JP2004363564A - 蛍光多層を有する発光ダイオード素子 - Google Patents
蛍光多層を有する発光ダイオード素子 Download PDFInfo
- Publication number
- JP2004363564A JP2004363564A JP2004128298A JP2004128298A JP2004363564A JP 2004363564 A JP2004363564 A JP 2004363564A JP 2004128298 A JP2004128298 A JP 2004128298A JP 2004128298 A JP2004128298 A JP 2004128298A JP 2004363564 A JP2004363564 A JP 2004363564A
- Authority
- JP
- Japan
- Prior art keywords
- light
- fluorescent
- emitting diode
- emits
- fluorescent layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 59
- 239000000126 substance Substances 0.000 claims description 48
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 20
- 230000005284 excitation Effects 0.000 claims description 20
- 239000003086 colorant Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 abstract description 47
- 239000010410 layer Substances 0.000 description 149
- 229920005989 resin Polymers 0.000 description 42
- 239000011347 resin Substances 0.000 description 42
- 239000003822 epoxy resin Substances 0.000 description 15
- 229920000647 polyepoxide Polymers 0.000 description 15
- 239000000203 mixture Substances 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 238000002474 experimental method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 229920002050 silicone resin Polymers 0.000 description 4
- 239000002356 single layer Substances 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 2
- 229910015802 BaSr Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
【解決手段】 励起光を放出する発光ダイオードチップと、前記発光ダイオードチップを多層で覆うように形成され、前記励起光により励起されると各層別に相異なる色を放出する複数の蛍光層から構成される蛍光多層とを備え、前記蛍光多層は、前記発光ダイオードチップに近い層になるほど長い波長の光を放出し、前記発光ダイオードチップから遠い層になるほど短い波長の光を放出するように形成される発光ダイオード素子である。このようなLED素子は、光変換効率が向上して、出力される光量が多くなる。
【選択図】図5A
Description
101 マウントリード、
101a カップ、
102 インナーリード、
103 ワイヤ、
104 透明樹脂、
110 LEDチップ、
120 蛍光多層、
121 第1蛍光層、
122 第2蛍光層、
123 第3蛍光層。
Claims (13)
- 励起光を放出する発光ダイオードチップと、
前記発光ダイオードチップを多層で覆うように形成され、前記励起光により励起されると各層別に相異なる色を放出する複数の蛍光層から構成される蛍光多層とを備え、
前記蛍光多層は、前記発光ダイオードチップに近い層になるほど長い波長の光を放出し、前記発光ダイオードチップから遠い層になるほど短い波長の光を放出するように形成される発光ダイオード素子。 - 前記発光ダイオードチップから放出される励起光は、紫外線である、請求項1に記載の発光ダイオード素子。
- 前記蛍光多層は、前記発光ダイオードチップ上に形成されて赤色光を放出する第1蛍光層と、前記第1蛍光層上に積層されて緑色光を放出する第2蛍光層と、前記第2蛍光層上に積層されて青色光を放出する第3蛍光層とを有する、請求項1または2に記載の発光ダイオード素子。
- 前記第1蛍光層は580nm〜700nmの波長を有する赤色光を放出する蛍光物質を含み、前記第2蛍光層は500nm〜550nmの波長を有する緑色光を放出する蛍光物質を含み、前記第3蛍光層は420nm〜480nmの波長を有する青色光を放出する蛍光物質を含む、請求項3に記載の発光ダイオード素子。
- 前記蛍光多層は、前記発光ダイオードチップ上に形成されて赤色光を放出する第1蛍光層と、前記第1蛍光層上に積層されて緑色光及び青色光を放出する第2蛍光層とを有する、請求項1または2に記載の発光ダイオード素子。
- 前記第1蛍光層は580nm〜700nmの波長を有する赤色光を放出する蛍光物質を含み、前記第2蛍光層は500nm〜550nmの波長を有する緑色光及び420nm〜480nmの波長を有する青色光を放出する蛍光物質を含む、請求項5に記載の発光ダイオード素子。
- 前記蛍光多層は、前記発光ダイオードチップ上に形成されて黄色光を放出する第1蛍光層と、前記第1蛍光層上に積層されて青色光を放出する第2蛍光層とを有する、請求項1または2に記載の発光ダイオード素子。
