ITTO20000876A0 - Composizione di fotoresist contenente un fotogeneratore di base con un fotogeneratore di acido. - Google Patents
Composizione di fotoresist contenente un fotogeneratore di base con un fotogeneratore di acido.Info
- Publication number
- ITTO20000876A0 ITTO20000876A0 IT2000TO000876A ITTO20000876A ITTO20000876A0 IT TO20000876 A0 ITTO20000876 A0 IT TO20000876A0 IT 2000TO000876 A IT2000TO000876 A IT 2000TO000876A IT TO20000876 A ITTO20000876 A IT TO20000876A IT TO20000876 A0 ITTO20000876 A0 IT TO20000876A0
- Authority
- IT
- Italy
- Prior art keywords
- photogerator
- acid
- composition
- base
- photoresist containing
- Prior art date
Links
- 239000002253 acid Substances 0.000 title 1
- 229920002120 photoresistant polymer Polymers 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02118—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/312—Organic layers, e.g. photoresist
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/115—Cationic or anionic
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/12—Nitrogen compound containing
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-1999-0040534A KR100481601B1 (ko) | 1999-09-21 | 1999-09-21 | 광산 발생제와 함께 광염기 발생제를 포함하는 포토레지스트 조성물 |
Publications (3)
Publication Number | Publication Date |
---|---|
ITTO20000876A0 true ITTO20000876A0 (it) | 2000-09-19 |
ITTO20000876A1 ITTO20000876A1 (it) | 2002-03-19 |
IT1320256B1 IT1320256B1 (it) | 2003-11-26 |
Family
ID=19612358
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT2000TO000876A IT1320256B1 (it) | 1999-09-21 | 2000-09-19 | Composizione di fotoresist contenente un fotogeneratore di base con un fotogeneratore di acido. |
Country Status (10)
Country | Link |
---|---|
US (1) | US6395451B1 (it) |
JP (1) | JP3875474B2 (it) |
KR (1) | KR100481601B1 (it) |
CN (1) | CN1258119C (it) |
DE (1) | DE10046891A1 (it) |
FR (1) | FR2798747B1 (it) |
GB (1) | GB2354596B (it) |
IT (1) | IT1320256B1 (it) |
NL (1) | NL1016224C2 (it) |
TW (1) | TWI262358B (it) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100583095B1 (ko) | 2000-06-30 | 2006-05-24 | 주식회사 하이닉스반도체 | 광산 발생제와 함께 광 라디칼 발생제(prg)를 포함하는포토레지스트 조성물 |
US6548226B2 (en) * | 2001-02-09 | 2003-04-15 | United Microelectronics Corp. | Photolithographic process |
DE10120676B4 (de) * | 2001-04-27 | 2005-06-16 | Infineon Technologies Ag | Verfahren zur Strukturierung einer Photolackschicht |
DE10120674B4 (de) | 2001-04-27 | 2005-06-16 | Infineon Technologies Ag | Verfahren zur Strukturierung einer Photolackschicht |
DE10120673B4 (de) * | 2001-04-27 | 2007-01-25 | Infineon Technologies Ag | Verfahren zur Strukturierung einer Photolackschicht |
US6696216B2 (en) * | 2001-06-29 | 2004-02-24 | International Business Machines Corporation | Thiophene-containing photo acid generators for photolithography |
JP3986911B2 (ja) * | 2002-07-15 | 2007-10-03 | 松下電器産業株式会社 | パターン形成材料及びパターン形成方法 |
KR100611394B1 (ko) * | 2003-11-20 | 2006-08-11 | 주식회사 하이닉스반도체 | 유기 반사 방지막 조성물 및 이를 이용한 포토레지스트의패턴 형성 방법 |
KR100570211B1 (ko) * | 2003-12-24 | 2006-04-12 | 주식회사 하이닉스반도체 | 유기 반사방지막용 가교제 중합체, 이를 포함하는 유기반사 방지막 조성물 및 이를 이용한 포토레지스트의 패턴형성 방법 |
KR100784337B1 (ko) | 2004-11-12 | 2007-12-13 | 한국생명공학연구원 | 신규한 o-아실옥심 유도체, 그의 제조방법 및 이를유효성분으로 하는 심장순환계 질환의 예방 및 치료용약학 조성물 |
