP2004526295A5 (enExample)
US9054183B2 (en) Trenched and implanted accumulation mode metal-oxide-semiconductor field-effect transistor
JP5081358B2 (ja) トレンチゲート電極を有する二重拡散金属酸化膜半導体トランジスタ及びその製造方法
KR101552022B1 (ko) 반도체 장치 및 반도체 장치를 제조하는 방법
TWI374474B (en) High voltage lateral fet structure with improved on resistance performance
TWI284925B (en) High voltage power MOSFET having a voltage sustaining region that includes doped columns formed by trench etching using an etchant gas that is also a doping source
US8129779B2 (en) Trench gate type VDMOSFET device with thicker gate insulation layer portion for reducing gate to source capacitance
US20140084362A1 (en) Semiconductor Device and Method for Manufacturing a Semiconductor Device
JP4924781B2 (ja) 縦型半導体装置
KR960036041A (ko) 고내압 트랜지스터 및 그 제조방법
US7262460B2 (en) Vertical insulated gate transistor and manufacturing method
JP2005507160A5 (enExample)
US9449968B2 (en) Method for manufacturing a semiconductor device and a semiconductor device
WO2002043117A3 (en) Trench gate fermi-threshold field effect transistors and methods of fabricating the same
JPH11191559A (ja) Mosfetの製造方法
US9082773B2 (en) Integrated circuit, semiconductor device and method of manufacturing a semiconductor device
US10553681B2 (en) Forming a superjunction transistor device
US7598586B2 (en) Semiconductor device and production method therefor
KR100518506B1 (ko) 트랜치 게이트형 전력용 모스 소자 및 그 제조방법
EP1699087A1 (en) Semiconductor device and its manufacturing method
CN108470772B (zh) 一种soi半导体器件及其形成方法
KR100839706B1 (ko) 마이크로일렉트로닉 디바이스와 그 제조 방법
JP2002016250A (ja) 半導体装置及びその製造方法
JP5483693B2 (ja) 半導体装置及びその製造方法
JP4290378B2 (ja) 横型パワーmosトランジスタおよびその製造方法