JP6760560B2 - 搬送ロボット - Google Patents
搬送ロボット Download PDFInfo
- Publication number
- JP6760560B2 JP6760560B2 JP2016166404A JP2016166404A JP6760560B2 JP 6760560 B2 JP6760560 B2 JP 6760560B2 JP 2016166404 A JP2016166404 A JP 2016166404A JP 2016166404 A JP2016166404 A JP 2016166404A JP 6760560 B2 JP6760560 B2 JP 6760560B2
- Authority
- JP
- Japan
- Prior art keywords
- transfer robot
- moving
- coil
- magnetic flux
- robot according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000012546 transfer Methods 0.000 title claims description 97
- 230000004907 flux Effects 0.000 claims description 83
- 238000001514 detection method Methods 0.000 claims description 43
- 230000007246 mechanism Effects 0.000 claims description 27
- 238000004891 communication Methods 0.000 claims description 26
- 230000005674 electromagnetic induction Effects 0.000 description 14
- 230000008859 change Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000009499 grossing Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 238000004804 winding Methods 0.000 description 4
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 229910001416 lithium ion Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q7/00—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting
- B23Q7/04—Arrangements for handling work specially combined with or arranged in, or specially adapted for use in connection with, machine tools, e.g. for conveying, loading, positioning, discharging, sorting by means of grippers
- B23Q7/046—Handling workpieces or tools
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67709—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using magnetic elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
1 :固定部(支持部)
2 :旋回部(支持部)
3 :ガイド体(支持部)
31 :スリット
32 :スリット
33 :磁石部
33a,33b :磁束発生面
34 :磁石支持部
5A,5B :移動部
5 :ハンド(移動部)
51 :支持アーム
52a :係止部(把持機構)
52b :当接部(把持機構、電力負荷)
53a,53b :ハンド
54 :検出センサ(電力負荷)
55a,55b,55 :コイル
56 :直流電源回路(整流回路)
57 :蓄電手段
58 :通信部(電力負荷)
59 :制御部
6 :第1アーム(移動部)
7 :第2アーム
8 :制御装置
81 :通信部
82 :制御部
GL :移動経路
Os :旋回軸
O1,O2 :回動軸
W :ワーク
Claims (13)
- 支持部と、
前記支持部に対して所定の移動経路上を移動可能に支持されており、ワークを載置するためのハンドを有する移動部と、
を備えており、
前記支持部は、前記移動経路に沿って延び、前記移動経路に対して直交する方向の磁束を発生させる磁石部を備え、
前記移動部は、前記磁束に鎖交するように配置されたコイルを備え、
前記磁石部が発生させる磁束は、前記移動経路に沿う方向の位置によって変化する、
ことを特徴とする搬送ロボット。 - 前記移動部は、
前記コイルに流れる電流を整流する整流回路と、
前記整流回路から出力される直流電力を蓄積する蓄電手段と、
をさらに備えている、
請求項1に記載の搬送ロボット。 - 前記磁石部は、複数の永久磁石を備えており、
前記各永久磁石は、N極とS極とが前記移動経路に直交する方向を向くようにして、前記移動経路に沿う方向に並べて配置されている。
請求項1または2に記載の搬送ロボット。 - 前記各永久磁石は、隣接する永久磁石とはN極とS極とが互いに反対側になるように配置されている。
請求項3に記載の搬送ロボット。 - 前記各永久磁石は、N極とS極とが水平方向を向くようにして配置されている、
請求項3または4に記載の搬送ロボット。 - 前記各永久磁石は、N極とS極とが鉛直方向を向くようにして配置されている、
請求項3または4に記載の搬送ロボット。 - 前記支持部は水平直線状のガイドレールを備えており、
前記移動部は、前記ガイドレールに支持されて移動する、
請求項1ないし6のいずれかに記載の搬送ロボット。 - 複数のアームをさらに備えており、
