US5964653A
(en)
*
|
1997-07-11 |
1999-10-12 |
Applied Materials, Inc. |
Carrier head with a flexible membrane for a chemical mechanical polishing system
|
US6722963B1
(en)
*
|
1999-08-03 |
2004-04-20 |
Micron Technology, Inc. |
Apparatus for chemical-mechanical planarization of microelectronic substrates with a carrier and membrane
|
US7140956B1
(en)
|
2000-03-31 |
2006-11-28 |
Speedfam-Ipec Corporation |
Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
|
US6390905B1
(en)
*
|
2000-03-31 |
2002-05-21 |
Speedfam-Ipec Corporation |
Workpiece carrier with adjustable pressure zones and barriers
|
US6558232B1
(en)
*
|
2000-05-12 |
2003-05-06 |
Multi-Planar Technologies, Inc. |
System and method for CMP having multi-pressure zone loading for improved edge and annular zone material removal control
|
TW579319B
(en)
*
|
2000-05-12 |
2004-03-11 |
Multi Planar Technologies Inc |
System and method for CMP head having multi-pressure annular zone subcarrier material removal control
|
US7198561B2
(en)
*
|
2000-07-25 |
2007-04-03 |
Applied Materials, Inc. |
Flexible membrane for multi-chamber carrier head
|
US6857945B1
(en)
*
|
2000-07-25 |
2005-02-22 |
Applied Materials, Inc. |
Multi-chamber carrier head with a flexible membrane
|
US6447368B1
(en)
*
|
2000-11-20 |
2002-09-10 |
Speedfam-Ipec Corporation |
Carriers with concentric balloons supporting a diaphragm
|
CN1260778C
(en)
*
|
2000-12-04 |
2006-06-21 |
株式会社荏原制作所 |
Substrate processing method
|
US6855037B2
(en)
*
|
2001-03-12 |
2005-02-15 |
Asm-Nutool, Inc. |
Method of sealing wafer backside for full-face electrochemical plating
|
US6939206B2
(en)
*
|
2001-03-12 |
2005-09-06 |
Asm Nutool, Inc. |
Method and apparatus of sealing wafer backside for full-face electrochemical plating
|
US6863771B2
(en)
*
|
2001-07-25 |
2005-03-08 |
Micron Technology, Inc. |
Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods
|
JP4025960B2
(en)
*
|
2001-08-08 |
2007-12-26 |
信越化学工業株式会社 |
Polishing method for square photomask substrate, square photomask substrate, photomask blanks and photomask
|
US6755726B2
(en)
*
|
2002-03-25 |
2004-06-29 |
United Microelectric Corp. |
Polishing head with a floating knife-edge
|
US6669540B2
(en)
*
|
2002-03-28 |
2003-12-30 |
Peter Wolterss CMP-Systeme GmbH & Co. KG |
Chuck means for flat workpieces, in particular semi-conductor wafers
|
US6627466B1
(en)
*
|
2002-05-03 |
2003-09-30 |
Lsi Logic Corporation |
Method and apparatus for detecting backside contamination during fabrication of a semiconductor wafer
|
US6998013B2
(en)
*
|
2002-10-10 |
2006-02-14 |
Taiwan Semiconductor Manufacturing Co., Ltd |
CMP apparatus polishing head with concentric pressure zones
|
KR100481872B1
(en)
*
|
2003-01-14 |
2005-04-11 |
삼성전자주식회사 |
Polishing head and chemical mechanical polishing apparatus
|
US6764387B1
(en)
*
|
2003-03-07 |
2004-07-20 |
Applied Materials Inc. |
Control of a multi-chamber carrier head
|
US7008309B2
(en)
*
|
2003-05-30 |
2006-03-07 |
Strasbaugh |
Back pressure control system for CMP and wafer polishing
|
JP4086722B2
(en)
*
|
2003-06-24 |
2008-05-14 |
株式会社荏原製作所 |
Substrate holding device and polishing device
|
KR100600231B1
(en)
*
|
2003-07-12 |
2006-07-13 |
동부일렉트로닉스 주식회사 |
CMP polishing head and its driving method
|
JP2005123485A
(en)
*
|
2003-10-17 |
2005-05-12 |
Ebara Corp |
Polishing device
|
KR100586018B1
(en)
*
|
2004-02-09 |
2006-06-01 |
삼성전자주식회사 |
Flexible membrane for a polishing head and chemical mechanical polishing apparatus including the same
|
KR100550342B1
(en)
|
2004-02-24 |
2006-02-08 |
삼성전자주식회사 |
Method for scattering a gas, and shower head, and apparatus having a shower head for manufacturing a semiconductor substrate
|
US7063604B2
(en)
*
|
2004-03-05 |
2006-06-20 |
Strasbaugh |
Independent edge control for CMP carriers
|
US7255771B2
(en)
|
2004-03-26 |
2007-08-14 |
Applied Materials, Inc. |
Multiple zone carrier head with flexible membrane
|
JP4822744B2
(en)
*
|
2004-06-04 |
2011-11-24 |
三星電子株式会社 |
Chemical mechanical polishing equipment, carrier head and compartment ring
|
KR100621629B1
(en)
*
|
2004-06-04 |
2006-09-19 |
삼성전자주식회사 |
Polishing head used in chemical mechanical polishing apparatus and polishing method
|
US20060000806A1
(en)
*
|
2004-06-30 |
2006-01-05 |
Golzarian Reza M |
Substrate carrier for surface planarization
|
US7033257B2
(en)
*
|
2004-07-21 |
2006-04-25 |
Agere Systems, Inc. |
Carrier head for chemical mechanical polishing
|
EP2797109B1
(en)
*
|
2004-11-01 |
2018-02-28 |
Ebara Corporation |
Polishing apparatus
|
KR100647041B1
(en)
*
|
2005-06-17 |
2006-11-23 |
두산디앤디 주식회사 |
Carrier head for chemical mechanical polishing apparatus with controlling abnormal polishing to zone partition polishing profile boundary
|
US20070026772A1
(en)
*
|
2005-07-28 |
2007-02-01 |
Dolechek Kert L |
