JP2004500251A5 - - Google Patents

Download PDF

Info

Publication number
JP2004500251A5
JP2004500251A5 JP2001572257A JP2001572257A JP2004500251A5 JP 2004500251 A5 JP2004500251 A5 JP 2004500251A5 JP 2001572257 A JP2001572257 A JP 2001572257A JP 2001572257 A JP2001572257 A JP 2001572257A JP 2004500251 A5 JP2004500251 A5 JP 2004500251A5
Authority
JP
Japan
Prior art keywords
carrier
pressure
plenums
concentric
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2001572257A
Other languages
English (en)
Other versions
JP2004500251A (ja
Filing date
Publication date
Priority claimed from US09/540,476 external-priority patent/US6390905B1/en
Application filed filed Critical
Publication of JP2004500251A publication Critical patent/JP2004500251A/ja
Publication of JP2004500251A5 publication Critical patent/JP2004500251A5/ja
Ceased legal-status Critical Current

Links

Claims (23)

  1. (a)ディスク形状の中央プレナムと、
    (b)前記中央プレナムを囲む複数の同心環形状プレナムと、
    (c)すべての隣り合うプレナム間に一つずつ配される複数の同心隔壁とを備え、前記同心隔壁の少なくとも一つは圧力調節可能である、ウェハ表面平坦化用キャリヤ。
  2. (a)圧力調節可能なディスク形状の中央プレナムと、
    (b)前記中央プレナムを囲む圧力調節可能な複数の同心環形状プレナムと、
    (c)すべての隣り合うプレナム間に一つずつ配される複数の圧力調節可能な同心隔壁とを備える、ウェハ表面平坦化用キャリヤ。
  3. キャリヤハウジングと、
    前記キャリヤハウジングに支持された第一及び第二の主表面を有するウェブ隔壁と、
    一つ一つが頭及び足を有する複数の環形状リブであって、各リブの頭が前記ウェブ隔壁の前記第一の主表面とほぼ直角に結合し、それにより複数の同心ウェブプレナムを画定してなる複数の環形状リブと、
    前記複数のウェブプレナムのそれぞれと個々に流体連通している複数の独立制御可能なウェブ流体連通経路と、
    前記ウェブ隔壁の第二の主表面に近接する複数の凹部であって、当該複数の凹部のそれぞれは前記複数の環形状リブの一つの反対に位置し、それによって複数の環形状キャリヤプレナムを形成する複数の凹部と、
    離隔配置された前記複数の環形状リブに加えられる前記複数のキャリヤプレナム内の圧力を制御するために、前記複数のキャリヤプレナムと流体連通する独立制御される複数のキャリヤ流体連通経路とを備える、ウェハ表面平坦化用キャリヤ。
  4. 前記ウェブ隔壁及び前記複数の環形状リブが、一体の弾性材料から製造されている請求項3記載のキャリヤ。
  5. (a)前記ウェブ隔壁又はリブを前記キャリヤハウジングに結合する複数の圧締リングを更に備える、請求項3記載のキャリヤ。
  6. 前記ウェブ隔壁はそれぞれのリブについて分離独立した環形状隔壁を持つ請求項3記載のキャリヤ。
  7. (a)前記リブの足近傍を真空にするためリブ内に通されたリブ真空ラインを更に備える、請求項3記載のキャリヤ。
  8. 前記キャリヤハウジングに設けられる保持リング溝と、
    前記キャリヤハウジングの周縁部に結合され、前記保持リング溝を覆って保持リングプレナムを形成する保持リング隔壁と、
    前記保持リング隔壁に結合された保持リングとを更に備える、請求項3記載のキャリヤ。
  9. (a)前記保持リングに作用する圧力を制御するため、前記保持リングプレナムと流体連通している保持リング流体連通経路を更に備える、請求項8記載のキャリヤ。
  10. 前記保持リングの系方向内側が弾性材料で被覆されている請求項8記載のキャリヤ。
  11. (a)複数の圧力調節可能な同心プレナムと、隣り合う前記プレナムのそれぞれの間に設けられた圧力調節可能な同心隔壁とを有するキャリヤに、被処理ウェハを装填する工程と、
    (b)前記ウェハが研磨表面に近接又は接触するまで前記キャリヤを移動する工程と、
    (c)前記キャリヤの前記複数の同心プレナムに対応する前記ウェハの複数の同心領域に対し、所望の除去速度を決定する工程と、
    (d)前記ウェハの対応する同心領域において所望の除去速度を実現するような圧力で、前記キャリヤの各同心プレナムを加圧することにより、前記研磨表面へ前記ウェハを押し当てる工程と、
    (e)同心プレナム間の前記複数の隔壁の各々に作用する圧力を調節する工程と、
    (f)前記ウェハと前記研磨表面との間に相対運動を生じさせる工程とを実行する、ウェハ平坦化方法。
  12. 複数の圧力調節可能な同心プレナムと、隣り合う前記プレナムのそれぞれの間に設けられた圧力調節可能な同心隔壁とを有するキャリヤに被処理ウェハを装填する前記工程(a)において、前記隣り合うプレナム間の前記隔壁が弾性リブからなる請求項11記載の方法。
  13. 前記ウェハの対応する同心領域において所望の除去速度を実現するような圧力で前記キャリヤの各同心プレナムを加圧することにより前記研磨表面へ前記ウェハを押し当てる前記工程(d)において、前記圧力は、ウェハと接触するように構成された第1主表面と前記同心隔壁に結合される第2主表面とを有するウェハ隔壁を介して前記ウェハに加えられる、請求項11記載の方法。
  14. 前記圧力を調整する工程は、前記複数の同心プレナムのそれぞれについての圧力操作可能なウェブ隔壁に加えられる圧力を調整する工程を含む、請求項11記載の方法。
  15. (g)前記キャリヤに取りつけられ、前記ウェハを取り囲むように位置決めされる保持リングを提供する工程と、
    (h)前記研磨表面に対し前記保持リングを介して独立に圧力を加える工程とをさらに実行する請求項11記載の方法。
  16. 前記独立に圧力を加える工程は、所定の方法で前記保持リングによって研磨表面に加えられる圧力を前記ウェハの周辺部分からの材料除去速度に影響を与えるように調整する工程を含む、請求項15記載の方法。
  17. 前記圧力を調整する工程が、前記同心プレナムの間の複数の隔壁のそれぞれに対する圧力を隣り合う同心プレナムにおける圧力と等しいか、またはそれらの圧力の間になるように調整する工程を含む請求項11記載の方法。
  18. キャリヤハウジングと、
    ウェハに接触するように構成された第一の主表面と、第二の主表面とを有するウェハ隔壁と、
    離隔配置された複数の環形状リブであって、各リブはその一端において前記ウェハ隔壁の前記第二の主表面と結合し、その他端において前記キャリヤハウジングと結合し、前記キャリヤハウジングと前記ウェハ隔壁とにより複数の同心ウェブプレナムを画定する複数の環形状リブと、
    前記同心ウェブプレナムのそれぞれの圧力を制御するために、前記複数のウェブプレナムのそれぞれと流体連通している複数の独立制御可能なウェブ流体連通経路と、
    前記キャリヤハウジング内に形成され、前記複数の離隔配置された環形状リブと整合するように配置された複数の同心環形状キャリヤプレナムと、
    離隔配置された複数の環形状リブに加えられる前記複数のキャリヤプレナム内の圧力を制御するために、前記複数のキャリヤプレナムと流体連通する独立制御される複数のキャリヤ流体連通経路とを備える、ウェハ表面平坦化用キャリヤ。
  19. 前記リブを前記キャリヤハウジングに結合する複数の圧締リングを更に備える、請求項18記載のキャリヤ。
  20. 前記キャリヤハウジングに設けられる保持リング溝と、前記キャリヤハウジングの周縁部に結合され、前記保持リング溝を覆って保持リングプレナムを形成する保持リング隔壁と、前記保持リング隔壁に結合される保持リングとを更に備える請求項18記載のキャリヤ。
  21. 前記環形状リブのそれぞれは各リブの前記他端に結合される柔軟な環形状リブ隔壁によって前記キャリヤハウジングに接続される請求項18記載のキャリヤ。
  22. CMP装置のキャリヤであって、
    キャリヤ本体と、
    加工物の表面に圧力を加えるように構成された第1表面と、加工物隔壁の第2表面から実質的に直角に伸びる複数の同心リブとを持つ隔壁であって、前記複数の同心リブのそれぞれは前記加工物隔壁に実質的に平行な延長部において途切れ、前記拡張部は前記キャリヤ本体を圧締するように構成されている隔壁とを備える、キャリヤ。
  23. 研磨パッドと、複数のリブによって支持された加工物隔壁と、前記加工物隔壁の第2表面の近傍に配置される圧力調整可能な複数のウェブプレナムと、前記加工物隔壁を囲み前記研磨パッドに押しつけられるように構成されているウェアリングとを備え、各リブは圧力調整可能なキャリヤプレナムを有し、前記加工物隔壁は前記加工物の第2表面に圧力を加える第1表面を有し、前記ウェアリングの研磨パッドに対する圧力は調整可能であるCMP装置を用いて加工物の第1表面を平坦化する方法であって、
    加工物の第2表面を前記加工物隔壁の第1表面に近接させて配置する工程と、
    前記加工物の前記第1表面を前記研磨パッドに接触させて配置する工程と、
    前記圧力調整可能なウェブプレナムのそれぞれに所定の圧力を与える工程と、
    前記キャリヤプレナムのそれぞれに所定の圧力を与える工程と、
    前記所定のウェブプレナムおよびキャリヤプレナムの圧力とは独立に、前記ウェアリングが前記研磨パッドに与える圧力を調整する工程と、
    前記加工物隔壁と前記研磨パッドとの間に相対運動を起す工程とを実行する方法。
JP2001572257A 2000-03-31 2001-03-20 調節可能な圧力領域及び隔壁を有する加工物キャリヤ Ceased JP2004500251A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/540,476 US6390905B1 (en) 2000-03-31 2000-03-31 Workpiece carrier with adjustable pressure zones and barriers
PCT/US2001/009099 WO2001074534A2 (en) 2000-03-31 2001-03-20 A workpiece carrier with adjustable pressure zones and barriers

