JP2003110003A5 - - Google Patents

Download PDF

Info

Publication number
JP2003110003A5
JP2003110003A5 JP2002208944A JP2002208944A JP2003110003A5 JP 2003110003 A5 JP2003110003 A5 JP 2003110003A5 JP 2002208944 A JP2002208944 A JP 2002208944A JP 2002208944 A JP2002208944 A JP 2002208944A JP 2003110003 A5 JP2003110003 A5 JP 2003110003A5
Authority
JP
Japan
Prior art keywords
end effector
disk
substrate
coupled
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002208944A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003110003A (ja
Filing date
Publication date
Priority claimed from US09/882,394 external-priority patent/US6752585B2/en
Application filed filed Critical
Publication of JP2003110003A publication Critical patent/JP2003110003A/ja
Publication of JP2003110003A5 publication Critical patent/JP2003110003A5/ja
Pending legal-status Critical Current

Links

JP2002208944A 2001-06-13 2002-06-13 半導体基板を移送するための方法及び装置 Pending JP2003110003A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/882,394 US6752585B2 (en) 2001-06-13 2001-06-13 Method and apparatus for transferring a semiconductor substrate
US09/882394 2001-06-13

Publications (2)

Publication Number Publication Date
JP2003110003A JP2003110003A (ja) 2003-04-11
JP2003110003A5 true JP2003110003A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 2005-09-29

Family

ID=25380475

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002208944A Pending JP2003110003A (ja) 2001-06-13 2002-06-13 半導体基板を移送するための方法及び装置

Country Status (2)