Apparatus for use in processing a semiconductor workpiece
|
US7207871B1
(en)
*
|
2005-10-06 |
2007-04-24 |
Applied Materials, Inc. |
Carrier head with multiple chambers
|
US8454413B2
(en)
|
2005-12-29 |
2013-06-04 |
Applied Materials, Inc. |
Multi-chamber carrier head with a textured membrane
|
US20070167110A1
(en)
*
|
2006-01-16 |
2007-07-19 |
Yu-Hsiang Tseng |
Multi-zone carrier head for chemical mechanical polishing and cmp method thereof
|
US7115017B1
(en)
|
2006-03-31 |
2006-10-03 |
Novellus Systems, Inc. |
Methods for controlling the pressures of adjustable pressure zones of a work piece carrier during chemical mechanical planarization
|
WO2007125511A2
(en)
*
|
2006-05-02 |
2007-11-08 |
Nxp B.V. |
Wafer de-chucking
|
US7402098B2
(en)
*
|
2006-10-27 |
2008-07-22 |
Novellus Systems, Inc. |
Carrier head for workpiece planarization/polishing
|
US7335092B1
(en)
|
2006-10-27 |
2008-02-26 |
Novellus Systems, Inc. |
Carrier head for workpiece planarization/polishing
|
US8702866B2
(en)
|
2006-12-18 |
2014-04-22 |
Lam Research Corporation |
Showerhead electrode assembly with gas flow modification for extended electrode life
|
JP2009131920A
(en)
*
|
2007-11-29 |
2009-06-18 |
Ebara Corp |
Polishing apparatus and polishing method
|
JP5254669B2
(en)
*
|
2008-06-05 |
2013-08-07 |
Hoya株式会社 |
Intraocular lens insertion device and cartridge
|
US8371904B2
(en)
*
|
2008-08-08 |
2013-02-12 |
Globalfoundries Singapore Pte. Ltd. |
Polishing with enhanced uniformity
|
US8739626B2
(en)
*
|
2009-08-04 |
2014-06-03 |
Fairchild Semiconductor Corporation |
Micromachined inertial sensor devices
|
JP5392483B2
(en)
*
|
2009-08-31 |
2014-01-22 |
不二越機械工業株式会社 |
Polishing equipment
|
JP4831842B2
(en)
*
|
2009-10-28 |
2011-12-07 |
三菱重工業株式会社 |
Joining device control device and multilayer joining method
|
JP5648954B2
(en)
*
|
2010-08-31 |
2015-01-07 |
不二越機械工業株式会社 |
Polishing equipment
|
JP5236705B2
(en)
*
|
2010-09-08 |
2013-07-17 |
株式会社荏原製作所 |
Polishing equipment
|
EP2616389B1
(en)
|
2010-09-18 |
2017-04-05 |
Fairchild Semiconductor Corporation |
Multi-die mems package
|
US9352961B2
(en)
|
2010-09-18 |
2016-05-31 |
Fairchild Semiconductor Corporation |
Flexure bearing to reduce quadrature for resonating micromachined devices
|
US8813564B2
(en)
|
2010-09-18 |
2014-08-26 |
Fairchild Semiconductor Corporation |
MEMS multi-axis gyroscope with central suspension and gimbal structure
|
EP2616388A4
(en)
|
2010-09-18 |
2014-08-13 |
Fairchild Semiconductor |
Sealed packaging for microelectromechanical systems
|
CN103221779B
(en)
|
2010-09-18 |
2017-05-31 |
快捷半导体公司 |
The axle inertial sensor of micromechanics monoblock type six
|
EP2616772B1
(en)
|
2010-09-18 |
2016-06-22 |
Fairchild Semiconductor Corporation |
Micromachined monolithic 3-axis gyroscope with single drive
|
CN103221795B
(en)
|
2010-09-20 |
2015-03-11 |
快捷半导体公司 |
Microelectromechanical pressure sensor including reference capacitor
|
WO2012040245A2
(en)
|
2010-09-20 |
2012-03-29 |
Fairchild Semiconductor Corporation |
Through silicon via with reduced shunt capacitance
|
US20120122373A1
(en)
*
|
2010-11-15 |
2012-05-17 |
Stmicroelectronics, Inc. |
Precise real time and position low pressure control of chemical mechanical polish (cmp) head
|
JP5671735B2
(en)
*
|
2011-01-18 |
2015-02-18 |
不二越機械工業株式会社 |
Double-side polishing equipment
|
US20130023129A1
(en)
|
2011-07-20 |
2013-01-24 |
Asm America, Inc. |
Pressure transmitter for a semiconductor processing environment
|
US9062972B2
(en)
|
2012-01-31 |
2015-06-23 |
Fairchild Semiconductor Corporation |
MEMS multi-axis accelerometer electrode structure
|
US8978475B2
(en)
|
2012-02-01 |
2015-03-17 |
Fairchild Semiconductor Corporation |
MEMS proof mass with split z-axis portions
|
US8754694B2
(en)
|
2012-04-03 |
2014-06-17 |
Fairchild Semiconductor Corporation |
Accurate ninety-degree phase shifter
|
US8742964B2
(en)
|
2012-04-04 |
2014-06-03 |
Fairchild Semiconductor Corporation |
Noise reduction method with chopping for a merged MEMS accelerometer sensor
|
US9488693B2
(en)
|
2012-04-04 |
2016-11-08 |
Fairchild Semiconductor Corporation |
Self test of MEMS accelerometer with ASICS integrated capacitors
|
EP2647952B1
(en)
|
2012-04-05 |
2017-11-15 |
Fairchild Semiconductor Corporation |
Mems device automatic-gain control loop for mechanical amplitude drive
|
US9069006B2
(en)
|
2012-04-05 |
2015-06-30 |
Fairchild Semiconductor Corporation |
Self test of MEMS gyroscope with ASICs integrated capacitors
|
EP2647955B8
(en)
|
2012-04-05 |
2018-12-19 |
Fairchild Semiconductor Corporation |
MEMS device quadrature phase shift cancellation
|
EP2648334B1
(en)
|
2012-04-05 |
2020-06-10 |
Fairchild Semiconductor Corporation |
Mems device front-end charge amplifier
|
US9094027B2
(en)
|
2012-04-12 |
2015-07-28 |
Fairchild Semiconductor Corporation |