- 前記第1蛍光層は560nm〜580nmの波長を有する黄色光を放出する蛍光物質を含む、前記第2蛍光層は420nm〜480nmの波長を有する青色光を放出する蛍光物質を含む、請求項7に記載の発光ダイオード素子。
- 前記発光ダイオードチップから放出される励起光は、青色光である、請求項1に記載の発光ダイオード素子。
- 前記蛍光多層は、前記発光ダイオードチップ上に形成されて赤色光を放出する第1蛍光層と、前記第1蛍光層上に積層されて緑色光を放出する第2蛍光層とを有する、請求項1または9に記載の発光ダイオード素子。
- 前記第1蛍光層は580nm〜700nmの波長を有する赤色光を放出する蛍光物質を含み、前記第2蛍光層は500nm〜550nmの波長を有する緑色光を放出する蛍光物質を含む、請求項10に記載の発光ダイオード素子。
- 前記蛍光多層は、前記発光ダイオードチップ上に形成されて赤色光を放出する第1蛍光層と、前記第1蛍光層上に積層されて黄色光を放出する第2蛍光層とを有する、請求項1、9または11に記載の発光ダイオード素子。
- 前記第1蛍光層は580nm〜700nmの波長を有する赤色光を放出する蛍光物質を含み、前記第2蛍光層は560nm〜580nmの波長を有する黄色光を放出する蛍光物質を含む、請求項12に記載の発光ダイオード素子。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030027546A KR100691143B1 (ko) | 2003-04-30 | 2003-04-30 | 다층 형광층을 가진 발광 다이오드 소자 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2004363564A true JP2004363564A (ja) | 2004-12-24 |
Family
ID=33095652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004128298A Pending JP2004363564A (ja) | 2003-04-30 | 2004-04-23 | 蛍光多層を有する発光ダイオード素子 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20040217692A1 (ja) |
EP (1) | EP1480278B1 (ja) |
JP (1) | JP2004363564A (ja) |
KR (1) | KR100691143B1 (ja) |
CN (1) | CN100370629C (ja) |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006313902A (ja) * | 2005-05-02 | 2006-11-16 | Samsung Electro Mech Co Ltd | 白色発光素子 |
KR100649704B1 (ko) | 2005-09-05 | 2006-11-27 | 삼성전기주식회사 | 발광 다이오드 패키지 및 그 제조방법 |
JP2006343409A (ja) * | 2005-06-07 | 2006-12-21 | Seiko Instruments Inc | 照明装置およびそれを用いた表示装置 |
JP2006352037A (ja) * | 2005-06-20 | 2006-12-28 | Rohm Co Ltd | 白色半導体発光素子およびその製法 |
WO2006137359A1 (ja) * | 2005-06-20 | 2006-12-28 | Rohm Co., Ltd. | 白色半導体発光素子およびその製法 |
JP2006352036A (ja) * | 2005-06-20 | 2006-12-28 | Rohm Co Ltd | 白色半導体発光素子 |
JP2007080872A (ja) * | 2005-09-09 | 2007-03-29 | Matsushita Electric Works Ltd | 発光装置 |
JP2007088261A (ja) * | 2005-09-22 | 2007-04-05 | Sanyo Electric Co Ltd | 発光装置 |
JP2007103512A (ja) * | 2005-09-30 | 2007-04-19 | Kyocera Corp | 発光装置 |
JP2008235824A (ja) * | 2007-03-23 | 2008-10-02 | Sharp Corp | 発光装置およびその製造方法 |
JP2008539566A (ja) * | 2005-04-26 | 2008-11-13 | パテント−トロイハント−ゲゼルシヤフト フユール エレクトリツシエ グリユーラムペン ミツト ベシユレンクテル ハフツング | 発光変換led |
JP2009506557A (ja) * | 2005-08-30 | 2009-02-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトロニクスデバイス |
JP2009094199A (ja) * | 2007-10-05 | 2009-04-30 | Sharp Corp | 発光装置、面光源、表示装置と、その製造方法 |
WO2009144922A1 (ja) * | 2008-05-30 | 2009-12-03 | 株式会社 東芝 | 白色ledおよびそれを用いたバックライトならびに液晶表示装置 |
WO2013038953A1 (ja) * | 2011-09-14 | 2013-03-21 | エムテックスマート株式会社 | Ledの製造方法、ledの製造装置およびled |
WO2014203479A1 (ja) * | 2013-06-21 | 2014-12-24 | パナソニックIpマネジメント株式会社 | 光源、及び光源を具備する車両用ヘッドランプ |
JP2018018931A (ja) * | 2016-07-27 | 2018-02-01 | 日亜化学工業株式会社 | 発光装置 |
Families Citing this family (79)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6995402B2 (en) * | 2003-10-03 | 2006-02-07 | Lumileds Lighting, U.S., Llc | Integrated reflector cup for a light emitting device mount |
