JP2004526295A5 - - Google Patents
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- Publication number
- JP2004526295A5 JP2004526295A5 JP2002544763A JP2002544763A JP2004526295A5 JP 2004526295 A5 JP2004526295 A5 JP 2004526295A5 JP 2002544763 A JP2002544763 A JP 2002544763A JP 2002544763 A JP2002544763 A JP 2002544763A JP 2004526295 A5 JP2004526295 A5 JP 2004526295A5
- Authority
- JP
- Japan
- Prior art keywords
- effect transistor
- field effect
- depth
- conductivity type
- trench
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005669 field effect Effects 0.000 claims 107
- 239000000758 substrate Substances 0.000 claims 43
- 239000004065 semiconductor Substances 0.000 claims 37
- 238000000034 method Methods 0.000 claims 32
- 230000005686 electrostatic field Effects 0.000 claims 31
- 239000000969 carrier Substances 0.000 claims 6
- 230000005684 electric field Effects 0.000 claims 3
- 238000005259 measurement Methods 0.000 claims 3
- 239000003990 capacitor Substances 0.000 claims 2
- 238000005530 etching Methods 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/718,816 US6555872B1 (en) | 2000-11-22 | 2000-11-22 | Trench gate fermi-threshold field effect transistors |
| PCT/US2001/046746 WO2002043117A2 (en) | 2000-11-22 | 2001-11-08 | Trench gate fermi-threshold field effect transistors and methods of fabricating the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004526295A JP2004526295A (ja) | 2004-08-26 |
| JP2004526295A5 true JP2004526295A5 (enExample) | 2005-12-22 |
Family
ID=24887671
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002544763A Pending JP2004526295A (ja) | 2000-11-22 | 2001-11-08 | トレンチゲートフェルミしきい値形電界効果トランジスタ及びその製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6555872B1 (enExample) |
| EP (1) | EP1344257A2 (enExample) |
| JP (1) | JP2004526295A (enExample) |
| KR (1) | KR100840630B1 (enExample) |
| CN (1) | CN1252831C (enExample) |
| AU (1) | AU2002230624A1 (enExample) |
| WO (1) | WO2002043117A2 (enExample) |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6642577B2 (en) * | 2000-03-16 | 2003-11-04 | Denso Corporation | Semiconductor device including power MOSFET and peripheral device and method for manufacturing the same |
| KR100459872B1 (ko) * | 2003-05-07 | 2004-12-03 | 삼성전자주식회사 | 트렌치 게이트를 갖는 매몰 채널형 트랜지스터 및 그제조방법 |
| KR100604816B1 (ko) * | 2003-05-19 | 2006-07-28 | 삼성전자주식회사 | 집적 회로 소자 리세스 트랜지스터의 제조 방법 및 이에의해 제조된 집적회로 소자 리세스 트랜지스터 |
| GB0314392D0 (en) * | 2003-06-20 | 2003-07-23 | Koninkl Philips Electronics Nv | Trench mos structure |
| US7217976B2 (en) * | 2004-02-09 | 2007-05-15 | International Rectifier Corporation | Low temperature process and structures for polycide power MOSFET with ultra-shallow source |
| KR100526891B1 (ko) | 2004-02-25 | 2005-11-09 | 삼성전자주식회사 | 반도체 소자에서의 버티컬 트랜지스터 구조 및 그에 따른형성방법 |
| JP2005285980A (ja) * | 2004-03-29 | 2005-10-13 | Sanyo Electric Co Ltd | 半導体装置および半導体装置の製造方法 |
| KR100549580B1 (ko) * | 2004-06-24 | 2006-02-08 | 주식회사 하이닉스반도체 | 리세스 채널 구조를 갖는 반도체 소자의 제조 방법 |
| DE102004063991B4 (de) | 2004-10-29 | 2009-06-18 | Infineon Technologies Ag | Verfahren zur Herstellung von dotierten Halbleitergebieten in einem Halbleiterkörper eines lateralen Trenchtransistors |
| KR101258864B1 (ko) * | 2004-12-07 | 2013-04-29 | 썬더버드 테크놀로지스, 인코포레이티드 | 긴장된 실리콘, 게이트 엔지니어링된 페르미-fet |
| US7271457B2 (en) * | 2005-03-04 | 2007-09-18 | Bae Systems Information And Electronic Systems Integration Inc. | Abrupt channel doping profile for fermi threshold field effect transistors |