Publications (2)

Publication Number Publication Date
JP2004500251A JP2004500251A (ja) 2004-01-08
JP2004500251A5 true JP2004500251A5 (ja) 2005-01-27

Family

ID=24155608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001572257A Ceased JP2004500251A (ja) 2000-03-31 2001-03-20 調節可能な圧力領域及び隔壁を有する加工物キャリヤ

Country Status (8)

Country Link
US (5) US6390905B1 (ja)
JP (1) JP2004500251A (ja)
KR (1) KR100729982B1 (ja)
AU (1) AU2001249331A1 (ja)
DE (1) DE10196003T1 (ja)
GB (1) GB2376908A (ja)
TW (1) TWI223318B (ja)
WO (1) WO2001074534A2 (ja)

Families Citing this family (286)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5964653A (en) * 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US6722963B1 (en) * 1999-08-03 2004-04-20 Micron Technology, Inc. Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
US7140956B1 (en) 2000-03-31 2006-11-28 Speedfam-Ipec Corporation Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US6623343B2 (en) * 2000-05-12 2003-09-23 Multi Planar Technologies, Inc. System and method for CMP head having multi-pressure annular zone subcarrier material removal control
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane
US7198561B2 (en) * 2000-07-25 2007-04-03 Applied Materials, Inc. Flexible membrane for multi-chamber carrier head
US6447368B1 (en) * 2000-11-20 2002-09-10 Speedfam-Ipec Corporation Carriers with concentric balloons supporting a diaphragm
US6790763B2 (en) * 2000-12-04 2004-09-14 Ebara Corporation Substrate processing method
US6855037B2 (en) * 2001-03-12 2005-02-15 Asm-Nutool, Inc. Method of sealing wafer backside for full-face electrochemical plating
US6939206B2 (en) 2001-03-12 2005-09-06 Asm Nutool, Inc. Method and apparatus of sealing wafer backside for full-face electrochemical plating
US6863771B2 (en) 2001-07-25 2005-03-08 Micron Technology, Inc. Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
JP4025960B2 (ja) * 2001-08-08 2007-12-26 信越化学工業株式会社 角形ホトマスク基板の研磨方法、角形ホトマスク基板、ホトマスクブランクス及びホトマスク
US6755726B2 (en) * 2002-03-25 2004-06-29 United Microelectric Corp. Polishing head with a floating knife-edge
US6669540B2 (en) * 2002-03-28 2003-12-30 Peter Wolterss CMP-Systeme GmbH & Co. KG Chuck means for flat workpieces, in particular semi-conductor wafers
US6627466B1 (en) * 2002-05-03 2003-09-30 Lsi Logic Corporation Method and apparatus for detecting backside contamination during fabrication of a semiconductor wafer
US6998013B2 (en) * 2002-10-10 2006-02-14 Taiwan Semiconductor Manufacturing Co., Ltd CMP apparatus polishing head with concentric pressure zones
KR100481872B1 (ko) * 2003-01-14 2005-04-11 삼성전자주식회사 폴리싱 헤드 및 화학적 기계적 연마 장치
US6764387B1 (en) * 2003-03-07 2004-07-20 Applied Materials Inc. Control of a multi-chamber carrier head
US7008309B2 (en) * 2003-05-30 2006-03-07 Strasbaugh Back pressure control system for CMP and wafer polishing
JP4086722B2 (ja) * 2003-06-24 2008-05-14 株式会社荏原製作所 基板保持装置及び研磨装置
KR100600231B1 (ko) * 2003-07-12 2006-07-13 동부일렉트로닉스 주식회사 씨엠피 폴리싱 헤드 및 그 동작방법
JP2005123485A (ja) * 2003-10-17 2005-05-12 Ebara Corp 研磨装置
KR100586018B1 (ko) * 2004-02-09 2006-06-01 삼성전자주식회사 연마 헤드용 플렉서블 멤브레인 및 이를 포함하는 연마 장치
KR100550342B1 (ko) 2004-02-24 2006-02-08 삼성전자주식회사 가스 산포 방법, 및 샤워 헤드, 및 샤워 헤드를 구비하는반도체 기판 가공 장치
US7063604B2 (en) * 2004-03-05 2006-06-20 Strasbaugh Independent edge control for CMP carriers
US7255771B2 (en) 2004-03-26 2007-08-14 Applied Materials, Inc. Multiple zone carrier head with flexible membrane
JP4822744B2 (ja) * 2004-06-04 2011-11-24 三星電子株式会社 化学機械的研磨装置、キャリアヘッド及び区画リング
KR100621629B1 (ko) * 2004-06-04 2006-09-19 삼성전자주식회사 화학적 기계적 연마 장치에 사용되는 연마 헤드 및 연마방법
US20060000806A1 (en) * 2004-06-30 2006-01-05 Golzarian Reza M Substrate carrier for surface planarization
US7033257B2 (en) * 2004-07-21 2006-04-25 Agere Systems, Inc. Carrier head for chemical mechanical polishing
KR101214506B1 (ko) * 2004-11-01 2012-12-27 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치
KR100647041B1 (ko) * 2005-06-17 2006-11-23 두산디앤디 주식회사 영역분할 연마 프로파일의 경계부 이상연마 제어기능을갖는 화학기계적 연마장치용 캐리어 헤드
US20070026772A1 (en) * 2005-07-28 2007-02-01 Dolechek Kert L Apparatus for use in processing a semiconductor workpiece
US7207871B1 (en) * 2005-10-06 2007-04-24 Applied Materials, Inc. Carrier head with multiple chambers
US8454413B2 (en) 2005-12-29 2013-06-04 Applied Materials, Inc. Multi-chamber carrier head with a textured membrane
US20070167110A1 (en) * 2006-01-16 2007-07-19 Yu-Hsiang Tseng Multi-zone carrier head for chemical mechanical polishing and cmp method thereof
US7115017B1 (en) 2006-03-31 2006-10-03 Novellus Systems, Inc. Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization
CN101484277A (zh) * 2006-05-02 2009-07-15 Nxp股份有限公司 晶片去夹具
US7335092B1 (en) 2006-10-27 2008-02-26 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US7402098B2 (en) * 2006-10-27 2008-07-22 Novellus Systems, Inc. Carrier head for workpiece planarization/polishing
US8702866B2 (en) * 2006-12-18 2014-04-22 Lam Research Corporation Showerhead electrode assembly with gas flow modification for extended electrode life
JP2009131920A (ja) * 2007-11-29 2009-06-18 Ebara Corp 研磨装置及び方法
JP5254669B2 (ja) * 2008-06-05 2013-08-07 Hoya株式会社 眼内レンズ挿入器具及びカートリッジ
US8371904B2 (en) * 2008-08-08 2013-02-12 Globalfoundries Singapore Pte. Ltd. Polishing with enhanced uniformity
US8739626B2 (en) * 2009-08-04 2014-06-03 Fairchild Semiconductor Corporation Micromachined inertial sensor devices
JP5392483B2 (ja) * 2009-08-31 2014-01-22 不二越機械工業株式会社 研磨装置
JP4831842B2 (ja) * 2009-10-28 2011-12-07 三菱重工業株式会社 接合装置制御装置および多層接合方法
JP5648954B2 (ja) * 2010-08-31 2015-01-07 不二越機械工業株式会社 研磨装置
JP5236705B2 (ja) * 2010-09-08 2013-07-17 株式会社荏原製作所 研磨装置
EP2616772B1 (en) 2010-09-18 2016-06-22 Fairchild Semiconductor Corporation Micromachined monolithic 3-axis gyroscope with single drive
WO2012037501A2 (en) 2010-09-18 2012-03-22 Cenk Acar Flexure bearing to reduce quadrature for resonating micromachined devices