Country Link
US (2) US6752585B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JP2003110003A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (99)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
JP4696373B2 (ja) * 2001-02-20 2011-06-08 東京エレクトロン株式会社 処理システム及び被処理体の搬送方法
WO2003024673A1 (fr) * 2001-09-12 2003-03-27 Takehide Hayashi Main de robot a fonction de positionnement pour tranche en semiconducteur et substrat de verre a cristaux liquides
FR2835337B1 (fr) * 2002-01-29 2004-08-20 Recif Sa Procede et dispositif d'identification de caracteres inscrits sur une plaque de semi-conducteur comportant au moins une marque d'orientation
US20060043750A1 (en) * 2004-07-09 2006-03-02 Paul Wirth End-effectors for handling microfeature workpieces
TWI304391B (en) 2002-07-22 2008-12-21 Brooks Automation Inc Substrate processing apparatus
US8960099B2 (en) * 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus
US7959395B2 (en) 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
US20070183871A1 (en) * 2002-07-22 2007-08-09 Christopher Hofmeister Substrate processing apparatus
US7988398B2 (en) 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
US6769861B2 (en) * 2002-10-08 2004-08-03 Brooks Automation Inc. Apparatus for alignment and orientation of a wafer for processing
US20040120797A1 (en) * 2002-12-19 2004-06-24 Texas Instruments Incorpprated Method and system for eliminating wafer protrusion
RU2005123989A (ru) 2003-01-02 2006-03-20 Лома Линда Юниверсити Медикал Сентер (Us) Управление конфигурацией и система поиска данных для системы протонной дистанционной протонно-лучевой терапии
TW200505776A (en) * 2003-01-31 2005-02-16 Aviza Tech Inc Transport system having shared load-lock front-end assembly
WO2004077531A1 (de) * 2003-02-25 2004-09-10 Technische Universität München Vorrichtung zum berührungsarmen greifen, halten und ausrichten von berührungsempfindlichen flachbauteilen
JP2004282002A (ja) * 2003-02-27 2004-10-07 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP3981885B2 (ja) * 2003-05-20 2007-09-26 株式会社ダイフク 搬送装置
JP4137711B2 (ja) * 2003-06-16 2008-08-20 東京エレクトロン株式会社 基板処理装置及び基板搬送手段の位置合わせ方法
CN101094933A (zh) * 2003-08-29 2007-12-26 交叉自动控制公司 用于半导体处理的方法和装置
US9691651B2 (en) 2005-01-28 2017-06-27 Brooks Automation, Inc. Substrate handling system for aligning and orienting substrates during a transfer operation
US8016541B2 (en) * 2003-09-10 2011-09-13 Brooks Automation, Inc. Substrate handling system for aligning and orienting substrates during a transfer operation
KR100583724B1 (ko) * 2003-10-29 2006-05-25 삼성전자주식회사 기판 이송 장치
KR100578134B1 (ko) * 2003-11-10 2006-05-10 삼성전자주식회사 멀티 챔버 시스템
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
SG132670A1 (en) * 2003-11-10 2007-06-28 Blueshift Technologies Inc Methods and systems for handling workpieces in a vacuum-based semiconductor handling system
US8313277B2 (en) * 2003-11-10 2012-11-20 Brooks Automation, Inc. Semiconductor manufacturing process modules
US8696298B2 (en) * 2003-11-10 2014-04-15 Brooks Automation, Inc. Semiconductor manufacturing process modules
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
JP4560546B2 (ja) * 2004-08-11 2010-10-13 リハイトン エレクトロニクス インク 導電性シート材料のシート電荷密度と移動度の測定のための装置及び取り扱いシステム
US7819079B2 (en) 2004-12-22 2010-10-26 Applied Materials, Inc. Cartesian cluster tool configuration for lithography type processes
US7798764B2 (en) 2005-12-22 2010-09-21 Applied Materials, Inc. Substrate processing sequence in a cartesian robot cluster tool
US7651306B2 (en) 2004-12-22 2010-01-26 Applied Materials, Inc. Cartesian robot cluster tool architecture
US7396412B2 (en) * 2004-12-22 2008-07-08 Sokudo Co., Ltd. Coat/develop module with shared dispense
US7374391B2 (en) * 2005-12-22 2008-05-20 Applied Materials, Inc. Substrate gripper for a substrate handling robot
US20070209593A1 (en) * 2006-03-07 2007-09-13 Ravinder Aggarwal Semiconductor wafer cooling device
DE102006015089A1 (de) * 2006-03-31 2007-10-11 Advanced Micro Devices, Inc., Sunnyvale System und Verfahren zur Scheibenhandhabung in Halbleiterprozessanlagen
JP4642787B2 (ja) * 2006-05-09 2011-03-02 東京エレクトロン株式会社 基板搬送装置及び縦型熱処理装置
US8398355B2 (en) * 2006-05-26 2013-03-19 Brooks Automation, Inc. Linearly distributed semiconductor workpiece processing tool
TW200900210A (en) * 2006-11-09 2009-01-01 Ihi Corp Frog-leg arm robot and control method thereof
US8562274B2 (en) * 2006-11-29 2013-10-22 Pouch Pac Innovations, Llc Load smart system for continuous loading of a pouch into a fill-seal machine
WO2008067437A2 (en) * 2006-11-29 2008-06-05 Pouch Pac Innovations, Llc System, method and machine for continuous loading of a product
US20080166210A1 (en) * 2007-01-05 2008-07-10 Applied Materials, Inc. Supinating cartesian robot blade
JP4937772B2 (ja) * 2007-01-22 2012-05-23 東京エレクトロン株式会社 基板の処理方法
JP5014811B2 (ja) * 2007-01-22 2012-08-29 東京エレクトロン株式会社 基板の処理方法
US8317449B2 (en) * 2007-03-05 2012-11-27 Applied Materials, Inc. Multiple substrate transfer robot
US20080219806A1 (en) * 2007-03-05 2008-09-11 Van Der Meulen Peter Semiconductor manufacturing process modules
US7675048B2 (en) * 2007-03-06 2010-03-09 Varian Semiconductor Equipment Associates, Inc. Wafer holding robot end effecter vertical position determination in ion implanter system