Micro-electro-mechanical-system (MEMS) driver
|
US9625272B2
(en)
|
2012-04-12 |
2017-04-18 |
Fairchild Semiconductor Corporation |
MEMS quadrature cancellation and signal demodulation
|
JP6158637B2
(en)
*
|
2012-08-28 |
2017-07-05 |
株式会社荏原製作所 |
Elastic film and substrate holding device
|
DE102013014881B4
(en)
|
2012-09-12 |
2023-05-04 |
Fairchild Semiconductor Corporation |
Enhanced silicon via with multi-material fill
|
US9233452B2
(en)
|
2012-10-29 |
2016-01-12 |
Wayne O. Duescher |
Vacuum-grooved membrane abrasive polishing wafer workholder
|
US8998677B2
(en)
|
2012-10-29 |
2015-04-07 |
Wayne O. Duescher |
Bellows driven floatation-type abrading workholder
|
US8845394B2
(en)
|
2012-10-29 |
2014-09-30 |
Wayne O. Duescher |
Bellows driven air floatation abrading workholder
|
US9039488B2
(en)
|
2012-10-29 |
2015-05-26 |
Wayne O. Duescher |
Pin driven flexible chamber abrading workholder
|
US9604339B2
(en)
|
2012-10-29 |
2017-03-28 |
Wayne O. Duescher |
Vacuum-grooved membrane wafer polishing workholder
|
US8998678B2
(en)
|
2012-10-29 |
2015-04-07 |
Wayne O. Duescher |
Spider arm driven flexible chamber abrading workholder
|
US9199354B2
(en)
|
2012-10-29 |
2015-12-01 |
Wayne O. Duescher |
Flexible diaphragm post-type floating and rigid abrading workholder
|
US9011207B2
(en)
|
2012-10-29 |
2015-04-21 |
Wayne O. Duescher |
Flexible diaphragm combination floating and rigid abrading workholder
|
US20140174655A1
(en)
*
|
2012-12-21 |
2014-06-26 |
HGST Netherlands B.V. |
Polishing tool with diaphram for uniform polishing of a wafer
|
US9193025B2
(en)
*
|
2013-03-13 |
2015-11-24 |
Sunedison Semiconductor Limited (Uen201334164H) |
Single side polishing using shape matching
|
US9227297B2
(en)
*
|
2013-03-20 |
2016-01-05 |
Applied Materials, Inc. |
Retaining ring with attachable segments
|
USD770990S1
(en)
*
|
2013-05-15 |
2016-11-08 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing apparatus
|
USD808349S1
(en)
|
2013-05-15 |
2018-01-23 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing apparatus
|
JP2014223684A
(en)
*
|
2013-05-15 |
2014-12-04 |
株式会社東芝 |
Polishing device, and polishing method
|
USD769200S1
(en)
|
2013-05-15 |
2016-10-18 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing apparatus
|
KR102323430B1
(en)
|
2014-03-31 |
2021-11-09 |
가부시키가이샤 에바라 세이사꾸쇼 |
Polishing apparatus and polishing method
|
US9610672B2
(en)
|
2014-06-27 |
2017-04-04 |
Applied Materials, Inc. |
Configurable pressure design for multizone chemical mechanical planarization polishing head
|
US10183374B2
(en)
*
|
2014-08-26 |
2019-01-22 |
Ebara Corporation |
Buffing apparatus, and substrate processing apparatus
|
US10941490B2
(en)
|
2014-10-07 |
2021-03-09 |
Asm Ip Holding B.V. |
Multiple temperature range susceptor, assembly, reactor and system including the susceptor, and methods of using the same
|
US10276355B2
(en)
|
2015-03-12 |
2019-04-30 |
Asm Ip Holding B.V. |
Multi-zone reactor, system including the reactor, and method of using the same
|
USD801942S1
(en)
*
|
2015-04-16 |
2017-11-07 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
USD797067S1
(en)
*
|
2015-04-21 |
2017-09-12 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
USD798248S1
(en)
*
|
2015-06-18 |
2017-09-26 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
US10160091B2
(en)
*
|
2015-11-16 |
2018-12-25 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
CMP polishing head design for improving removal rate uniformity
|
US11139308B2
(en)
|
2015-12-29 |
2021-10-05 |
Asm Ip Holding B.V. |
Atomic layer deposition of III-V compounds to form V-NAND devices
|
US10529554B2
(en)
|
2016-02-19 |
2020-01-07 |
Asm Ip Holding B.V. |
Method for forming silicon nitride film selectively on sidewalls or flat surfaces of trenches
|
US9962805B2
(en)
*
|
2016-04-22 |
2018-05-08 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Chemical mechanical polishing apparatus and method
|
US11453943B2
(en)
|
2016-05-25 |
2022-09-27 |
Asm Ip Holding B.V. |
Method for forming carbon-containing silicon/metal oxide or nitride film by ALD using silicon precursor and hydrocarbon precursor
|
US10702969B2
(en)
|
2016-06-23 |
2020-07-07 |
Western Digital Technologies, Inc. |
Actuator tilt interposer for within-row lapping mount tool for magnetic recording read-write heads
|
US10850364B2
(en)
|
2016-06-23 |
2020-12-01 |
Western Digital Technologies, Inc. |
Within-row stripe height and wedge angle control for magnetic recording read-write heads
|
US9881639B2
(en)
*
|
2016-06-23 |
2018-01-30 |
Western Digital Technologies, Inc. |
Within-row wedge angle control for magnetic recording read-write heads
|
US10612137B2
(en)
|
2016-07-08 |
2020-04-07 |
Asm Ip Holdings B.V. |
Organic reactants for atomic layer deposition
|
US9859151B1
(en)
|
2016-07-08 |
2018-01-02 |
