Classifications

• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/2851—Testing of integrated circuits [IC]
  • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
  • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
• • G—PHYSICS
  • G01—MEASURING; TESTING
  • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
  • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
  • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
  • G01R31/2851—Testing of integrated circuits [IC]

Definitions

• the present invention relates to a probe device for performing an electrical inspection by bringing a probe needle of a probe card into contact with a semiconductor element formed on a substrate to be measured such as a semiconductor wafer.
• the probe device has a wafer mounting table for holding a semiconductor wafer.
• the wafer mounting table includes a drive mechanism having an XY drive mechanism including an XY table and a Z-axis drive mechanism.
• the drive mechanism enables the semiconductor wafer held on the wafer mounting table to move in the XYZ directions.
• a probe card holding mechanism for holding a probe force provided with a large number of probe needles corresponding to the electrode pads of the semiconductor element is provided above the wafer mounting table.
• a predetermined probe card is held by the probe card holding mechanism, and a semiconductor wafer on which electrical characteristics are to be inspected is placed on the wafer mounting table. Then, by moving and moving the wafer mounting table in the XYZ directions, the probe needle group and the plurality of electrode pad groups of the semiconductor element move at a predetermined movement pitch and come into contact with each other. As a result, the tester electrically connected to the probe needle group inspects the electrical characteristics of each semiconductor element.
• the probe needle group and the plurality of electrode pad groups of the semiconductor element sequentially come into contact with each other by moving the wafer mounting table. It is like that.
• Such movement of the wafer mounting table is performed stepwise. That is, the movement and stop of the wafer mounting table are repeated at the predetermined pitch. Then, while the wafer mounting table is stopped, the electrical characteristics of the semiconductor element are inspected.
• the surface of the electrode pad may be undesirably shaved by the probe needle and may be damaged.
• the present invention has been made in view of such a conventional situation, and it is possible to attenuate mechanical vibration at an early stage, perform good measurement with high throughput, and perform electrode pad by vibration. It is an object of the present invention to provide a probe device that can suppress the occurrence of damage to the probe.
• the present invention relates to a substrate to be processed on which a semiconductor element having a plurality of groups of electrode pads is formed.
• a mounting table to be mounted a probe card holding mechanism for holding a probe card provided with a probe needle group corresponding to each group of the electrode pads, and moving the mounting table to each group of the electrode pads.
• a drive mechanism for sequentially bringing the probe needles into contact with each other comprising: a conversion element for converting mechanical vibration energy generated in a component of the probe apparatus into electric energy; and a conversion element. And an electric circuit for extinguishing a current based on the electric energy converted by the electric device.
• the object of the present invention can be achieved, that is, mechanical vibration can be attenuated at an early stage, good measurement can be performed at high throughput, and the electrode pad due to vibration can be reduced. Damage can be suppressed.
• the conversion element is a piezo element.
• the probe card holding mechanism may be fixed to a plate-like member, and the conversion element may be provided on the plate-like member.
• a positioning camera for imaging and positioning the substrate to be processed is further provided.
• the conversion element may be provided on a support member that supports the alignment camera.
• the electric circuit is configured by an LR series circuit.
• FIG. 1 is a diagram showing an overall external configuration of an embodiment of the probe device of the present invention.
• FIG. 2 is a diagram schematically showing a vertical cross-sectional configuration of the probe device of FIG.
• FIG. 3 is a diagram showing a configuration of a main part of the probe device of FIG.
• FIG. 4 is a diagram showing a configuration of a main part of the prop apparatus of FIG.
• FIG. 5 is a diagram showing a configuration of a main part of the probe device of FIG.
• FIG. 6 is a diagram showing another configuration example of the electric circuit shown in FIG.
• FIG. 7 is a diagram illustrating an example in which a conversion element is arranged on a support member of a bridge camera.
