JP4330703B2 - 搬送モジュール及びクラスターシステム - Google Patents

搬送モジュール及びクラスターシステム Download PDF

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Publication number
JP4330703B2
JP4330703B2 JP17331899A JP17331899A JP4330703B2 JP 4330703 B2 JP4330703 B2 JP 4330703B2 JP 17331899 A JP17331899 A JP 17331899A JP 17331899 A JP17331899 A JP 17331899A JP 4330703 B2 JP4330703 B2 JP 4330703B2
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JP
Japan
Prior art keywords
transfer
module
chamber
movable
unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP17331899A
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English (en)
Japanese (ja)
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JP2001002241A (ja
JP2001002241A5 (https=
Inventor
光明 小美野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP17331899A priority Critical patent/JP4330703B2/ja
Priority to TW089111497A priority patent/TW483860B/zh
Priority to US09/595,930 priority patent/US6634845B1/en
Priority to KR1020000033122A priority patent/KR100756152B1/ko
Publication of JP2001002241A publication Critical patent/JP2001002241A/ja
Publication of JP2001002241A5 publication Critical patent/JP2001002241A5/ja
Application granted granted Critical
Publication of JP4330703B2 publication Critical patent/JP4330703B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP17331899A 1999-06-18 1999-06-18 搬送モジュール及びクラスターシステム Expired - Fee Related JP4330703B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP17331899A JP4330703B2 (ja) 1999-06-18 1999-06-18 搬送モジュール及びクラスターシステム
TW089111497A TW483860B (en) 1999-06-18 2000-06-13 Transfer module and clusyter system for semiconductor manufacturing process
US09/595,930 US6634845B1 (en) 1999-06-18 2000-06-16 Transfer module and cluster system for semiconductor manufacturing process
KR1020000033122A KR100756152B1 (ko) 1999-06-18 2000-06-16 반송 모듈 및 클러스터 시스템

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17331899A JP4330703B2 (ja) 1999-06-18 1999-06-18 搬送モジュール及びクラスターシステム

Publications (3)

Publication Number Publication Date
JP2001002241A JP2001002241A (ja) 2001-01-09
JP2001002241A5 JP2001002241A5 (https=) 2005-10-27
JP4330703B2 true JP4330703B2 (ja) 2009-09-16

Family

ID=15958223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17331899A Expired - Fee Related JP4330703B2 (ja) 1999-06-18 1999-06-18 搬送モジュール及びクラスターシステム

Country Status (4)

Country Link
US (1) US6634845B1 (https=)
JP (1) JP4330703B2 (https=)
KR (1) KR100756152B1 (https=)
TW (1) TW483860B (https=)

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JP4330703B2 (ja) * 1999-06-18 2009-09-16 東京エレクトロン株式会社 搬送モジュール及びクラスターシステム
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JP5125290B2 (ja) * 2007-07-27 2013-01-23 株式会社Ｉｈｉ 浮上搬送装置及び処理搬送システム
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US10784175B2 (en) 2018-03-20 2020-09-22 Tokyo Electron Limited Platform and method of operating for integrated end-to-end gate contact process
TWI733342B (zh) * 2019-03-20 2021-07-11 日商國際電氣股份有限公司 氣體供給部，基板處理裝置及半導體裝置的製造方法
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Also Published As

Publication number Publication date
TW483860B (en) 2002-04-21
JP2001002241A (ja) 2001-01-09
KR100756152B1 (ko) 2007-09-05
KR20010007402A (ko) 2001-01-26
US6634845B1 (en) 2003-10-21

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