TWI274163B - Prober - Google Patents
Prober Download PDFInfo
- Publication number
- TWI274163B TWI274163B TW091137043A TW91137043A TWI274163B TW I274163 B TWI274163 B TW I274163B TW 091137043 A TW091137043 A TW 091137043A TW 91137043 A TW91137043 A TW 91137043A TW I274163 B TWI274163 B TW I274163B
- Authority
- TW
- Taiwan
- Prior art keywords
- probe
- probe device
- conversion element
- disposed
- group
- Prior art date
Links
- 239000000523 sample Substances 0.000 claims abstract description 69
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- 230000007246 mechanism Effects 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 239000000470 constituent Substances 0.000 claims abstract 2
- 238000006243 chemical reaction Methods 0.000 claims description 45
- 230000002079 cooperative effect Effects 0.000 claims description 3
- 230000000875 corresponding effect Effects 0.000 claims description 3
- 230000001131 transforming effect Effects 0.000 claims description 2
- PCTMTFRHKVHKIS-BMFZQQSSSA-N (1s,3r,4e,6e,8e,10e,12e,14e,16e,18s,19r,20r,21s,25r,27r,30r,31r,33s,35r,37s,38r)-3-[(2r,3s,4s,5s,6r)-4-amino-3,5-dihydroxy-6-methyloxan-2-yl]oxy-19,25,27,30,31,33,35,37-octahydroxy-18,20,21-trimethyl-23-oxo-22,39-dioxabicyclo[33.3.1]nonatriaconta-4,6,8,10 Chemical compound C1C=C2C[C@@H](OS(O)(=O)=O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2.O[C@H]1[C@@H](N)[C@H](O)[C@@H](C)O[C@H]1O[C@H]1/C=C/C=C/C=C/C=C/C=C/C=C/C=C/[C@H](C)[C@@H](O)[C@@H](C)[C@H](C)OC(=O)C[C@H](O)C[C@H](O)CC[C@@H](O)[C@H](O)C[C@H](O)C[C@](O)(C[C@H](O)[C@H]2C(O)=O)O[C@H]2C1 PCTMTFRHKVHKIS-BMFZQQSSSA-N 0.000 claims 1
- 230000010358 mechanical oscillation Effects 0.000 abstract 1
- 230000002463 transducing effect Effects 0.000 abstract 1
- 238000013016 damping Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 230000002238 attenuated effect Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
- Vibration Prevention Devices (AREA)
- Measuring Leads Or Probes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002021048A JP2003222654A (ja) | 2002-01-30 | 2002-01-30 | プローブ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200302352A TW200302352A (en) | 2003-08-01 |
| TWI274163B true TWI274163B (en) | 2007-02-21 |
Family
ID=27654380
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW091137043A TWI274163B (en) | 2002-01-30 | 2002-12-23 | Prober |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US6933736B2 (enExample) |
| JP (1) | JP2003222654A (enExample) |
| KR (1) | KR100597227B1 (enExample) |
| TW (1) | TWI274163B (enExample) |
| WO (1) | WO2003065441A1 (enExample) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6232789B1 (en) | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
| US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
| US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
| US6578264B1 (en) | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
| US6838890B2 (en) | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
| DE20114544U1 (de) | 2000-12-04 | 2002-02-21 | Cascade Microtech, Inc., Beaverton, Oreg. | Wafersonde |
| AU2002327490A1 (en) | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
| EP1509776A4 (en) | 2002-05-23 | 2010-08-18 | Cascade Microtech Inc | PROBE TO TEST ANY TESTING EQUIPMENT |
| US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
| US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
| WO2006017078A2 (en) | 2004-07-07 | 2006-02-16 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