WO2008129989A1 (ja) * 2007-04-19 2008-10-30 Ulvac, Inc. 基板保持機構およびこれを備えた基板組立装置
US20080310939A1 (en) * 2007-06-15 2008-12-18 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for use in a lithography tool
DK2190530T3 (en) 2007-09-13 2018-02-19 Toby D Henderson PATIENT POSITIONING SYSTEM
US7976263B2 (en) * 2007-09-22 2011-07-12 David Barker Integrated wafer transfer mechanism
US20090092470A1 (en) * 2007-10-03 2009-04-09 Bonora Anthony C End effector with sensing capabilities
KR101420285B1 (ko) * 2008-01-09 2014-07-17 삼성전자주식회사 반도체 제조설비 그의 웨이퍼 로딩/언로딩 방법
US8146973B2 (en) * 2008-03-13 2012-04-03 Applied Materials, Inc. Tendon enhanced end effector
US8242730B2 (en) * 2008-06-10 2012-08-14 Nichols Michael J Automated robot teach tool and method of use
US8118200B2 (en) * 2009-04-07 2012-02-21 Forenta Device for removing wrinkles from the sleeve of a garment
US8602706B2 (en) 2009-08-17 2013-12-10 Brooks Automation, Inc. Substrate processing apparatus
US8752872B2 (en) * 2009-09-14 2014-06-17 Fabworx Solutions, Inc. Edge grip end effector
US8911554B2 (en) * 2010-01-05 2014-12-16 Applied Materials, Inc. System for batch processing of magnetic media
JP5473857B2 (ja) * 2010-10-14 2014-04-16 東京エレクトロン株式会社 搬送装置および処理システム
US8528955B2 (en) * 2011-01-24 2013-09-10 AMF automation Technologies, LLC Robot end effector with cable management
US8746666B2 (en) * 2011-05-05 2014-06-10 Varian Semiconductor Equipment Associates, Inc. Media carrier
JP2011161629A (ja) * 2011-06-03 2011-08-25 Kawasaki Heavy Ind Ltd 基板搬送ロボット
CN102738056A (zh) * 2011-06-28 2012-10-17 清华大学 一种利用气缸伸缩的推杆式晶圆夹持装置
JP2012035408A (ja) * 2011-11-09 2012-02-23 Kawasaki Heavy Ind Ltd 基板搬送ロボット
US10847391B2 (en) * 2013-03-12 2020-11-24 Applied Materials, Inc. Semiconductor device manufacturing platform with single and twinned processing chambers
DE102013009484B4 (de) * 2013-06-06 2021-05-20 Asys Automatic Systems Gmbh & Co. Kg Bearbeitungsanlage polaren Aufbaus für planare Substrate, Handhabungsvorrichtung, Kupplungsanordnung und Roboter für eine Bearbeitungsanlage
US9299598B2 (en) * 2013-12-23 2016-03-29 Lam Research Corp. Robot with integrated aligner
DE102014008340B4 (de) * 2014-06-12 2017-10-19 Asys Automatic Systems Gmbh & Co. Kg Cluster einer Reinraumanlage
JP6368376B2 (ja) * 2014-10-10 2018-08-01 川崎重工業株式会社 ウエハ搬送方法及び装置
KR20160055010A (ko) * 2014-11-07 2016-05-17 삼성전자주식회사 웨이퍼 이송 로봇 및 그 제어 방법
JP2016143787A (ja) * 2015-02-03 2016-08-08 川崎重工業株式会社 基板搬送ロボットおよび基板搬送方法
KR101740480B1 (ko) * 2015-05-29 2017-06-08 세메스 주식회사 티칭 방법, 그리고 이를 이용한 기판 처리 장치
US10322513B2 (en) 2015-12-08 2019-06-18 Genmark Automation, Inc. Robot end effector applying tensile holding force
JP6760560B2 (ja) * 2016-08-29 2020-09-23 株式会社ダイヘン 搬送ロボット
US10186449B2 (en) 2016-12-31 2019-01-22 Applied Materials, Inc. Apparatus and methods for wafer rotation to improve spatial ALD process uniformity
US10639787B2 (en) * 2017-03-06 2020-05-05 Berkshire Grey, Inc. Systems and methods for efficiently moving a variety of objects
US10224224B2 (en) 2017-03-10 2019-03-05 Micromaterials, LLC High pressure wafer processing systems and related methods
US10622214B2 (en) 2017-05-25 2020-04-14 Applied Materials, Inc. Tungsten defluorination by high pressure treatment
US10903107B2 (en) * 2017-07-11 2021-01-26 Brooks Automation, Inc. Semiconductor process transport apparatus comprising an adapter pendant
US10276411B2 (en) 2017-08-18 2019-04-30 Applied Materials, Inc. High pressure and high temperature anneal chamber
JP6947914B2 (ja) 2017-08-18 2021-10-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 高圧高温下のアニールチャンバ
KR102659317B1 (ko) 2017-09-12 2024-04-18 어플라이드 머티어리얼스, 인코포레이티드 보호 배리어 층을 사용하여 반도체 구조들을 제조하기 위한 장치 및 방법들
DE102017129603B4 (de) * 2017-09-27 2021-07-01 VON ARDENNE Asset GmbH & Co. KG Vakuumkammeranordnung und Verfahren zum Prozessieren eines Substrats
EP4321649B1 (en) 2017-11-11 2025-08-20 Micromaterials LLC Gas delivery system for high pressure processing chamber
KR20200075892A (ko) 2017-11-17 2020-06-26 어플라이드 머티어리얼스, 인코포레이티드 고압 처리 시스템을 위한 컨덴서 시스템
WO2019173006A1 (en) 2018-03-09 2019-09-12 Applied Materials, Inc. High pressure annealing process for metal containing materials
US10950429B2 (en) 2018-05-08 2021-03-16 Applied Materials, Inc. Methods of forming amorphous carbon hard mask layers and hard mask layers formed therefrom
JP7205966B2 (ja) * 2018-06-29 2023-01-17 川崎重工業株式会社 基板搬送装置及びその運転方法
US10748783B2 (en) 2018-07-25 2020-08-18 Applied Materials, Inc. Gas delivery module
US10675581B2 (en) 2018-08-06 2020-06-09 Applied Materials, Inc. Gas abatement apparatus
CN112996950B (zh) 2018-11-16 2024-04-05 应用材料公司 使用增强扩散工艺的膜沉积
WO2020117462A1 (en) 2018-12-07 2020-06-11 Applied Materials, Inc. Semiconductor processing system
US11901222B2 (en) 2020-02-17 2024-02-13 Applied Materials, Inc. Multi-step process for flowable gap-fill film
JP2021163872A (ja) * 2020-03-31 2021-10-11 ラピスセミコンダクタ株式会社 ウエハ搬送装置及びウエハ搬送方法、並びにウエハ検査装置及びウエハ検査方法
TWI776479B (zh) * 2020-04-22 2022-09-01 漢辰科技股份有限公司 離子佈植裝置及機械手臂
JP7543062B2 (ja) * 2020-10-02 2024-09-02 ニデックインスツルメンツ株式会社 産業用ロボットのハンド、産業用ロボット
CN113314448B (zh) * 2021-05-13 2022-07-22 长江存储科技有限责任公司 半导体传输设备及其控制方法
US20230360940A1 (en) * 2022-05-03 2023-11-09 Applied Materials, Inc. Wafer film frame carrier