| JP5114829B2 (ja) * | 2005-05-13 | 2013-01-09 | ソニー株式会社 | 半導体装置およびその製造方法 |
| US20070001199A1 (en) * | 2005-06-30 | 2007-01-04 | Thunderbird Technologies, Inc. | Circuits and Integrated Circuits Including Field Effect Transistors Having Differing Body Effects |
| US8338887B2 (en) | 2005-07-06 | 2012-12-25 | Infineon Technologies Ag | Buried gate transistor |
| US8110868B2 (en) | 2005-07-27 | 2012-02-07 | Infineon Technologies Austria Ag | Power semiconductor component with a low on-state resistance |
| US8461648B2 (en) | 2005-07-27 | 2013-06-11 | Infineon Technologies Austria Ag | Semiconductor component with a drift region and a drift control region |
| US7714352B2 (en) * | 2006-02-09 | 2010-05-11 | Nissan Motor Co., Ltd. | Hetero junction semiconductor device |
| US7348629B2 (en) * | 2006-04-20 | 2008-03-25 | International Business Machines Corporation | Metal gated ultra short MOSFET devices |
| US7956387B2 (en) * | 2006-09-08 | 2011-06-07 | Qimonda Ag | Transistor and memory cell array |
| US8115251B2 (en) | 2007-04-30 | 2012-02-14 | International Business Machines Corporation | Recessed gate channel with low Vt corner |
| US20090134476A1 (en) * | 2007-11-13 | 2009-05-28 | Thunderbird Technologies, Inc. | Low temperature coefficient field effect transistors and design and fabrication methods |
| US20100123206A1 (en) * | 2008-11-18 | 2010-05-20 | Thunderbird Technologies, Inc. | Methods of fabricating field effect transistors including titanium nitride gates over partially nitrided oxide and devices so fabricated |
| KR101097867B1 (ko) | 2009-06-15 | 2011-12-23 | 주식회사 하이닉스반도체 | 반도체 소자의 제조방법 |
| FR2958779B1 (fr) * | 2010-04-07 | 2015-07-17 | Centre Nat Rech Scient | Point memoire ram a un transistor |
| US20130161734A1 (en) * | 2011-12-22 | 2013-06-27 | Nan Ya Technology Corporation | Transistor structure and method for preparing the same |
| US8796751B2 (en) | 2012-11-20 | 2014-08-05 | Micron Technology, Inc. | Transistors, memory cells and semiconductor constructions |
| JP6513450B2 (ja) * | 2015-03-26 | 2019-05-15 | 三重富士通セミコンダクター株式会社 | 半導体装置 |
| DE102015118616B3 (de) | 2015-10-30 | 2017-04-13 | Infineon Technologies Austria Ag | Latchup-fester Transistor |
| JP6740986B2 (ja) * | 2017-08-31 | 2020-08-19 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
| TWI845679B (zh) * | 2019-05-13 | 2024-06-21 | 以色列商普騰泰克斯有限公司 | 藉由測量及模擬來確定積體電路的未知偏誤及元件參數 |
| CN112086511B (zh) | 2019-06-13 | 2025-07-18 | 半导体元件工业有限责任公司 | 自对准沟槽mosfet接触件的系统和方法 |
| US10892188B2 (en) * | 2019-06-13 | 2021-01-12 | Semiconductor Components Industries, Llc | Self-aligned trench MOSFET contacts having widths less than minimum lithography limits |
| CN111767690B (zh) * | 2020-06-23 | 2024-03-22 | 杰华特微电子股份有限公司 | 基于lvs工具的盆区检测方法 |
| US11527626B2 (en) * | 2020-10-30 | 2022-12-13 | Monolithic Power Systems, Inc. | Field-plate trench FET and associated method for manufacturing |
| WO2022215076A1 (en) | 2021-04-07 | 2022-10-13 | Proteantecs Ltd. | Adaptive frequency scaling based on clock cycle time measurement |
| CN116417516A (zh) * | 2021-12-31 | 2023-07-11 | 无锡华润上华科技有限公司 | 沟槽型dmos器件及其制备方法 |
| US20230261113A1 (en) * | 2022-02-17 | 2023-08-17 | Tokyo Electron Limited | 3d ufet device for advanced 3d integration |
| US12461143B2 (en) | 2024-01-24 | 2025-11-04 | Proteantecs Ltd. | Integrated circuit margin measurement |
| CN119153539A (zh) * | 2024-11-18 | 2024-12-17 | 珠海格力电子元器件有限公司 | 半导体结构以及半导体器件 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3975221A (en) | 1973-08-29 | 1976-08-17 | American Micro-Systems, Inc. | Low capacitance V groove MOS NOR gate and method of manufacture |
| US4835585A (en) | 1984-11-26 | 1989-05-30 | American Telephone And Telegraph Company, At&T Bell Laboratories | Trench gate structures |
| US4735918A (en) | 1985-05-24 | 1988-04-05 | Hughes Aircraft Company | Vertical channel field effect transistor |
| JPS63287064A (ja) | 1987-05-19 | 1988-11-24 | Fujitsu Ltd | Mis形半導体装置およびその製造方法 |
| KR0173111B1 (ko) | 1988-06-02 | 1999-02-01 | 야마무라 가쯔미 | 트렌치 게이트 mos fet |
| US4990974A (en) | 1989-03-02 | 1991-02-05 | Thunderbird Technologies, Inc. | Fermi threshold field effect transistor |
| US5108938A (en) | 1989-03-21 | 1992-04-28 | Grumman Aerospace Corporation | Method of making a trench gate complimentary metal oxide semiconductor transistor |
| US5206182A (en) * | 1989-06-08 | 1993-04-27 | United Technologies Corporation | Trench isolation process |
| US5369295A (en) * | 1992-01-28 | 1994-11-29 | Thunderbird Technologies, Inc. | Fermi threshold field effect transistor with reduced gate and diffusion capacitance |
| US5440160A (en) * | 1992-01-28 | 1995-08-08 | Thunderbird Technologies, Inc. | High saturation current, low leakage current fermi threshold field effect transistor |
| JP2899122B2 (ja) | 1991-03-18 | 1999-06-02 | キヤノン株式会社 | 絶縁ゲートトランジスタ及び半導体集積回路 |
| US5814869A (en) | 1992-01-28 | 1998-09-29 | Thunderbird Technologies, Inc. | Short channel fermi-threshold field effect transistors |
| US5543654A (en) * | 1992-01-28 | 1996-08-06 | Thunderbird Technologies, Inc. | Contoured-tub fermi-threshold field effect transistor and method of forming same |
| US5367186A (en) * | 1992-01-28 | 1994-11-22 | Thunderbird Technologies, Inc. | Bounded tub fermi threshold field effect transistor |
| US5194923A (en) | 1992-01-28 | 1993-03-16 | Thunderbird Technologies, Inc. | Fermi threshold field effect transistor with reduced gate and diffusion capacitance |
| US5510630A (en) * | 1993-10-18 | 1996-04-23 | Westinghouse Electric Corporation | Non-volatile random access memory cell constructed of silicon carbide |
| US5434435A (en) | 1994-05-04 | 1995-07-18 | North Carolina State University | Trench gate lateral MOSFET |
| US5698884A (en) | 1996-02-07 | 1997-12-16 | Thunderbird Technologies, Inc. | Short channel fermi-threshold field effect transistors including drain field termination region and methods of fabricating same |
| US5960270A (en) | 1997-08-11 | 1999-09-28 | Motorola, Inc. | Method for forming an MOS transistor having a metallic gate electrode that is formed after the formation of self-aligned source and drain regions |
| TW432636B (en) | 1997-09-26 | 2001-05-01 | Thunderbird Tech Inc | Metal gate fermi-threshold field effect transistor |
| US5937297A (en) | 1998-06-01 | 1999-08-10 | Chartered Semiconductor Manufacturing, Ltd. | Method for making sub-quarter-micron MOSFET |
-
2000
- 2000-11-22 US US09/718,816 patent/US6555872B1/en not_active Expired - Fee Related
-
2001
- 2001-11-08 AU AU2002230624A patent/AU2002230624A1/en not_active Abandoned
- 2001-11-08 CN CNB018222072A patent/CN1252831C/zh not_active Expired - Fee Related
- 2001-11-08 WO PCT/US2001/046746 patent/WO2002043117A2/en not_active Ceased
- 2001-11-08 KR KR1020037006925A patent/KR100840630B1/ko not_active Expired - Fee Related
- 2001-11-08 EP EP01990859A patent/EP1344257A2/en not_active Ceased
- 2001-11-08 JP JP2002544763A patent/JP2004526295A/ja active Pending
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