JP2004104102A - 半導体装置及びその製造方法、回路基板並びに電子機器 - Google Patents

半導体装置及びその製造方法、回路基板並びに電子機器 Download PDF

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Publication number
JP2004104102A
JP2004104102A JP2003284994A JP2003284994A JP2004104102A JP 2004104102 A JP2004104102 A JP 2004104102A JP 2003284994 A JP2003284994 A JP 2003284994A JP 2003284994 A JP2003284994 A JP 2003284994A JP 2004104102 A JP2004104102 A JP 2004104102A
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JP
Japan
Prior art keywords
semiconductor device
resin layer
wiring
dummy
electrically connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003284994A
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English (en)
Japanese (ja)
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JP2004104102A5 (enExample
Inventor
Koji Yamaguchi
山口　浩司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2003284994A priority Critical patent/JP2004104102A/ja
Priority to US10/637,614 priority patent/US7132742B2/en
Publication of JP2004104102A publication Critical patent/JP2004104102A/ja
Publication of JP2004104102A5 publication Critical patent/JP2004104102A5/ja
Priority to US11/544,709 priority patent/US7298042B2/en
Priority to US11/907,480 priority patent/US7560810B2/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H10W42/20—
    • H10W72/012—
    • H10W74/129—
    • H10W90/701—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H10W70/655—
    • H10W70/656—
    • H10W72/019—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/251—
    • H10W72/922—
    • H10W72/923—
    • H10W72/9415—
    • H10W72/9445—
    • H10W72/952—
    • H10W74/00—
    • H10W90/724—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2003284994A 2002-08-21 2003-08-01 半導体装置及びその製造方法、回路基板並びに電子機器 Pending JP2004104102A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003284994A JP2004104102A (ja) 2002-08-21 2003-08-01 半導体装置及びその製造方法、回路基板並びに電子機器
US10/637,614 US7132742B2 (en) 2002-08-21 2003-08-11 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
US11/544,709 US7298042B2 (en) 2002-08-21 2006-10-10 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
US11/907,480 US7560810B2 (en) 2002-08-21 2007-10-12 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002240778 2002-08-21
JP2003284994A JP2004104102A (ja) 2002-08-21 2003-08-01 半導体装置及びその製造方法、回路基板並びに電子機器

Publications (2)

Publication Number Publication Date
JP2004104102A true JP2004104102A (ja) 2004-04-02
JP2004104102A5 JP2004104102A5 (enExample) 2006-07-13

Family

ID=32301103

Family Applications (1)

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JP2003284994A Pending JP2004104102A (ja) 2002-08-21 2003-08-01 半導体装置及びその製造方法、回路基板並びに電子機器

Country Status (2)

Country Link
US (3) US7132742B2 (enExample)
JP (1) JP2004104102A (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007122690A (ja) * 2005-09-29 2007-05-17 Semiconductor Energy Lab Co Ltd 半導体装置
US7605464B2 (en) 2007-01-19 2009-10-20 Seiko Epson Corporation Semiconductor device
CN101615649A (zh) * 2008-06-27 2009-12-30 斯坦雷电气株式会社 光半导体装置
KR20110036354A (ko) * 2009-10-01 2011-04-07 삼성전자주식회사 집적회로 칩 및 이의 제조방법과 집적회로 칩을 구비하는 플립 칩 패키지 및 이의 제조방법
JP2013004609A (ja) * 2011-06-14 2013-01-07 Nikon Corp 基板貼り合わせ方法
JP2020174160A (ja) * 2019-04-12 2020-10-22 株式会社日立製作所 半導体装置、電力変換装置および半導体装置の製造方法
JP2021072178A (ja) * 2019-10-29 2021-05-06 タイコエレクトロニクスジャパン合同会社 ソケット

