WO2008050518A1

WO2008050518A1 - Prober device

Info

Publication number: WO2008050518A1
Application number: PCT/JP2007/064874
Authority: WO
Inventors: Kenichi Tsunogaki; Takashi Ohtori
Original assignee: Panasonic Corporation
Priority date: 2006-10-20
Filing date: 2007-07-30
Publication date: 2008-05-02

Abstract

A prober device includes a probe card having a probe needle and separates the probe card from a wafer upon reception of a save signal during probe inspection. The prober device includes an imaging unit (12), an image recognition unit (13), a position acquisition unit (14), a displacement calculation unit (16), and a control unit (17). The imaging unit (12) images an electrode pad which is in contact with the probe needle. The image recognition unit (13) recognizes the electrode pad and the probe needle from the captured image data. The position acquisition unit (14) acquires the position of the electrode pad and the probe needle according to the recognition result of the image recognition unit (13). According to the position acquired by the position acquisition unit (14), the displacement calculation unit (16) calculates the displacement of the probe needle against the electrode pad. The control unit (17) outputs a save signal if the calculated displacement is greater than a predetermined value.

Description

Specification

Prober equipment

Technical field

TECHNICAL FIELD [0001] The present invention relates to a prober device, and more particularly, to a probe needle protection technique in the prober device.

Background art

[0002] Electrical characteristic inspection of a semiconductor integrated circuit is generally performed using a prober device, and is also called probe inspection. The probe inspection is performed by bringing a probe needle disposed on the probe card into contact with each electrode pad of a semiconductor integrated circuit regularly formed on the wafer. However, if any vibration occurs while the probe needle is in contact with the electrode pad, excessive force may be applied to the probe needle and the probe needle may be deformed. If the probe needle is deformed, the probe card must be repaired or replaced, which is expensive.

[0003] Conventionally, a technique for detecting deformation caused by an earthquake and preventing deformation of the probe needle is known.

(See Patent Document 1).

Patent Document 1: Japanese Patent Laid-Open No. 2005-300381

Disclosure of the invention

Problems to be solved by the invention

[0004] With the above technology, pitch and roll cannot be detected! /. In addition, it may not be possible to deal with low-frequency earthquakes. Furthermore, it does not take into account shaking caused by other than earthquakes. For this reason, the probe needle may not be sufficiently protected

In view of the above problems, an object of the present invention is to realize a prober device that can protect a probe needle from vibration during probe inspection.

Means for solving the problem

[0006] The means taken by the present invention in order to solve the above problems includes a probe card on which a probe needle is arranged, and when a retraction signal is received during probe inspection, As a prober device, the probe needle comes into contact with the probe pad! /, And the image recognition unit recognizes the electrode pad and the probe needle from the image data obtained by photographing the electrode pad. And a position acquisition unit for acquiring the positions of the electrode pad and the probe needle based on the recognition result by the image recognition unit, and a probe needle for the electrode pad based on the position acquired by the position acquisition unit. A displacement calculation unit for calculating the displacement of the first and second control units for comparing the displacement calculated by the displacement calculation unit with a predetermined value and outputting a retract signal when the displacement is greater than the predetermined value. .

[0007] According to this, since the probe and the card are separated when the displacement of the probe needle relative to the electrode pad is larger than a predetermined value, the force S can be protected from vibration during probe inspection. I'll do it.

[0008] Preferably, the imaging unit captures a plurality of electrode pads, the displacement calculation unit calculates a displacement for each of the plurality of electrode pads, and the control unit includes a plurality of electrode nodes / nodes. When the displacement related to at least one of the electrode pads is larger than a predetermined value, a withdrawal signal is output.

[0009] According to this, since the output of the retract signal is controlled based on the displacement of the probe needle with respect to the plurality of electrode pads, the control is based on only the displacement of the probe needle with respect to one electrode pad. Also, the probe needle can be protected with high accuracy.

[0010] Specifically, the imaging unit includes a movable imaging device or a plurality of imaging devices, and images a plurality of electrode pads sequentially or simultaneously.

[0011] Preferably, the above prober apparatus includes a timer for measuring a predetermined time and a storage unit for storing the position acquired by the position acquisition unit. Here, the photographing unit photographs the electrode pad every time a predetermined time is measured by the timer, and the displacement calculating unit reads the position stored in the storage unit and calculates the displacement.

[0012] According to this, it is possible to capture the electrode pad at predetermined time intervals and protect the probe needle based on the displacement of the probe needle calculated from the captured image data.

[0013] Preferably, the control unit outputs a retract signal or a warning signal when detecting that the electrode pad and the probe needle are in contact with each other continuously for a predetermined time or more. The alarm generator generates a warning sound in response to the warning signal. [0014] According to this, since the electrode pad and the probe needle are controlled so as not to be inadvertently brought into contact with each other for a long time, the risk of damage to the probe needle due to the contact between the electrode pad and the probe needle for a long time is reduced. Can be reduced.

The invention's effect

As described above, according to the present invention, the probe needle can be protected from vibration during probe inspection.

Brief Description of Drawings

FIG. 1 is a diagram showing a configuration of a prober apparatus according to a first embodiment.

FIG. 2 is a diagram illustrating an image photographed by a photographing unit.

FIG. 3 is an example of a flowchart of probe gold protection operation according to the first embodiment.

[FIG. 4] FIG. 4 is another example of the flowchart of the probe gold protection operation according to the first embodiment.

FIG. 5 is another example of a flowchart of the probe gold protection operation according to the first embodiment.

FIG. 6 is a diagram showing a configuration of a prober apparatus according to a second embodiment.

FIG. 7 is an example of a flowchart of probe gold protection operation according to the second embodiment.

[FIG. 8] FIG. 8 is another example of a flowchart of the probe gold protection operation according to the second embodiment.

Explanation of symbols

[0017] 1A, IB prober device

2 LSI tester

10 stages

11 Probe card

101 electrode pads

110 Probe Kinju

12 Shooting section 13 Image recognition unit

14 Position acquisition unit

15 Memory

16 Displacement calculator

17, 17 'control unit

18 timer

19 Stage controller

20 Alarm generator

100 Ueno coffee

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, the best mode for carrying out the present invention will be described with reference to the drawings.

[0019] (First embodiment)

FIG. 1 shows a configuration of a prober apparatus according to the first embodiment. The prober apparatus 1A includes a stage 10, a probe card 11, an imaging unit 12, an image recognition unit 13, a position acquisition unit 14, a storage unit 15, a displacement calculation unit 16, a control unit 17, a timer 18, and a stage control unit 19. . The prober device 1A performs probe inspection by communicating with an external LSI tester 2 storing information necessary for inspection.

The stage 10 is a table on which the wafer 100 is placed, and moves in the vertical direction under the control of the stage control unit 19. A semiconductor integrated circuit to be inspected is regularly formed on the wafer 100, and each semiconductor integrated circuit is provided with a plurality of electrode pads.

The probe card 11 is fixed at a predetermined position facing the wafer 100 placed on the stage 10. Also, the probe card 11 has a number of probe needles 110 necessary for probe inspection.

The imaging unit 12 images an arbitrary electrode pad based on an instruction in a state where the probe needle 110 is in contact with each electrode pad of the semiconductor integrated circuit. Specifically, the photographing unit 12 can be configured with a digital camera. FIG. 2 shows an image photographed by the photographing unit 12. FIG. 2 shows the electrode pad 101 taken from above. Probe needle tip 110a It is in contact with the electrode pad 101.

Returning to FIG. 1, the image recognition unit 13 takes in the image data photographed by the photographing unit 12, and recognizes the electrode pad 101 and the probe needle tip portion 11 Oa from the image data. The position acquisition unit 14 acquires the positions of the electrode pad 101 and the probe needle tip 110a based on the recognition result of the image recognition unit 13, respectively. The storage unit 15 stores the positions of the electrode pad 101 and the probe needle tip portion 11 Oa acquired by the position acquisition unit 14.

The displacement calculation unit 16 reads the positions of the electrode pad 101 and the probe needle tip end 110a stored in the storage unit 15 and calculates the displacement of the probe needle tip 110a relative to the electrode pad 101. . Specifically, the displacement calculation unit 16 determines the position (reference position) of the electrode pad 101 and the probe needle tip 11 Oa acquired based on the image data taken before the probe inspection is started! The displacement of the probe needle tip portion 11 Oa is calculated based on the position of the electrode pad 101 and the probe needle tip portion 110a acquired based on the image data taken after the start of the inspection.

The control unit 17 compares the displacement calculated by the displacement calculation unit 16 with a predetermined value set in advance. When the displacement is larger than a predetermined value, the evacuation signal si is output. Further, the control unit 17 instructs the photographing unit 12 to perform photographing. For example, the control unit 17 gives a shooting instruction each time the timer 18 measures a predetermined time.

The stage control unit 19 moves the stage 10 downward when it receives the evacuation signal si output from the control unit 17. Thereby, the wafer 100 is separated from the probe card 11 and the probe needle 110 is protected.

