JP2010510647A - ワイヤ接合部及びはんだ接合部の形成方法 - Google Patents
ワイヤ接合部及びはんだ接合部の形成方法 Download PDFInfo
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- JP2010510647A JP2010510647A JP2009536693A JP2009536693A JP2010510647A JP 2010510647 A JP2010510647 A JP 2010510647A JP 2009536693 A JP2009536693 A JP 2009536693A JP 2009536693 A JP2009536693 A JP 2009536693A JP 2010510647 A JP2010510647 A JP 2010510647A
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- H01L23/3157—Partial encapsulation or coating
- H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
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Abstract
【解決手段】 一実施形態において、この方法は、ワイヤ接合部のためのワイヤ接合金属領域及びはんだ接合部のためのはんだ接合金属領域を含む構造体を準備するステップであって、両領域がシリコン酸化物層の上のシリコン窒化物層で覆われたステップと、ワイヤ接合金属領域の上のシリコン酸化物層に至る第1の開口部と、はんだ接合金属領域を露出する第2の開口部とを材料内に形成するステップと、ワイヤ接合金属領域が覆われた状態を保ちながら、はんだ接合金属領域に対するはんだ接合部を形成するステップと、シリコン酸化物層をワイヤ接合金属領域に至るまで除去するステップを含む、ワイヤ接合金属領域を露出させるステップと、ワイヤ接合金属領域に対するワイヤ接合部を形成するステップとを含む。ワイヤ接合部及びはんだ接合部は、必要に応じて、単一のマルチパート・ウェハ(MPW)上又は単一チップ上でアクセス可能にすることができ、実質的に同時に形成することができる。
【選択図】 図10
Description
102:ワイヤ接合金属領域
104:はんだ接合金属領域
106:シリコン窒化物層
108:シリコン酸化物層
110:基板
112:ワイヤ
114、116、118:バリア層
130:材料
132、134:開口部
140、162、166、184:フォトレジスト
142:中間開口部
144、164、168、192、194:エッチング
150:未硬化感光性ポリイミド(PSPI)層
160:未硬化ポリイミド層
170:硬化
180:はんだ接合部
182:BLM層
186:開口部
190:ワイヤ接合部
196:湿式洗浄
Claims (20)
- ワイヤ接合部及びはんだ接合部を形成する方法であって、
前記ワイヤ接合部のためのワイヤ接合金属領域及び前記はんだ接合部のためのはんだ接合金属領域を含む構造体を準備するステップであって、両領域がシリコン酸化物層の上のシリコン窒化物層で覆われたステップと
前記ワイヤ接合金属領域の上の前記シリコン酸化物層に至る第1の開口部と、前記はんだ接合金属領域を露出する第2の開口部とを材料内に形成するステップと、
前記ワイヤ接合金属領域が覆われた状態を保ちながら、前記はんだ接合金属領域に対する前記はんだ接合部を形成するステップと、
前記シリコン酸化物層を前記ワイヤ接合金属領域に至るまで除去するステップを含む、前記ワイヤ接合金属領域を露出させるステップと、
前記ワイヤ接合金属領域に対する前記ワイヤ接合部を形成するステップと、
を含む方法。 - 前記第1及び第2の開口部の形成ステップは、
前記はんだ接合金属領域及び前記ワイヤ接合金属領域の上の前記シリコン窒化物層の上に第1のフォトレジストを形成するステップと、
前記はんだ接合金属領域の上でのみ前記第1のフォトレジストを貫通する中間開口部を形成するステップと、
前記中間開口部を用いて前記はんだ接合金属領域の上でのみ前記シリコン窒化物層を除去するステップと、
前記第1のフォトレジストを除去するステップと、
前記材料として未硬化感光性ポリイミド(PSPI)層を堆積するステップと、
前記ワイヤ接合金属領域の上の前記未硬化PSPI層を貫通する前記第1の開口部と、前記はんだ接合金属領域の上の前記未硬化PSPI層を貫通する前記第2の開口部とを形成するステップと、
前記未硬化PSPI層を硬化させるステップと、
エッチングを行って、前記はんだ接合金属領域を露出させ、かつ前記ワイヤ接合金属領域の上の前記シリコン酸化物層に至るまで前記シリコン窒化物層を除去するステップと
を含む、請求項1に記載の方法。 - 前記はんだ接合部を形成するステップは、
ボール制限金属(BLM)層を堆積するステップと、
第2のフォトレジストを堆積するステップと、
前記はんだ接合金属領域の上でのみ、前記第2のフォトレジスト内に前記BLM層に至る開口部を形成するステップと、
前記第2のフォトレジストの開口部内に前記はんだ接合部を形成するステップと、
前記第2のフォトレジストと、前記はんだ接合部の下の前記BLM層以外の前記BLM層とを除去して、前記ワイヤ接合金属領域の上の前記シリコン酸化物層を露出させるステップと、
を含む、請求項2に記載の方法。 - 前記第2のフォトレジストは、感光性乾式ポリマ・レジストを含む、請求項3に記載の方法。
- 前記シリコン酸化物層の除去後に、前記ワイヤ接合金属領域の湿式洗浄を行うステップと、
前記はんだ接合部を洗浄し、リフローするステップと、
をさらに含む、請求項3に記載の方法。 - 前記第1及び第2の開口部の形成ステップは、
前記はんだ接合金属領域及び前記ワイヤ接合金属領域の上の前記シリコン窒化物層の上に前記材料として未硬化ポリイミド層を形成するステップと、
