JP2001002241A5 - - Google Patents

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Publication number
JP2001002241A5
JP2001002241A5 JP1999173318A JP17331899A JP2001002241A5 JP 2001002241 A5 JP2001002241 A5 JP 2001002241A5 JP 1999173318 A JP1999173318 A JP 1999173318A JP 17331899 A JP17331899 A JP 17331899A JP 2001002241 A5 JP2001002241 A5 JP 2001002241A5
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JP
Japan
Prior art keywords
movable
transfer
unit
module
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1999173318A
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English (en)
Japanese (ja)
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JP2001002241A (ja
JP4330703B2 (ja
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Publication date
Application filed filed Critical
Priority to JP17331899A priority Critical patent/JP4330703B2/ja
Priority claimed from JP17331899A external-priority patent/JP4330703B2/ja
Priority to TW089111497A priority patent/TW483860B/zh
Priority to US09/595,930 priority patent/US6634845B1/en
Priority to KR1020000033122A priority patent/KR100756152B1/ko
Publication of JP2001002241A publication Critical patent/JP2001002241A/ja
Publication of JP2001002241A5 publication Critical patent/JP2001002241A5/ja
Application granted granted Critical
Publication of JP4330703B2 publication Critical patent/JP4330703B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP17331899A 1999-06-18 1999-06-18 搬送モジュール及びクラスターシステム Expired - Fee Related JP4330703B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP17331899A JP4330703B2 (ja) 1999-06-18 1999-06-18 搬送モジュール及びクラスターシステム
TW089111497A TW483860B (en) 1999-06-18 2000-06-13 Transfer module and clusyter system for semiconductor manufacturing process
US09/595,930 US6634845B1 (en) 1999-06-18 2000-06-16 Transfer module and cluster system for semiconductor manufacturing process
KR1020000033122A KR100756152B1 (ko) 1999-06-18 2000-06-16 반송 모듈 및 클러스터 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17331899A JP4330703B2 (ja) 1999-06-18 1999-06-18 搬送モジュール及びクラスターシステム

Publications (3)

Publication Number Publication Date
JP2001002241A JP2001002241A (ja) 2001-01-09
JP2001002241A5 true JP2001002241A5 (https=) 2005-10-27
JP4330703B2 JP4330703B2 (ja) 2009-09-16

Family

ID=15958223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17331899A Expired - Fee Related JP4330703B2 (ja) 1999-06-18 1999-06-18 搬送モジュール及びクラスターシステム

Country Status (4)

Country Link
US (1) US6634845B1 (https=)
JP (1) JP4330703B2 (https=)
KR (1) KR100756152B1 (https=)
TW (1) TW483860B (https=)

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JP5353107B2 (ja) * 2008-08-07 2013-11-27 シンフォニアテクノロジー株式会社 搬送装置
JP5470770B2 (ja) 2008-08-07 2014-04-16 シンフォニアテクノロジー株式会社 真空処理装置
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JP5280522B2 (ja) * 2009-04-28 2013-09-04 キヤノンアネルバ株式会社 識別情報設定装置、および識別情報設定方法
JP5306908B2 (ja) * 2009-06-03 2013-10-02 東京エレクトロン株式会社 搬送モジュール
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US10784175B2 (en) 2018-03-20 2020-09-22 Tokyo Electron Limited Platform and method of operating for integrated end-to-end gate contact process
TWI733342B (zh) * 2019-03-20 2021-07-11 日商國際電氣股份有限公司 氣體供給部，基板處理裝置及半導體裝置的製造方法
DE102020212223A1 (de) * 2020-09-29 2022-03-31 Robert Bosch Gesellschaft mit beschränkter Haftung Berührungslose Beförderungsvorrichtung
KR102491101B1 (ko) * 2020-10-06 2023-01-19 세메스 주식회사 Oht 대차 견인 장치 및 이를 이용한 oht 시스템 운영 방법
JP7519923B2 (ja) * 2021-01-12 2024-07-22 東京エレクトロン株式会社 基板搬送装置、基板搬送方法、および基板処理システム
JP7679629B2 (ja) * 2021-01-25 2025-05-20 東京エレクトロン株式会社 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法
DE102021202915A1 (de) * 2021-03-25 2022-09-29 Robert Bosch Gesellschaft mit beschränkter Haftung Berührungslose Beförderungsvorrichtung
DE102022123236A1 (de) * 2022-09-12 2024-03-14 Mafu Robotics GmbH Behandlung von Werkstücken insbesondere von Wafern
CN117810137B (zh) * 2024-03-01 2024-04-26 深圳市锐铂自动化科技有限公司 Igbt模块的自动插针机

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