JP4654670B2 (ja) * | 2003-12-16 | 2011-03-23 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
US20080231170A1 (en) * | 2004-01-26 | 2008-09-25 | Fukudome Masato | Wavelength Converter, Light-Emitting Device, Method of Producing Wavelength Converter and Method of Producing Light-Emitting Device |
ATE480605T1 (de) * | 2004-02-20 | 2010-09-15 | Lumination Llc | Regeln für effiziente lichtquellen mit mittels leuchtstoff konvertierten leds |
JP2006114854A (ja) * | 2004-10-18 | 2006-04-27 | Sharp Corp | 半導体発光装置、液晶表示装置用のバックライト装置 |
JP2006135002A (ja) * | 2004-11-04 | 2006-05-25 | Koito Mfg Co Ltd | 発光デバイス及び車両用灯具 |
KR100781924B1 (ko) * | 2004-12-02 | 2007-12-04 | 주식회사 에스티앤아이 | 2개의 형광체를 이용한 고출력 백색 발광 다이오드 소자 |
JP4582095B2 (ja) | 2004-12-17 | 2010-11-17 | 宇部興産株式会社 | 光変換構造体およびそれを利用した発光装置 |
TWI239671B (en) * | 2004-12-30 | 2005-09-11 | Ind Tech Res Inst | LED applied with omnidirectional reflector |
JP2006278980A (ja) * | 2005-03-30 | 2006-10-12 | Sanyo Electric Co Ltd | 半導体発光装置 |
US7598663B2 (en) * | 2005-08-04 | 2009-10-06 | Taiwan Oasis Technology Co., Ltd. | Multi-wavelength LED provided with combined fluorescent materials positioned over and underneath the LED component |
US7329907B2 (en) | 2005-08-12 | 2008-02-12 | Avago Technologies, Ecbu Ip Pte Ltd | Phosphor-converted LED devices having improved light distribution uniformity |
US8441179B2 (en) * | 2006-01-20 | 2013-05-14 | Cree, Inc. | Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources |
CN100411210C (zh) * | 2006-03-03 | 2008-08-13 | 中山大学 | 一种白光led的封装方法 |
DE102006024165A1 (de) * | 2006-05-23 | 2007-11-29 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Optoelektronischer Halbleiterchip mit einem Wellenlängenkonversionsstoff sowie optoelektronisches Halbleiterbauelement mit einem solchen Halbleiterchip und Verfahren zur Herstellung des optoelektronischen Halbleiterchips |
JP5033558B2 (ja) * | 2006-09-28 | 2012-09-26 | 三洋電機株式会社 | 発光装置 |
US9048400B2 (en) * | 2006-10-12 | 2015-06-02 | Panasonic Intellectual Property Management Co., Ltd. | Light-emitting device with a wavelength converting layer and method for manufacturing the same |
US8652040B2 (en) | 2006-12-19 | 2014-02-18 | Valencell, Inc. | Telemetric apparatus for health and environmental monitoring |
US8157730B2 (en) | 2006-12-19 | 2012-04-17 | Valencell, Inc. | Physiological and environmental monitoring systems and methods |
KR101258228B1 (ko) * | 2006-12-28 | 2013-04-25 | 서울반도체 주식회사 | 복수개의 파장변환 물질층들을 갖는 발광 소자 |
WO2008085411A2 (en) * | 2006-12-27 | 2008-07-17 | Valencell, Inc. | Multi-wavelength optical devices and methods of using same |
TWI326923B (en) * | 2007-03-07 | 2010-07-01 | Lite On Technology Corp | White light emitting diode |
