JP6577899B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
- Publication number
- JP6577899B2 JP6577899B2 JP2016073354A JP2016073354A JP6577899B2 JP 6577899 B2 JP6577899 B2 JP 6577899B2 JP 2016073354 A JP2016073354 A JP 2016073354A JP 2016073354 A JP2016073354 A JP 2016073354A JP 6577899 B2 JP6577899 B2 JP 6577899B2
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- film
- pad
- semiconductor device
- wiring
- conductive layer
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Description
<半導体装置>
図1は、本実施の形態1の半導体装置を示す概略平面図である。図2は、図1の半導体装置の断面図である。なお、図1では、配線基板の上面を覆う封止体の図示を省略している。
次に、上記のように構成された本実施の形態1の半導体チップ12(特に、パッドPD)の製造方法について説明する。
まず、絶縁層35の上部(最上層の配線層が形成される部分)にパッドPDおよび第3層目の配線M3を形成する工程について、図5〜図12を参照しながら詳細に説明する。ここで、図5〜図12は、図3に示す矩形の破線で囲まれた領域(パッドPDの一部と配線M3の一部とを含む領域)に対応する断面図である。
次に、図6に示すように、窒化チタン膜42Bの上部に形成したフォトレジスト膜PR1をマスクにして窒化チタン膜42B、第2アルミニウム膜41B、窒化チタン膜42A、第1アルミニウム膜41A、およびバリアメタル膜40をドライエッチングすることにより、これら5層の積層膜(バリアメタル膜40、第1アルミニウム膜41A、窒化チタン膜42A、第2アルミニウム膜41B、および窒化チタン膜42Bの積層膜)から成るパッドPDおよび配線M3を形成する。
次に、フォトレジスト膜PR1を除去した後、図7に示すように、絶縁層35、パッドPD、および配線M3の各表面を覆う第1保護膜30Aを堆積する。第1保護膜30Aは、例えばプラズマCVD(Plasma-enhanced chemical vapor deposition)法で堆積した酸化シリコン膜43Aと、高密度プラズマCVD法で堆積した酸化シリコン膜43Bと、TEOS(Tetra Ethyl Ortho Silicate;Si(OC2H5)4)およびオゾン(O3)をソースガスに用いたプラズマCVD法で堆積した酸化シリコン膜43Cとの積層膜から成り、その膜厚は例えば1.9μmである。
次に、図8に示すように、第1保護膜30Aの上部に形成したフォトレジスト膜PR2をマスクにしたドライエッチングでパッドPDの上部の第1保護膜30Aに開口OP1を形成し、パッドPDの表面の一部(周縁部を除いた領域)を露出させる。第1保護膜30Aのドライエッチングには、絶縁膜(第1保護膜30A)に対する選択比の高いエッチングガス、例えばCF4、CHF3、N2、およびArの混合ガス(第1ガス)を使用してパッドPDの表面(窒化チタン膜42B)の削れを抑制し、パッドPDの主導電膜である第2アルミニウム膜41Bが削れないようにする。
次に、フォトレジスト膜PR2を除去した後、図9に示すように、第1保護膜30AおよびパッドPDの各表面を覆う第2保護膜30Bを堆積する。第2保護膜30Bは、例えばプラズマCVD法で堆積した窒化シリコン膜から成り、その膜厚は例えば0.6μmである。これにより、絶縁層35、配線M3、およびパッドPDの周縁部の各表面は、酸化シリコン系の絶縁膜である第1保護膜30Aと、窒化シリコン膜から成る第2保護膜30Bとの積層膜で構成される保護膜30によって覆われる。また、パッドPDの表面の一部(周縁部を除いた領域)は、第2保護膜30Bで覆われる。
次に、図10に示すように、第2保護膜30Bの上部に形成したフォトレジスト膜PR3をマスクにしたドライエッチングでパッドPDの上部の第2保護膜30Bに開口OP2を形成し、パッドPDの表面の一部(ワイヤ接合部)を露出させる。
次に、図11に示すように、第2保護膜30Bの上部に残したフォトレジスト膜PR3をマスクにしたドライエッチングでパッドPDのワイヤ接合部の第2アルミニウム膜41Bを除去し、下層の窒化チタン膜42Aの表面を露出させる。
次に、図12に示すように、第2保護膜30Bの上部に残したフォトレジスト膜PR3をマスクにしたドライエッチングでパッドPDのワイヤ接合部に露出した窒化チタン膜42Aを除去し、主導電膜である第1アルミニウム膜41Aの表面を露出させる。
次に、上記のように構成された本実施の形態1の半導体装置の製造方法について説明する。
まず、図15に示す配線基板11を用意し、この配線基板11の上面の中央部(チップ搭載領域)にダイボンド材23を介して、上記の工程を行うことで取得した半導体チップ12(図13および図14に示すパッドPDを有する半導体チップ12)を搭載(ダイボンディング)する。
次に、半導体チップ12に形成された複数のパッドPDのそれぞれと、配線基板11に形成された複数のボンディングリード14Pのそれぞれとを、銅から成るワイヤ25によって電気的に接続する。このワイヤボンディング工程では、図16に示すような超音波を併用した熱圧着ボンディング方式によってワイヤ25の接合を行う。
上記ワイヤボンディング工程が完了すると、配線基板11をモールド金型に装着し、図17に示すように、配線基板11の上面、半導体チップ12および複数のワイヤ25を封止体26によって封止する。
その後、配線基板11の下面に形成された複数のバンプランド(外部端子)16Pに半田ボール13を接続し、続いてこれらの半田ボール13にプローブを接触して電気特性を測定する選別工程を経ることにより、図1に示すBGA型の半導体装置10が完成する。また、大型基板(マップ基板)に複数の半導体チップ12を搭載する場合は、モールド工程が完了した大型基板の下面のバンプランド16Pに半田ボール13を接続した後、大型基板をダイシングして複数の配線基板11に個片化し、その後、上記した選別工程を経ることにより、図1に示すBGA型の半導体装置10が完成する。
前記実施の形態1では、パッドPDのワイヤ接合部に第1アルミニウム膜41Aを露出させ、第1アルミニウム膜41Aの表面に銅からなるワイヤ25のボール部25Bを直接接合することについて説明したが、本実施の形態2では、前記実施の形態1の図12に示すように主導電膜である第1アルミニウム膜41Aの表面を露出させた後、さらに、この露出したパッドPDの第1アルミニウム膜41Aの表面(ワイヤ接合部)に、OPM(Over Pad Metal)膜と呼ばれる導電性接着層を形成し、このOPM膜にワイヤを接合する点で、前記実施の形態1と相違する。
例えば、前記実施の形態1では、半導体装置10を搭載する基材として配線基板11を例示したが、基材としてリードフレームを使用することもできる。
また、前記実施の形態1では、半導体チップ12の主面上で、かつ、主面の周縁部に複数のパッドPDを配置する例を説明したが、パッドPDは、半導体チップ12の主面上で、かつ、主面の中央部付近に配置しても良い。この場合は、配線M3は、平面視において、複数のパッドと半導体チップ12の辺との間に位置する。さらには、半導体チップ12の主面の周縁部と中央部の双方に配置しても良い。
また、例えば、上記の通り種々の変形例について説明したが、上記で説明した各変形例同士を組み合わせて適用することができる。
[付記]
端子を有する基材と、
前記基材上に搭載され、主面にパッドおよび配線を有する半導体チップと、
前記半導体チップの前記パッドと前記基材の前記端子とを互いに、かつ、電気的に接続する、銅から成るワイヤと、
を有し、
前記半導体チップは、
絶縁層と、
前記絶縁層の表面上に形成された前記パッドと、
前記絶縁層の前記表面上に形成された前記配線と、
前記パッドの一部を露出し、かつ、前記配線を覆うように前記絶縁層上に形成された絶縁膜と、
を備えており、
前記半導体チップの前記パッドは、前記絶縁層から露出した前記一部の膜厚が前記絶縁層で覆われた部分の膜厚よりも薄い、半導体装置。
11 配線基板(基材)
12 半導体チップ
12S 半導体基板