• FIG. 8 is a diagram illustrating another example in which a conversion element is arranged on a support member of a bridge camera.
• FIG. 9 is a view showing still another example in which a conversion element is arranged on a support member of a bridge camera.
• FIG. 1 and 2 show a configuration of a probe device according to an embodiment of the present invention.
• FIG. 1 is a perspective view of the entire probe device
• FIG. 2 is a cross-sectional view of a main part of the probe device.
• the cap device of the present embodiment includes a housing 2 as an exterior body.
• the upper surface of the housing 2 functions as a head plate 2a.
• This head blade 2a is provided with an insert ring 21, and the insert ring 21 is provided with a probe force holding mechanism 4h.
• the prop card 4 is detachably held by the prop card holding mechanism 4 h.
• the housing 2 includes a wafer cassette (not shown) containing semiconductor wafers, a transfer mechanism (not shown) for transferring the semiconductor wafer W between the wafer mounting table 7 and the wafer cassette, and the like. Is also housed.
• reference numeral 3 denotes a tray for transferring the probe card 4 between a probe card holding mechanism 4 h provided on the insert ring 21 and the outside of the housing 2.
• Reference numeral 3 denotes a cover that covers the tray 3 when the tray 3 is not used, and reference numeral 24 denotes a display device that displays a screen for operating the probe device.
• the tray 3 is horizontal when used, is configured to be able to rotate and move up and down in a horizontal plane between the inside and the outside of the housing 2, and when not in use, falls down vertically as shown in FIG. It is configured to be in a state parallel to the front side of the housing 2.
• a probe base 2 b is provided at the bottom of the housing 2. Between the probe base 2b and the head plate 2a, there is provided a side wall constituting member 2c constituting a side surface of the housing 2.
• An XY stage 5 is provided in the housing 2 as a drive mechanism in the XY directions. Wafer mounting table on X-Y stage 5 via Z-axis drive mechanism 6 (Chuck top) 7 is provided. The semiconductor wafer W can be mounted on the wafer mounting table 7. The semiconductor wafer W is held by suction on the wafer mounting table 7 by a vacuum chuck (not shown).
• a support member 8 is provided above the wafer mounting table 7 so as to be bridged between opposing side walls of the housing 2.
• a bridge camera 9 for imaging and positioning the semiconductor wafer W is disposed on the support member 8.
• Rails 10 are provided at both ends of the support member 8. Accordingly, the support member 8 can move along the rails 10 in a direction perpendicular to the plane of FIG.
• the bridge camera 9 can be moved between an imaging position above the wafer mounting table 7 and an appropriate evacuation position retracted from above the wafer mounting table 7.
• a plurality of plate-like conversion elements 30 for converting mechanical vibration energy into electric energy are provided on the back surface side of head plate 2a.
• the conversion element 30 is, for example, a piezo element.
• an electric circuit 31 for extinguishing a current generated based on the electric energy converted by the conversion element 30 is connected to these conversion elements 30.
• the electric circuit 31 is an LR series circuit composed of an inductance component 31a composed of a coil or the like and a resistance component 31b composed of a variable resistance. The circuit can attenuate the current in a short time by attenuating the oscillation of the current generated in the conversion element 30 in a short time.
• the values of the inductance component 31a and the resistance component 3lb need to be appropriately selected according to the frequency of the current generated based on the electric energy converted by the conversion element 30.
• the mechanical vibration energy generated in the head plate 2a is converted into electric energy by the conversion element 30 and the electric circuit 31 to be attenuated and eliminated in a short time.
• a vibration damping mechanism is constructed.
• the conversion element 30 has directionality. Therefore, in order to efficiently attenuate the mechanical vibration generated in the head plate 2a, the arrangement position and the arrangement direction of the conversion element 30 in the head plate 2a are generated in the head blade 2a. It is desirable to set appropriately according to the direction of mechanical vibration.
• the four corners of the head plate 2a are often supported by columnar members (not shown). In this case, the head plate 2a often vibrates around the four corners so that the center of the head plate 2a is bent.
• the conversion elements 30 are arranged at each of the four corners of J and the doublet 2a (total of four), or as shown in FIG. It is preferable to arrange a total of eight conversion elements 30 between the four corners 2a and between them.
