WO2008050518A1 - Dispositif de sondeur - Google Patents

Dispositif de sondeur Download PDF

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Publication number
WO2008050518A1
WO2008050518A1 PCT/JP2007/064874 JP2007064874W WO2008050518A1 WO 2008050518 A1 WO2008050518 A1 WO 2008050518A1 JP 2007064874 W JP2007064874 W JP 2007064874W WO 2008050518 A1 WO2008050518 A1 WO 2008050518A1
Authority
WO
WIPO (PCT)
Prior art keywords
unit
displacement
probe
probe needle
electrode pad
Prior art date
Application number
PCT/JP2007/064874
Other languages
English (en)
Japanese (ja)
Inventor
Kenichi Tsunogaki
Takashi Ohtori
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Publication of WO2008050518A1 publication Critical patent/WO2008050518A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Definitions

  • the present invention relates to a prober device, and more particularly, to a probe needle protection technique in the prober device.
  • Electrical characteristic inspection of a semiconductor integrated circuit is generally performed using a prober device, and is also called probe inspection.
  • the probe inspection is performed by bringing a probe needle disposed on the probe card into contact with each electrode pad of a semiconductor integrated circuit regularly formed on the wafer. However, if any vibration occurs while the probe needle is in contact with the electrode pad, excessive force may be applied to the probe needle and the probe needle may be deformed. If the probe needle is deformed, the probe card must be repaired or replaced, which is expensive.
  • Patent Document 1 Japanese Patent Laid-Open No. 2005-300381
  • an object of the present invention is to realize a prober device that can protect a probe needle from vibration during probe inspection.
  • the means taken by the present invention in order to solve the above problems includes a probe card on which a probe needle is arranged, and when a retraction signal is received during probe inspection, As a prober device, the probe needle comes into contact with the probe pad! /, And the image recognition unit recognizes the electrode pad and the probe needle from the image data obtained by photographing the electrode pad. And a position acquisition unit for acquiring the positions of the electrode pad and the probe needle based on the recognition result by the image recognition unit, and a probe needle for the electrode pad based on the position acquired by the position acquisition unit. A displacement calculation unit for calculating the displacement of the first and second control units for comparing the displacement calculated by the displacement calculation unit with a predetermined value and outputting a retract signal when the displacement is greater than the predetermined value. .
  • the imaging unit captures a plurality of electrode pads
  • the displacement calculation unit calculates a displacement for each of the plurality of electrode pads
  • the control unit includes a plurality of electrode nodes / nodes.
  • the output of the retract signal is controlled based on the displacement of the probe needle with respect to the plurality of electrode pads, the control is based on only the displacement of the probe needle with respect to one electrode pad. Also, the probe needle can be protected with high accuracy.
  • the imaging unit includes a movable imaging device or a plurality of imaging devices, and images a plurality of electrode pads sequentially or simultaneously.
  • the above prober apparatus includes a timer for measuring a predetermined time and a storage unit for storing the position acquired by the position acquisition unit.
  • the photographing unit photographs the electrode pad every time a predetermined time is measured by the timer, and the displacement calculating unit reads the position stored in the storage unit and calculates the displacement.
  • the control unit outputs a retract signal or a warning signal when detecting that the electrode pad and the probe needle are in contact with each other continuously for a predetermined time or more.
  • the alarm generator generates a warning sound in response to the warning signal.
  • the probe needle can be protected from vibration during probe inspection.
  • FIG. 1 is a diagram showing a configuration of a prober apparatus according to a first embodiment.
  • FIG. 2 is a diagram illustrating an image photographed by a photographing unit.
  • FIG. 3 is an example of a flowchart of probe gold protection operation according to the first embodiment.
  • FIG. 4 is another example of the flowchart of the probe gold protection operation according to the first embodiment.
  • FIG. 5 is another example of a flowchart of the probe gold protection operation according to the first embodiment.
  • FIG. 6 is a diagram showing a configuration of a prober apparatus according to a second embodiment.
  • FIG. 7 is an example of a flowchart of probe gold protection operation according to the second embodiment.
  • FIG. 8 is another example of a flowchart of the probe gold protection operation according to the second embodiment.
  • FIG. 1 shows a configuration of a prober apparatus according to the first embodiment.
  • the prober apparatus 1A includes a stage 10, a probe card 11, an imaging unit 12, an image recognition unit 13, a position acquisition unit 14, a storage unit 15, a displacement calculation unit 16, a control unit 17, a timer 18, and a stage control unit 19. .
  • the prober device 1A performs probe inspection by communicating with an external LSI tester 2 storing information necessary for inspection.
  • the stage 10 is a table on which the wafer 100 is placed, and moves in the vertical direction under the control of the stage control unit 19.
  • a semiconductor integrated circuit to be inspected is regularly formed on the wafer 100, and each semiconductor integrated circuit is provided with a plurality of electrode pads.
  • the probe card 11 is fixed at a predetermined position facing the wafer 100 placed on the stage 10. Also, the probe card 11 has a number of probe needles 110 necessary for probe inspection.
  • the imaging unit 12 images an arbitrary electrode pad based on an instruction in a state where the probe needle 110 is in contact with each electrode pad of the semiconductor integrated circuit.
  • the photographing unit 12 can be configured with a digital camera.
  • FIG. 2 shows an image photographed by the photographing unit 12.
  • FIG. 2 shows the electrode pad 101 taken from above. Probe needle tip 110a It is in contact with the electrode pad 101.
  • the image recognition unit 13 takes in the image data photographed by the photographing unit 12, and recognizes the electrode pad 101 and the probe needle tip portion 11 Oa from the image data.
  • the position acquisition unit 14 acquires the positions of the electrode pad 101 and the probe needle tip 110a based on the recognition result of the image recognition unit 13, respectively.
  • the storage unit 15 stores the positions of the electrode pad 101 and the probe needle tip portion 11 Oa acquired by the position acquisition unit 14.