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2133757B (en) * 1983-01-14 1987-01-14 Western Electric Co A frictionless transport system
US4836733A (en) 1986-04-28 1989-06-06 Varian Associates, Inc. Wafer transfer system
JP2508540B2 (ja) 1987-11-02 1996-06-19 三菱マテリアル株式会社 ウェ―ハの位置検出装置
DE3901824A1 (de) * 1989-01-23 1990-07-26 Leybold Ag Hub- und drehaggregat fuer eine schmelz- und/oder giessanlage
US5308222A (en) * 1991-05-17 1994-05-03 Kensington Laboratories, Inc. Noncentering specimen prealigner
JP2867194B2 (ja) 1992-02-05 1999-03-08 東京エレクトロン株式会社 処理装置及び処理方法
DE69402918T2 (de) 1993-07-15 1997-08-14 Applied Materials Inc Substratfangvorrichtung und Keramikblatt für Halbleiterbearbeitungseinrichtung
US6102164A (en) 1996-02-28 2000-08-15 Applied Materials, Inc. Multiple independent robot assembly and apparatus for processing and transferring semiconductor wafers
DE19608543A1 (de) * 1996-03-06 1997-09-11 Bosch Gmbh Robert Meßfühler
JPH09330975A (ja) * 1996-06-11 1997-12-22 Nikon Corp 搬送装置
US5955858A (en) * 1997-02-14 1999-09-21 Applied Materials, Inc. Mechanically clamping robot wrist
US6002840A (en) 1997-09-30 1999-12-14 Brooks Automation Inc. Substrate transport apparatus
US6085125A (en) 1998-05-11 2000-07-04 Genmark Automation, Inc. Prealigner and planarity teaching station
US6109677A (en) 1998-05-28 2000-08-29 Sez North America, Inc. Apparatus for handling and transporting plate like substrates
US6719516B2 (en) * 1998-09-28 2004-04-13 Applied Materials, Inc. Single wafer load lock with internal wafer transport
US6113165A (en) 1998-10-02 2000-09-05 Taiwan Semiconductor Manufacturing Co., Ltd. Self-sensing wafer holder and method of using
US6322312B1 (en) * 1999-03-18 2001-11-27 Applied Materials, Inc. Mechanical gripper for wafer handling robots
US6357996B2 (en) * 1999-05-14 2002-03-19 Newport Corporation Edge gripping specimen prealigner
US6162008A (en) 1999-06-08 2000-12-19 Varian Semiconductor Equipment Associates, Inc. Wafer orientation sensor
US6166509A (en) * 1999-07-07 2000-12-26 Applied Materials, Inc. Detection system for substrate clamp
US6313696B1 (en) * 1999-12-08 2001-11-06 Hewlett-Packard Company Differential buffer having common-mode rejection
US6752442B2 (en) * 2001-11-09 2004-06-22 Speedfam-Ipec Corporation Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector

Similar Documents

Publication Publication Date Title
JP2003110003A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
TWI577513B (zh) 用於機器人之磁性旋轉強制止停裝置
JP4808299B2 (ja) クランプリスト、クランプ機構、ロボットアームアセンブリ及びロボット
JP3529416B2 (ja) 真空チャンバーロボット装置用２重同軸磁気カプラ
JP2003110003A (ja) 半導体基板を移送するための方法及び装置
EP0858866B1 (en) Mechanically clamping robot wrist
US7726011B2 (en) Chip transfer method and apparatus
WO2013123742A1 (zh) 一种易清洗的薄壁盘状物夹持装置及方法
CN115706035A (zh) 半导体清洗设备及其晶圆翻转装置
WO2007094517A1 (ja) ロボットハンド
JP2013517191A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
MY114839A (en) Medium attaching device and disk drive apparatus
JP2013139071A (ja) 搬送システム
CN116061200A (zh) 基于直接驱动马达的晶片传递机器人设备
WO2019015367A1 (zh) 电机及具有此电机的云台和机械臂
JPH0851138A (ja) 多重基板伝達装置
CN104071569A (zh) 一种抓取装置
CN114915090A (zh) 惯量调节机构及电机
CN214878399U (zh) 圆盘式机器人爪库
CN211320066U (zh) 晶圆转移装置
JP4648161B2 (ja) ダブルアーム列式基板搬送用ロボット
JP2006205264A (ja) 基板搬送装置
JP2006332460A (ja) ウェーハの搬送装置
JP3885217B2 (ja) ウェハ搬送装置
CN113319877A (zh) 一种力反馈大行程机械手抓