HK1049913B - 具有可熔焊區和可細絲壓焊區的金屬再分佈層 - Google Patents

具有可熔焊區和可細絲壓焊區的金屬再分佈層

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Publication number
HK1049913B
HK1049913B HK03101891.5A HK03101891A HK1049913B HK 1049913 B HK1049913 B HK 1049913B HK 03101891 A HK03101891 A HK 03101891A HK 1049913 B HK1049913 B HK 1049913B
Authority
HK
Hong Kong
Prior art keywords
pads
redistribution layer
solderable
metal redistribution
wire bondable
Prior art date
Application number
HK03101891.5A
Other languages
English (en)
Other versions
HK1049913A1 (en
Inventor
K‧M‧蘭
J‧A‧科瓦茨
Original Assignee
愛特梅爾公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 愛特梅爾公司 filed Critical 愛特梅爾公司
Publication of HK1049913A1 publication Critical patent/HK1049913A1/xx
Publication of HK1049913B publication Critical patent/HK1049913B/zh

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    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
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    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49162—Manufacturing circuit on or in base by using wire as conductive path
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    • Y10T29/49211—Contact or terminal manufacturing by assembling plural parts with bonding of fused material
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    • Y10T29/49222—Contact or terminal manufacturing by assembling plural parts forming array of contacts or terminals

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)
HK03101891.5A 1999-11-05 2003-03-14 具有可熔焊區和可細絲壓焊區的金屬再分佈層 HK1049913B (zh)

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US09/434,711 US6511901B1 (en) 1999-11-05 1999-11-05 Metal redistribution layer having solderable pads and wire bondable pads
PCT/US2000/024087 WO2001035462A1 (en) 1999-11-05 2000-08-31 Metal redistribution layer having solderable pads and wire bondable pads

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HK1049913B true HK1049913B (zh) 2005-08-05

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JP2003514380A (ja) 2003-04-15
WO2001035462A1 (en) 2001-05-17
EP1228530A1 (en) 2002-08-07
US6577008B2 (en) 2003-06-10
HK1049913A1 (en) 2003-05-30
US20030119297A1 (en) 2003-06-26
US6762117B2 (en) 2004-07-13
TW477051B (en) 2002-02-21
KR20020044590A (ko) 2002-06-15
NO20022134L (no) 2002-05-03
US20020025585A1 (en) 2002-02-28
NO20022134D0 (no) 2002-05-03
CN1198337C (zh) 2005-04-20
CN1387681A (zh) 2002-12-25
KR100643065B1 (ko) 2006-11-10
US6511901B1 (en) 2003-01-28
CA2388926A1 (en) 2001-05-17

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