Asm Ip Holding B.V. |
Selective film deposition method to form air gaps
|
US9812320B1
(en)
|
2016-07-28 |
2017-11-07 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
US9887082B1
(en)
|
2016-07-28 |
2018-02-06 |
Asm Ip Holding B.V. |
Method and apparatus for filling a gap
|
USD836572S1
(en)
*
|
2016-09-30 |
2018-12-25 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
US11532757B2
(en)
|
2016-10-27 |
2022-12-20 |
Asm Ip Holding B.V. |
Deposition of charge trapping layers
|
US10714350B2
(en)
|
2016-11-01 |
2020-07-14 |
ASM IP Holdings, B.V. |
Methods for forming a transition metal niobium nitride film on a substrate by atomic layer deposition and related semiconductor device structures
|
KR102546317B1
(en)
|
2016-11-15 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
Gas supply unit and substrate processing apparatus including the same
|
USD839224S1
(en)
*
|
2016-12-12 |
2019-01-29 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing
|
US11447861B2
(en)
|
2016-12-15 |
2022-09-20 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus and a method of forming a patterned structure
|
US11581186B2
(en)
|
2016-12-15 |
2023-02-14 |
Asm Ip Holding B.V. |
Sequential infiltration synthesis apparatus
|
US11390950B2
(en)
|
2017-01-10 |
2022-07-19 |
Asm Ip Holding B.V. |
Reactor system and method to reduce residue buildup during a film deposition process
|
US10468261B2
(en)
|
2017-02-15 |
2019-11-05 |
Asm Ip Holding B.V. |
Methods for forming a metallic film on a substrate by cyclical deposition and related semiconductor device structures
|
US10770286B2
(en)
|
2017-05-08 |
2020-09-08 |
Asm Ip Holdings B.V. |
Methods for selectively forming a silicon nitride film on a substrate and related semiconductor device structures
|
US11306395B2
(en)
|
2017-06-28 |
2022-04-19 |
Asm Ip Holding B.V. |
Methods for depositing a transition metal nitride film on a substrate by atomic layer deposition and related deposition apparatus
|
USD859332S1
(en)
*
|
2017-06-29 |
2019-09-10 |
Ebara Corporation |
Elastic membrane for semiconductor wafer polishing
|
US10926378B2
(en)
|
2017-07-08 |
2021-02-23 |
Wayne O. Duescher |
Abrasive coated disk islands using magnetic font sheet
|
KR20190009245A
(en)
|
2017-07-18 |
2019-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
Methods for forming a semiconductor device structure and related semiconductor device structures
|
US10590535B2
(en)
|
2017-07-26 |
2020-03-17 |
Asm Ip Holdings B.V. |
Chemical treatment, deposition and/or infiltration apparatus and method for using the same
|
US10770336B2
(en)
|
2017-08-08 |
2020-09-08 |
Asm Ip Holding B.V. |
Substrate lift mechanism and reactor including same
|
US10692741B2
(en)
|
2017-08-08 |
2020-06-23 |
Asm Ip Holdings B.V. |
Radiation shield
|
US11769682B2
(en)
|
2017-08-09 |
2023-09-26 |
Asm Ip Holding B.V. |
Storage apparatus for storing cassettes for substrates and processing apparatus equipped therewith
|
US11830730B2
(en)
|
2017-08-29 |
2023-11-28 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
US11295980B2
(en)
|
2017-08-30 |
2022-04-05 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum metal film over a dielectric surface of a substrate by a cyclical deposition process and related semiconductor device structures
|
US10658205B2
(en)
|
2017-09-28 |
2020-05-19 |
Asm Ip Holdings B.V. |
Chemical dispensing apparatus and methods for dispensing a chemical to a reaction chamber
|
USD851613S1
(en)
|
2017-10-05 |
2019-06-18 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
US11639811B2
(en)
|
2017-11-27 |
2023-05-02 |
Asm Ip Holding B.V. |
Apparatus including a clean mini environment
|
KR102597978B1
(en)
|
2017-11-27 |
2023-11-06 |
에이에스엠 아이피 홀딩 비.브이. |
Storage device for storing wafer cassettes for use with batch furnaces
|
USD868124S1
(en)
|
2017-12-11 |
2019-11-26 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
USD918161S1
(en)
*
|
2017-12-19 |
2021-05-04 |
Ebara Corporation |
Elastic membrane
|
US10872771B2
(en)
|
2018-01-16 |
2020-12-22 |
Asm Ip Holding B. V. |
Method for depositing a material film on a substrate within a reaction chamber by a cyclical deposition process and related device structures
|
WO2019142055A2
(en)
|
2018-01-19 |
2019-07-25 |
Asm Ip Holding B.V. |
Method for depositing a gap-fill layer by plasma-assisted deposition
|
TWI799494B
(en)
|
2018-01-19 |
2023-04-21 |
荷蘭商Asm 智慧財產控股公司 |
Deposition method
|
US11081345B2
(en)
|
2018-02-06 |
2021-08-03 |
Asm Ip Holding B.V. |
Method of post-deposition treatment for silicon oxide film
|
CN111699278B
(en)
|
2018-02-14 |
2023-05-16 |
Asm Ip私人控股有限公司 |
Method for depositing ruthenium-containing films on substrates by cyclical deposition processes
|
US10896820B2
(en)
|
2018-02-14 |
2021-01-19 |
Asm Ip Holding B.V. |