US9278846B2 (en) 2010-09-18 2016-03-08 Fairchild Semiconductor Corporation Micromachined monolithic 6-axis inertial sensor
KR20130057485A (ko) 2010-09-18 2013-05-31 페어차일드 세미컨덕터 코포레이션 미세 전자 기계 시스템에 미치는 응력을 감소시키기 위한 패키징
WO2012037492A2 (en) 2010-09-18 2012-03-22 Janusz Bryzek Multi-die mems package
US9278845B2 (en) 2010-09-18 2016-03-08 Fairchild Semiconductor Corporation MEMS multi-axis gyroscope Z-axis electrode structure
WO2012040245A2 (en) 2010-09-20 2012-03-29 Fairchild Semiconductor Corporation Through silicon via with reduced shunt capacitance
WO2012040211A2 (en) 2010-09-20 2012-03-29 Fairchild Semiconductor Corporation Microelectromechanical pressure sensor including reference capacitor
US20120122373A1 (en) * 2010-11-15 2012-05-17 Stmicroelectronics, Inc. Precise real time and position low pressure control of chemical mechanical polish (cmp) head
JP5671735B2 (ja) * 2011-01-18 2015-02-18 不二越機械工業株式会社 両面研磨装置
US20130023129A1 (en) 2011-07-20 2013-01-24 Asm America, Inc. Pressure transmitter for a semiconductor processing environment
US9062972B2 (en) 2012-01-31 2015-06-23 Fairchild Semiconductor Corporation MEMS multi-axis accelerometer electrode structure
US8978475B2 (en) 2012-02-01 2015-03-17 Fairchild Semiconductor Corporation MEMS proof mass with split z-axis portions
US8754694B2 (en) 2012-04-03 2014-06-17 Fairchild Semiconductor Corporation Accurate ninety-degree phase shifter
US8742964B2 (en) 2012-04-04 2014-06-03 Fairchild Semiconductor Corporation Noise reduction method with chopping for a merged MEMS accelerometer sensor
US9488693B2 (en) 2012-04-04 2016-11-08 Fairchild Semiconductor Corporation Self test of MEMS accelerometer with ASICS integrated capacitors
EP2647952B1 (en) 2012-04-05 2017-11-15 Fairchild Semiconductor Corporation Mems device automatic-gain control loop for mechanical amplitude drive
US9069006B2 (en) 2012-04-05 2015-06-30 Fairchild Semiconductor Corporation Self test of MEMS gyroscope with ASICs integrated capacitors
EP2648334B1 (en) 2012-04-05 2020-06-10 Fairchild Semiconductor Corporation Mems device front-end charge amplifier
EP2647955B8 (en) 2012-04-05 2018-12-19 Fairchild Semiconductor Corporation MEMS device quadrature phase shift cancellation
KR101999745B1 (ko) 2012-04-12 2019-10-01 페어차일드 세미컨덕터 코포레이션 미세 전자 기계 시스템 구동기
US9625272B2 (en) 2012-04-12 2017-04-18 Fairchild Semiconductor Corporation MEMS quadrature cancellation and signal demodulation
JP6158637B2 (ja) * 2012-08-28 2017-07-05 株式会社荏原製作所 弾性膜及び基板保持装置
DE102013014881B4 (de) 2012-09-12 2023-05-04 Fairchild Semiconductor Corporation Verbesserte Silizium-Durchkontaktierung mit einer Füllung aus mehreren Materialien
US9199354B2 (en) 2012-10-29 2015-12-01 Wayne O. Duescher Flexible diaphragm post-type floating and rigid abrading workholder
US9011207B2 (en) 2012-10-29 2015-04-21 Wayne O. Duescher Flexible diaphragm combination floating and rigid abrading workholder
US9039488B2 (en) 2012-10-29 2015-05-26 Wayne O. Duescher Pin driven flexible chamber abrading workholder
US8998678B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Spider arm driven flexible chamber abrading workholder
US9604339B2 (en) 2012-10-29 2017-03-28 Wayne O. Duescher Vacuum-grooved membrane wafer polishing workholder
US8998677B2 (en) 2012-10-29 2015-04-07 Wayne O. Duescher Bellows driven floatation-type abrading workholder
US9233452B2 (en) 2012-10-29 2016-01-12 Wayne O. Duescher Vacuum-grooved membrane abrasive polishing wafer workholder
US8845394B2 (en) 2012-10-29 2014-09-30 Wayne O. Duescher Bellows driven air floatation abrading workholder
US20140174655A1 (en) * 2012-12-21 2014-06-26 HGST Netherlands B.V. Polishing tool with diaphram for uniform polishing of a wafer
US20160376700A1 (en) 2013-02-01 2016-12-29 Asm Ip Holding B.V. System for treatment of deposition reactor
US9193025B2 (en) * 2013-03-13 2015-11-24 Sunedison Semiconductor Limited (Uen201334164H) Single side polishing using shape matching
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
USD770990S1 (en) * 2013-05-15 2016-11-08 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
USD769200S1 (en) * 2013-05-15 2016-10-18 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
JP2014223684A (ja) * 2013-05-15 2014-12-04 株式会社東芝 研磨装置および研磨方法
USD808349S1 (en) 2013-05-15 2018-01-23 Ebara Corporation Elastic membrane for semiconductor wafer polishing apparatus
KR102323430B1 (ko) 2014-03-31 2021-11-09 가부시키가이샤 에바라 세이사꾸쇼 연마 장치 및 연마 방법
US9610672B2 (en) 2014-06-27 2017-04-04 Applied Materials, Inc. Configurable pressure design for multizone chemical mechanical planarization polishing head
KR102213468B1 (ko) * 2014-08-26 2021-02-08 가부시키가이샤 에바라 세이사꾸쇼 버프 처리 장치 및 기판 처리 장치
US10941490B2 (en) 2014-10-07 2021-03-09 Asm Ip Holding B.V. Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
US10276355B2 (en) 2015-03-12 2019-04-30 Asm Ip Holding B.V. Multi-zone reactor, system including the reactor, and method of using the same
USD801942S1 (en) * 2015-04-16 2017-11-07 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD797067S1 (en) * 2015-04-21 2017-09-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD798248S1 (en) * 2015-06-18 2017-09-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10160091B2 (en) * 2015-11-16 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. CMP polishing head design for improving removal rate uniformity
US11139308B2 (en) 2015-12-29 2021-10-05 Asm Ip Holding B.V. Atomic layer deposition of III-V compounds to form V-NAND devices
US10529554B2 (en) 2016-02-19 2020-01-07 Asm Ip Holding B.V. Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
US9962805B2 (en) * 2016-04-22 2018-05-08 Taiwan Semiconductor Manufacturing Company, Ltd. Chemical mechanical polishing apparatus and method
US11453943B2 (en) 2016-05-25 2022-09-27 Asm Ip Holding B.V. Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
