JP2001283169A5 - - Google Patents
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- Publication number
- JP2001283169A5 JP2001283169A5 JP2000092950A JP2000092950A JP2001283169A5 JP 2001283169 A5 JP2001283169 A5 JP 2001283169A5 JP 2000092950 A JP2000092950 A JP 2000092950A JP 2000092950 A JP2000092950 A JP 2000092950A JP 2001283169 A5 JP2001283169 A5 JP 2001283169A5
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- electronic device
- film
- substrate
- adhesive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 claims 22
- 239000000758 substrate Substances 0.000 claims 10
- 239000000463 material Substances 0.000 claims 5
- 239000000853 adhesive Substances 0.000 claims 4
- 230000001070 adhesive effect Effects 0.000 claims 4
- 229920000298 Cellophane Polymers 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000092950A JP4239352B2 (ja) | 2000-03-28 | 2000-03-28 | 電子装置の製造方法 |
| US09/818,638 US6660557B2 (en) | 2000-03-28 | 2001-03-28 | Method of manufacturing an electronic device |
| US10/676,016 US7056769B2 (en) | 2000-03-28 | 2003-10-02 | Method of manufacturing an electronic device |
| US11/411,884 US7459341B2 (en) | 2000-03-28 | 2006-04-27 | Method of manufacturing an electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000092950A JP4239352B2 (ja) | 2000-03-28 | 2000-03-28 | 電子装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001283169A JP2001283169A (ja) | 2001-10-12 |
| JP2001283169A5 true JP2001283169A5 (enExample) | 2005-10-27 |
| JP4239352B2 JP4239352B2 (ja) | 2009-03-18 |
Family
ID=18608207
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000092950A Expired - Fee Related JP4239352B2 (ja) | 2000-03-28 | 2000-03-28 | 電子装置の製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (3) | US6660557B2 (enExample) |
| JP (1) | JP4239352B2 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4239352B2 (ja) * | 2000-03-28 | 2009-03-18 | 株式会社日立製作所 | 電子装置の製造方法 |
| JP3892703B2 (ja) * | 2001-10-19 | 2007-03-14 | 富士通株式会社 | 半導体基板用治具及びこれを用いた半導体装置の製造方法 |
| WO2003096595A2 (en) * | 2002-05-08 | 2003-11-20 | Drexler Technology Corporation | Method of making secure personal data card |
| JP3898666B2 (ja) * | 2003-04-28 | 2007-03-28 | 松下電器産業株式会社 | 固体撮像装置およびその製造方法 |
| US7629667B2 (en) * | 2003-08-28 | 2009-12-08 | Hitachi, Ltd. | Semiconductor device including an on-chip coil antenna formed on a device layer which is formed on an oxide film layer |
| JP4106003B2 (ja) * | 2003-09-03 | 2008-06-25 | 松下電器産業株式会社 | 固体撮像装置の製造方法 |
| EP1693785A4 (en) * | 2003-12-10 | 2008-07-30 | Oji Paper Co | BAND WITH EMBEDDED IC-CHIP AND LEAF WITH EMBEDDED IC-CHIP |
| KR100577527B1 (ko) * | 2003-12-29 | 2006-05-10 | 매그나칩 반도체 유한회사 | 고주파 소자 및 그 제조 방법 |
| JP2006039854A (ja) * | 2004-07-26 | 2006-02-09 | Brother Ind Ltd | タグテープロール及びタグラベル作成装置用カートリッジ |
| US20070098997A1 (en) * | 2005-11-02 | 2007-05-03 | Bayer Materialscience Llc | Composite articles and a process for their production |
| JP4796628B2 (ja) * | 2006-06-02 | 2011-10-19 | 株式会社日立製作所 | Icタグ用インレットの製造方法 |
| JP3980624B1 (ja) * | 2006-09-20 | 2007-09-26 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 基板上の半導体部品の薄型化 |
| EP2085914B1 (en) * | 2006-11-07 | 2014-03-12 | Toppan Forms Co., Ltd. | Window base material, card having module housed therein, and method for manufacturing card having module housed therein |
| JP4860436B2 (ja) * | 2006-11-07 | 2012-01-25 | トッパン・フォームズ株式会社 | Icカードおよびその製造方法 |
| US20080241991A1 (en) * | 2007-03-26 | 2008-10-02 | National Semiconductor Corporation | Gang flipping for flip-chip packaging |
| US9195929B2 (en) * | 2013-08-05 | 2015-11-24 | A-Men Technology Corporation | Chip card assembling structure and method thereof |