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004104102A (ja) * 2002-08-21 2004-04-02 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP3726906B2 (ja) * 2003-03-18 2005-12-14 セイコーエプソン株式会社 半導体装置及びその製造方法、回路基板並びに電子機器
KR100580110B1 (ko) * 2004-05-28 2006-05-12 매그나칩 반도체 유한회사 반도체 소자의 더미 패턴 구조
US7227247B2 (en) * 2005-02-16 2007-06-05 Intel Corporation IC package with signal land pads
EP1770610A3 (en) * 2005-09-29 2010-12-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
EP2054932A2 (en) 2006-08-17 2009-05-06 Nxp B.V. Semiconductor component and assembly with projecting electrode
US20080122078A1 (en) * 2006-11-08 2008-05-29 Jun He Systems and methods to passivate on-die redistribution interconnects
US7615865B2 (en) * 2007-05-21 2009-11-10 Stats Chippac, Ltd. Standoff height improvement for bumping technology using solder resist
KR100876889B1 (ko) * 2007-06-26 2009-01-07 주식회사 하이닉스반도체 반도체 패키지 및 이를 이용한 멀티칩 반도체 패키지
KR101361828B1 (ko) * 2007-09-03 2014-02-12 삼성전자주식회사 반도체 디바이스, 반도체 패키지, 스택 모듈, 카드, 시스템및 반도체 디바이스의 제조 방법
JP2009206429A (ja) * 2008-02-29 2009-09-10 Toshiba Corp 記憶媒体
JP5538682B2 (ja) * 2008-03-06 2014-07-02 ピーエスフォー ルクスコ エスエイアールエル 半導体装置及びその製造方法
US8633586B2 (en) * 2008-03-26 2014-01-21 Stats Chippac Ltd. Mock bump system for flip chip integrated circuits
US8624402B2 (en) * 2008-03-26 2014-01-07 Stats Chippac Ltd Mock bump system for flip chip integrated circuits
JP5264585B2 (ja) * 2009-03-24 2013-08-14 パナソニック株式会社 電子部品接合方法および電子部品
JP5107959B2 (ja) * 2009-04-09 2012-12-26 ルネサスエレクトロニクス株式会社 基板
US7977783B1 (en) * 2009-08-27 2011-07-12 Amkor Technology, Inc. Wafer level chip size package having redistribution layers
JP5737848B2 (ja) * 2010-03-01 2015-06-17 セイコーエプソン株式会社 センサーデバイス、センサーデバイスの製造方法、モーションセンサー及びモーションセンサーの製造方法
KR20110124993A (ko) * 2010-05-12 2011-11-18 삼성전자주식회사 반도체 칩 및 이를 포함하는 반도체 패키지 및 반도체 칩의 제조 방법
KR20140025253A (ko) * 2012-08-22 2014-03-04 삼성디스플레이 주식회사 구동칩 및 그 제조방법
US9111793B2 (en) * 2013-08-29 2015-08-18 International Business Machines Corporation Joining a chip to a substrate with solder alloys having different reflow temperatures
US10622021B2 (en) * 2016-02-19 2020-04-14 Avcr Bilgi Teknolojileri A.S Method and system for video editing

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01238148A (ja) * 1988-03-18 1989-09-22 Fuji Electric Co Ltd 半導体装置
JPH08191071A (ja) * 1995-01-11 1996-07-23 Toshiba Corp 半導体装置
JPH1022411A (ja) * 1996-06-28 1998-01-23 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2001035872A (ja) * 1999-07-19 2001-02-09 Fujitsu Ten Ltd 半導体素子の実装構造及びバンプの構造
JP2001177051A (ja) * 1999-12-20 2001-06-29 Toshiba Corp 半導体装置及びシステム装置
JP2001210749A (ja) * 2000-01-26 2001-08-03 Kyocera Corp バンプ電極付き配線基板およびその製造方法
JP2001257289A (ja) * 2000-03-10 2001-09-21 Mitsubishi Electric Corp 半導体パッケージ、半導体装置並びに半導体装置の製造方法
JP2002093946A (ja) * 2000-09-19 2002-03-29 Hitachi Ltd 半導体装置及び半導体装置の実装構造体
JP2002093947A (ja) * 2000-09-19 2002-03-29 Hitachi Ltd 半導体装置およびその製造方法並びに半導体装置実装構造体
JP2002151532A (ja) * 2000-11-08 2002-05-24 Sharp Corp 電子部品、半導体装置の実装方法および半導体装置の実装構造
JP2002231749A (ja) * 2001-02-01 2002-08-16 Casio Comput Co Ltd 半導体装置およびその接合構造

