JP2003222654A - プローブ装置 - Google Patents
プローブ装置Info
- Publication number
- JP2003222654A JP2003222654A JP2002021048A JP2002021048A JP2003222654A JP 2003222654 A JP2003222654 A JP 2003222654A JP 2002021048 A JP2002021048 A JP 2002021048A JP 2002021048 A JP2002021048 A JP 2002021048A JP 2003222654 A JP2003222654 A JP 2003222654A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- probe device
- conversion element
- mounting table
- mechanical vibration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 70
- 238000006243 chemical reaction Methods 0.000 claims description 43
- 239000004065 semiconductor Substances 0.000 claims description 33
- 238000013016 damping Methods 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 5
- 238000005259 measurement Methods 0.000 abstract description 5
- 235000012431 wafers Nutrition 0.000 description 44
- 238000010586 diagram Methods 0.000 description 8
- 230000002238 attenuated effect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Vibration Prevention Devices (AREA)
- Measuring Leads Or Probes (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002021048A JP2003222654A (ja) | 2002-01-30 | 2002-01-30 | プローブ装置 |
| TW091137043A TWI274163B (en) | 2002-01-30 | 2002-12-23 | Prober |
| US10/484,779 US6933736B2 (en) | 2002-01-30 | 2003-01-08 | Prober |
| KR1020047001411A KR100597227B1 (ko) | 2002-01-30 | 2003-01-08 | 프로브장치 |
| PCT/JP2003/000084 WO2003065441A1 (en) | 2002-01-30 | 2003-01-08 | Prober |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002021048A JP2003222654A (ja) | 2002-01-30 | 2002-01-30 | プローブ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003222654A true JP2003222654A (ja) | 2003-08-08 |
| JP2003222654A5 JP2003222654A5 (enExample) | 2005-07-28 |
Family
ID=27654380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002021048A Pending JP2003222654A (ja) | 2002-01-30 | 2002-01-30 | プローブ装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6933736B2 (enExample) |
| JP (1) | JP2003222654A (enExample) |
| KR (1) | KR100597227B1 (enExample) |
| TW (1) | TWI274163B (enExample) |
| WO (1) | WO2003065441A1 (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006029361A (ja) * | 2004-07-12 | 2006-02-02 | Toyota Motor Corp | 圧電素子と電気装置が重合された圧電式振動抑制装置 |
| JP2007227899A (ja) * | 2006-01-13 | 2007-09-06 | King Yuan Electronics Co Ltd | Zifコネクタつきプローブカード、その組立方法、ウェハテストシステム、及びそれを導入したウェハテスト方法 |
| WO2008050518A1 (en) * | 2006-10-20 | 2008-05-02 | Panasonic Corporation | Prober device |
| JP2022139421A (ja) * | 2021-03-12 | 2022-09-26 | レーザーテック株式会社 | 検査装置及び振動抑制方法 |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6232789B1 (en) | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
| US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
| US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
| US6578264B1 (en) | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
| US6838890B2 (en) | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
| DE20114544U1 (de) | 2000-12-04 | 2002-02-21 | Cascade Microtech, Inc., Beaverton, Oreg. | Wafersonde |
| AU2002327490A1 (en) | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
| EP1509776A4 (en) | 2002-05-23 | 2010-08-18 | Cascade Microtech Inc | PROBE TO TEST ANY TESTING EQUIPMENT |
| US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
| US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
| WO2006017078A2 (en) | 2004-07-07 | 2006-02-16 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
| DE112004002554T5 (de) | 2003-12-24 | 2006-11-23 | Cascade Microtech, Inc., Beaverton | Active wafer probe |
| DE202005021435U1 (de) | 2004-09-13 | 2008-02-28 | Cascade Microtech, Inc., Beaverton | Doppelseitige Prüfaufbauten |
| US7265534B2 (en) * | 2004-10-20 | 2007-09-04 | Freescale Semiconductor, Inc. | Test system for device characterization |
| US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
| US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
| US7449899B2 (en) | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
| WO2006137979A2 (en) | 2005-06-13 | 2006-12-28 | Cascade Microtech, Inc. | Wideband active-passive differential signal probe |
| DE112007001399T5 (de) | 2006-06-09 | 2009-05-07 | Cascade Microtech, Inc., Beaverton | Messfühler für differentielle Signale mit integrierter Symmetrieschaltung |