| US10020285B2 (en) | 2014-09-04 | 2018-07-10 | Infineon Technologies Austria Ag | Method of producing a semiconductor device and a semiconductor device |
| KR102365285B1 (ko) * | 2014-11-05 | 2022-02-18 | 에베 그룹 에. 탈너 게엠베하 | 제품 기판을 코팅하기 위한 방법 및 장치 |
| KR102417917B1 (ko) | 2016-04-26 | 2022-07-07 | 삼성전자주식회사 | 공정 시스템 및 그 동작 방법 |
| CN108231651B (zh) * | 2017-12-26 | 2020-02-21 | 厦门市三安光电科技有限公司 | 微元件转移装置和转移方法 |
Family Cites Families (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4063993A (en) * | 1975-07-07 | 1977-12-20 | National Semiconductor Corporation | Method of making gang bonding interconnect tape for semiconductive devices |
| DE2920012C2 (de) * | 1979-05-17 | 1988-09-29 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte |
| JPS6190272A (ja) | 1984-10-09 | 1986-05-08 | Sharp Corp | 辞書機能を用いた翻訳方式 |
| JPH01108095A (ja) * | 1987-10-20 | 1989-04-25 | Ryoden Kasei Co Ltd | Icカード |
| JPH0353546A (ja) * | 1989-07-21 | 1991-03-07 | Mitsubishi Electric Corp | 半導体装置の製造方法およびその製造装置 |
| EP0487782B1 (de) * | 1990-11-30 | 1995-11-29 | Siemens Aktiengesellschaft | Verfahren zum Beloten von Leiterplatten |
| JPH04259520A (ja) * | 1991-02-13 | 1992-09-16 | Nippon Steel Corp | 樹脂成形金型及びフレキシブルテープ |
| JP2994510B2 (ja) * | 1992-02-10 | 1999-12-27 | ローム株式会社 | 半導体装置およびその製法 |
| US5544017A (en) * | 1992-08-05 | 1996-08-06 | Fujitsu Limited | Multichip module substrate |
| CA2101293C (en) * | 1992-08-05 | 2004-06-29 | David A. Nicholas | Articulating endoscopic surgical apparatus |
| US5776796A (en) * | 1994-05-19 | 1998-07-07 | Tessera, Inc. | Method of encapsulating a semiconductor package |
| US6184475B1 (en) * | 1994-09-29 | 2001-02-06 | Fujitsu Limited | Lead-free solder composition with Bi, In and Sn |
| US5524765A (en) * | 1994-11-15 | 1996-06-11 | Tempo G | Carrier tape packaging system utilizing a layer of gel for retaining small components |
| DE69501632T2 (de) * | 1994-11-21 | 1998-07-23 | Apic Yamada Corp | Harzformmaschine mit Trennfolie |
| JP3197788B2 (ja) | 1995-05-18 | 2001-08-13 | 株式会社日立製作所 | 半導体装置の製造方法 |
| DE19528730A1 (de) * | 1995-08-04 | 1997-02-06 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung eines Datenträgers |
| US6224690B1 (en) * | 1995-12-22 | 2001-05-01 | International Business Machines Corporation | Flip-Chip interconnections using lead-free solders |
| MY118036A (en) * | 1996-01-22 | 2004-08-30 | Lintec Corp | Wafer dicing/bonding sheet and process for producing semiconductor device |
| US6080606A (en) * | 1996-03-26 | 2000-06-27 | The Trustees Of Princeton University | Electrophotographic patterning of thin film circuits |
| US6046499A (en) * | 1996-03-27 | 2000-04-04 | Kabushiki Kaisha Toshiba | Heat transfer configuration for a semiconductor device |
| JPH10264560A (ja) | 1997-03-25 | 1998-10-06 | Seiko Precision Kk | Icカードの製造方法 |
| BR9804917A (pt) * | 1997-05-19 | 2000-01-25 | Hitachi Maxell Ltda | Módulo de circuito integrado flexìvel e processos para produzir um módulo de circuito integrado flexìvel e um portador de informação. |
| US6184109B1 (en) * | 1997-07-23 | 2001-02-06 | Kabushiki Kaisha Toshiba | Method of dividing a wafer and method of manufacturing a semiconductor device |
| US6013535A (en) * | 1997-08-05 | 2000-01-11 | Micron Technology, Inc. | Method for applying adhesives to a lead frame |
| KR20010023027A (ko) * | 1997-08-19 | 2001-03-26 | 가나이 쓰토무 | 범프 전극 형성 방법 및 반도체 장치 제조 방법 |
| US6024285A (en) * | 1997-08-19 | 2000-02-15 | Micron Technology, Inc. | Wireless communication devices and methods of forming wireless communication devices |
| KR100386833B1 (ko) * | 1997-08-27 | 2003-06-09 | 나가다 죠스게 | 구상반도체 디바이스와 그 제조방법 그리고 구상반도체 디바이스 |
| EP1031939B1 (en) * | 1997-11-14 | 2005-09-14 | Toppan Printing Co., Ltd. | Composite ic card |
