CN1542991A - 具有荧光多层结构的发光二极管装置 - Google Patents
具有荧光多层结构的发光二极管装置 Download PDFInfo
- Publication number
- CN1542991A CN1542991A CNA2004100420837A CN200410042083A CN1542991A CN 1542991 A CN1542991 A CN 1542991A CN A2004100420837 A CNA2004100420837 A CN A2004100420837A CN 200410042083 A CN200410042083 A CN 200410042083A CN 1542991 A CN1542991 A CN 1542991A
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- Prior art keywords
- fluorescence coating
- led
- light
- fluorescence
- emission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000003086 colorant Substances 0.000 claims abstract description 6
- 230000005284 excitation Effects 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims description 157
- 239000011248 coating agent Substances 0.000 claims description 151
- 239000000463 material Substances 0.000 claims description 82
- 239000011159 matrix material Substances 0.000 claims description 80
- 238000010276 construction Methods 0.000 claims description 36
- 230000003287 optical effect Effects 0.000 claims description 5
- 238000006243 chemical reaction Methods 0.000 abstract description 34
- 239000000203 mixture Substances 0.000 description 14
- 239000003822 epoxy resin Substances 0.000 description 9
- 229920000647 polyepoxide Polymers 0.000 description 9
- 229920001296 polysiloxane Polymers 0.000 description 9
- 238000010586 diagram Methods 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- ASNHGEVAWNWCRQ-UHFFFAOYSA-N 4-(hydroxymethyl)oxolane-2,3,4-triol Chemical compound OCC1(O)COC(O)C1O ASNHGEVAWNWCRQ-UHFFFAOYSA-N 0.000 description 1
- 229910015802 BaSr Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 229910052691 Erbium Inorganic materials 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000002223 garnet Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
Description
Claims (13)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020030027546A KR100691143B1 (ko) | 2003-04-30 | 2003-04-30 | 다층 형광층을 가진 발광 다이오드 소자 |
KR27546/03 | 2003-04-30 | ||
KR27546/2003 | 2003-04-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1542991A true CN1542991A (zh) | 2004-11-03 |
CN100370629C CN100370629C (zh) | 2008-02-20 |
Family
ID=33095652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100420837A Expired - Fee Related CN100370629C (zh) | 2003-04-30 | 2004-04-30 | 具有荧光多层结构的发光二极管装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20040217692A1 (zh) |
EP (1) | EP1480278B1 (zh) |
JP (1) | JP2004363564A (zh) |
KR (1) | KR100691143B1 (zh) |
CN (1) | CN100370629C (zh) |
Cited By (20)
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CN100411210C (zh) * | 2006-03-03 | 2008-08-13 | 中山大学 | 一种白光led的封装方法 |
CN100452454C (zh) * | 2004-11-04 | 2009-01-14 | 株式会社小糸制作所 | 发光设备及车辆用灯具 |
CN101899301A (zh) * | 2010-06-25 | 2010-12-01 | 海洋王照明科技股份有限公司 | Led发光材料、led发光装置及制作方法 |
CN101545610B (zh) * | 2008-03-28 | 2011-06-15 | 丰田合成株式会社 | 包括发光二极管的发光器件 |
US7982233B2 (en) | 2006-05-23 | 2011-07-19 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip comprising a wavelength conversion substance, and optoelectronic semiconductor component comprising such a semiconductor chip, and method for producing the optoelectronic semiconductor chip |
CN102169951A (zh) * | 2011-01-28 | 2011-08-31 | 晶科电子(广州)有限公司 | 一种提高发光效率的led封装结构及其制造方法 |
CN102237477A (zh) * | 2010-04-29 | 2011-11-09 | 财团法人工业技术研究院 | 多层堆栈封装的发光二极管 |
CN101167195B (zh) * | 2005-04-26 | 2012-03-14 | 电灯专利信托有限公司 | 荧光转换发光二极管 |
CN102487116A (zh) * | 2010-12-03 | 2012-06-06 | 展晶科技(深圳)有限公司 | 发光二极管 |
CN101814559B (zh) * | 2009-02-19 | 2012-08-08 | 旭丽电子(广州)有限公司 | 发光二极管装置及其制作方法 |
WO2013053286A1 (en) * | 2011-10-14 | 2013-04-18 | Yung Pun Cheng | Led lamp having two layers of fluorescent powder |