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US5889327A (en) * 1996-10-04 1999-03-30 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with a package having a plurality of bump electrodes and module with a plurality of semiconductor devices
JP2000100814A (ja) * 1998-09-18 2000-04-07 Hitachi Ltd 半導体装置
JP4776752B2 (ja) 2000-04-19 2011-09-21 ルネサスエレクトロニクス株式会社 半導体装置
TW445612B (en) * 2000-08-03 2001-07-11 Siliconware Precision Industries Co Ltd Solder ball array structure to control the degree of collapsing
US6696765B2 (en) * 2001-11-19 2004-02-24 Hitachi, Ltd. Multi-chip module
TW462120B (en) * 2000-11-10 2001-11-01 Siliconware Precision Industries Co Ltd Tape carrier type semiconductor package structure
JP2003100801A (ja) * 2001-09-25 2003-04-04 Mitsubishi Electric Corp 半導体装置
JP2004104103A (ja) * 2002-08-21 2004-04-02 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP2004104102A (ja) * 2002-08-21 2004-04-02 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01238148A (ja) * 1988-03-18 1989-09-22 Fuji Electric Co Ltd 半導体装置
JPH08191071A (ja) * 1995-01-11 1996-07-23 Toshiba Corp 半導体装置
JPH1022411A (ja) * 1996-06-28 1998-01-23 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2001035872A (ja) * 1999-07-19 2001-02-09 Fujitsu Ten Ltd 半導体素子の実装構造及びバンプの構造
JP2001177051A (ja) * 1999-12-20 2001-06-29 Toshiba Corp 半導体装置及びシステム装置
JP2001210749A (ja) * 2000-01-26 2001-08-03 Kyocera Corp バンプ電極付き配線基板およびその製造方法
JP2001257289A (ja) * 2000-03-10 2001-09-21 Mitsubishi Electric Corp 半導体パッケージ、半導体装置並びに半導体装置の製造方法
JP2002093946A (ja) * 2000-09-19 2002-03-29 Hitachi Ltd 半導体装置及び半導体装置の実装構造体
JP2002093947A (ja) * 2000-09-19 2002-03-29 Hitachi Ltd 半導体装置およびその製造方法並びに半導体装置実装構造体
JP2002151532A (ja) * 2000-11-08 2002-05-24 Sharp Corp 電子部品、半導体装置の実装方法および半導体装置の実装構造
JP2002231749A (ja) * 2001-02-01 2002-08-16 Casio Comput Co Ltd 半導体装置およびその接合構造

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007122690A (ja) * 2005-09-29 2007-05-17 Semiconductor Energy Lab Co Ltd 半導体装置
US7605464B2 (en) 2007-01-19 2009-10-20 Seiko Epson Corporation Semiconductor device
CN101615649A (zh) * 2008-06-27 2009-12-30 斯坦雷电气株式会社 光半导体装置
KR20110036354A (ko) * 2009-10-01 2011-04-07 삼성전자주식회사 집적회로 칩 및 이의 제조방법과 집적회로 칩을 구비하는 플립 칩 패키지 및 이의 제조방법
KR101652386B1 (ko) * 2009-10-01 2016-09-12 삼성전자주식회사 집적회로 칩 및 이의 제조방법과 집적회로 칩을 구비하는 플립 칩 패키지 및 이의 제조방법
JP2013004609A (ja) * 2011-06-14 2013-01-07 Nikon Corp 基板貼り合わせ方法
JP2020174160A (ja) * 2019-04-12 2020-10-22 株式会社日立製作所 半導体装置、電力変換装置および半導体装置の製造方法
JP7137516B2 (ja) 2019-04-12 2022-09-14 株式会社日立製作所 半導体装置および電力変換装置
JP2021072178A (ja) * 2019-10-29 2021-05-06 タイコエレクトロニクスジャパン合同会社 ソケット
JP7316192B2 (ja) 2019-10-29 2023-07-27 タイコエレクトロニクスジャパン合同会社 ソケット

Also Published As

Publication number Publication date
US20080042259A1 (en) 2008-02-21
US7132742B2 (en) 2006-11-07
US7560810B2 (en) 2009-07-14
US7298042B2 (en) 2007-11-20
US20040166660A1 (en) 2004-08-26
US20070029673A1 (en) 2007-02-08

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