US10702969B2 (en) 2016-06-23 2020-07-07 Western Digital Technologies, Inc. Actuator tilt interposer for within-row lapping mount tool for magnetic recording read-write heads
US10850364B2 (en) 2016-06-23 2020-12-01 Western Digital Technologies, Inc. Within-row stripe height and wedge angle control for magnetic recording read-write heads
US9881639B2 (en) * 2016-06-23 2018-01-30 Western Digital Technologies, Inc. Within-row wedge angle control for magnetic recording read-write heads
US9859151B1 (en) 2016-07-08 2018-01-02 Asm Ip Holding B.V. Selective film deposition method to form air gaps
US10612137B2 (en) 2016-07-08 2020-04-07 Asm Ip Holdings B.V. Organic reactants for atomic layer deposition
US9887082B1 (en) 2016-07-28 2018-02-06 Asm Ip Holding B.V. Method and apparatus for filling a gap
US9812320B1 (en) 2016-07-28 2017-11-07 Asm Ip Holding B.V. Method and apparatus for filling a gap
USD836572S1 (en) * 2016-09-30 2018-12-25 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US11532757B2 (en) 2016-10-27 2022-12-20 Asm Ip Holding B.V. Deposition of charge trapping layers
US10714350B2 (en) 2016-11-01 2020-07-14 ASM IP Holdings, B.V. Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
KR102546317B1 (ko) 2016-11-15 2023-06-21 에이에스엠 아이피 홀딩 비.브이. 기체 공급 유닛 및 이를 포함하는 기판 처리 장치
USD839224S1 (en) * 2016-12-12 2019-01-29 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US11581186B2 (en) 2016-12-15 2023-02-14 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus
US11447861B2 (en) 2016-12-15 2022-09-20 Asm Ip Holding B.V. Sequential infiltration synthesis apparatus and a method of forming a patterned structure
US11390950B2 (en) 2017-01-10 2022-07-19 Asm Ip Holding B.V. Reactor system and method to reduce residue buildup during a film deposition process
US10468261B2 (en) 2017-02-15 2019-11-05 Asm Ip Holding B.V. Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
US10770286B2 (en) 2017-05-08 2020-09-08 Asm Ip Holdings B.V. Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
US11306395B2 (en) 2017-06-28 2022-04-19 Asm Ip Holding B.V. Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
USD859332S1 (en) * 2017-06-29 2019-09-10 Ebara Corporation Elastic membrane for semiconductor wafer polishing
US10926378B2 (en) 2017-07-08 2021-02-23 Wayne O. Duescher Abrasive coated disk islands using magnetic font sheet
KR20190009245A (ko) 2017-07-18 2019-01-28 에이에스엠 아이피 홀딩 비.브이. 반도체 소자 구조물 형성 방법 및 관련된 반도체 소자 구조물
US10590535B2 (en) 2017-07-26 2020-03-17 Asm Ip Holdings B.V. Chemical treatment, deposition and/or infiltration apparatus and method for using the same
US10770336B2 (en) 2017-08-08 2020-09-08 Asm Ip Holding B.V. Substrate lift mechanism and reactor including same
US10692741B2 (en) 2017-08-08 2020-06-23 Asm Ip Holdings B.V. Radiation shield
US11769682B2 (en) 2017-08-09 2023-09-26 Asm Ip Holding B.V. Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
US11830730B2 (en) 2017-08-29 2023-11-28 Asm Ip Holding B.V. Layer forming method and apparatus
US11295980B2 (en) 2017-08-30 2022-04-05 Asm Ip Holding B.V. Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
US10658205B2 (en) 2017-09-28 2020-05-19 Asm Ip Holdings B.V. Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
USD851613S1 (en) 2017-10-05 2019-06-18 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
KR102597978B1 (ko) 2017-11-27 2023-11-06 에이에스엠 아이피 홀딩 비.브이. 배치 퍼니스와 함께 사용하기 위한 웨이퍼 카세트를 보관하기 위한 보관 장치
US11639811B2 (en) 2017-11-27 2023-05-02 Asm Ip Holding B.V. Apparatus including a clean mini environment
USD868124S1 (en) 2017-12-11 2019-11-26 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD918161S1 (en) * 2017-12-19 2021-05-04 Ebara Corporation Elastic membrane
US10872771B2 (en) 2018-01-16 2020-12-22 Asm Ip Holding B. V. Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
KR20200108016A (ko) 2018-01-19 2020-09-16 에이에스엠 아이피 홀딩 비.브이. 플라즈마 보조 증착에 의해 갭 충진 층을 증착하는 방법
TW202325889A (zh) 2018-01-19 2023-07-01 荷蘭商Asm 智慧財產控股公司 沈積方法
US11081345B2 (en) 2018-02-06 2021-08-03 Asm Ip Holding B.V. Method of post-deposition treatment for silicon oxide film
US10896820B2 (en) 2018-02-14 2021-01-19 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
US11685991B2 (en) 2018-02-14 2023-06-27 Asm Ip Holding B.V. Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
KR102636427B1 (ko) 2018-02-20 2024-02-13 에이에스엠 아이피 홀딩 비.브이. 기판 처리 방법 및 장치
US10975470B2 (en) 2018-02-23 2021-04-13 Asm Ip Holding B.V. Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
US11473195B2 (en) 2018-03-01 2022-10-18 Asm Ip Holding B.V. Semiconductor processing apparatus and a method for processing a substrate
USD877101S1 (en) * 2018-03-09 2020-03-03 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
US10593603B2 (en) 2018-03-16 2020-03-17 Sandisk Technologies Llc Chemical mechanical polishing apparatus containing hydraulic multi-chamber bladder and method of using thereof
KR102646467B1 (ko) 2018-03-27 2024-03-11 에이에스엠 아이피 홀딩 비.브이. 기판 상에 전극을 형성하는 방법 및 전극을 포함하는 반도체 소자 구조
KR102596988B1 (ko) 2018-05-28 2023-10-31 에이에스엠 아이피 홀딩 비.브이. 기판 처리 방법 및 그에 의해 제조된 장치
US11718913B2 (en) 2018-06-04 2023-08-08 Asm Ip Holding B.V. Gas distribution system and reactor system including same
KR102568797B1 (ko) 2018-06-21 2023-08-21 에이에스엠 아이피 홀딩 비.브이. 기판 처리 시스템
US10797133B2 (en) 2018-06-21 2020-10-06 Asm Ip Holding B.V. Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
WO2020003000A1 (en) 2018-06-27 2020-01-02 Asm Ip Holding B.V. Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
WO2020002995A1 (en) 2018-06-27 2020-01-02 Asm Ip Holding B.V. Cyclic deposition methods for forming metal-containing material and films and structures including the metal-containing material
US10388513B1 (en) 2018-07-03 2019-08-20 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
US10755922B2 (en) 2018-07-03 2020-08-25 Asm Ip Holding B.V. Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
JP7074606B2 (ja) * 2018-08-02 2022-05-24 株式会社荏原製作所 基板を保持するためのトップリングおよび基板処理装置
CN109277948B (zh) * 2018-08-02 2020-05-12 数码模冲压技术(武汉)有限公司 一种机器人修磨压力控制方法、系统、存储介质及设备
US11430674B2 (en) 2018-08-22 2022-08-30 Asm Ip Holding B.V. Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
KR20200030162A (ko) 2018-09-11 2020-03-20 에이에스엠 아이피 홀딩 비.브이. 박막 증착 방법
US11024523B2 (en) 2018-09-11 2021-06-01 Asm Ip Holding B.V. Substrate processing apparatus and method
CN110970344A (zh) 2018-10-01 2020-04-07 Asm Ip控股有限公司 衬底保持设备、包含所述设备的系统及其使用方法
KR102592699B1 (ko) 2018-10-08 2023-10-23 에이에스엠 아이피 홀딩 비.브이. 기판 지지 유닛 및 이를 포함하는 박막 증착 장치와 기판 처리 장치
KR102546322B1 (ko) 2018-10-19 2023-06-21 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치 및 기판 처리 방법
US11087997B2 (en) 2018-10-31 2021-08-10 Asm Ip Holding B.V. Substrate processing apparatus for processing substrates
KR20200051105A (ko) 2018-11-02 2020-05-13 에이에스엠 아이피 홀딩 비.브이. 기판 지지 유닛 및 이를 포함하는 기판 처리 장치
US11572620B2 (en) 2018-11-06 2023-02-07 Asm Ip Holding B.V. Methods for selectively depositing an amorphous silicon film on a substrate
US10818758B2 (en) 2018-11-16 2020-10-27 Asm Ip Holding B.V. Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
KR102636428B1 (ko) 2018-12-04 2024-02-13 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치를 세정하는 방법
US11158513B2 (en) 2018-12-13 2021-10-26 Asm Ip Holding B.V. Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
JP2020096183A (ja) 2018-12-14 2020-06-18 エーエスエム・アイピー・ホールディング・ベー・フェー 窒化ガリウムの選択的堆積を用いてデバイス構造体を形成する方法及びそのためのシステム
TWI819180B (zh) 2019-01-17 2023-10-21 荷蘭商Asm 智慧財產控股公司 藉由循環沈積製程於基板上形成含過渡金屬膜之方法
KR20200102357A (ko) 2019-02-20 2020-08-31 에이에스엠 아이피 홀딩 비.브이. 3-d nand 응용의 플러그 충진체 증착용 장치 및 방법
TW202044325A (zh) 2019-02-20 2020-12-01 荷蘭商Asm Ip私人控股有限公司 填充一基板之一表面內所形成的一凹槽的方法、根據其所形成之半導體結構、及半導體處理設備
JP2020136677A (ja) 2019-02-20 2020-08-31 エーエスエム・アイピー・ホールディング・ベー・フェー 基材表面内に形成された凹部を充填するための周期的堆積方法および装置
TW202100794A (zh) 2019-02-22 2021-01-01 荷蘭商Asm Ip私人控股有限公司 基材處理設備及處理基材之方法
KR20200108242A (ko) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. 실리콘 질화물 층을 선택적으로 증착하는 방법, 및 선택적으로 증착된 실리콘 질화물 층을 포함하는 구조체
KR20200108248A (ko) 2019-03-08 2020-09-17 에이에스엠 아이피 홀딩 비.브이. SiOCN 층을 포함한 구조체 및 이의 형성 방법
KR20200116033A (ko) 2019-03-28 2020-10-08 에이에스엠 아이피 홀딩 비.브이. 도어 개방기 및 이를 구비한 기판 처리 장치
KR20200116855A (ko) 2019-04-01 2020-10-13 에이에스엠 아이피 홀딩 비.브이. 반도체 소자를 제조하는 방법
KR20200123380A (ko) 2019-04-19 2020-10-29 에이에스엠 아이피 홀딩 비.브이. 층 형성 방법 및 장치
KR20200125453A (ko) 2019-04-24 2020-11-04 에이에스엠 아이피 홀딩 비.브이. 기상 반응기 시스템 및 이를 사용하는 방법
KR20200130121A (ko) 2019-05-07 2020-11-18 에이에스엠 아이피 홀딩 비.브이. 딥 튜브가 있는 화학물질 공급원 용기
KR20200130652A (ko) 2019-05-10 2020-11-19 에이에스엠 아이피 홀딩 비.브이. 표면 상에 재료를 증착하는 방법 및 본 방법에 따라 형성된 구조
JP2020188255A (ja) 2019-05-16 2020-11-19 エーエスエム アイピー ホールディング ビー.ブイ. ウェハボートハンドリング装置、縦型バッチ炉および方法
USD975665S1 (en) 2019-05-17 2023-01-17 Asm Ip Holding B.V. Susceptor shaft
USD947913S1 (en) 2019-05-17 2022-04-05 Asm Ip Holding B.V. Susceptor shaft
KR20200141002A (ko) 2019-06-06 2020-12-17 에이에스엠 아이피 홀딩 비.브이. 배기 가스 분석을 포함한 기상 반응기 시스템을 사용하는 방법
KR20200143254A (ko) 2019-06-11 2020-12-23 에이에스엠 아이피 홀딩 비.브이. 개질 가스를 사용하여 전자 구조를 형성하는 방법, 상기 방법을 수행하기 위한 시스템, 및 상기 방법을 사용하여 형성되는 구조
KR20210005515A (ko) 2019-07-03 2021-01-14 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치용 온도 제어 조립체 및 이를 사용하는 방법
JP2021015791A (ja) 2019-07-09 2021-02-12 エーエスエム アイピー ホールディング ビー.ブイ. 同軸導波管を用いたプラズマ装置、基板処理方法
CN112216646A (zh) 2019-07-10 2021-01-12 Asm Ip私人控股有限公司 基板支撑组件及包括其的基板处理装置
JP1651618S (ja) * 2019-07-11 2020-01-27
JP1651619S (ja) * 2019-07-11 2020-01-27
KR20210010307A (ko) 2019-07-16 2021-01-27 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
KR20210010820A (ko) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. 실리콘 게르마늄 구조를 형성하는 방법
KR20210010816A (ko) 2019-07-17 2021-01-28 에이에스엠 아이피 홀딩 비.브이. 라디칼 보조 점화 플라즈마 시스템 및 방법
JP1651623S (ja) * 2019-07-18 2020-01-27
US11643724B2 (en) 2019-07-18 2023-05-09 Asm Ip Holding B.V. Method of forming structures using a neutral beam
CN112309843A (zh) 2019-07-29 2021-02-02 Asm Ip私人控股有限公司 实现高掺杂剂掺入的选择性沉积方法
CN112309900A (zh) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 基板处理设备
CN112309899A (zh) 2019-07-30 2021-02-02 Asm Ip私人控股有限公司 基板处理设备
US11587814B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11587815B2 (en) 2019-07-31 2023-02-21 Asm Ip Holding B.V. Vertical batch furnace assembly
US11227782B2 (en) 2019-07-31 2022-01-18 Asm Ip Holding B.V. Vertical batch furnace assembly
KR20210018759A (ko) 2019-08-05 2021-02-18 에이에스엠 아이피 홀딩 비.브이. 화학물질 공급원 용기를 위한 액체 레벨 센서
US11691241B1 (en) * 2019-08-05 2023-07-04 Keltech Engineering, Inc. Abrasive lapping head with floating and rigid workpiece carrier
USD965524S1 (en) 2019-08-19 2022-10-04 Asm Ip Holding B.V. Susceptor support
USD965044S1 (en) 2019-08-19 2022-09-27 Asm Ip Holding B.V. Susceptor shaft
JP2021031769A (ja) 2019-08-21 2021-03-01 エーエスエム アイピー ホールディング ビー.ブイ. 成膜原料混合ガス生成装置及び成膜装置
KR20210024423A (ko) 2019-08-22 2021-03-05 에이에스엠 아이피 홀딩 비.브이. 홀을 구비한 구조체를 형성하기 위한 방법
USD979506S1 (en) 2019-08-22 2023-02-28 Asm Ip Holding B.V. Insulator
US11945073B2 (en) 2019-08-22 2024-04-02 Applied Materials, Inc. Dual membrane carrier head for chemical mechanical polishing
US11325223B2 (en) * 2019-08-23 2022-05-10 Applied Materials, Inc. Carrier head with segmented substrate chuck
US11286558B2 (en) 2019-08-23 2022-03-29 Asm Ip Holding B.V. Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
USD908645S1 (en) 2019-08-26 2021-01-26 Applied Materials, Inc. Sputtering target for a physical vapor deposition chamber
KR20210029090A (ko) 2019-09-04 2021-03-15 에이에스엠 아이피 홀딩 비.브이. 희생 캡핑 층을 이용한 선택적 증착 방법
KR20210029663A (ko) 2019-09-05 2021-03-16 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
US11562901B2 (en) 2019-09-25 2023-01-24 Asm Ip Holding B.V. Substrate processing method
CN112593212B (zh) 2019-10-02 2023-12-22 Asm Ip私人控股有限公司 通过循环等离子体增强沉积工艺形成拓扑选择性氧化硅膜的方法
TW202129060A (zh) 2019-10-08 2021-08-01 荷蘭商Asm Ip控股公司 基板處理裝置、及基板處理方法
KR20210043460A (ko) 2019-10-10 2021-04-21 에이에스엠 아이피 홀딩 비.브이. 포토레지스트 하부층을 형성하기 위한 방법 및 이를 포함한 구조체
KR20210045930A (ko) 2019-10-16 2021-04-27 에이에스엠 아이피 홀딩 비.브이. 실리콘 산화물의 토폴로지-선택적 막의 형성 방법
US11637014B2 (en) 2019-10-17 2023-04-25 Asm Ip Holding B.V. Methods for selective deposition of doped semiconductor material
KR20210047808A (ko) 2019-10-21 2021-04-30 에이에스엠 아이피 홀딩 비.브이. 막을 선택적으로 에칭하기 위한 장치 및 방법
US11646205B2 (en) 2019-10-29 2023-05-09 Asm Ip Holding B.V. Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
KR20210054983A (ko) 2019-11-05 2021-05-14 에이에스엠 아이피 홀딩 비.브이. 도핑된 반도체 층을 갖는 구조체 및 이를 형성하기 위한 방법 및 시스템
US11501968B2 (en) 2019-11-15 2022-11-15 Asm Ip Holding B.V. Method for providing a semiconductor device with silicon filled gaps
KR20210062561A (ko) 2019-11-20 2021-05-31 에이에스엠 아이피 홀딩 비.브이. 기판의 표면 상에 탄소 함유 물질을 증착하는 방법, 상기 방법을 사용하여 형성된 구조물, 및 상기 구조물을 형성하기 위한 시스템
KR20210065848A (ko) 2019-11-26 2021-06-04 에이에스엠 아이피 홀딩 비.브이. 제1 유전체 표면과 제2 금속성 표면을 포함한 기판 상에 타겟 막을 선택적으로 형성하기 위한 방법
CN112951697A (zh) 2019-11-26 2021-06-11 Asm Ip私人控股有限公司 基板处理设备
CN112885692A (zh) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 基板处理设备
CN112885693A (zh) 2019-11-29 2021-06-01 Asm Ip私人控股有限公司 基板处理设备
JP2021090042A (ja) 2019-12-02 2021-06-10 エーエスエム アイピー ホールディング ビー.ブイ. 基板処理装置、基板処理方法
KR20210070898A (ko) 2019-12-04 2021-06-15 에이에스엠 아이피 홀딩 비.브이. 기판 처리 장치
JP2021097227A (ja) 2019-12-17 2021-06-24 エーエスエム・アイピー・ホールディング・ベー・フェー 窒化バナジウム層および窒化バナジウム層を含む構造体を形成する方法
US11527403B2 (en) 2019-12-19 2022-12-13 Asm Ip Holding B.V. Methods for filling a gap feature on a substrate surface and related semiconductor structures
KR20210089077A (ko) 2020-01-06 2021-07-15 에이에스엠 아이피 홀딩 비.브이. 가스 공급 어셈블리, 이의 구성 요소, 및 이를 포함하는 반응기 시스템
KR20210095050A (ko) 2020-01-20 2021-07-30 에이에스엠 아이피 홀딩 비.브이. 박막 형성 방법 및 박막 표면 개질 방법
TW202130846A (zh) 2020-02-03 2021-08-16 荷蘭商Asm Ip私人控股有限公司 形成包括釩或銦層的結構之方法
KR20210100010A (ko) 2020-02-04 2021-08-13 에이에스엠 아이피 홀딩 비.브이. 대형 물품의 투과율 측정을 위한 방법 및 장치
US11776846B2 (en) 2020-02-07 2023-10-03 Asm Ip Holding B.V. Methods for depositing gap filling fluids and related systems and devices
US11781243B2 (en) 2020-02-17 2023-10-10 Asm Ip Holding B.V. Method for depositing low temperature phosphorous-doped silicon
KR20210116240A (ko) 2020-03-11 2021-09-27 에이에스엠 아이피 홀딩 비.브이. 조절성 접합부를 갖는 기판 핸들링 장치
US11876356B2 (en) 2020-03-11 2024-01-16 Asm Ip Holding B.V. Lockout tagout assembly and system and method of using same
KR20210117157A (ko) 2020-03-12 2021-09-28 에이에스엠 아이피 홀딩 비.브이. 타겟 토폴로지 프로파일을 갖는 층 구조를 제조하기 위한 방법
USD937329S1 (en) 2020-03-23 2021-11-30 Applied Materials, Inc. Sputter target for a physical vapor deposition chamber
KR20210124042A (ko) 2020-04-02 2021-10-14 에이에스엠 아이피 홀딩 비.브이. 박막 형성 방법
TW202146689A (zh) 2020-04-03 2021-12-16 荷蘭商Asm Ip控股公司 阻障層形成方法及半導體裝置的製造方法
TW202145344A (zh) 2020-04-08 2021-12-01 荷蘭商Asm Ip私人控股有限公司 用於選擇性蝕刻氧化矽膜之設備及方法
US11821078B2 (en) 2020-04-15 2023-11-21 Asm Ip Holding B.V. Method for forming precoat film and method for forming silicon-containing film
KR20210132600A (ko) 2020-04-24 2021-11-04 에이에스엠 아이피 홀딩 비.브이. 바나듐, 질소 및 추가 원소를 포함한 층을 증착하기 위한 방법 및 시스템
CN113555279A (zh) 2020-04-24 2021-10-26 Asm Ip私人控股有限公司 形成含氮化钒的层的方法及包含其的结构
TW202146831A (zh) 2020-04-24 2021-12-16 荷蘭商Asm Ip私人控股有限公司 垂直批式熔爐總成、及用於冷卻垂直批式熔爐之方法
KR20210134226A (ko) 2020-04-29 2021-11-09 에이에스엠 아이피 홀딩 비.브이. 고체 소스 전구체 용기
KR20210134869A (ko) 2020-05-01 2021-11-11 에이에스엠 아이피 홀딩 비.브이. Foup 핸들러를 이용한 foup의 빠른 교환
KR20210141379A (ko) 2020-05-13 2021-11-23 에이에스엠 아이피 홀딩 비.브이. 반응기 시스템용 레이저 정렬 고정구
TW202147383A (zh) 2020-05-19 2021-12-16 荷蘭商Asm Ip私人控股有限公司 基材處理設備
USD947802S1 (en) 2020-05-20 2022-04-05 Applied Materials, Inc. Replaceable substrate carrier interfacing film
KR20210145078A (ko) 2020-05-21 2021-12-01 에이에스엠 아이피 홀딩 비.브이. 다수의 탄소 층을 포함한 구조체 및 이를 형성하고 사용하는 방법
TW202201602A (zh) 2020-05-29 2022-01-01 荷蘭商Asm Ip私人控股有限公司 基板處理方法
TW202218133A (zh) 2020-06-24 2022-05-01 荷蘭商Asm Ip私人控股有限公司 形成含矽層之方法
WO2021262521A1 (en) * 2020-06-26 2021-12-30 Applied Materials, Inc. Deformable substrate chuck
TW202217953A (zh) 2020-06-30 2022-05-01 荷蘭商Asm Ip私人控股有限公司 基板處理方法
TW202219628A (zh) 2020-07-17 2022-05-16 荷蘭商Asm Ip私人控股有限公司 用於光微影之結構與方法
TW202204662A (zh) 2020-07-20 2022-02-01 荷蘭商Asm Ip私人控股有限公司 用於沉積鉬層之方法及系統
KR20220027026A (ko) 2020-08-26 2022-03-07 에이에스엠 아이피 홀딩 비.브이. 금속 실리콘 산화물 및 금속 실리콘 산질화물 층을 형성하기 위한 방법 및 시스템
USD990534S1 (en) 2020-09-11 2023-06-27 Asm Ip Holding B.V. Weighted lift pin
USD1012873S1 (en) 2020-09-24 2024-01-30 Asm Ip Holding B.V. Electrode for semiconductor processing apparatus
TW202229613A (zh) 2020-10-14 2022-08-01 荷蘭商Asm Ip私人控股有限公司 於階梯式結構上沉積材料的方法
KR20220053482A (ko) 2020-10-22 2022-04-29 에이에스엠 아이피 홀딩 비.브이. 바나듐 금속을 증착하는 방법, 구조체, 소자 및 증착 어셈블리
TW202223136A (zh) 2020-10-28 2022-06-16 荷蘭商Asm Ip私人控股有限公司 用於在基板上形成層之方法、及半導體處理系統
JP2023516875A (ja) * 2020-11-10 2023-04-21 アプライド マテリアルズ インコーポレイテッド 局所的なウエハ圧力を有する研磨ヘッド
TW202235675A (zh) 2020-11-30 2022-09-16 荷蘭商Asm Ip私人控股有限公司 注入器、及基板處理設備
USD940765S1 (en) 2020-12-02 2022-01-11 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
CN114639631A (zh) 2020-12-16 2022-06-17 Asm Ip私人控股有限公司 跳动和摆动测量固定装置
JP1692349S (ja) * 2020-12-18 2021-08-10
TW202231903A (zh) 2020-12-22 2022-08-16 荷蘭商Asm Ip私人控股有限公司 過渡金屬沉積方法、過渡金屬層、用於沉積過渡金屬於基板上的沉積總成
USD1007449S1 (en) 2021-05-07 2023-12-12 Applied Materials, Inc. Target profile for a physical vapor deposition chamber target
USD980813S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas flow control plate for substrate processing apparatus
USD1023959S1 (en) 2021-05-11 2024-04-23 Asm Ip Holding B.V. Electrode for substrate processing apparatus
USD980814S1 (en) 2021-05-11 2023-03-14 Asm Ip Holding B.V. Gas distributor for substrate processing apparatus
USD981973S1 (en) 2021-05-11 2023-03-28 Asm Ip Holding B.V. Reactor wall for substrate processing apparatus
US20220362903A1 (en) * 2021-05-12 2022-11-17 Taiwan Semiconductor Manufacturing Co., Ltd. Multiple polishing heads with cross-zone pressure element distributions for cmp
USD990441S1 (en) 2021-09-07 2023-06-27 Asm Ip Holding B.V. Gas flow control plate