| US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
| US7443186B2 (en) | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
| US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
| US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
| US7750657B2 (en) * | 2007-03-15 | 2010-07-06 | Applied Materials Inc. | Polishing head testing with movable pedestal |
| US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
| US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
| US8410806B2 (en) | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3208734B2 (ja) * | 1990-08-20 | 2001-09-17 | 東京エレクトロン株式会社 | プローブ装置 |
| JPH05149379A (ja) | 1991-11-29 | 1993-06-15 | Takenaka Komuten Co Ltd | アクテイブ除振装置 |
| JPH0669321A (ja) | 1992-08-19 | 1994-03-11 | Tokyo Electron Yamanashi Kk | プローブ装置 |
| US5642056A (en) * | 1993-12-22 | 1997-06-24 | Tokyo Electron Limited | Probe apparatus for correcting the probe card posture before testing |
| JPH1082204A (ja) | 1996-09-10 | 1998-03-31 | Mitsubishi Steel Mfg Co Ltd | 摩擦力制御型制振装置 |
| US5814733A (en) * | 1996-09-12 | 1998-09-29 | Motorola, Inc. | Method of characterizing dynamics of a workpiece handling system |
| JPH11304837A (ja) | 1998-04-27 | 1999-11-05 | Yokogawa Electric Corp | プローブ装置 |
| JP4588816B2 (ja) | 1999-06-15 | 2010-12-01 | 特許機器株式会社 | 圧電制振ユニットおよびこれを用いた制振構造 |
| DE19952943C2 (de) | 1999-11-03 | 2003-07-03 | Infineon Technologies Ag | Nadelkarten-Justageeinrichtung zur Planarisierung von Nadelsätzen einer Nadelkarte |
-
2002
- 2002-01-30 JP JP2002021048A patent/JP2003222654A/ja active Pending
- 2002-12-23 TW TW091137043A patent/TWI274163B/zh not_active IP Right Cessation
-
2003
- 2003-01-08 WO PCT/JP2003/000084 patent/WO2003065441A1/ja not_active Ceased
- 2003-01-08 US US10/484,779 patent/US6933736B2/en not_active Expired - Fee Related
- 2003-01-08 KR KR1020047001411A patent/KR100597227B1/ko not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006029361A (ja) * | 2004-07-12 | 2006-02-02 | Toyota Motor Corp | 圧電素子と電気装置が重合された圧電式振動抑制装置 |
| JP2007227899A (ja) * | 2006-01-13 | 2007-09-06 | King Yuan Electronics Co Ltd | Zifコネクタつきプローブカード、その組立方法、ウェハテストシステム、及びそれを導入したウェハテスト方法 |
| WO2008050518A1 (en) * | 2006-10-20 | 2008-05-02 | Panasonic Corporation | Prober device |
| JP2022139421A (ja) * | 2021-03-12 | 2022-09-26 | レーザーテック株式会社 | 検査装置及び振動抑制方法 |
| JP7561662B2 (ja) | 2021-03-12 | 2024-10-04 | レーザーテック株式会社 | 検査装置及び振動抑制方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200302352A (en) | 2003-08-01 |
| WO2003065441A1 (en) | 2003-08-07 |
| US6933736B2 (en) | 2005-08-23 |
| KR100597227B1 (ko) | 2006-07-06 |
| US20040164759A1 (en) | 2004-08-26 |
| TWI274163B (en) | 2007-02-21 |
| KR20040020973A (ko) | 2004-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003222654A (ja) | プローブ装置 | |
| JP5049694B2 (ja) | プローブカード、半導体検査装置および半導体装置の製造方法 | |
| KR101375097B1 (ko) | 웨이퍼 트레이, 반도체 웨이퍼 시험 장치 및 반도체 웨이퍼의 시험 방법 | |
| JP5417428B2 (ja) | 電子顕微鏡および試料保持方法 | |
| JP2016143809A (ja) | 剥離装置、剥離システム、剥離方法、プログラム、および情報記憶媒体 | |
| CN108140602B (zh) | 载置台装置和探针装置 | |
| KR100745861B1 (ko) | 재치대의 정전기 제거 기구 및 검사 장치 | |
| JP2021048279A (ja) | ウェーハの処理方法、及び、チップ測定装置 | |
| JP4794624B2 (ja) | プローブカードの製造方法及び製造装置 | |
| JP7239527B2 (ja) | 半導体素子の検査装置及び半導体素子の検査方法 | |
| JP5179347B2 (ja) | 導電性接触子ユニット | |
| JP5345161B2 (ja) | パワーデバイス用のウエハキャリア及びこのウエハキャリアを用いる検査装置 | |
| JP7209938B2 (ja) | プローバ | |
| JP2016181639A (ja) | プローバ | |
| JP2009231848A (ja) | 半導体ウェハのテスト装置、半導体ウェハのテスト方法及び半導体ウェハ用プローブカード | |
| US11894256B2 (en) | Substrate holding mechanism, substrate mounting method, and substrate detaching method | |
| JP2004207399A (ja) | 基板保持装置 | |
| JP2001250850A (ja) | プローブ方法及びプローブ装置 | |
| JPH07321186A (ja) | 静電吸着装置 | |
| JP2000205840A (ja) | 形状検査装置 | |
| JP2023082554A (ja) | 筐体及びプローバ | |
| JP2016110864A (ja) | 走査型電子顕微鏡 | |
| JPH08203800A (ja) | 試料ホルダの固定装置 | |
| JP2008128656A (ja) | 表面形状測定システムおよび測定方法 | |
| JPH04215004A (ja) | 走査型トンネル顕微鏡 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041221 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041221 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20071113 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080311 |