Method for depositing a ruthenium-containing film on a substrate by a cyclical deposition process
|
KR102636427B1
(en)
|
2018-02-20 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing method and apparatus
|
US10975470B2
(en)
|
2018-02-23 |
2021-04-13 |
Asm Ip Holding B.V. |
Apparatus for detecting or monitoring for a chemical precursor in a high temperature environment
|
US11473195B2
(en)
|
2018-03-01 |
2022-10-18 |
Asm Ip Holding B.V. |
Semiconductor processing apparatus and a method for processing a substrate
|
USD877101S1
(en)
|
2018-03-09 |
2020-03-03 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
US10593603B2
(en)
|
2018-03-16 |
2020-03-17 |
Sandisk Technologies Llc |
Chemical mechanical polishing apparatus containing hydraulic multi-chamber bladder and method of using thereof
|
KR102646467B1
(en)
|
2018-03-27 |
2024-03-11 |
에이에스엠 아이피 홀딩 비.브이. |
Method of forming an electrode on a substrate and a semiconductor device structure including an electrode
|
KR102596988B1
(en)
|
2018-05-28 |
2023-10-31 |
에이에스엠 아이피 홀딩 비.브이. |
Method of processing a substrate and a device manufactured by the same
|
US11718913B2
(en)
|
2018-06-04 |
2023-08-08 |
Asm Ip Holding B.V. |
Gas distribution system and reactor system including same
|
KR102568797B1
(en)
|
2018-06-21 |
2023-08-21 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing system
|
US10797133B2
(en)
|
2018-06-21 |
2020-10-06 |
Asm Ip Holding B.V. |
Method for depositing a phosphorus doped silicon arsenide film and related semiconductor device structures
|
JP2021529254A
(en)
|
2018-06-27 |
2021-10-28 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
Periodic deposition methods for forming metal-containing materials and films and structures containing metal-containing materials
|
KR20210027265A
(en)
|
2018-06-27 |
2021-03-10 |
에이에스엠 아이피 홀딩 비.브이. |
Periodic deposition method for forming metal-containing material and film and structure comprising metal-containing material
|
US10755922B2
(en)
|
2018-07-03 |
2020-08-25 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
US10388513B1
(en)
|
2018-07-03 |
2019-08-20 |
Asm Ip Holding B.V. |
Method for depositing silicon-free carbon-containing film as gap-fill layer by pulse plasma-assisted deposition
|
JP7074606B2
(en)
*
|
2018-08-02 |
2022-05-24 |
株式会社荏原製作所 |
Top ring and board processing equipment for holding the board
|
CN109277948B
(en)
*
|
2018-08-02 |
2020-05-12 |
数码模冲压技术(武汉)有限公司 |
Robot grinding pressure control method and system, storage medium and equipment
|
US11430674B2
(en)
|
2018-08-22 |
2022-08-30 |
Asm Ip Holding B.V. |
Sensor array, apparatus for dispensing a vapor phase reactant to a reaction chamber and related methods
|
KR20200030162A
(en)
|
2018-09-11 |
2020-03-20 |
에이에스엠 아이피 홀딩 비.브이. |
Method for deposition of a thin film
|
US11024523B2
(en)
|
2018-09-11 |
2021-06-01 |
Asm Ip Holding B.V. |
Substrate processing apparatus and method
|
CN110970344A
(en)
|
2018-10-01 |
2020-04-07 |
Asm Ip控股有限公司 |
Substrate holding apparatus, system including the same, and method of using the same
|
KR102592699B1
(en)
|
2018-10-08 |
2023-10-23 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate support unit and apparatuses for depositing thin film and processing the substrate including the same
|
KR102546322B1
(en)
|
2018-10-19 |
2023-06-21 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing apparatus and substrate processing method
|
US11087997B2
(en)
|
2018-10-31 |
2021-08-10 |
Asm Ip Holding B.V. |
Substrate processing apparatus for processing substrates
|
KR20200051105A
(en)
|
2018-11-02 |
2020-05-13 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate support unit and substrate processing apparatus including the same
|
US11572620B2
(en)
|
2018-11-06 |
2023-02-07 |
Asm Ip Holding B.V. |
Methods for selectively depositing an amorphous silicon film on a substrate
|
US10818758B2
(en)
|
2018-11-16 |
2020-10-27 |
Asm Ip Holding B.V. |
Methods for forming a metal silicate film on a substrate in a reaction chamber and related semiconductor device structures
|
KR102636428B1
(en)
|
2018-12-04 |
2024-02-13 |
에이에스엠 아이피 홀딩 비.브이. |
A method for cleaning a substrate processing apparatus
|
US11158513B2
(en)
|
2018-12-13 |
2021-10-26 |
Asm Ip Holding B.V. |
Methods for forming a rhenium-containing film on a substrate by a cyclical deposition process and related semiconductor device structures
|
JP2020096183A
(en)
|
2018-12-14 |
2020-06-18 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
Method of forming device structure using selective deposition of gallium nitride, and system for the same
|
TWI819180B
(en)
|
2019-01-17 |
2023-10-21 |
荷蘭商Asm 智慧財產控股公司 |
Methods of forming a transition metal containing film on a substrate by a cyclical deposition process
|
KR20200102357A
(en)
|
2019-02-20 |
2020-08-31 |
에이에스엠 아이피 홀딩 비.브이. |