• the conversion element 30 can be fixed to the head plate 2a by, for example, fixing both ends of the conversion element 30 by screws, or bonding the conversion element 30 by an adhesive or the like. A method of sticking or the like can be used.
• the arrangement position (arrangement) and the arrangement number of the conversion elements 30 can be other arrangement positions and arrangement numbers. If the mechanical vibration generated in the head plate 2a is efficiently transmitted to the conversion element 30, and if the energy of the mechanical vibration is efficiently converted into electric energy by the conversion element 30, the conversion element 3
• the arrangement position and the number of arrangement of 0 may be any.
• the electric circuit 31 can also use two operational amplifiers as the inductance component 3 la as shown in FIG. 6, for example. With such a configuration, a large inductance can be realized with a relatively small circuit, and the value of the inductance can be made variable.
• the semiconductor wafer W is transferred by a transfer device (not shown) and mounted on the wafer mounting table 7.
• the semiconductor wafer W is sucked onto the wafer mounting table 7 by the vacuum chuck.
• the wafer stage 7 is moved in the X—Y—Z directions by the X—Y stage 5 and the Z-axis drive mechanism 6.
• a group of probe needles 4 a provided on the probe card 4 sequentially comes into contact with a group of electrode pads of a large number of semiconductor elements formed on the semiconductor wafer W on the wafer mounting table 7.
• the test element electrically connected to the probe needle 4a and the semiconductor element are electrically connected, and the electrical characteristics of each semiconductor element are measured.
• the housing 2 and the like vibrate mechanically.
• the head plate 2a on which the probe card 4 is supported also vibrates mechanically.
• the X-Y stage 5 and the Z-axis drive mechanism 6 are driven to move the wafer mounting table 7 so that the group of the probe needles 4a becomes the group of the electrode pads of the semiconductor element formed on the semiconductor wafer W. After contact, electrical measurements can be started immediately without the need for long delay times. That is, the throughput can be improved.
• the support member 8 with a vibration damping mechanism including the conversion element 30 and the electric circuit 31 similarly to the above-described head plate 2a.
• a total of three conversion elements 30 can be provided at both ends and the center of the support member 8.
• a total of two conversion elements 30 can be provided at both ends of the support member 8.
• the conversion element 30 can be provided only at the center of the support member 8.
• the arrangement position (arrangement) and the arrangement number of the conversion elements 30 can be other arrangement positions and arrangement numbers. If the mechanical vibration generated in the support member 8 is efficiently transmitted to the conversion element 30 and the energy of the mechanical vibration is efficiently converted into electric energy by the conversion element 30, the arrangement of the conversion element 30 is provided.
• the position and the number of arrangements may be any.
• the vibration damping mechanism including the conversion element 30 and the electric circuit 31 on the support member 8 that supports the bridge camera 9
• the vibration of the page camera 9 can be suppressed.
• the vibration damping mechanism including the conversion element 30 and the electric circuit 31 is disposed on the head plate 2a and a case where the vibration damping mechanism is disposed on the support member 8 supporting the page camera are described.
• the present invention is not limited to such a case, and it goes without saying that the vibration damping mechanism can be provided at a site other than these members.
• the shape of the conversion element 30 and the configuration of the electric circuit 31 can be appropriately changed.

Landscapes

• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• General Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Power Engineering (AREA)
• Testing Or Measuring Of Semiconductors Or The Like (AREA)
• Testing Of Individual Semiconductor Devices (AREA)
• Measuring Leads Or Probes (AREA)
• Tests Of Electronic Circuits (AREA)
• Vibration Prevention Devices (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (1)

Family

ID=27654380

Family Applications (1)

Country Status (5)

Families Citing this family (31)

Citations (3)

Family Cites Families (6)

• 2002
  • 2002-01-30 JP JP2002021048A patent/JP2003222654A/ja active Pending
  • 2002-12-23 TW TW091137043A patent/TWI274163B/zh not_active IP Right Cessation
• 2003
  • 2003-01-08 WO PCT/JP2003/000084 patent/WO2003065441A1/ja not_active Ceased
  • 2003-01-08 US US10/484,779 patent/US6933736B2/en not_active Expired - Fee Related
  • 2003-01-08 KR KR1020047001411A patent/KR100597227B1/ko not_active Expired - Fee Related

Patent Citations (3)

Also Published As

Similar Documents

Legal Events