| JPH11161760A (ja) * | 1997-11-26 | 1999-06-18 | Hitachi Ltd | 薄型電子回路部品及びその製造方法及びその製造装置 |
| JP3936840B2 (ja) * | 1997-12-22 | 2007-06-27 | 株式会社日立製作所 | 半導体装置およびその製造方法 |
| US6057174A (en) * | 1998-01-07 | 2000-05-02 | Seiko Epson Corporation | Semiconductor device, method of fabricating the same, and electronic apparatus |
| JP4562820B2 (ja) * | 1998-03-02 | 2010-10-13 | 富士フイルム株式会社 | 固体撮像素子の取付方法 |
| JP4075138B2 (ja) | 1998-06-05 | 2008-04-16 | 凸版印刷株式会社 | 非接触icカード用検査装置および検査方法 |
| US6239480B1 (en) * | 1998-07-06 | 2001-05-29 | Clear Logic, Inc. | Modified lead frame for improved parallelism of a die to package |
| AU5651699A (en) * | 1998-09-18 | 2000-04-10 | Hitachi Maxell, Ltd. | Noncontact communication semiconductor device |
| JP2000114204A (ja) * | 1998-10-01 | 2000-04-21 | Mitsubishi Electric Corp | ウエハシート及びこれを用いた半導体装置の製造方法並びに半導体製造装置 |
| US6630370B2 (en) * | 1998-10-02 | 2003-10-07 | Shinko Electric Industries Co., Ltd. | Process for manufacturing IC card |
| JP3441382B2 (ja) * | 1998-10-14 | 2003-09-02 | 日本電信電話株式会社 | 半導体装置の製造方法 |
| JP3643488B2 (ja) * | 1998-10-30 | 2005-04-27 | 株式会社日立製作所 | Icカード |
| DE69941548D1 (de) * | 1998-11-30 | 2009-11-26 | Hitachi Ltd | Verfahren zur Montage eines elektronischen Schaltungschips |
| US6569710B1 (en) * | 1998-12-03 | 2003-05-27 | International Business Machines Corporation | Panel structure with plurality of chip compartments for providing high volume of chip modules |
| US6214640B1 (en) * | 1999-02-10 | 2001-04-10 | Tessera, Inc. | Method of manufacturing a plurality of semiconductor packages |
| JP3504543B2 (ja) * | 1999-03-03 | 2004-03-08 | 株式会社日立製作所 | 半導体素子の分離方法およびその装置並びに半導体素子の搭載方法 |
| WO2000054324A1 (en) * | 1999-03-11 | 2000-09-14 | Seiko Epson Corporation | Flexible wiring substrate, film carrier, tapelike semiconductor device, semiconductor device, method of manufacture of semiconductor device, circuit board, and electronic device |
| US6110806A (en) * | 1999-03-26 | 2000-08-29 | International Business Machines Corporation | Process for precision alignment of chips for mounting on a substrate |
| JP2000311959A (ja) * | 1999-04-27 | 2000-11-07 | Sanyo Electric Co Ltd | 半導体装置とその製造方法 |
| US6147662A (en) * | 1999-09-10 | 2000-11-14 | Moore North America, Inc. | Radio frequency identification tags and labels |
| JP4299414B2 (ja) * | 1999-10-12 | 2009-07-22 | 富士通マイクロエレクトロニクス株式会社 | コンビネーションカード、icカード用モジュール及びコンビネーションカードの製造方法 |
| US6402013B2 (en) * | 1999-12-03 | 2002-06-11 | Senju Metal Industry Co., Ltd | Thermosetting soldering flux and soldering process |
| ATE280976T1 (de) * | 2000-03-24 | 2004-11-15 | Infineon Technologies Ag | Gehäuse für biometrische sensorchips |
| JP4239352B2 (ja) * | 2000-03-28 | 2009-03-18 | 株式会社日立製作所 | 電子装置の製造方法 |
| JP3485525B2 (ja) * | 2000-07-06 | 2004-01-13 | 沖電気工業株式会社 | 半導体装置の製造方法 |
| JP2002096974A (ja) * | 2000-09-22 | 2002-04-02 | Oki Electric Ind Co Ltd | 搬送用リールとそれを用いた搬送方法、及び電子装置の製造方法 |
| US6357664B1 (en) * | 2001-05-24 | 2002-03-19 | Identicard Systems Incorporated | Identification card utilizing an integrated circuit |
| US6514795B1 (en) * | 2001-10-10 | 2003-02-04 | Micron Technology, Inc. | Packaged stacked semiconductor die and method of preparing same |
| JP4523223B2 (ja) * | 2002-04-26 | 2010-08-11 | 株式会社日立製作所 | レーダセンサ |
-
2000
- 2000-03-28 JP JP2000092950A patent/JP4239352B2/ja not_active Expired - Fee Related
-
2001
- 2001-03-28 US US09/818,638 patent/US6660557B2/en not_active Expired - Fee Related
-
2003
- 2003-10-02 US US10/676,016 patent/US7056769B2/en not_active Expired - Fee Related
-
2006
- 2006-04-27 US US11/411,884 patent/US7459341B2/en not_active Expired - Fee Related
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