13 半田ボール(外部端子)
14 上面配線
14P ボンディングリード(端子)
16 下面配線
16P バンプランド(電極)
18 貫通孔(ビア)
21、22 ソルダーレジスト(絶縁膜)
23 ダイボンド材(接着剤)
25 ワイヤ(導電性部材)
25B ボール部
26 封止体
30 保護膜(絶縁膜)
30A 第1保護膜(絶縁膜)
30B 第2保護膜(絶縁膜)
31、33、35 絶縁層
32、34、36 メタルプラグ
40 バリアメタル膜
41A アルミニウム膜(第1導電層)
41B アルミニウム膜(第3導電層)
42A 窒化チタン膜(第2導電層)
42B 窒化チタン膜(第4導電層)
43A 酸化シリコン膜
43B 酸化シリコン膜
43C 酸化シリコン膜
44 導電性接着層(OPM膜)
50 ステージ
51 キャピラリ
52 金属ホーン
60 ダイパッド部
61 リード
62 封止体
CS 主面
M1、M2、M3 配線
PD パッド(電極)
PR1、PR2、PR3、PR4 フォトレジスト膜
Q1、Q2 半導体素子
Claims (7)
- 以下の工程を含む半導体装置の製造方法:
(a)パッドおよび配線を有する半導体チップを、基材上に搭載する工程;
(b)前記(a)工程の後、銅から成るワイヤを介して、前記半導体チップの前記パッドと前記基材の端子を互いに、かつ、電気的に接続する工程;
ここで、
前記半導体チップは、
絶縁層と、
前記絶縁層の表面上に形成された前記パッドと、
前記絶縁層の前記表面上に形成された前記配線と、
前記パッドの一部を露出し、かつ、前記配線を覆うように前記絶縁層の前記表面上に形成された絶縁膜と、
を備えており、
前記半導体チップの前記パッドは、以下の(a−1)〜(a−5)工程により製造される:
(a−1)アルミニウムから成る第1導電層、前記第1導電層とは異なる材料から成り、前記第1導電層上に積層された第2導電層、および前記第1導電層と同じ材料から成り、前記第2導電層上に積層された第3導電層を有する積層膜を、前記絶縁層の前記表面上に形成する工程;
(a−2)前記(a−1)工程の後、前記積層膜をパターニングすることで、前記第1乃至第3導電層を有する前記パッドと、前記第1乃至第3導電層を有する前記配線を形成する工程;
(a−3)前記(a−2)工程の後、前記パッドおよび前記配線を覆うように前記絶縁膜を前記絶縁層の前記表面上に形成する工程;
(a−4)前記(a−3)工程の後、前記絶縁膜をパターニングすることで、前記パッドの前記一部を前記絶縁膜から露出させる工程;
(a−5)前記(a−4)工程の後、前記絶縁膜から露出した前記パッドの前記一部をエッチングすることで、前記第1導電層を露出させる工程;
前記(b)工程では、前記ワイヤの第1部分を、前記絶縁膜から露出した前記パッドの前記第1導電層の表面に接続し、
前記第1導電層は、前記第3導電層よりも厚く形成する。 - 請求項1記載の半導体装置の製造方法において、
前記(b)工程では、前記ワイヤに超音波を印加しながら、前記ワイヤの前記第1部分を、前記絶縁膜から露出した前記パッドの前記第1導電層の表面に接続する、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(a−5)工程の後、前記パッドの前記一部に露出した前記第1導電層の表面上に導電性接着層を形成する工程をさらに含み、
前記(b)工程では、前記導電性接着層を介して前記ワイヤを前記パッドと電気的に接続させる、半導体装置の製造方法。 - 請求項3記載の半導体装置の製造方法において、
前記導電性接着層は、パラジウムを含有する、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記(a−5)工程により前記パッドの周縁部を前記パッドの中央部よりも厚く形成する、半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記第2導電層と同じ材料から成り、前記第3導電層上に積層された第4導電層をさらに有する、半導体装置の製造方法。 - 請求項6記載の半導体装置の製造方法において、
前記第2導電層および前記第4導電層は、窒化チタンから成る、半導体装置の製造方法。
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