FIG. 3 shows a flowchart of the probe needle protecting operation in the probe apparatus 1A. First, the electrode pad 101 is photographed by the photographing unit 12 (S100). The electrode pad 101 and the probe needle tip 110a are recognized from the image data photographed in step S100, and the reference position is acquired. The acquired reference position is stored in the storage unit 15 (S101). When probe inspection is started, the electrode pad 101 is imaged again by the imaging unit 12 (S102). In the same procedure as described above, the positions of the electrode pad 101 and the probe needle tip portion 110a are acquired and stored in the storage unit 15 (S103).

[0028] Reference position stored in step S101 and stored in step S103 The position is read from the storage unit 15, and the displacement of the probe needle tip portion 110a with respect to the electrode pad 101 is calculated. When the calculated displacement is larger than the predetermined value (YES leg of S104), the retract signal si is output (S105). As a result, the stage 10 is moved downward, and the probe needle protecting operation ends. On the other hand, when the calculated displacement is smaller than the predetermined value (NO limb of S104), during the probe examination, return to step S102 and continue the subsequent processing.

[0029] According to the present embodiment, during the probe inspection, when the displacement of the probe needle tip exceeds a predetermined value for some reason, the probe card and the wafer are immediately separated and are brought into a non-contact state. Therefore, deformation of the probe needle can be prevented.

[0030] As the photographing unit 12, a plurality of digital cameras may be provided. Multiple digital cameras photograph different electrode pads at the same time. Figure 4 shows a flowchart of the probe needle protection operation when two digital cameras are installed. First, the electrode pads A and B are taken respectively by the two digital cameras (S100a, S100b) based on _o captured each image data is the reference position A and B is acquired and stored in the storage unit 15 (S1 Ola, S 101b) _{o When} probe inspection is started, electrode pads A and B are imaged again (S102a, S102b), and positions A and B based on the imaged image data are recorded in the storage unit 15. It is remembered (S103a, S103b). Then, the displacement of the probe needle tip for each electrode pad is calculated, and each displacement is compared with a predetermined value. When the displacement of the tip of the probe needle is greater than the predetermined value! / On either one of electrode pads A and B (YES leg of S1 04 '), the retract signal si is output ( S 105). On the other hand, when the displacement of the tip of the probe needle for electrode pads A and B is both smaller than the predetermined value (NO limb of S104 ′), the probe returns to steps S102a and S102b for subsequent processing during probe inspection. continue. According to this, since the output of the retract signal si is controlled based on the displacement of the probe needle tip with respect to a plurality of electrode pads, the output is controlled only based on the displacement of the probe needle tip with respect to one electrode pad. The probe needle can be protected more securely than in the case where the

[0031] The imaging unit 12 shown in FIG. 1 may be movable, and a plurality of electrode pads may be sequentially imaged. Figure 5 shows a flow chart of the probe needle protection operation when a movable digital camera is installed. Step Acquired from image data of electrode pad A taken at SlOOa The determined reference position A is stored in the recording unit 15 (S 101a). Thereafter, the position of the photographing unit 12 is moved (S110), and the reference position A acquired from the image data of the electrode pad A photographed in step SlOOb is stored in the recording unit 15 (S101b). When the probe inspection is started, the position of the imaging unit 12 is moved and the electrode pads A and B are imaged as described above, and the positions A and B based on the imaged image data are stored in the storage unit 15. (S 1 02a to S103b). The subsequent processing is the same as that shown in FIG. By moving the digital camera and shooting multiple electrode pads, the same effect as when multiple digital cameras are installed can be realized at a lower cost.

[0032] Note that the storage unit 15 and the timer 18 may be provided outside the prober device 1A. Further, the control unit 17 may instruct photographing at an arbitrary timing.

[0033] Acquisition of the reference position may be omitted. At this time, the displacement calculation unit 16 reads the two most recent positions from the position information stored in the storage unit 15 after the probe inspection is started, and calculates the displacement of the probe needle tip. .

[0034] (Second Embodiment)

FIG. 6 shows a configuration of a prober apparatus according to the second embodiment. The prober device 1B includes an alarm generation unit 20 and a control unit 17 ′ instead of the control unit 17 in addition to the configuration of the prober device 1A shown in FIG.

[0035] When the displacement calculated by the displacement calculating unit 16 is larger than a predetermined value, the control unit 17 'outputs the evacuation signal si. The control unit 17 ′ outputs a warning signal s2 when the contact time between the electrode pad and the probe needle tip reaches a predetermined time. As the predetermined time, a time (for example, 100 seconds) that is sufficiently longer than the standard probe inspection time of 5 to 30 seconds per semiconductor integrated circuit is set. When the alarm generation unit 20 receives the warning signal s2 output from the control unit 17 ′, it generates a warning sound.

FIG. 7 shows a flowchart of the probe needle protecting operation in the prober apparatus 1B. Here, the predetermined time is set to 100 seconds, and this is divided by the required time (for example, 1 second) from when the electrode pad is photographed until the judgment for signal output is completed (1 loop). Set the number of large loops to 100. Steps that are the same as those in FIG. [0037] When the displacement of the probe needle tip calculated by the displacement calculator 16 is smaller than a predetermined value (NO limb of S104), it is determined whether or not the loop count n has reached 100 (S20). 0). When it is determined that the loop count n has reached 100 (YES in S200), a warning signal s2 is output (S201). As a result, a warning sound is emitted and the probe needle protection operation ends. On the other hand, when the loop count n is less than 100 (NO in S200), the process returns to step S102 to repeat the subsequent processing.

[0038] According to the present embodiment, when the contact time between the electrode pad and the probe needle is too longer than the time required for the probe inspection, a warning sound is generated to alert the user. Therefore, it is possible to reduce the risk of damage to the tip of the probe needle due to device troubles and inspection program bugs that are caused only by deformation of the probe needle due to shaking during probe inspection, and human error. it can.

Note that the alarm generation unit 20 may be omitted. At this time, the control unit 17 ′ may output the save signal si instead of the warning signal s2. FIG. 8 shows a flowchart of probe needle protection when the alarm generation unit 20 is omitted. When the displacement of the probe needle tip calculated by the displacement calculator 16 is greater than the specified value or the loop count n reaches 100 (YES in step S202), the retract signal si is output. (S105). On the other hand, when the calculated displacement is smaller than the predetermined value and the loop count n is less than 100 (NO in step S202), the process returns to step S102 and the subsequent processing is repeated. According to this, even when the contact time between the electrode pad and the probe needle is too longer than the time required for the probe inspection, the probe card and the wafer can be separated to protect the probe needle.

Industrial applicability

The prober apparatus of the present invention is useful as a prober apparatus for a semiconductor integrated circuit that is miniaturized and highly integrated because it can protect the probe needle from vibration during probe inspection.

Claims

The scope of the claims

[1] A prober device comprising a probe card on which probe needles are arranged, and separating the probe card and the wafer when receiving a retract signal during probe inspection,

An imaging unit for imaging the electrode pad in contact with the probe needle;

An image recognition unit for recognizing the electrode pad and the probe needle from image data captured by the imaging unit;

A position acquisition unit for acquiring the positions of the electrode pad and the probe needle based on the recognition result by the image recognition unit;

A displacement calculating unit that calculates the displacement of the probe needle relative to the electrode pad based on the position acquired by the position acquiring unit;

A controller that compares the displacement calculated by the displacement calculator with a predetermined value and outputs the retract signal when the displacement is greater than the predetermined value.

A prober device characterized by that.

[2] In the prober device according to claim 1,

The photographing unit photographs a plurality of electrode pads,

The displacement calculation unit is configured to calculate the displacement for each of the plurality of electrode pads.

The control unit outputs the retract signal when the displacement related to at least one of the plurality of electrode pads is larger than the predetermined value.

A prober device characterized by that.

[3] In the prober device according to claim 2,

The prober device characterized in that the photographing unit has a movable photographing device and photographs the plurality of electrode pads sequentially.

[4] The prober device according to claim 2,

The prober device characterized in that the photographing unit has a plurality of photographing devices and photographs the plurality of electrode pads simultaneously.

[5] The prober device according to claim 1,

A timer for measuring a predetermined time; A storage unit for storing the position acquired by the position acquisition unit,

The imaging unit captures the electrode pad every time the predetermined time is measured by the timer.

The displacement calculation unit reads the position stored in the storage unit and calculates the displacement.

A prober device characterized by that.

[6] In the prober device according to claim 1,

The control unit outputs the retract signal when it is detected that the electrode pad and the probe needle are in contact with each other continuously for a predetermined time or more.

A prober device characterized by that.

[7] The prober device according to claim 1,

The control unit outputs a warning signal when detecting that the electrode pad and the probe needle are in contact with each other continuously for a predetermined time or more,

Provided with an alarm generator that emits a warning sound when receiving the warning signal

A prober device characterized by that.