JP4753904B2 (ja) | 2007-03-15 | 2011-08-24 | シャープ株式会社 | 発光装置 |
US7687816B2 (en) * | 2007-03-20 | 2010-03-30 | International Business Machines Corporation | Light emitting diode |
JP5044329B2 (ja) * | 2007-08-31 | 2012-10-10 | 株式会社東芝 | 発光装置 |
DE102007057710B4 (de) * | 2007-09-28 | 2024-03-14 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierendes Bauelement mit Konversionselement |
US8251903B2 (en) | 2007-10-25 | 2012-08-28 | Valencell, Inc. | Noninvasive physiological analysis using excitation-sensor modules and related devices and methods |
JP2009153712A (ja) | 2007-12-26 | 2009-07-16 | Olympus Corp | 光源装置およびそれを備えた内視鏡装置 |
TWI363851B (en) * | 2008-03-28 | 2012-05-11 | Ind Tech Res Inst | Lighting device and assembling method thereof |
JP2009245981A (ja) * | 2008-03-28 | 2009-10-22 | Toyota Central R&D Labs Inc | Led発光装置 |
CN101551077B (zh) * | 2008-04-03 | 2011-11-30 | 财团法人工业技术研究院 | 发光装置与应用其的背光装置及其组装方法 |
DE102008021666A1 (de) * | 2008-04-30 | 2009-11-05 | Ledon Lighting Jennersdorf Gmbh | Lichtemittierende Vorrichtung und Verfahren zur Herstellung einer lichtemittierenden Vorrichtung |
KR101505430B1 (ko) * | 2008-06-30 | 2015-03-31 | 서울반도체 주식회사 | Led 패키지 |
WO2010017831A1 (de) | 2008-08-11 | 2010-02-18 | Osram Gesellschaft mit beschränkter Haftung | Konversions led |
JP5284006B2 (ja) * | 2008-08-25 | 2013-09-11 | シチズン電子株式会社 | 発光装置 |
EP2164302A1 (de) | 2008-09-12 | 2010-03-17 | Ilford Imaging Switzerland Gmbh | Optisches Element und Verfahren zu seiner Herstellung |
CN101814559B (zh) * | 2009-02-19 | 2012-08-08 | 旭丽电子(广州)有限公司 | 发光二极管装置及其制作方法 |
US9750462B2 (en) | 2009-02-25 | 2017-09-05 | Valencell, Inc. | Monitoring apparatus and methods for measuring physiological and/or environmental conditions |
US8788002B2 (en) | 2009-02-25 | 2014-07-22 | Valencell, Inc. | Light-guiding devices and monitoring devices incorporating same |
US8700111B2 (en) | 2009-02-25 | 2014-04-15 | Valencell, Inc. | Light-guiding devices and monitoring devices incorporating same |
CN102356479A (zh) | 2009-03-19 | 2012-02-15 | 皇家飞利浦电子股份有限公司 | 具有远端发光材料的照明设备 |
KR101172143B1 (ko) * | 2009-08-10 | 2012-08-07 | 엘지이노텍 주식회사 | 백색 발광다이오드 소자용 시온계 산화질화물 형광체, 그의 제조방법 및 그를 이용한 백색 led 소자 |
KR101163902B1 (ko) * | 2010-08-10 | 2012-07-09 | 엘지이노텍 주식회사 | 발광 소자 |
WO2011028033A2 (ko) | 2009-09-02 | 2011-03-10 | 엘지이노텍주식회사 | 형광체, 형광체 제조방법 및 백색 발광 소자 |
CN102237477A (zh) * | 2010-04-29 | 2011-11-09 | 财团法人工业技术研究院 | 多层堆栈封装的发光二极管 |
CN101899301B (zh) * | 2010-06-25 | 2014-02-19 | 海洋王照明科技股份有限公司 | Led发光材料、led发光装置及制作方法 |
JP5593163B2 (ja) | 2010-08-18 | 2014-09-17 | 昭和電工株式会社 | 発光ダイオード及び発光ダイオードランプ |
CN102487116B (zh) * | 2010-12-03 | 2014-11-05 | 展晶科技(深圳)有限公司 | 发光二极管 |
CN102569593A (zh) * | 2010-12-22 | 2012-07-11 | 展晶科技(深圳)有限公司 | 发光二极管 |
