TW483860B - Transfer module and clusyter system for semiconductor manufacturing process - Google Patents

Transfer module and clusyter system for semiconductor manufacturing process Download PDF

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Publication number
TW483860B
TW483860B TW089111497A TW89111497A TW483860B TW 483860 B TW483860 B TW 483860B TW 089111497 A TW089111497 A TW 089111497A TW 89111497 A TW89111497 A TW 89111497A TW 483860 B TW483860 B TW 483860B
Authority
TW
Taiwan
Prior art keywords
transfer
module
shell
processing
patent application
Prior art date
Application number
TW089111497A
Other languages
English (en)
Chinese (zh)
Inventor
Mitsuaki Komino
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Application granted granted Critical
Publication of TW483860B publication Critical patent/TW483860B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3304—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber characterised by movements or sequence of movements of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW089111497A 1999-06-18 2000-06-13 Transfer module and clusyter system for semiconductor manufacturing process TW483860B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17331899A JP4330703B2 (ja) 1999-06-18 1999-06-18 搬送モジュール及びクラスターシステム

Publications (1)

Publication Number Publication Date
TW483860B true TW483860B (en) 2002-04-21

Family

ID=15958223

Family Applications (1)

Application Number Title Priority Date Filing Date
TW089111497A TW483860B (en) 1999-06-18 2000-06-13 Transfer module and clusyter system for semiconductor manufacturing process

Country Status (4)

