JP4239352B2 - 電子装置の製造方法 - Google Patents

電子装置の製造方法 Download PDF

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Publication number
JP4239352B2
JP4239352B2 JP2000092950A JP2000092950A JP4239352B2 JP 4239352 B2 JP4239352 B2 JP 4239352B2 JP 2000092950 A JP2000092950 A JP 2000092950A JP 2000092950 A JP2000092950 A JP 2000092950A JP 4239352 B2 JP4239352 B2 JP 4239352B2
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Prior art keywords
manufacturing
electronic device
film
chip
substrate
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Expired - Fee Related
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JP2000092950A
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English (en)
Japanese (ja)
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JP2001283169A (ja
JP2001283169A5 (enExample
Inventor
光雄 宇佐美
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Hitachi Ltd
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Hitachi Ltd
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Priority to JP2000092950A priority Critical patent/JP4239352B2/ja
Priority to US09/818,638 priority patent/US6660557B2/en
Publication of JP2001283169A publication Critical patent/JP2001283169A/ja
Priority to US10/676,016 priority patent/US7056769B2/en
Publication of JP2001283169A5 publication Critical patent/JP2001283169A5/ja
Priority to US11/411,884 priority patent/US7459341B2/en
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Publication of JP4239352B2 publication Critical patent/JP4239352B2/ja
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    • H01L2924/06—Polymers
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    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
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