US8888701B2 (en) | 2011-01-27 | 2014-11-18 | Valencell, Inc. | Apparatus and methods for monitoring physiological data during environmental interference |
CN102169951A (zh) * | 2011-01-28 | 2011-08-31 | 晶科电子(广州)有限公司 | 一种提高发光效率的led封装结构及其制造方法 |
CN102646761B (zh) * | 2011-02-21 | 2014-10-15 | 展晶科技(深圳)有限公司 | Led封装制程 |
CN102683542B (zh) * | 2011-03-15 | 2014-12-10 | 展晶科技(深圳)有限公司 | Led封装结构 |
KR101212654B1 (ko) * | 2011-05-20 | 2012-12-14 | (주)라이타이저코리아 | 발광 다이오드 패키지 및 그의 제조 방법 |
US8986842B2 (en) | 2011-05-24 | 2015-03-24 | Ecole Polytechnique Federale De Lausanne (Epfl) | Color conversion films comprising polymer-substituted organic fluorescent dyes |
WO2013016007A2 (en) | 2011-07-25 | 2013-01-31 | Valencell, Inc. | Apparatus and methods for estimating time-state physiological parameters |
EP3222210B1 (en) | 2011-08-02 | 2024-09-25 | Yukka Magic LLC | Systems and methods for variable filter adjustment by heart rate metric feedback |
CN102916114B (zh) * | 2011-08-05 | 2016-04-20 | 赛恩倍吉科技顾问(深圳)有限公司 | 发光二极管 |
CN202371641U (zh) * | 2011-10-14 | 2012-08-08 | 郑榕彬 | 具有双层荧光粉的led灯 |
CN103375708B (zh) * | 2012-04-26 | 2015-10-28 | 展晶科技(深圳)有限公司 | 发光二极管灯源装置 |
EP2789672B1 (en) * | 2012-05-01 | 2016-12-14 | National Institute for Materials Science | Optical material and production method therefor, and light emitting diode, optical isolator, and optical processing apparatus which use said optical material |
WO2014116924A1 (en) | 2013-01-28 | 2014-07-31 | Valencell, Inc. | Physiological monitoring devices having sensing elements decoupled from body motion |
CN103337584A (zh) * | 2013-06-06 | 2013-10-02 | 河北神通光电科技有限公司 | 一种白光led及其封装方法 |
CN103996787A (zh) * | 2014-02-19 | 2014-08-20 | 浙江英特来光电科技有限公司 | 一种高显指高光效白光led结构 |
JP7010589B2 (ja) * | 2014-06-27 | 2022-01-26 | 株式会社キーエンス | 多波長共焦点測定装置 |
US9538921B2 (en) | 2014-07-30 | 2017-01-10 | Valencell, Inc. | Physiological monitoring devices with adjustable signal analysis and interrogation power and monitoring methods using same |
KR20160017849A (ko) * | 2014-08-06 | 2016-02-17 | 서울바이오시스 주식회사 | 고출력 발광 장치 및 그 제조 방법 |
EP4360552A3 (en) | 2014-08-06 | 2024-07-10 | Yukka Magic LLC | Optical physiological sensor modules with reduced signal noise |
WO2016022707A1 (en) * | 2014-08-06 | 2016-02-11 | Cree, Inc. | Multi-layer conversion material for down conversion in solid state lighting |
CN104409602A (zh) * | 2014-09-04 | 2015-03-11 | 郑榕彬 | 一种高显色指数的led灯 |
US9794653B2 (en) | 2014-09-27 | 2017-10-17 | Valencell, Inc. | Methods and apparatus for improving signal quality in wearable biometric monitoring devices |
US10945618B2 (en) | 2015-10-23 | 2021-03-16 | Valencell, Inc. | Physiological monitoring devices and methods for noise reduction in physiological signals based on subject activity type |