Country Link
US (1) US6634845B1 (https=)
JP (1) JP4330703B2 (https=)
KR (1) KR100756152B1 (https=)
TW (1) TW483860B (https=)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4330703B2 (ja) * 1999-06-18 2009-09-16 東京エレクトロン株式会社 搬送モジュール及びクラスターシステム
TWI294155B (en) * 2002-06-21 2008-03-01 Applied Materials Inc Transfer chamber for vacuum processing system
US6935828B2 (en) * 2002-07-17 2005-08-30 Transfer Engineering And Manufacturing, Inc. Wafer load lock and magnetically coupled linear delivery system
US8960099B2 (en) * 2002-07-22 2015-02-24 Brooks Automation, Inc Substrate processing apparatus
US7959395B2 (en) * 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
US20070183871A1 (en) * 2002-07-22 2007-08-09 Christopher Hofmeister Substrate processing apparatus
US7988398B2 (en) 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
AU2003253689A1 (en) * 2002-07-31 2004-02-16 Tokyo Electron Limited Reduced volume, high conductance process chamber
GB0329933D0 (en) * 2003-12-24 2004-01-28 Boc Group Plc Load lock
US20050189399A1 (en) * 2004-02-26 2005-09-01 Progressive Tool & Industries, Co. Flexible body workstation for assembling workpieces
TWI298895B (en) * 2004-06-02 2008-07-11 Applied Materials Inc Electronic device manufacturing chamber and methods of forming the same
US7784164B2 (en) * 2004-06-02 2010-08-31 Applied Materials, Inc. Electronic device manufacturing chamber method
US7438175B2 (en) * 2005-06-10 2008-10-21 Applied Materials, Inc. Linear vacuum deposition system
US7469715B2 (en) 2005-07-01 2008-12-30 Applied Materials, Inc. Chamber isolation valve RF grounding
US7699957B2 (en) 2006-03-03 2010-04-20 Advanced Display Process Engineering Co., Ltd. Plasma processing apparatus
KR101020160B1 (ko) * 2006-03-03 2011-03-09 엘아이지에이디피 주식회사 플라즈마 처리장치
KR101020155B1 (ko) * 2006-03-03 2011-03-09 엘아이지에이디피 주식회사 플라즈마 처리장치
KR100920427B1 (ko) * 2006-03-03 2009-10-08 주식회사 에이디피엔지니어링 플라즈마 처리장치
US20090053017A1 (en) * 2006-03-17 2009-02-26 Shlomo Shmuelov Storage and purge system for semiconductor wafers
US8398355B2 (en) * 2006-05-26 2013-03-19 Brooks Automation, Inc. Linearly distributed semiconductor workpiece processing tool
KR20080004118A (ko) * 2006-07-04 2008-01-09 피에스케이 주식회사 기판 처리 설비
JP5283835B2 (ja) * 2006-07-06 2013-09-04 東京エレクトロン株式会社 マイクロ波プラズマ処理装置及びマイクロ波プラズマ処理装置用ゲートバルブ
US20080025821A1 (en) * 2006-07-25 2008-01-31 Applied Materials, Inc. Octagon transfer chamber
JP2008034740A (ja) * 2006-07-31 2008-02-14 Dainippon Screen Mfg Co Ltd ロードロック装置、それを備えた基板処理装置および基板処理システム
US20080025823A1 (en) * 2006-07-31 2008-01-31 Masahiko Harumoto Load lock device, and substrate processing apparatus and substrate processing system including the same
JP4781192B2 (ja) * 2006-07-31 2011-09-28 大日本スクリーン製造株式会社 ロードロック装置、それを備えた基板処理装置および基板処理システム
US20080175694A1 (en) * 2007-01-19 2008-07-24 Dong-Seok Park Unit and method for transferring substrates and apparatus and method for treating substrates with the unit
JP5125290B2 (ja) * 2007-07-27 2013-01-23 株式会社Ｉｈｉ 浮上搬送装置及び処理搬送システム
CN101802996B (zh) * 2007-09-20 2012-03-28 株式会社爱发科 检测搬运装置停止的方法
JP5353107B2 (ja) * 2008-08-07 2013-11-27 シンフォニアテクノロジー株式会社 搬送装置
JP5470770B2 (ja) 2008-08-07 2014-04-16 シンフォニアテクノロジー株式会社 真空処理装置
US20100098518A1 (en) * 2008-10-20 2010-04-22 Applied Materials, Inc. In/out door for a vacuum chamber
US20100127201A1 (en) * 2008-11-21 2010-05-27 Applied Materials, Inc. Interlocking valve chamber and lid
JP5280522B2 (ja) * 2009-04-28 2013-09-04 キヤノンアネルバ株式会社 識別情報設定装置、および識別情報設定方法
JP5306908B2 (ja) * 2009-06-03 2013-10-02 東京エレクトロン株式会社 搬送モジュール
US8602706B2 (en) 2009-08-17 2013-12-10 Brooks Automation, Inc. Substrate processing apparatus
KR101124209B1 (ko) * 2010-07-26 2012-03-28 엘아이지에이디피 주식회사 플라즈마 처리장치
KR101331288B1 (ko) * 2010-08-06 2013-11-20 도쿄엘렉트론가부시키가이샤 기판 처리 시스템, 반송 모듈, 기판 처리 방법 및 반도체 소자의 제조 방법
JP2013062316A (ja) * 2011-09-12 2013-04-04 Tokyo Electron Ltd 搬送装置及びプラズマ処理システム
US9679751B2 (en) 2012-03-15 2017-06-13 Lam Research Corporation Chamber filler kit for plasma etch chamber useful for fast gas switching
US10297481B2 (en) * 2013-03-21 2019-05-21 Tokyo Electron Limited Magnetic annealing apparatus
US10037869B2 (en) * 2013-08-13 2018-07-31 Lam Research Corporation Plasma processing devices having multi-port valve assemblies
US20150047785A1 (en) * 2013-08-13 2015-02-19 Lam Research Corporation Plasma Processing Devices Having Multi-Port Valve Assemblies
JP6114668B2 (ja) * 2013-09-18 2017-04-12 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US20170194181A1 (en) * 2016-01-04 2017-07-06 Micron Technology, Inc. Overhead traveling vehicle, transportation system with the same, and method of operating the same
KR101964327B1 (ko) * 2017-04-05 2019-04-01 코스텍시스템(주) 웨이퍼 이송 장치
US10784175B2 (en) 2018-03-20 2020-09-22 Tokyo Electron Limited Platform and method of operating for integrated end-to-end gate contact process
TWI733342B (zh) * 2019-03-20 2021-07-11 日商國際電氣股份有限公司 氣體供給部，基板處理裝置及半導體裝置的製造方法
DE102020212223A1 (de) * 2020-09-29 2022-03-31 Robert Bosch Gesellschaft mit beschränkter Haftung Berührungslose Beförderungsvorrichtung
KR102491101B1 (ko) * 2020-10-06 2023-01-19 세메스 주식회사 Oht 대차 견인 장치 및 이를 이용한 oht 시스템 운영 방법
JP7519923B2 (ja) * 2021-01-12 2024-07-22 東京エレクトロン株式会社 基板搬送装置、基板搬送方法、および基板処理システム
JP7679629B2 (ja) * 2021-01-25 2025-05-20 東京エレクトロン株式会社 基板の搬送を行う装置、基板を処理するシステム及び基板を処理する方法
DE102021202915A1 (de) * 2021-03-25 2022-09-29 Robert Bosch Gesellschaft mit beschränkter Haftung Berührungslose Beförderungsvorrichtung
DE102022123236A1 (de) * 2022-09-12 2024-03-14 Mafu Robotics GmbH Behandlung von Werkstücken insbesondere von Wafern
CN117810137B (zh) * 2024-03-01 2024-04-26 深圳市锐铂自动化科技有限公司 Igbt模块的自动插针机