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5036630A (en) * 1990-04-13 1991-08-06 International Business Machines Corporation Radial uniformity control of semiconductor wafer polishing
US5230184A (en) 1991-07-05 1993-07-27 Motorola, Inc. Distributed polishing head
FR2683468B1 (fr) * 1991-11-08 1995-06-09 Unimetall Sa Procede de fabrication de billettes d'acier de format quadrangulaire et billettes ainsi obtenues.
US5205082A (en) 1991-12-20 1993-04-27 Cybeq Systems, Inc. Wafer polisher head having floating retainer ring
US5584746A (en) 1993-10-18 1996-12-17 Shin-Etsu Handotai Co., Ltd. Method of polishing semiconductor wafers and apparatus therefor
JP3311116B2 (ja) 1993-10-28 2002-08-05 株式会社東芝 半導体製造装置
US5820448A (en) 1993-12-27 1998-10-13 Applied Materials, Inc. Carrier head with a layer of conformable material for a chemical mechanical polishing system
US5624299A (en) 1993-12-27 1997-04-29 Applied Materials, Inc. Chemical mechanical polishing apparatus with improved carrier and method of use
US5544421A (en) 1994-04-28 1996-08-13 Semitool, Inc. Semiconductor wafer processing system
KR100200199B1 (ko) * 1994-08-02 1999-06-15 사또 아끼오 광학필터용 폴리이미드수지조성물
JP3158934B2 (ja) 1995-02-28 2001-04-23 三菱マテリアル株式会社 ウェーハ研磨装置
US5908530A (en) * 1995-05-18 1999-06-01 Obsidian, Inc. Apparatus for chemical mechanical polishing
US5795215A (en) 1995-06-09 1998-08-18 Applied Materials, Inc. Method and apparatus for using a retaining ring to control the edge effect
US5681215A (en) 1995-10-27 1997-10-28 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5762544A (en) 1995-10-27 1998-06-09 Applied Materials, Inc. Carrier head design for a chemical mechanical polishing apparatus
US5738574A (en) 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5762546A (en) 1995-12-13 1998-06-09 Coburn Optical Industries, Inc. Pneumatically assisted conformal tool for an ophthalmic lens finer/polisher
DE69717510T2 (de) * 1996-01-24 2003-10-02 Lam Res Corp Halbleiterscheiben-Polierkopf
US5762539A (en) 1996-02-27 1998-06-09 Ebara Corporation Apparatus for and method for polishing workpiece
US5941758A (en) * 1996-11-13 1999-08-24 Intel Corporation Method and apparatus for chemical-mechanical polishing
DE19651761A1 (de) * 1996-12-12 1998-06-18 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Polieren von Halbleiterscheiben
US5851140A (en) * 1997-02-13 1998-12-22 Integrated Process Equipment Corp. Semiconductor wafer polishing apparatus with a flexible carrier plate
US6056632A (en) * 1997-02-13 2000-05-02 Speedfam-Ipec Corp. Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US5964653A (en) 1997-07-11 1999-10-12 Applied Materials, Inc. Carrier head with a flexible membrane for a chemical mechanical polishing system
US5916016A (en) * 1997-10-23 1999-06-29 Vlsi Technology, Inc. Methods and apparatus for polishing wafers
JPH11226865A (ja) * 1997-12-11 1999-08-24 Speedfam Co Ltd キャリア及びcmp装置
JP2000015572A (ja) * 1998-04-29 2000-01-18 Speedfam Co Ltd キャリア及び研磨装置
US6210255B1 (en) * 1998-09-08 2001-04-03 Applied Materials, Inc. Carrier head for chemical mechanical polishing a substrate
US6162116A (en) * 1999-01-23 2000-12-19 Applied Materials, Inc. Carrier head for chemical mechanical polishing
US6368189B1 (en) * 1999-03-03 2002-04-09 Mitsubishi Materials Corporation Apparatus and method for chemical-mechanical polishing (CMP) head having direct pneumatic wafer polishing pressure
DE19941903A1 (de) * 1999-09-02 2001-03-15 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum Polieren einer Halbleiterscheibe
US6663466B2 (en) * 1999-11-17 2003-12-16 Applied Materials, Inc. Carrier head with a substrate detector
US6361419B1 (en) * 2000-03-27 2002-03-26 Applied Materials, Inc. Carrier head with controllable edge pressure
US6390905B1 (en) * 2000-03-31 2002-05-21 Speedfam-Ipec Corporation Workpiece carrier with adjustable pressure zones and barriers
US6558232B1 (en) * 2000-05-12 2003-05-06 Multi-Planar Technologies, Inc. System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
US6857945B1 (en) * 2000-07-25 2005-02-22 Applied Materials, Inc. Multi-chamber carrier head with a flexible membrane