WO2017070463A1 (en) | 2015-10-23 | 2017-04-27 | Valencell, Inc. | Physiological monitoring devices and methods that identify subject activity type |
CN105449078A (zh) * | 2015-12-21 | 2016-03-30 | 华中科技大学 | 一种白光led及其制备方法 |
WO2018009736A1 (en) | 2016-07-08 | 2018-01-11 | Valencell, Inc. | Motion-dependent averaging for physiological metric estimating systems and methods |
KR102362004B1 (ko) * | 2017-03-24 | 2022-02-15 | 엘지이노텍 주식회사 | 반도체 소자 패키지 |
TWI757315B (zh) * | 2017-07-28 | 2022-03-11 | 晶元光電股份有限公司 | 發光裝置以及其製造方法 |
TWI717674B (zh) * | 2019-01-04 | 2021-02-01 | 友達光電股份有限公司 | 發光裝置及照明模組 |
CN115799433B (zh) * | 2023-01-09 | 2024-09-10 | 四川世纪和光科技发展有限公司 | 一种红光封装结构、红光led光源及封装方法 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2949014A (en) * | 1958-06-02 | 1960-08-16 | Whirlpool Co | Thermoelectric air conditioning apparatus |
US3602758A (en) * | 1969-06-20 | 1971-08-31 | Westinghouse Electric Corp | Phosphor blend lamps which reduce the proportions of the costlier phosphors |
JPS579319U (ja) * | 1980-06-14 | 1982-01-18 | ||
US4536198A (en) * | 1982-11-15 | 1985-08-20 | Hydro-Dri Systems, Inc. | Moisture control device |
US4700550A (en) * | 1986-03-10 | 1987-10-20 | Rhodes Barry V | Enthalpic heat pump desiccant air conditioning system |
US4654057A (en) * | 1986-04-01 | 1987-03-31 | Rhodes Barry V | Dehumidifier |
US4879492A (en) * | 1988-09-30 | 1989-11-07 | North American Philips Corp. | Fluorescent lamp having a multi-layer phosphor optimized for lumen output, color rendering and cost |
US5373704A (en) * | 1990-04-17 | 1994-12-20 | Arthur D. Little, Inc. | Desiccant dehumidifier |
US5230719A (en) * | 1990-05-15 | 1993-07-27 | Erling Berner | Dehumidification apparatus |
JP3149444B2 (ja) * | 1991-01-30 | 2001-03-26 | 東芝ライテック株式会社 | 低圧水銀蒸気放電灯 |
US5297398A (en) * | 1991-07-05 | 1994-03-29 | Milton Meckler | Polymer desiccant and system for dehumidified air conditioning |
US5661983A (en) * | 1995-06-02 | 1997-09-02 | Energy International, Inc. | Fluidized bed desiccant cooling system |
US5799728A (en) * | 1996-04-30 | 1998-09-01 | Memc Electric Materials, Inc. | Dehumidifier |
TW383508B (en) * | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
US5817167A (en) * | 1996-08-21 | 1998-10-06 | Des Champs Laboratories Incorporated | Desiccant based dehumidifier |
US5813753A (en) * | 1997-05-27 | 1998-09-29 | Philips Electronics North America Corporation | UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light |
WO1999000175A1 (fr) * | 1997-06-30 | 1999-01-07 | Sanyo Electric Co., Ltd. | Dispositif adsorbant, procede de desodorisation utilisant ce dispositif, et procede d'apport d'oxygene a haute concentration |
US6252254B1 (en) * | 1998-02-06 | 2001-06-26 | General Electric Company | Light emitting device with phosphor composition |