  • the displacement calculation unit 16 reads the positions of the electrode pad 101 and the probe needle tip end 110a stored in the storage unit 15 and calculates the displacement of the probe needle tip 110a relative to the electrode pad 101. . Specifically, the displacement calculation unit 16 determines the position (reference position) of the electrode pad 101 and the probe needle tip 11 Oa acquired based on the image data taken before the probe inspection is started! The displacement of the probe needle tip portion 11 Oa is calculated based on the position of the electrode pad 101 and the probe needle tip portion 110a acquired based on the image data taken after the start of the inspection.
  • the control unit 17 compares the displacement calculated by the displacement calculation unit 16 with a predetermined value set in advance. When the displacement is larger than a predetermined value, the evacuation signal si is output. Further, the control unit 17 instructs the photographing unit 12 to perform photographing. For example, the control unit 17 gives a shooting instruction each time the timer 18 measures a predetermined time.
  • the stage control unit 19 moves the stage 10 downward when it receives the evacuation signal si output from the control unit 17. Thereby, the wafer 100 is separated from the probe card 11 and the probe needle 110 is protected.
  • FIG. 3 shows a flowchart of the probe needle protecting operation in the probe apparatus 1A.
  • the electrode pad 101 is photographed by the photographing unit 12 (S100).
  • the electrode pad 101 and the probe needle tip 110a are recognized from the image data photographed in step S100, and the reference position is acquired.
  • the acquired reference position is stored in the storage unit 15 (S101).
  • the electrode pad 101 is imaged again by the imaging unit 12 (S102).
  • the positions of the electrode pad 101 and the probe needle tip portion 110a are acquired and stored in the storage unit 15 (S103).
  • the probe card and the wafer are immediately separated and are brought into a non-contact state. Therefore, deformation of the probe needle can be prevented.
  • FIG. 12 As the photographing unit 12, a plurality of digital cameras may be provided. Multiple digital cameras photograph different electrode pads at the same time.
  • Figure 4 shows a flowchart of the probe needle protection operation when two digital cameras are installed. First, the electrode pads A and B are taken respectively by the two digital cameras (S100a, S100b) based on o captured each image data is the reference position A and B is acquired and stored in the storage unit 15 (S1 Ola, S 101b) o When probe inspection is started, electrode pads A and B are imaged again (S102a, S102b), and positions A and B based on the imaged image data are recorded in the storage unit 15. It is remembered (S103a, S103b).
  • the displacement of the probe needle tip for each electrode pad is calculated, and each displacement is compared with a predetermined value.
  • the displacement of the tip of the probe needle is greater than the predetermined value! /
  • the retract signal si is output ( S 105).
  • the probe returns to steps S102a and S102b for subsequent processing during probe inspection. continue.
  • the output of the retract signal si is controlled based on the displacement of the probe needle tip with respect to a plurality of electrode pads, the output is controlled only based on the displacement of the probe needle tip with respect to one electrode pad.
  • the probe needle can be protected more securely than in the case where the
  • the imaging unit 12 shown in FIG. 1 may be movable, and a plurality of electrode pads may be sequentially imaged.
  • Figure 5 shows a flow chart of the probe needle protection operation when a movable digital camera is installed. Step Acquired from image data of electrode pad A taken at SlOOa The determined reference position A is stored in the recording unit 15 (S 101a). Thereafter, the position of the photographing unit 12 is moved (S110), and the reference position A acquired from the image data of the electrode pad A photographed in step SlOOb is stored in the recording unit 15 (S101b).
  • the position of the imaging unit 12 is moved and the electrode pads A and B are imaged as described above, and the positions A and B based on the imaged image data are stored in the storage unit 15. (S 1 02a to S103b).
  • the subsequent processing is the same as that shown in FIG.
  • the storage unit 15 and the timer 18 may be provided outside the prober device 1A. Further, the control unit 17 may instruct photographing at an arbitrary timing.
  • the displacement calculation unit 16 reads the two most recent positions from the position information stored in the storage unit 15 after the probe inspection is started, and calculates the displacement of the probe needle tip. .
  • FIG. 6 shows a configuration of a prober apparatus according to the second embodiment.
  • the prober device 1B includes an alarm generation unit 20 and a control unit 17 ′ instead of the control unit 17 in addition to the configuration of the prober device 1A shown in FIG.
  • the control unit 17 When the displacement calculated by the displacement calculating unit 16 is larger than a predetermined value, the control unit 17 'outputs the evacuation signal si.
  • the control unit 17 ′ outputs a warning signal s2 when the contact time between the electrode pad and the probe needle tip reaches a predetermined time.
  • a predetermined time a time (for example, 100 seconds) that is sufficiently longer than the standard probe inspection time of 5 to 30 seconds per semiconductor integrated circuit is set.
  • the alarm generation unit 20 receives the warning signal s2 output from the control unit 17 ′, it generates a warning sound.
  • FIG. 7 shows a flowchart of the probe needle protecting operation in the prober apparatus 1B.
  • the predetermined time is set to 100 seconds, and this is divided by the required time (for example, 1 second) from when the electrode pad is photographed until the judgment for signal output is completed (1 loop). Set the number of large loops to 100. Steps that are the same as those in FIG. [0037]
  • a predetermined value NO limb of S104
  • a warning signal s2 is output (S201).
  • the loop count n is less than 100 (NO in S200)
  • the process returns to step S102 to repeat the subsequent processing.
  • the contact time between the electrode pad and the probe needle is too longer than the time required for the probe inspection, a warning sound is generated to alert the user. Therefore, it is possible to reduce the risk of damage to the tip of the probe needle due to device troubles and inspection program bugs that are caused only by deformation of the probe needle due to shaking during probe inspection, and human error. it can.
  • FIG. 8 shows a flowchart of probe needle protection when the alarm generation unit 20 is omitted.
  • the control unit 17 ′ may output the save signal si instead of the warning signal s2.
  • FIG. 8 shows a flowchart of probe needle protection when the alarm generation unit 20 is omitted.
  • the retract signal si is output. (S105).
  • the process returns to step S102 and the subsequent processing is repeated. According to this, even when the contact time between the electrode pad and the probe needle is too longer than the time required for the probe inspection, the probe card and the wafer can be separated to protect the probe needle.
  • the prober apparatus of the present invention is useful as a prober apparatus for a semiconductor integrated circuit that is miniaturized and highly integrated because it can protect the probe needle from vibration during probe inspection.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

