JP2003514380A - はんだ付けが可能なパッドおよびワイヤボンディングが可能なパッドを有する金属再配置層 - Google Patents

はんだ付けが可能なパッドおよびワイヤボンディングが可能なパッドを有する金属再配置層

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Publication number
JP2003514380A
JP2003514380A JP2001537102A JP2001537102A JP2003514380A JP 2003514380 A JP2003514380 A JP 2003514380A JP 2001537102 A JP2001537102 A JP 2001537102A JP 2001537102 A JP2001537102 A JP 2001537102A JP 2003514380 A JP2003514380 A JP 2003514380A
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JP
Japan
Prior art keywords
layer
forming
metal layer
wire bond
opening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2001537102A
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English (en)
Japanese (ja)
Inventor
ラム，ケン・エム
コバッツ，ジュリアス・エイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atmel Corp
Original Assignee
Atmel Corp
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Filing date
Publication date
Application filed by Atmel Corp filed Critical Atmel Corp
Publication of JP2003514380A publication Critical patent/JP2003514380A/ja
Withdrawn legal-status Critical Current

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    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
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    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
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    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP2001537102A 1999-11-05 2000-08-31 はんだ付けが可能なパッドおよびワイヤボンディングが可能なパッドを有する金属再配置層 Withdrawn JP2003514380A (ja)

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US09/434,711 US6511901B1 (en) 1999-11-05 1999-11-05 Metal redistribution layer having solderable pads and wire bondable pads
US09/434,711 1999-11-05
PCT/US2000/024087 WO2001035462A1 (en) 1999-11-05 2000-08-31 Metal redistribution layer having solderable pads and wire bondable pads

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EP (1) EP1228530A1 (zh)
JP (1) JP2003514380A (zh)
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CN (1) CN1198337C (zh)
CA (1) CA2388926A1 (zh)
HK (1) HK1049913B (zh)
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US20020025585A1 (en) 2002-02-28
US6511901B1 (en) 2003-01-28
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US6762117B2 (en) 2004-07-13
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