US6580097B1 (en) * | 1998-02-06 | 2003-06-17 | General Electric Company | Light emitting device with phosphor composition |
US6501091B1 (en) | 1998-04-01 | 2002-12-31 | Massachusetts Institute Of Technology | Quantum dot white and colored light emitting diodes |
JP3486345B2 (ja) | 1998-07-14 | 2004-01-13 | 東芝電子エンジニアリング株式会社 | 半導体発光装置 |
US6696703B2 (en) * | 1999-09-27 | 2004-02-24 | Lumileds Lighting U.S., Llc | Thin film phosphor-converted light emitting diode device |
KR20000007067A (ko) * | 1999-11-23 | 2000-02-07 | 김창태 | 형광물질을 가진 엘이디 패키지 제조방법 |
KR20010068371A (ko) * | 2000-01-05 | 2001-07-23 | 박종만 | 형광 물질을 이용한 복합 파장의 빛을 내는 발광 반도체소자 |
KR100372834B1 (ko) * | 2000-05-25 | 2003-02-19 | 에이프로시스템즈 (주) | 형광 물질을 이용한 복합 파장의 광을 발생시키는 발광반도체 소자 |
US6737681B2 (en) * | 2001-08-22 | 2004-05-18 | Nichia Corporation | Light emitting device with fluorescent member excited by semiconductor light emitting element |
US6434942B1 (en) * | 2001-09-20 | 2002-08-20 | Walter T. Charlton | Building, or other self-supporting structure, incorporating multi-stage system for energy generation |
SG173925A1 (en) * | 2002-03-22 | 2011-09-29 | Nichia Corp | Nitride phosphor and production process thereof, and light emitting device |
-
2003
- 2003-04-30 KR KR1020030027546A patent/KR100691143B1/ko not_active IP Right Cessation
-
2004
- 2004-04-23 JP JP2004128298A patent/JP2004363564A/ja active Pending
- 2004-04-28 US US10/833,053 patent/US20040217692A1/en not_active Abandoned
- 2004-04-29 EP EP04252504.8A patent/EP1480278B1/en not_active Expired - Lifetime
- 2004-04-30 CN CNB2004100420837A patent/CN100370629C/zh not_active Expired - Fee Related
Cited By (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008539566A (ja) * | 2005-04-26 | 2008-11-13 | パテント−トロイハント−ゲゼルシヤフト フユール エレクトリツシエ グリユーラムペン ミツト ベシユレンクテル ハフツング | 発光変換led |
JP2006313902A (ja) * | 2005-05-02 | 2006-11-16 | Samsung Electro Mech Co Ltd | 白色発光素子 |
JP2006343409A (ja) * | 2005-06-07 | 2006-12-21 | Seiko Instruments Inc | 照明装置およびそれを用いた表示装置 |
JP2006352036A (ja) * | 2005-06-20 | 2006-12-28 | Rohm Co Ltd | 白色半導体発光素子 |
WO2006137359A1 (ja) * | 2005-06-20 | 2006-12-28 | Rohm Co., Ltd. | 白色半導体発光素子およびその製法 |
JP2006352037A (ja) * | 2005-06-20 | 2006-12-28 | Rohm Co Ltd | 白色半導体発光素子およびその製法 |
JP2009506557A (ja) * | 2005-08-30 | 2009-02-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | オプトエレクトロニクスデバイス |
KR100649704B1 (ko) | 2005-09-05 | 2006-11-27 | 삼성전기주식회사 | 발광 다이오드 패키지 및 그 제조방법 |
JP2007080872A (ja) * | 2005-09-09 | 2007-03-29 | Matsushita Electric Works Ltd | 発光装置 |
JP2007088261A (ja) * | 2005-09-22 | 2007-04-05 | Sanyo Electric Co Ltd | 発光装置 |
JP2007103512A (ja) * | 2005-09-30 | 2007-04-19 | Kyocera Corp | 発光装置 |
JP2008235824A (ja) * | 2007-03-23 | 2008-10-02 | Sharp Corp | 発光装置およびその製造方法 |