前記はんだ接合金属領域を覆う第1のフォトレジストを用いて、前記ワイヤ接合金属領域の上でのみ前記未硬化ポリイミド層を貫通して前記シリコン酸化物層に至る前記第1の開口部を形成するステップと、
前記第1のフォトレジストを除去するステップと、
前記ワイヤ接合金属領域を覆う第2のフォトレジストを用いて、前記未硬化ポリイミド層を貫通して前記はんだ接合金属領域の上のみに至る前記第2の開口部を形成するステップと、
前記第2のフォトレジストを除去するステップと、
前記未硬化ポリイミド層を硬化させるステップと
を含む、請求項1に記載の方法。 - 前記はんだ接合部を形成するステップは、
ボール制限金属(BLM)層を堆積するステップと、
第3のフォトレジストを堆積するステップと、
前記はんだ接合金属領域の上でのみ、前記第3のフォトレジスト内に前記BLM層に至る開口部を形成するステップと、
前記第3のフォトレジストの開口部内に前記はんだ接合部を形成するステップと、
前記第3のフォトレジストと、前記はんだ接合部の下の前記BLM層以外の前記BLM層とを除去して、前記ワイヤ接合金属領域の上の前記シリコン酸化物層を露出させるステップと
を含む、請求項6に記載の方法。 - 前記第3のフォトレジストは、感光性乾式ポリマ・レジストを含む、請求項7に記載の方法。
- 前記シリコン酸化物層の除去後に、前記ワイヤ接合金属領域の湿式洗浄を行うステップと、
前記はんだ接合部を洗浄し、リフローするステップと、
をさらに含む、請求項7に記載の方法。 - 前記未硬化ポリイミド層は非感光性である、請求項6に記載の方法。
- 前記はんだ接合金属領域及び前記ワイヤ接合金属領域の各々が、アルミニウム及び銅のうちの1つを含む、請求項1に記載の方法。
- ワイヤ接合部及びはんだ接合部を形成する方法であって、
前記ワイヤ接合部のためのワイヤ接合金属領域及び前記はんだ接合部のためのはんだ接合金属領域を含む構造体を準備するステップであって、両領域がシリコン酸化物層の上のシリコン窒化物層で覆われたステップと、
前記ワイヤ接合金属領域の上の前記シリコン酸化物層に至る第1の開口部と、前記はんだ接合金属領域を露出する第2の開口部とを材料内に形成するステップであって、
前記はんだ接合金属層及び前記ワイヤ接合金属領域の上の前記シリコン窒化物層の上に第1のフォトレジストを形成し、
前記はんだ接合金属領域の上でのみ前記第1のフォトレジストを貫通する中間開口部を形成し、
前記中間開口部を用いて前記はんだ接合金属領域の上でのみ前記シリコン窒化物層を除去し、
前記第1のフォトレジストを除去し、
前記材料として未硬化感光性ポリイミド(PSPI)層を堆積し、
前記ワイヤ接合金属領域の上の前記未硬化PSPI層を貫通する前記第1の開口部と、前記はんだ接合金属領域の上の前記未硬化PSPI層を貫通する前記第2の開口部とを形成し、
前記未硬化PSPI層を硬化させるステップと、
エッチングを行って、前記はんだ接合金属領域を露出させ、かつ前記ワイヤ接合金属領域の上の前記シリコン酸化物層に至るまで前記シリコン窒化物層を除去するステップと、
前記ワイヤ接合金属領域が覆われた状態を保ちながら、前記はんだ接合金属領域に対する前記はんだ接合部を形成するステップと、
前記シリコン酸化物層を前記ワイヤ接合金属領域に至るまで除去するステップを含む、前記ワイヤ接合金属領域を露出させるステップと、
前記ワイヤ接合金属領域に対する前記ワイヤ接合部を形成するステップと、
を含む方法。 - 前記はんだ接合部を形成するステップは、
ボール制限金属(BLM)層を堆積するステップと、
第2のフォトレジストを堆積するステップと、
前記はんだ接合金属領域の上でのみ、前記第2のフォトレジスト内に前記BLM層に至る開口部を形成するステップと、
前記第2のフォトレジストの開口部内に前記はんだ接合部を形成するステップと、
前記第2のフォトレジストと、前記はんだ接合部の下の前記BLM層以外の前記BLM層とを除去するステップと、
を含む、請求項12に記載の方法。 - 前記第2のフォトレジストは、感光性乾式ポリマ・レジストを含む、請求項13に記載の方法。
- 前記シリコン酸化物層の除去後に、前記ワイヤ接合金属領域の湿式洗浄を行うステップと、
前記はんだ接合部を洗浄し、リフローするステップと、
をさらに含む、請求項13に記載の方法。 - ワイヤ接合部及びはんだ接合部を形成する方法であって、
前記ワイヤ接合のためのワイヤ接合金属領域及び前記はんだ接合のためのはんだ接合金属領域を含む構造体を準備するステップであって、両領域がシリコン酸化物層の上のシリコン窒化物層で覆われたステップと、
前記ワイヤ接合金属領域の上の前記シリコン酸化物層に至る第1の開口部、及び前記はんだ接合金属領域を露出する第2の開口部を材料内に形成するステップであって、
前記はんだ接合金属領域及び前記ワイヤ接合金属領域の上の前記シリコン窒化物層の上に前記材料として未硬化ポリイミド層を形成し、
前記はんだ接合金属領域を覆う第1のフォトレジストを用いて、前記ワイヤ接合金属領域の上でのみ前記未硬化ポリイミド層を貫通して前記シリコン酸化物層に至る前記第1の開口部を形成し、
前記第1のフォトレジストを除去し、
前記ワイヤ接合金属領域を覆う第2のフォトレジストを用いて、前記未硬化ポリイミド層を貫通して前記はんだ接合金属領域の上のみに至る前記第2の開口部を形成し、
前記第2のフォトレジストを除去し、
前記未硬化ポリイミド層を硬化させるステップと、
前記ワイヤ接合金属領域が覆われた状態を保ちながら、前記はんだ接合金属領域に対するはんだ接合部を形成するステップと、
前記シリコン酸化物層を前記ワイヤ接合金属領域に至るまで除去するステップを含む、前記ワイヤ接合金属領域を露出させるステップと、
前記ワイヤ接合金属領域に対する前記ワイヤ接合部を形成するステップと、
を含む方法。 - 前記はんだ接合部を形成するステップは、
ボール制限金属(BLM)層を堆積するステップと、
第3のフォトレジストを堆積するステップと、
前記はんだ接合金属領域の上でのみ、前記第3のフォトレジスト内に前記BLM層に至る開口部を形成するステップと、
前記第3のフォトレジストの開口部内に前記はんだ接合部を形成するステップと、
