JP2004104102A - 半導体装置及びその製造方法、回路基板並びに電子機器 - Google Patents

半導体装置及びその製造方法、回路基板並びに電子機器 Download PDF

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Publication number
JP2004104102A
JP2004104102A JP2003284994A JP2003284994A JP2004104102A JP 2004104102 A JP2004104102 A JP 2004104102A JP 2003284994 A JP2003284994 A JP 2003284994A JP 2003284994 A JP2003284994 A JP 2003284994A JP 2004104102 A JP2004104102 A JP 2004104102A
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Prior art keywords
semiconductor device
resin layer
wiring
dummy
electrically connected
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Pending
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JP2003284994A
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English (en)
Japanese (ja)
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JP2004104102A5 (cg-RX-API-DMAC7.html
Inventor
Koji Yamaguchi
山口　浩司
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2003284994A priority Critical patent/JP2004104102A/ja
Priority to US10/637,614 priority patent/US7132742B2/en
Publication of JP2004104102A publication Critical patent/JP2004104102A/ja
Publication of JP2004104102A5 publication Critical patent/JP2004104102A5/ja
Priority to US11/544,709 priority patent/US7298042B2/en
Priority to US11/907,480 priority patent/US7560810B2/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2003284994A 2002-08-21 2003-08-01 半導体装置及びその製造方法、回路基板並びに電子機器 Pending JP2004104102A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003284994A JP2004104102A (ja) 2002-08-21 2003-08-01 半導体装置及びその製造方法、回路基板並びに電子機器
US10/637,614 US7132742B2 (en) 2002-08-21 2003-08-11 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
US11/544,709 US7298042B2 (en) 2002-08-21 2006-10-10 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
US11/907,480 US7560810B2 (en) 2002-08-21 2007-10-12 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002240778 2002-08-21
JP2003284994A JP2004104102A (ja) 2002-08-21 2003-08-01 半導体装置及びその製造方法、回路基板並びに電子機器

Publications (2)

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