JP2009094199A (ja) * | 2007-10-05 | 2009-04-30 | Sharp Corp | 発光装置、面光源、表示装置と、その製造方法 |
WO2009144922A1 (ja) * | 2008-05-30 | 2009-12-03 | 株式会社 東芝 | 白色ledおよびそれを用いたバックライトならびに液晶表示装置 |
US8288937B2 (en) | 2008-05-30 | 2012-10-16 | Kabushiki Kaisha Toshiba | White LED, and backlight and liquid crystal display device using the same |
WO2013038953A1 (ja) * | 2011-09-14 | 2013-03-21 | エムテックスマート株式会社 | Ledの製造方法、ledの製造装置およびled |
JPWO2013038953A1 (ja) * | 2011-09-14 | 2015-03-26 | エムテックスマート株式会社 | Ledの製造方法、ledの製造装置およびled |
US9064979B2 (en) | 2011-09-14 | 2015-06-23 | Mtek-Smart Corporation | Method for manufacturing LED |
WO2014203479A1 (ja) * | 2013-06-21 | 2014-12-24 | パナソニックIpマネジメント株式会社 | 光源、及び光源を具備する車両用ヘッドランプ |
JP2018018931A (ja) * | 2016-07-27 | 2018-02-01 | 日亜化学工業株式会社 | 発光装置 |
Also Published As
Publication number | Publication date |
---|---|
EP1480278A3 (en) | 2006-08-16 |
US20040217692A1 (en) | 2004-11-04 |
KR100691143B1 (ko) | 2007-03-09 |
CN100370629C (zh) | 2008-02-20 |
EP1480278A2 (en) | 2004-11-24 |
EP1480278B1 (en) | 2013-06-19 |
CN1542991A (zh) | 2004-11-03 |
KR20040093609A (ko) | 2004-11-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2004363564A (ja) | 蛍光多層を有する発光ダイオード素子 | |
JP3717480B2 (ja) | 半導体発光装置 | |
JP5042999B2 (ja) | 色不足分を補償する発光材料を備えた照明システム | |
KR101247020B1 (ko) | 발광 장치 | |
JP4048116B2 (ja) | 発光素子を備えた光源 | |
JP4559496B2 (ja) | 発光装置 | |
US7859182B2 (en) | Warm white LED-based lamp incoporating divalent EU-activated silicate yellow emitting phosphor | |
JP4350183B2 (ja) | 半導体発光装置 | |
JP4477854B2 (ja) | 蛍光体変換発光デバイス | |
EP2610930B1 (en) | Multichip white led device | |
JP7291800B2 (ja) | Ledフィラメント及びledフィラメント電球 | |
US20140285996A1 (en) | White light apparatus with enhanced color contrast | |
JP5398657B2 (ja) | 発光デバイス | |
JP2005020010A (ja) | 白色発光デバイス | |
JP2005019997A (ja) | 白色発光デバイス | |
JP2008071806A (ja) | 発光装置 | |
JP2007049114A (ja) | 発光装置とその製造方法 | |
JP6496725B2 (ja) | 赤色発光蛍光体を有するledパッケージ | |
TW200522396A (en) | Light emitting devices with enhanced luminous efficiency | |
JP2008270781A (ja) | 発光装置 | |
JP2011151419A (ja) | 発光装置とその製造方法 | |
US20240117946A1 (en) | LED-Filaments and LED-Filament Lamps | |
JP2005302920A (ja) | 発光装置 | |
JP2009111273A (ja) | 発光装置 | |
JP2017017132A (ja) | 発光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20041207 |
|
A711 | Notification of change in applicant |
Free format text: JAPANESE INTERMEDIATE CODE: A711 Effective date: 20041207 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A821 Effective date: 20041207 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20050608 |
|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060223 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070410 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070918 |