Apparatus and methods for plug fill deposition in 3-d nand applications
|
JP2020136677A
(en)
|
2019-02-20 |
2020-08-31 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
Periodic accumulation method for filing concave part formed inside front surface of base material, and device
|
JP2020136678A
(en)
|
2019-02-20 |
2020-08-31 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
Method for filing concave part formed inside front surface of base material, and device
|
TW202100794A
(en)
|
2019-02-22 |
2021-01-01 |
荷蘭商Asm Ip私人控股有限公司 |
Substrate processing apparatus and method for processing substrate
|
KR20200108242A
(en)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
Method for Selective Deposition of Silicon Nitride Layer and Structure Including Selectively-Deposited Silicon Nitride Layer
|
KR20200108248A
(en)
|
2019-03-08 |
2020-09-17 |
에이에스엠 아이피 홀딩 비.브이. |
STRUCTURE INCLUDING SiOCN LAYER AND METHOD OF FORMING SAME
|
JP2020167398A
(en)
|
2019-03-28 |
2020-10-08 |
エーエスエム・アイピー・ホールディング・ベー・フェー |
Door opener and substrate processing apparatus provided therewith
|
KR20200116855A
(en)
|
2019-04-01 |
2020-10-13 |
에이에스엠 아이피 홀딩 비.브이. |
Method of manufacturing semiconductor device
|
US11447864B2
(en)
|
2019-04-19 |
2022-09-20 |
Asm Ip Holding B.V. |
Layer forming method and apparatus
|
KR20200125453A
(en)
|
2019-04-24 |
2020-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
Gas-phase reactor system and method of using same
|
KR20200130121A
(en)
|
2019-05-07 |
2020-11-18 |
에이에스엠 아이피 홀딩 비.브이. |
Chemical source vessel with dip tube
|
KR20200130652A
(en)
|
2019-05-10 |
2020-11-19 |
에이에스엠 아이피 홀딩 비.브이. |
Method of depositing material onto a surface and structure formed according to the method
|
JP2020188255A
(en)
|
2019-05-16 |
2020-11-19 |
エーエスエム アイピー ホールディング ビー.ブイ. |
Wafer boat handling device, vertical batch furnace, and method
|
USD947913S1
(en)
|
2019-05-17 |
2022-04-05 |
Asm Ip Holding B.V. |
Susceptor shaft
|
USD975665S1
(en)
|
2019-05-17 |
2023-01-17 |
Asm Ip Holding B.V. |
Susceptor shaft
|
KR20200141003A
(en)
|
2019-06-06 |
2020-12-17 |
에이에스엠 아이피 홀딩 비.브이. |
Gas-phase reactor system including a gas detector
|
KR20200143254A
(en)
|
2019-06-11 |
2020-12-23 |
에이에스엠 아이피 홀딩 비.브이. |
Method of forming an electronic structure using an reforming gas, system for performing the method, and structure formed using the method
|
KR20210005515A
(en)
|
2019-07-03 |
2021-01-14 |
에이에스엠 아이피 홀딩 비.브이. |
Temperature control assembly for substrate processing apparatus and method of using same
|
JP2021015791A
(en)
|
2019-07-09 |
2021-02-12 |
エーエスエム アイピー ホールディング ビー.ブイ. |
Plasma device and substrate processing method using coaxial waveguide
|
CN112216646A
(en)
|
2019-07-10 |
2021-01-12 |
Asm Ip私人控股有限公司 |
Substrate supporting assembly and substrate processing device comprising same
|
JP1651618S
(en)
*
|
2019-07-11 |
2020-01-27 |
|
|
JP1651619S
(en)
*
|
2019-07-11 |
2020-01-27 |
|
|
KR20210010307A
(en)
|
2019-07-16 |
2021-01-27 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing apparatus
|
KR20210010816A
(en)
|
2019-07-17 |
2021-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
Radical assist ignition plasma system and method
|
KR20210010820A
(en)
|
2019-07-17 |
2021-01-28 |
에이에스엠 아이피 홀딩 비.브이. |
Methods of forming silicon germanium structures
|
US11643724B2
(en)
|
2019-07-18 |
2023-05-09 |
Asm Ip Holding B.V. |
Method of forming structures using a neutral beam
|
JP1651623S
(en)
*
|
2019-07-18 |
2020-01-27 |
|
|
CN112309843A
(en)
|
2019-07-29 |
2021-02-02 |
Asm Ip私人控股有限公司 |
Selective deposition method for achieving high dopant doping
|
CN112309900A
(en)
|
2019-07-30 |
2021-02-02 |
Asm Ip私人控股有限公司 |
Substrate processing apparatus
|
CN112309899A
(en)
|
2019-07-30 |
2021-02-02 |
Asm Ip私人控股有限公司 |
Substrate processing apparatus
|
US11587814B2
(en)
|
2019-07-31 |
2023-02-21 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
US11227782B2
(en)
|
2019-07-31 |
2022-01-18 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
US11587815B2
(en)
|
2019-07-31 |
2023-02-21 |
Asm Ip Holding B.V. |
Vertical batch furnace assembly
|
US11691241B1
(en)
*
|
2019-08-05 |
2023-07-04 |
Keltech Engineering, Inc. |
Abrasive lapping head with floating and rigid workpiece carrier
|
KR20210018759A
(en)
|
2019-08-05 |
2021-02-18 |
에이에스엠 아이피 홀딩 비.브이. |
Liquid level sensor for a chemical source vessel
|
USD965044S1
(en)
|
2019-08-19 |
2022-09-27 |
Asm Ip Holding B.V. |
Susceptor shaft
|
USD965524S1
(en)
|
2019-08-19 |
2022-10-04 |
Asm Ip Holding B.V. |
Susceptor support
|
JP2021031769A
(en)
|
2019-08-21 |
2021-03-01 |
エーエスエム アイピー ホールディング ビー.ブイ. |
Production apparatus of mixed gas of film deposition raw material and film deposition apparatus
|
USD979506S1
(en)
|
2019-08-22 |
2023-02-28 |
Asm Ip Holding B.V. |
Insulator
|
US11945073B2