La présente invention concerne un dispositif de sonde qui comprend une carte de sonde qui dispose d'une aiguille de sonde et qui sépare la carte de sonde d'une plaquette lors de la réception d'un signal d'enregistrement pendant l'inspection de sonde. Le dispositif de sonde comprend une unité d'imagerie (12), une unité de reconnaissance d'image (13), une unité d'acquisition de position (14), une unité de calcul de déplacement (16) et une unité de contrôle (17). L'unité d'imagerie (12) capture l'image d'une connexion d'électrode qui est en contact avec l'aiguille de sonde. L'unité de reconnaissance d'image (13) reconnaît la connexion d'électrode et l'aiguille de sonde à partir des données d'image capturées. L'unité d'acquisition de position (14) acquiert la position de la connexion d'électrode et de l'aiguille de sonde en fonction du résultat de reconnaissance de l'unité de reconnaissance d'image (13). Selon la position acquise par l'unité d'acquisition de position (14), l'unité de calcul de déplacement (16) calcule le déplacement de l'aiguille de sonde par rapport à la connexion d'électrode. L'unité de contrôle (17) émet un signal d'enregistrement si le déplacement calculé est supérieur à une valeur prédéterminée.
PCT/JP2007/064874 2006-10-20 2007-07-30 Dispositif de sondeur WO2008050518A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006286214 2006-10-20
JP2006-286214 2006-10-20