Similar Documents

Publication Publication Date Title
JP2004500251A5 (ja)
US6659850B2 (en) Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6056632A (en) Semiconductor wafer polishing apparatus with a variable polishing force wafer carrier head
US7140956B1 (en) Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
US6033478A (en) Wafer support with improved temperature control
US6776694B2 (en) Methods for carrier head with multi-part flexible membrane
JP4709818B2 (ja) 温度制御研磨ヘッドを有する化学機械研磨システム
KR101150913B1 (ko) 기판 폴리싱 장치 및 기판 폴리싱 방법
JP4217400B2 (ja) ウェーハ研磨装置及びウェーハ研磨方法
JP3937368B2 (ja) 柔軟なキャリアプレートを有する半導体ウェハポリシング装置
US6361419B1 (en) Carrier head with controllable edge pressure
US6494774B1 (en) Carrier head with pressure transfer mechanism
US20070207709A1 (en) Polishing head for polishing semiconductor wafers
US6746318B2 (en) Workpiece carrier with adjustable pressure zones and barriers
JP2003031531A (ja) ウェーハ研磨装置及びウェーハ研磨方法
US20080014842A1 (en) Polishing head for polishing semiconductor wafers
JP2005531930A (ja) 部分的に膜であるキャリアヘッド
KR20040023228A (ko) 화학적 기계적 평탄화 기계의 폴리싱 헤드
US6336853B1 (en) Carrier having pistons for distributing a pressing force on the back surface of a workpiece
US7018273B1 (en) Platen with diaphragm and method for optimizing wafer polishing
JPH11156697A (ja) 平面研磨装置及び平面研磨方法
JP2004165175A (ja) 半導体ウェハを研磨するためのマルチボリューム隔壁を有するキャリヤと研磨方法
JP5495525B2 (ja) 研磨ヘッドにおけるウェーハ回転安定化構造
AU4136400A (en) Cmp polishing head with three chambers and method for using the same
JP2005520357A (ja) 半導体ウェハを研磨するためのマルチボリューム隔壁を有するキャリヤと研磨方法