前記第3のフォトレジストと、前記はんだ接合部の下の前記BLM層以外の前記BLM層とを除去して、前記ワイヤ接合金属領域の上の前記シリコン酸化物層を露出させるステップと
を含む、請求項16に記載の方法。 - 前記第3のフォトレジストは、感光性乾式ポリマ・レジストを含む、請求項17に記載の方法。
- 前記シリコン酸化物層の除去後に、前記ワイヤ接合金属領域の湿式洗浄を行うステップと、
前記はんだ接合部を洗浄し、リフローするステップと、
をさらに含む、請求項17に記載の方法。 - 前記未硬化ポリイミド層は非感光性である、請求項16に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/561,437 US7601628B2 (en) | 2006-11-20 | 2006-11-20 | Wire and solder bond forming methods |
PCT/EP2007/061763 WO2008061864A1 (en) | 2006-11-20 | 2007-10-31 | Wire and solder bond forming methods |
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JP2010510647A true JP2010510647A (ja) | 2010-04-02 |
JP4659120B2 JP4659120B2 (ja) | 2011-03-30 |
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US (1) | US7601628B2 (ja) |
EP (1) | EP2095418B1 (ja) |
JP (1) | JP4659120B2 (ja) |
KR (1) | KR20090074801A (ja) |
AT (1) | ATE490552T1 (ja) |
DE (1) | DE602007010978D1 (ja) |
WO (1) | WO2008061864A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
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US7521287B2 (en) * | 2006-11-20 | 2009-04-21 | International Business Machines Corporation | Wire and solder bond forming methods |
US8796868B1 (en) | 2007-01-30 | 2014-08-05 | Marvell International Ltd. | Semiconductor layout |
US7982311B2 (en) * | 2008-12-19 | 2011-07-19 | Intel Corporation | Solder limiting layer for integrated circuit die copper bumps |
JP5732035B2 (ja) * | 2009-03-20 | 2015-06-10 | ミクロガン ゲーエムベーハー | 垂直接触電子部品及びその製造方法 |
US20100264522A1 (en) * | 2009-04-20 | 2010-10-21 | Chien-Pin Chen | Semiconductor device having at least one bump without overlapping specific pad or directly contacting specific pad |
JP2011216771A (ja) * | 2010-04-01 | 2011-10-27 | Rohm Co Ltd | 半導体装置およびその製造方法 |
US8339798B2 (en) * | 2010-07-08 | 2012-12-25 | Apple Inc. | Printed circuit boards with embedded components |
US8916463B2 (en) | 2012-09-06 | 2014-12-23 | International Business Machines Corporation | Wire bond splash containment |
US8994173B2 (en) | 2013-06-26 | 2015-03-31 | International Business Machines Corporation | Solder bump connection and method of making |
WO2017199706A1 (ja) * | 2016-05-18 | 2017-11-23 | 三菱電機株式会社 | 電力用半導体装置およびその製造方法 |
US20210175138A1 (en) * | 2019-12-05 | 2021-06-10 | Cree, Inc. | Semiconductors Having Die Pads with Environmental Protection and Process of Making Semiconductors Having Die Pads with Environmental Protection |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59208865A (ja) * | 1983-05-13 | 1984-11-27 | Hitachi Ltd | 半導体装置およびその製造方法 |
JPS63179535A (ja) * | 1987-01-21 | 1988-07-23 | Hitachi Ltd | 半導体装置の製造方法 |