Publications (1)

Publication Number Publication Date
WO2008050518A1 true WO2008050518A1 (fr) 2008-05-02

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WO (1) WO2008050518A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102901920A (zh) * 2011-07-26 2013-01-30 精工爱普生株式会社 电子部件搬运装置以及电子部件搬运方法
US9186466B2 (en) 2012-03-14 2015-11-17 Becton, Dickinson And Company Passively activated safety needle assemblies and methods of use
CN116755171A (zh) * 2023-08-21 2023-09-15 矽佳半导体(嘉兴)有限公司 一种cp测试的安全防护系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5883152U (ja) * 1981-12-01 1983-06-06 松下電器産業株式会社 触針型測定装置
JPH1164446A (ja) * 1997-08-26 1999-03-05 Ando Electric Co Ltd Ｔａｂ用オートハンドラ
JP2003222654A (ja) * 2002-01-30 2003-08-08 Tokyo Electron Ltd プローブ装置
JP2004152916A (ja) * 2002-10-29 2004-05-27 Nec Corp 半導体デバイス検査装置及び検査方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5883152U (ja) * 1981-12-01 1983-06-06 松下電器産業株式会社 触針型測定装置
JPH1164446A (ja) * 1997-08-26 1999-03-05 Ando Electric Co Ltd Ｔａｂ用オートハンドラ
JP2003222654A (ja) * 2002-01-30 2003-08-08 Tokyo Electron Ltd プローブ装置
JP2004152916A (ja) * 2002-10-29 2004-05-27 Nec Corp 半導体デバイス検査装置及び検査方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102901920A (zh) * 2011-07-26 2013-01-30 精工爱普生株式会社 电子部件搬运装置以及电子部件搬运方法
US9186466B2 (en) 2012-03-14 2015-11-17 Becton, Dickinson And Company Passively activated safety needle assemblies and methods of use
USRE47472E1 (en) 2012-03-14 2019-07-02 Becton, Dickinson And Company Passively activated safety needle assemblies and methods of use
USRE48049E1 (en) 2012-03-14 2020-06-16 Becton, Dickinson And Company Passively activated safety needle assemblies and methods of use
CN116755171A (zh) * 2023-08-21 2023-09-15 矽佳半导体(嘉兴)有限公司 一种cp测试的安全防护系统
CN116755171B (zh) * 2023-08-21 2023-11-03 矽佳半导体(嘉兴)有限公司 一种cp测试的安全防护系统

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