前記移動部は、前記複数のアームが連動してそれぞれ回動することで、水平直線状に移動する、
請求項1ないし6のいずれかに記載の搬送ロボット。 - 前記移動部は、前記支持部に対して回動可能に設けられている、
請求項1ないし6のいずれかに記載の搬送ロボット。 - 前記移動部は、電力負荷を備えており、
前記電力負荷は、前記コイルから出力される電力によって駆動される、
請求項1ないし9のいずれかに記載の搬送ロボット。 - 前記電力負荷は、ワークを検出する検出センサと、前記検出センサによる検出結果を送信する通信部である、
請求項10に記載の搬送ロボット。 - 前記電力負荷は、ワークを把持する把持機構である、
請求項10に記載の搬送ロボット。 - 前記移動部を複数備えている、
請求項1ないし12のいずれかに記載の搬送ロボット。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016166404A JP6760560B2 (ja) | 2016-08-29 | 2016-08-29 | 搬送ロボット |
US15/686,626 US10118266B2 (en) | 2016-08-29 | 2017-08-25 | Transfer robot without a wire connection between fixed and moving parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016166404A JP6760560B2 (ja) | 2016-08-29 | 2016-08-29 | 搬送ロボット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2018034211A JP2018034211A (ja) | 2018-03-08 |
JP6760560B2 true JP6760560B2 (ja) | 2020-09-23 |
Family
ID=61241364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016166404A Active JP6760560B2 (ja) | 2016-08-29 | 2016-08-29 | 搬送ロボット |
Country Status (2)
Country | Link |
---|---|
US (1) | US10118266B2 (ja) |
JP (1) | JP6760560B2 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7080074B2 (ja) * | 2018-03-15 | 2022-06-03 | 株式会社ダイヘン | 搬送装置 |
USD892881S1 (en) | 2018-03-29 | 2020-08-11 | Daihen Corporation | Power transmission unit and power receiving unit of an industrial robot arm |
JP1619125S (ja) | 2018-03-29 | 2018-11-26 | ||
JP1612766S (ja) | 2018-03-29 | 2018-09-03 | ||
JP1612912S (ja) | 2018-03-29 | 2018-09-03 | ||
JP1612908S (ja) | 2018-03-29 | 2018-09-03 | ||
DE102018008648A1 (de) * | 2018-11-05 | 2020-05-07 | Günther Zimmer | System zur Funkanbindung einer Baugruppe an eine Steuerung |
KR102420427B1 (ko) * | 2021-01-27 | 2022-07-13 | 최성희 | 정밀측정이 가능한 로봇용 그리퍼 |
JP7537847B2 (ja) * | 2021-03-02 | 2024-08-21 | 東京エレクトロン株式会社 | 基板搬送装置及び基板処理システム |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07257751A (ja) * | 1994-03-18 | 1995-10-09 | Kanagawa Kagaku Gijutsu Akad | 静電浮上搬送装置及びその静電浮上用電極 |
JPH09213772A (ja) * | 1996-01-30 | 1997-08-15 | Dainippon Screen Mfg Co Ltd | 基板保持装置 |
JPH09330975A (ja) * | 1996-06-11 | 1997-12-22 | Nikon Corp | 搬送装置 |
US6752585B2 (en) * | 2001-06-13 | 2004-06-22 | Applied Materials Inc | Method and apparatus for transferring a semiconductor substrate |
JP6283153B2 (ja) * | 2011-12-08 | 2018-02-21 | 株式会社ダイヘン | ワーク検出機構 |
JP6099916B2 (ja) | 2012-09-25 | 2017-03-22 | 株式会社ダイヘン | ワーク搬送ロボット |
-
2016
- 2016-08-29 JP JP2016166404A patent/JP6760560B2/ja active Active
-
2017
- 2017-08-25 US US15/686,626 patent/US10118266B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
US20180056463A1 (en) | 2018-03-01 |
JP2018034211A (ja) | 2018-03-08 |
US10118266B2 (en) | 2018-11-06 |
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