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60162731U (ja) * 1983-11-16 1985-10-29 東京エレクトロン株式会社 セラミツク材を用いた空気軸受装置
JPS60162731A (ja) 1984-01-31 1985-08-24 Nippon Steel Corp 時効性の小さい連続焼鈍冷延鋼板の製造方法
US4624617A (en) * 1984-10-09 1986-11-25 David Belna Linear induction semiconductor wafer transportation apparatus
JPS6288528A (ja) 1985-10-15 1987-04-23 Omron Tateisi Electronics Co Ｘｙステ−ジ
US4742286A (en) 1985-10-29 1988-05-03 Micro-Stage, Inc. Gas bearing X-Y-θ stage assembly
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US4836733A (en) * 1986-04-28 1989-06-06 Varian Associates, Inc. Wafer transfer system
US4790258A (en) * 1987-04-03 1988-12-13 Tegal Corporation Magnetically coupled wafer lift pins
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US5447409A (en) * 1989-10-20 1995-09-05 Applied Materials, Inc. Robot assembly
DE69222025T2 (de) 1991-11-05 1998-02-05 Seiko Epson Corp., Tokio/Tokyo Mikro-roboter
JP2598353B2 (ja) * 1991-12-04 1997-04-09 アネルバ株式会社 基板処理装置、基板搬送装置及び基板交換方法
WO1993024343A1 (fr) 1992-05-22 1993-12-09 Daifuku Co., Ltd. Appareil permettant de fournir, sans contact du courant electrique a un objet mobile
JPH05336613A (ja) * 1992-05-29 1993-12-17 Ntn Corp 超電導スライダの起動方法
JPH0649529A (ja) 1992-07-29 1994-02-22 Kawasaki Steel Corp 溶鋼の脱炭・脱ガス方法
US5417537A (en) * 1993-05-07 1995-05-23 Miller; Kenneth C. Wafer transport device
JPH07211762A (ja) * 1994-01-13 1995-08-11 Hitachi Ltd ウエハ搬送処理装置
US5793184A (en) 1994-04-20 1998-08-11 Opcon, Ltd. Solar power supply unit for battery operated devices
JPH09283467A (ja) * 1996-04-18 1997-10-31 Mitsubishi Electric Corp 半導体装置の製造方法
US5855681A (en) * 1996-11-18 1999-01-05 Applied Materials, Inc. Ultra high throughput wafer vacuum processing system
US5838121A (en) 1996-11-18 1998-11-17 Applied Materials, Inc. Dual blade robot
JPH1126550A (ja) * 1997-07-04 1999-01-29 Tokyo Electron Ltd 基板搬送装置およびそれを用いた基板処理装置
JPH11103531A (ja) 1997-09-29 1999-04-13 Nec Mori Energy Kk 非接触充電装置
KR100265287B1 (ko) * 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
JP4354039B2 (ja) 1999-04-02 2009-10-28 東京エレクトロン株式会社 駆動装置
JP4330703B2 (ja) * 1999-06-18 2009-09-16 東京エレクトロン株式会社 搬送モジュール及びクラスターシステム

Also Published As

Publication number Publication date
JP2001002241A (ja) 2001-01-09
JP4330703B2 (ja) 2009-09-16
KR100756152B1 (ko) 2007-09-05
KR20010007402A (ko) 2001-01-26
US6634845B1 (en) 2003-10-21

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