JPH0689919A (ja) * | 1992-06-30 | 1994-03-29 | Hughes Aircraft Co | ワイヤボンドとはんだ接続の両者を有する電気的内部接続基体および製造方法 |
JP2001351940A (ja) * | 2000-04-10 | 2001-12-21 | Agere Systems Guardian Corp | Icチップにおいて銅相互接続配線 |
JP2003514380A (ja) * | 1999-11-05 | 2003-04-15 | アトメル・コーポレイション | はんだ付けが可能なパッドおよびワイヤボンディングが可能なパッドを有する金属再配置層 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6204074B1 (en) * | 1995-01-09 | 2001-03-20 | International Business Machines Corporation | Chip design process for wire bond and flip-chip package |
US5844317A (en) * | 1995-12-21 | 1998-12-01 | International Business Machines Corporation | Consolidated chip design for wire bond and flip-chip package technologies |
US6534863B2 (en) * | 2001-02-09 | 2003-03-18 | International Business Machines Corporation | Common ball-limiting metallurgy for I/O sites |
US6762122B2 (en) * | 2001-09-27 | 2004-07-13 | Unitivie International Limited | Methods of forming metallurgy structures for wire and solder bonding |
US7521287B2 (en) * | 2006-11-20 | 2009-04-21 | International Business Machines Corporation | Wire and solder bond forming methods |
-
2006
- 2006-11-20 US US11/561,437 patent/US7601628B2/en not_active Expired - Fee Related
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2007
- 2007-10-31 EP EP07822110A patent/EP2095418B1/en not_active Not-in-force
- 2007-10-31 DE DE602007010978T patent/DE602007010978D1/de active Active
- 2007-10-31 JP JP2009536693A patent/JP4659120B2/ja not_active Expired - Fee Related
- 2007-10-31 KR KR1020097009876A patent/KR20090074801A/ko active IP Right Grant
- 2007-10-31 AT AT07822110T patent/ATE490552T1/de not_active IP Right Cessation
- 2007-10-31 WO PCT/EP2007/061763 patent/WO2008061864A1/en active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59208865A (ja) * | 1983-05-13 | 1984-11-27 | Hitachi Ltd | 半導体装置およびその製造方法 |
JPS63179535A (ja) * | 1987-01-21 | 1988-07-23 | Hitachi Ltd | 半導体装置の製造方法 |
JPH0689919A (ja) * | 1992-06-30 | 1994-03-29 | Hughes Aircraft Co | ワイヤボンドとはんだ接続の両者を有する電気的内部接続基体および製造方法 |
JP2003514380A (ja) * | 1999-11-05 | 2003-04-15 | アトメル・コーポレイション | はんだ付けが可能なパッドおよびワイヤボンディングが可能なパッドを有する金属再配置層 |
JP2001351940A (ja) * | 2000-04-10 | 2001-12-21 | Agere Systems Guardian Corp | Icチップにおいて銅相互接続配線 |
Also Published As
Publication number | Publication date |
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WO2008061864A1 (en) | 2008-05-29 |
EP2095418B1 (en) | 2010-12-01 |
JP4659120B2 (ja) | 2011-03-30 |
KR20090074801A (ko) | 2009-07-07 |
ATE490552T1 (de) | 2010-12-15 |
EP2095418A1 (en) | 2009-09-02 |
US20080119036A1 (en) | 2008-05-22 |
DE602007010978D1 (ja) | 2011-01-13 |
US7601628B2 (en) | 2009-10-13 |
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