JP4452632B2 (ja) * | 2005-01-24 | 2010-04-21 | 富士フイルム株式会社 | 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 |
KR101115089B1 (ko) * | 2005-03-02 | 2012-02-29 | 주식회사 동진쎄미켐 | 유기 반사방지막 형성용 유기 중합체 및 이를 포함하는 유기 조성물 |
KR20060109697A (ko) * | 2005-04-18 | 2006-10-23 | 주식회사 하이닉스반도체 | 포토레지스트 중합체, 이를 포함하는 포토레지스트 조성물및 이를 이용한 반도체 소자의 패턴 형성 방법 |
JP2007056221A (ja) * | 2005-08-26 | 2007-03-08 | Jsr Corp | 重合体、感放射線性樹脂組成物および液晶表示素子用スペーサー |
JP4699140B2 (ja) * | 2005-08-29 | 2011-06-08 | 東京応化工業株式会社 | パターン形成方法 |
EP2049950A2 (en) | 2006-08-02 | 2009-04-22 | Nxp B.V. | Photolithography |
JP5276821B2 (ja) * | 2007-10-01 | 2013-08-28 | 東京応化工業株式会社 | レジスト組成物およびレジストパターン形成方法 |
US8236476B2 (en) * | 2008-01-08 | 2012-08-07 | International Business Machines Corporation | Multiple exposure photolithography methods and photoresist compositions |
JP5175579B2 (ja) * | 2008-02-25 | 2013-04-03 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
JP5276958B2 (ja) * | 2008-11-19 | 2013-08-28 | 東京応化工業株式会社 | レジスト組成物、およびレジストパターン形成方法 |
JP5682311B2 (ja) * | 2008-12-02 | 2015-03-11 | 和光純薬工業株式会社 | 光塩基発生剤 |
JP5573356B2 (ja) * | 2009-05-26 | 2014-08-20 | 信越化学工業株式会社 | レジスト材料及びパターン形成方法 |
US8216767B2 (en) * | 2009-09-08 | 2012-07-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Patterning process and chemical amplified photoresist with a photodegradable base |
US8956806B2 (en) * | 2009-09-18 | 2015-02-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist and patterning process |
US8512939B2 (en) * | 2009-09-25 | 2013-08-20 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist stripping technique |
JP5624742B2 (ja) * | 2009-10-02 | 2014-11-12 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法 |
US9599895B2 (en) * | 2011-04-12 | 2017-03-21 | Empire Technology Development Llc | Lithography using photoresist with photoinitiator and photoinhibitor |
JP5783861B2 (ja) * | 2011-09-15 | 2015-09-24 | 東京応化工業株式会社 | レジストパターン形成方法 |
JP5789460B2 (ja) * | 2011-09-22 | 2015-10-07 | 東京応化工業株式会社 | レジスト組成物及びレジストパターン形成方法 |
KR20130039124A (ko) * | 2011-10-11 | 2013-04-19 | 삼성전자주식회사 | 반도체 소자의 패턴 형성방법 |
JP5764478B2 (ja) * | 2011-11-24 | 2015-08-19 | 東京応化工業株式会社 | レジストパターン形成方法 |
JP6002467B2 (ja) * | 2012-01-11 | 2016-10-05 | 東京応化工業株式会社 | レジストパターン形成方法、レジスト組成物 |
JP5879209B2 (ja) * | 2012-06-21 | 2016-03-08 | 東京応化工業株式会社 | レジスト組成物及びレジストパターン形成方法 |
JP5593357B2 (ja) * | 2012-09-18 | 2014-09-24 | 富士フイルム株式会社 | ポジ型レジスト組成物及びそれを用いたパターン形成方法 |
TWI652281B (zh) * | 2015-02-18 | 2019-03-01 | 日商住友電木股份有限公司 | 含有光產鹼劑的光可成像聚烯烴組成物 |
TWI636326B (zh) * | 2015-05-15 | 2018-09-21 | 南韓商羅門哈斯電子材料韓國公司 | 光鹼產生劑及包括其的光致抗蝕劑組成物 |
KR20180088652A (ko) * | 2015-11-30 | 2018-08-06 | 프로메러스, 엘엘씨 | 광산발생제 및 염기 함유 영구유전체조성물 |
JP2017173741A (ja) * | 2016-03-25 | 2017-09-28 | アーゼッド・エレクトロニック・マテリアルズ(ルクセンブルグ)ソシエテ・ア・レスポンサビリテ・リミテ | 感光性シロキサン組成物 |
WO2017176282A1 (en) | 2016-04-08 | 2017-10-12 | Intel Corporation | Two-stage bake photoresist with releasable quencher |
US11054742B2 (en) * | 2018-06-15 | 2021-07-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV metallic resist performance enhancement via additives |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH02118650A (ja) * | 1988-10-28 | 1990-05-02 | Matsushita Electric Ind Co Ltd | パターン形成材料 |
JP2687567B2 (ja) * | 1989-04-11 | 1997-12-08 | ソニー株式会社 | ポジ型レジスト及びレジストパターン形成方法 |
JP2687578B2 (ja) * | 1989-05-11 | 1997-12-08 | ソニー株式会社 | 高感度レジスト及びレジストパターンの形成方法 |
US5650261A (en) * | 1989-10-27 | 1997-07-22 | Rohm And Haas Company | Positive acting photoresist comprising a photoacid, a photobase and a film forming acid-hardening resin system |
JPH04362642A (ja) * | 1991-06-10 | 1992-12-15 | Konica Corp | 感光性組成物 |
US5206117A (en) * | 1991-08-14 | 1993-04-27 | Labadie Jeffrey W | Photosensitive polyamic alkyl ester composition and process for its use |
JP3317576B2 (ja) * | 1994-05-12 | 2002-08-26 | 富士写真フイルム株式会社 | ポジ型感光性樹脂組成物 |
EP0718317B1 (en) * | 1994-12-20 | 2000-02-23 | Olin Microelectronic Chemicals, Inc. | Photoresist compositions |
US6071667A (en) * | 1995-04-13 | 2000-06-06 | Hitachi Chemical Co., Ltd. | Photosensitive resin composition containing a photosensitive polyamide resin |
US5942367A (en) * | 1996-04-24 | 1999-08-24 | Shin-Etsu Chemical Co., Ltd. | Chemically amplified positive resist composition, pattern forming method, and method for preparing polymer having a crosslinking group |
JP3705657B2 (ja) * | 1996-09-05 | 2005-10-12 | 信越化学工業株式会社 | N,n−ジアルキルカルバミン酸2−ニトロベンジルエステル類の製造方法 |
JP3514590B2 (ja) * | 1996-09-06 | 2004-03-31 | 信越化学工業株式会社 | 化学増幅ポジ型レジスト材料 |
US6106999A (en) * | 1997-08-12 | 2000-08-22 | Mitsui Chemicals | Photosensitizer, visible light curable resin composition using the same, and use of the composition |
JPH11295895A (ja) * | 1998-04-15 | 1999-10-29 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
KR100593662B1 (ko) * | 1998-04-21 | 2006-10-11 | 삼성전자주식회사 | 개시제를 포함하는 반도체장치 제조용 포토레지스트 및 이를 이용한 포토리소그래피공정 |
EP0952489B1 (en) * | 1998-04-22 | 2014-08-13 | FUJIFILM Corporation | Positive photosensitive resin composition |
JP4023003B2 (ja) * | 1998-04-23 | 2007-12-19 | 住友化学株式会社 | 化学増幅型ポジ型フォトレジスト組成物 |
-
1999
- 1999-09-21 KR KR10-1999-0040534A patent/KR100481601B1/ko not_active IP Right Cessation
-
2000
- 2000-09-08 TW TW089118564A patent/TWI262358B/zh active
- 2000-09-13 GB GB0022375A patent/GB2354596B/en not_active Expired - Fee Related
- 2000-09-19 IT IT2000TO000876A patent/IT1320256B1/it active
- 2000-09-19 CN CNB001248502A patent/CN1258119C/zh not_active Expired - Fee Related
- 2000-09-20 FR FR0011972A patent/FR2798747B1/fr not_active Expired - Fee Related
- 2000-09-20 NL NL1016224A patent/NL1016224C2/nl not_active IP Right Cessation
- 2000-09-21 DE DE10046891A patent/DE10046891A1/de not_active Withdrawn
- 2000-09-21 JP JP2000287440A patent/JP3875474B2/ja not_active Expired - Fee Related
- 2000-09-21 US US09/666,932 patent/US6395451B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3875474B2 (ja) | 2007-01-31 |
GB2354596A (en) | 2001-03-28 |
NL1016224A1 (nl) | 2001-03-22 |
GB2354596B (en) | 2003-06-18 |
JP2001133980A (ja) | 2001-05-18 |
FR2798747B1 (fr) | 2004-01-16 |
CN1258119C (zh) | 2006-05-31 |
US6395451B1 (en) | 2002-05-28 |
GB0022375D0 (en) | 2000-10-25 |
IT1320256B1 (it) | 2003-11-26 |
CN1289069A (zh) | 2001-03-28 |
FR2798747A1 (fr) | 2001-03-23 |
TWI262358B (en) | 2006-09-21 |
NL1016224C2 (nl) | 2001-05-30 |
ITTO20000876A1 (it) | 2002-03-19 |
KR100481601B1 (ko) | 2005-04-08 |
DE10046891A1 (de) | 2001-05-10 |
KR20010028348A (ko) | 2001-04-06 |
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