(en)
|
2019-08-22 |
2024-04-02 |
Applied Materials, Inc. |
Dual membrane carrier head for chemical mechanical polishing
|
KR20210024423A
(en)
|
2019-08-22 |
2021-03-05 |
에이에스엠 아이피 홀딩 비.브이. |
Method for forming a structure with a hole
|
US11325223B2
(en)
*
|
2019-08-23 |
2022-05-10 |
Applied Materials, Inc. |
Carrier head with segmented substrate chuck
|
US11286558B2
(en)
|
2019-08-23 |
2022-03-29 |
Asm Ip Holding B.V. |
Methods for depositing a molybdenum nitride film on a surface of a substrate by a cyclical deposition process and related semiconductor device structures including a molybdenum nitride film
|
USD908645S1
(en)
|
2019-08-26 |
2021-01-26 |
Applied Materials, Inc. |
Sputtering target for a physical vapor deposition chamber
|
KR20210029090A
(en)
|
2019-09-04 |
2021-03-15 |
에이에스엠 아이피 홀딩 비.브이. |
Methods for selective deposition using a sacrificial capping layer
|
KR20210029663A
(en)
|
2019-09-05 |
2021-03-16 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing apparatus
|
US11562901B2
(en)
|
2019-09-25 |
2023-01-24 |
Asm Ip Holding B.V. |
Substrate processing method
|
CN112593212B
(en)
|
2019-10-02 |
2023-12-22 |
Asm Ip私人控股有限公司 |
Method for forming topologically selective silicon oxide film by cyclic plasma enhanced deposition process
|
TW202129060A
(en)
|
2019-10-08 |
2021-08-01 |
荷蘭商Asm Ip控股公司 |
Substrate processing device, and substrate processing method
|
KR20210043460A
(en)
|
2019-10-10 |
2021-04-21 |
에이에스엠 아이피 홀딩 비.브이. |
Method of forming a photoresist underlayer and structure including same
|
KR20210045930A
(en)
|
2019-10-16 |
2021-04-27 |
에이에스엠 아이피 홀딩 비.브이. |
Method of Topology-Selective Film Formation of Silicon Oxide
|
US11637014B2
(en)
|
2019-10-17 |
2023-04-25 |
Asm Ip Holding B.V. |
Methods for selective deposition of doped semiconductor material
|
KR20210047808A
(en)
|
2019-10-21 |
2021-04-30 |
에이에스엠 아이피 홀딩 비.브이. |
Apparatus and methods for selectively etching films
|
US11646205B2
(en)
|
2019-10-29 |
2023-05-09 |
Asm Ip Holding B.V. |
Methods of selectively forming n-type doped material on a surface, systems for selectively forming n-type doped material, and structures formed using same
|
KR20210054983A
(en)
|
2019-11-05 |
2021-05-14 |
에이에스엠 아이피 홀딩 비.브이. |
Structures with doped semiconductor layers and methods and systems for forming same
|
US11501968B2
(en)
|
2019-11-15 |
2022-11-15 |
Asm Ip Holding B.V. |
Method for providing a semiconductor device with silicon filled gaps
|
KR20210062561A
(en)
|
2019-11-20 |
2021-05-31 |
에이에스엠 아이피 홀딩 비.브이. |
Method of depositing carbon-containing material on a surface of a substrate, structure formed using the method, and system for forming the structure
|
CN112951697A
(en)
|
2019-11-26 |
2021-06-11 |
Asm Ip私人控股有限公司 |
Substrate processing apparatus
|
KR20210065848A
(en)
|
2019-11-26 |
2021-06-04 |
에이에스엠 아이피 홀딩 비.브이. |
Methods for selectivley forming a target film on a substrate comprising a first dielectric surface and a second metallic surface
|
CN112885693A
(en)
|
2019-11-29 |
2021-06-01 |
Asm Ip私人控股有限公司 |
Substrate processing apparatus
|
CN112885692A
(en)
|
2019-11-29 |
2021-06-01 |
Asm Ip私人控股有限公司 |
Substrate processing apparatus
|
JP2021090042A
(en)
|
2019-12-02 |
2021-06-10 |
エーエスエム アイピー ホールディング ビー.ブイ. |
Substrate processing apparatus and substrate processing method
|
KR20210070898A
(en)
|
2019-12-04 |
2021-06-15 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing apparatus
|
CN112992667A
(en)
|
2019-12-17 |
2021-06-18 |
Asm Ip私人控股有限公司 |
Method of forming vanadium nitride layer and structure including vanadium nitride layer
|
KR20210080214A
(en)
|
2019-12-19 |
2021-06-30 |
에이에스엠 아이피 홀딩 비.브이. |
Methods for filling a gap feature on a substrate and related semiconductor structures
|
KR20210095050A
(en)
|
2020-01-20 |
2021-07-30 |
에이에스엠 아이피 홀딩 비.브이. |
Method of forming thin film and method of modifying surface of thin film
|
TW202130846A
(en)
|
2020-02-03 |
2021-08-16 |
荷蘭商Asm Ip私人控股有限公司 |
Method of forming structures including a vanadium or indium layer
|
TW202146882A
(en)
|
2020-02-04 |
2021-12-16 |
荷蘭商Asm Ip私人控股有限公司 |
Method of verifying an article, apparatus for verifying an article, and system for verifying a reaction chamber
|
US11776846B2
(en)
|
2020-02-07 |
2023-10-03 |
Asm Ip Holding B.V. |
Methods for depositing gap filling fluids and related systems and devices
|
US11781243B2
(en)
|
2020-02-17 |
2023-10-10 |
Asm Ip Holding B.V. |
Method for depositing low temperature phosphorous-doped silicon
|
KR20210116240A
(en)
|
2020-03-11 |
2021-09-27 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate handling device with adjustable joints
|
KR20210116249A
(en)
|
2020-03-11 |
2021-09-27 |
에이에스엠 아이피 홀딩 비.브이. |
lockout tagout assembly and system and method of using same
|
KR20210117157A
(en)
|
2020-03-12 |
2021-09-28 |
에이에스엠 아이피 홀딩 비.브이. |
Method for Fabricating Layer Structure Having Target Topological Profile
|
USD937329S1
(en)
|
2020-03-23 |
2021-11-30 |
Applied Materials, Inc. |
Sputter target for a physical vapor deposition chamber
|
KR20210124042A
(en)
|
2020-04-02 |
2021-10-14 |
에이에스엠 아이피 홀딩 비.브이. |
Thin film forming method
|
TW202146689A
(en)
|
2020-04-03 |
2021-12-16 |
荷蘭商Asm Ip控股公司 |
Method for forming barrier layer and method for manufacturing semiconductor device
|
TW202145344A
(en)
|
2020-04-08 |
2021-12-01 |
荷蘭商Asm Ip私人控股有限公司 |
Apparatus and methods for selectively etching silcon oxide films
|
US11821078B2
(en)
|
2020-04-15 |
2023-11-21 |
Asm Ip Holding B.V. |
Method for forming precoat film and method for forming silicon-containing film
|
KR20210132600A
(en)
|
2020-04-24 |
2021-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
Methods and systems for depositing a layer comprising vanadium, nitrogen, and a further element
|
US11898243B2
(en)
|
2020-04-24 |
2024-02-13 |
Asm Ip Holding B.V. |
Method of forming vanadium nitride-containing layer
|
KR20210132605A
(en)
|
2020-04-24 |
2021-11-04 |
에이에스엠 아이피 홀딩 비.브이. |
Vertical batch furnace assembly comprising a cooling gas supply
|
KR20210134226A
(en)
|
2020-04-29 |
2021-11-09 |
에이에스엠 아이피 홀딩 비.브이. |
Solid source precursor vessel
|
KR20210134869A
(en)
|
2020-05-01 |
2021-11-11 |
에이에스엠 아이피 홀딩 비.브이. |
Fast FOUP swapping with a FOUP handler
|
KR20210141379A
(en)
|
2020-05-13 |
2021-11-23 |
에이에스엠 아이피 홀딩 비.브이. |
Laser alignment fixture for a reactor system
|
KR20210143653A
(en)
|
2020-05-19 |
2021-11-29 |
에이에스엠 아이피 홀딩 비.브이. |
Substrate processing apparatus
|
USD947802S1
(en)
|
2020-05-20 |
2022-04-05 |
Applied Materials, Inc. |
Replaceable substrate carrier interfacing film
|
KR20210145078A
(en)
|
2020-05-21 |
2021-12-01 |
에이에스엠 아이피 홀딩 비.브이. |
Structures including multiple carbon layers and methods of forming and using same
|
TW202201602A
(en)
|
2020-05-29 |
2022-01-01 |
荷蘭商Asm Ip私人控股有限公司 |
Substrate processing device
|
TW202218133A
(en)
|
2020-06-24 |
2022-05-01 |
荷蘭商Asm Ip私人控股有限公司 |
Method for forming a layer provided with silicon
|
WO2021262521A1
(en)
*
|
2020-06-26 |
2021-12-30 |
Applied Materials, Inc. |
Deformable substrate chuck
|
TW202217953A
(en)
|
2020-06-30 |
2022-05-01 |
荷蘭商Asm Ip私人控股有限公司 |
Substrate processing method
|
TW202219628A
(en)
|
2020-07-17 |
2022-05-16 |
荷蘭商Asm Ip私人控股有限公司 |
Structures and methods for use in photolithography
|
TW202204662A
(en)
|
2020-07-20 |
2022-02-01 |
荷蘭商Asm Ip私人控股有限公司 |
Method and system for depositing molybdenum layers
|
US11725280B2
(en)
|
2020-08-26 |
2023-08-15 |
Asm Ip Holding B.V. |
Method for forming metal silicon oxide and metal silicon oxynitride layers
|
USD990534S1
(en)
|
2020-09-11 |
2023-06-27 |
Asm Ip Holding B.V. |
Weighted lift pin
|
USD1012873S1
(en)
|
2020-09-24 |
2024-01-30 |
Asm Ip Holding B.V. |
Electrode for semiconductor processing apparatus
|
TW202229613A
(en)
|
2020-10-14 |
2022-08-01 |
荷蘭商Asm Ip私人控股有限公司 |
Method of depositing material on stepped structure
|
TW202217037A
(en)
|
2020-10-22 |
2022-05-01 |
荷蘭商Asm Ip私人控股有限公司 |
Method of depositing vanadium metal, structure, device and a deposition assembly
|
TW202223136A
(en)
|
2020-10-28 |
2022-06-16 |
荷蘭商Asm Ip私人控股有限公司 |
Method for forming layer on substrate, and semiconductor processing system
|
WO2022103583A1
(en)
*
|
2020-11-10 |
2022-05-19 |
Applied Materials, Inc. |
Polishing head with local wafer pressure
|
TW202235675A
(en)
|
2020-11-30 |
2022-09-16 |
荷蘭商Asm Ip私人控股有限公司 |
Injector, and substrate processing apparatus
|
USD940765S1
(en)
|
2020-12-02 |
2022-01-11 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
CN114639631A
(en)
|
2020-12-16 |
2022-06-17 |
Asm Ip私人控股有限公司 |
Fixing device for measuring jumping and swinging
|
JP1692349S
(en)
*
|
2020-12-18 |
2021-08-10 |
|
|
TW202231903A
(en)
|
2020-12-22 |
2022-08-16 |
荷蘭商Asm Ip私人控股有限公司 |
Transition metal deposition method, transition metal layer, and deposition assembly for depositing transition metal on substrate
|
USD1007449S1
(en)
|
2021-05-07 |
2023-12-12 |
Applied Materials, Inc. |
Target profile for a physical vapor deposition chamber target
|
USD981973S1
(en)
|
2021-05-11 |
2023-03-28 |
Asm Ip Holding B.V. |
Reactor wall for substrate processing apparatus
|
USD980814S1
(en)
|
2021-05-11 |
2023-03-14 |
Asm Ip Holding B.V. |
Gas distributor for substrate processing apparatus
|
USD980813S1
(en)
|
2021-05-11 |
2023-03-14 |
Asm Ip Holding B.V. |
Gas flow control plate for substrate processing apparatus
|
US20220362903A1
(en)
*
|
2021-05-12 |
2022-11-17 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
Multiple polishing heads with cross-zone pressure element distributions for cmp
|
USD990441S1
(en)
|
2021-09-07 |
2023-06-27 |
Asm Ip Holding B.V. |
Gas flow control plate
|