CN103337584A (zh) * | 2013-06-06 | 2013-10-02 | 河北神通光电科技有限公司 | 一种白光led及其封装方法 |
CN103996787A (zh) * | 2014-02-19 | 2014-08-20 | 浙江英特来光电科技有限公司 | 一种高显指高光效白光led结构 |
CN104409602A (zh) * | 2014-09-04 | 2015-03-11 | 郑榕彬 | 一种高显色指数的led灯 |
CN105374915A (zh) * | 2014-08-06 | 2016-03-02 | 首尔伟傲世有限公司 | 高功率发光装置 |
CN105449078A (zh) * | 2015-12-21 | 2016-03-30 | 华中科技大学 | 一种白光led及其制备方法 |
CN106796974A (zh) * | 2014-08-06 | 2017-05-31 | 克利公司 | 用于固态照明中的下转换的多层转换材料 |
CN109309153A (zh) * | 2017-07-28 | 2019-02-05 | 晶元光电股份有限公司 | 发光装置以及其制造方法 |
CN110131596A (zh) * | 2019-01-04 | 2019-08-16 | 友达光电股份有限公司 | 发光装置及照明模组 |
CN110196020A (zh) * | 2014-06-27 | 2019-09-03 | 株式会社基恩士 | 多波长共焦测量装置 |
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US6995402B2 (en) * | 2003-10-03 | 2006-02-07 | Lumileds Lighting, U.S., Llc | Integrated reflector cup for a light emitting device mount |
JP4654670B2 (ja) * | 2003-12-16 | 2011-03-23 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
JP4653662B2 (ja) * | 2004-01-26 | 2011-03-16 | 京セラ株式会社 | 波長変換器、発光装置、波長変換器の製造方法および発光装置の製造方法 |
ATE480605T1 (de) * | 2004-02-20 | 2010-09-15 | Lumination Llc | Regeln für effiziente lichtquellen mit mittels leuchtstoff konvertierten leds |
JP2006114854A (ja) * | 2004-10-18 | 2006-04-27 | Sharp Corp | 半導体発光装置、液晶表示装置用のバックライト装置 |
KR100781924B1 (ko) * | 2004-12-02 | 2007-12-04 | 주식회사 에스티앤아이 | 2개의 형광체를 이용한 고출력 백색 발광 다이오드 소자 |
EP1837921B1 (en) * | 2004-12-17 | 2015-11-18 | Ube Industries, Ltd. | Photo-conversion structure and light-emitting device using same |
TWI239671B (en) * | 2004-12-30 | 2005-09-11 | Ind Tech Res Inst | LED applied with omnidirectional reflector |
JP2006278980A (ja) * | 2005-03-30 | 2006-10-12 | Sanyo Electric Co Ltd | 半導体発光装置 |
KR100682874B1 (ko) * | 2005-05-02 | 2007-02-15 | 삼성전기주식회사 | 백색 led |
JP4800669B2 (ja) * | 2005-06-07 | 2011-10-26 | セイコーインスツル株式会社 | 照明装置およびそれを用いた表示装置 |
JP4004514B2 (ja) * | 2005-06-20 | 2007-11-07 | ローム株式会社 | 白色半導体発光素子 |
EP1895600A1 (en) * | 2005-06-20 | 2008-03-05 | Rohm Co., Ltd. | White semiconductor light emitting element and manufacturing method thereof |
JP2006352036A (ja) * | 2005-06-20 | 2006-12-28 | Rohm Co Ltd | 白色半導体発光素子 |
US7598663B2 (en) * | 2005-08-04 | 2009-10-06 | Taiwan Oasis Technology Co., Ltd. | Multi-wavelength LED provided with combined fluorescent materials positioned over and underneath the LED component |
US7329907B2 (en) * | 2005-08-12 | 2008-02-12 | Avago Technologies, Ecbu Ip Pte Ltd | Phosphor-converted LED devices having improved light distribution uniformity |
DE102006020529A1 (de) * | 2005-08-30 | 2007-03-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
KR100649704B1 (ko) | 2005-09-05 | 2006-11-27 | 삼성전기주식회사 | 발광 다이오드 패키지 및 그 제조방법 |
JP3979424B2 (ja) * | 2005-09-09 | 2007-09-19 | 松下電工株式会社 | 発光装置 |
JP2007088261A (ja) * | 2005-09-22 | 2007-04-05 | Sanyo Electric Co Ltd | 発光装置 |
JP2007103512A (ja) * | 2005-09-30 | 2007-04-19 | Kyocera Corp | 発光装置 |
US8441179B2 (en) * | 2006-01-20 | 2013-05-14 | Cree, Inc. | Lighting devices having remote lumiphors that are excited by lumiphor-converted semiconductor excitation sources |
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- 2004-04-28 US US10/833,053 patent/US20040217692A1/en not_active Abandoned
- 2004-04-29 EP EP04252504.8A patent/EP1480278B1/en not_active Expired - Fee Related
- 2004-04-30 CN CNB2004100420837A patent/CN100370629C/zh not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
EP1480278A2 (en) | 2004-11-24 |
EP1480278A3 (en) | 2006-08-16 |
US20040217692A1 (en) | 2004-11-04 |
EP1480278B1 (en) | 2013-06-19 |
KR100691143B1 (ko) | 2007-03-09 |
JP2004363564A (ja) | 2004-12-24 |
KR20040093609A (ko) | 2004-11-06 |
CN100370629C (zh) | 2008-02-20 |
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