| DE112004002554T5 (de) | 2003-12-24 | 2006-11-23 | Cascade Microtech, Inc., Beaverton | Active wafer probe |
| JP4797341B2 (ja) * | 2004-07-12 | 2011-10-19 | トヨタ自動車株式会社 | 圧電素子と電気装置が重合された圧電式振動抑制装置 |
| DE202005021435U1 (de) | 2004-09-13 | 2008-02-28 | Cascade Microtech, Inc., Beaverton | Doppelseitige Prüfaufbauten |
| US7265534B2 (en) * | 2004-10-20 | 2007-09-04 | Freescale Semiconductor, Inc. | Test system for device characterization |
| US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
| US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
| US7449899B2 (en) | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
| WO2006137979A2 (en) | 2005-06-13 | 2006-12-28 | Cascade Microtech, Inc. | Wideband active-passive differential signal probe |
| JP2007227899A (ja) * | 2006-01-13 | 2007-09-06 | King Yuan Electronics Co Ltd | Ｚｉｆコネクタつきプローブカード、その組立方法、ウェハテストシステム、及びそれを導入したウェハテスト方法 |
| DE112007001399T5 (de) | 2006-06-09 | 2009-05-07 | Cascade Microtech, Inc., Beaverton | Messfühler für differentielle Signale mit integrierter Symmetrieschaltung |
| US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
| US7443186B2 (en) | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
| US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
| US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
| WO2008050518A1 (en) * | 2006-10-20 | 2008-05-02 | Panasonic Corporation | Prober device |
| US7750657B2 (en) * | 2007-03-15 | 2010-07-06 | Applied Materials Inc. | Polishing head testing with movable pedestal |
| US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
| US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
| US8410806B2 (en) | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
| JP7561662B2 (ja) * | 2021-03-12 | 2024-10-04 | レーザーテック株式会社 | 検査装置及び振動抑制方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3208734B2 (ja) * | 1990-08-20 | 2001-09-17 | 東京エレクトロン株式会社 | プローブ装置 |
| JPH05149379A (ja) | 1991-11-29 | 1993-06-15 | Takenaka Komuten Co Ltd | アクテイブ除振装置 |
| JPH0669321A (ja) | 1992-08-19 | 1994-03-11 | Tokyo Electron Yamanashi Kk | プローブ装置 |
| US5642056A (en) * | 1993-12-22 | 1997-06-24 | Tokyo Electron Limited | Probe apparatus for correcting the probe card posture before testing |
| JPH1082204A (ja) | 1996-09-10 | 1998-03-31 | Mitsubishi Steel Mfg Co Ltd | 摩擦力制御型制振装置 |
| US5814733A (en) * | 1996-09-12 | 1998-09-29 | Motorola, Inc. | Method of characterizing dynamics of a workpiece handling system |
| JPH11304837A (ja) | 1998-04-27 | 1999-11-05 | Yokogawa Electric Corp | プローブ装置 |
| JP4588816B2 (ja) | 1999-06-15 | 2010-12-01 | 特許機器株式会社 | 圧電制振ユニットおよびこれを用いた制振構造 |
| DE19952943C2 (de) | 1999-11-03 | 2003-07-03 | Infineon Technologies Ag | Nadelkarten-Justageeinrichtung zur Planarisierung von Nadelsätzen einer Nadelkarte |
-
2002
- 2002-01-30 JP JP2002021048A patent/JP2003222654A/ja active Pending
- 2002-12-23 TW TW091137043A patent/TWI274163B/zh not_active IP Right Cessation
-
2003
- 2003-01-08 WO PCT/JP2003/000084 patent/WO2003065441A1/ja not_active Ceased
- 2003-01-08 US US10/484,779 patent/US6933736B2/en not_active Expired - Fee Related
- 2003-01-08 KR KR1020047001411A patent/KR100597227B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| TW200302352A (en) | 2003-08-01 |
| WO2003065441A1 (en) | 2003-08-07 |
| US6933736B2 (en) | 2005-08-23 |
| KR100597227B1 (ko) | 2006-07-06 |
| JP2003222654A (ja) | 2003-08-08 |
| US20040164759A1 (en) | 2004-08-26 |
| KR20040020973A (ko) | 2004-03-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |