ITMI920457A1 - Dispositivo di memoria integrato a semiconduttori utilizzante un circuito di prova - Google Patents

Dispositivo di memoria integrato a semiconduttori utilizzante un circuito di prova

Info

Publication number
ITMI920457A1
ITMI920457A1 IT000457A ITMI920457A ITMI920457A1 IT MI920457 A1 ITMI920457 A1 IT MI920457A1 IT 000457 A IT000457 A IT 000457A IT MI920457 A ITMI920457 A IT MI920457A IT MI920457 A1 ITMI920457 A1 IT MI920457A1
Authority
IT
Italy
Prior art keywords
memory device
semiconductor integrated
test circuit
integrated memory
test
Prior art date
Application number
IT000457A
Other languages
English (en)
Inventor
Takashi Nakashima
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of ITMI920457A0 publication Critical patent/ITMI920457A0/it
Publication of ITMI920457A1 publication Critical patent/ITMI920457A1/it
Application granted granted Critical
Publication of IT1254651B publication Critical patent/IT1254651B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/38—Response verification devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Power Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Read Only Memory (AREA)
  • Non-Volatile Memory (AREA)
ITMI920457A 1991-10-14 1992-02-28 Dispositivo di memoria integrato a semiconduttori utilizzante un circuito di prova IT1254651B (it)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910018043A KR940006676B1 (ko) 1991-10-14 1991-10-14 시험회로를 내장한 기억용 반도체 집적회로

Publications (3)

Publication Number Publication Date
ITMI920457A0 ITMI920457A0 (it) 1992-02-28
ITMI920457A1 true ITMI920457A1 (it) 1993-08-28
IT1254651B IT1254651B (it) 1995-09-28

Family

ID=19321217

Family Applications (1)

Application Number Title Priority Date Filing Date
ITMI920457A IT1254651B (it) 1991-10-14 1992-02-28 Dispositivo di memoria integrato a semiconduttori utilizzante un circuito di prova

Country Status (7)

Country Link
US (1) US5351213A (it)
JP (1) JP2526344B2 (it)
KR (1) KR940006676B1 (it)
DE (1) DE4206344C2 (it)
FR (1) FR2682521B1 (it)
GB (1) GB2260618B (it)
IT (1) IT1254651B (it)

Families Citing this family (30)

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US6208195B1 (en) 1991-03-18 2001-03-27 Integrated Device Technology, Inc. Fast transmission gate switch
JPH06506333A (ja) 1991-03-18 1994-07-14 クウォリティ・セミコンダクタ・インコーポレイテッド 高速トランスミッションゲートスイッチ
TW260788B (it) * 1993-09-01 1995-10-21 Philips Electronics Nv
AU693474B2 (en) * 1993-09-16 1998-07-02 Quality Semiconductor, Inc. Scan test circuit using fast transmission gate switch
US5535164A (en) * 1995-03-03 1996-07-09 International Business Machines Corporation BIST tester for multiple memories
US6388314B1 (en) 1995-08-17 2002-05-14 Micron Technology, Inc. Single deposition layer metal dynamic random access memory
KR100197554B1 (ko) * 1995-09-30 1999-06-15 윤종용 반도체 메모리장치의 고속테스트 방법
US5925142A (en) * 1995-10-06 1999-07-20 Micron Technology, Inc. Self-test RAM using external synchronous clock
US5721863A (en) * 1996-01-29 1998-02-24 International Business Machines Corporation Method and structure for accessing semi-associative cache memory using multiple memories to store different components of the address
US5703818A (en) * 1996-08-26 1997-12-30 Mitsubishi Denki Kabushiki Kaisha Test circuit
US5740180A (en) * 1997-02-18 1998-04-14 Motorola, Inc. Circuit and test method for testing input cells
DE19711097C2 (de) * 1997-03-17 2000-04-06 Siemens Ag Integrierte Schaltung mit einem Speicher und einer Prüfschaltung
US5903491A (en) 1997-06-09 1999-05-11 Micron Technology, Inc. Single deposition layer metal dynamic random access memory
US5848010A (en) * 1997-07-14 1998-12-08 Micron Technology, Inc. Circuit and method for antifuse stress test
JP3235523B2 (ja) * 1997-08-06 2001-12-04 日本電気株式会社 半導体集積回路
US6154864A (en) * 1998-05-19 2000-11-28 Micron Technology, Inc. Read only memory embedded in a dynamic random access memory
KR100333536B1 (ko) * 1998-05-29 2002-08-27 주식회사 하이닉스반도체 센스앰프를이용하여테스트를수행하는메모리소자
US6603693B2 (en) 2001-12-12 2003-08-05 Micron Technology, Inc. DRAM with bias sensing
US6747889B2 (en) * 2001-12-12 2004-06-08 Micron Technology, Inc. Half density ROM embedded DRAM
US6545899B1 (en) 2001-12-12 2003-04-08 Micron Technology, Inc. ROM embedded DRAM with bias sensing
US20030115538A1 (en) * 2001-12-13 2003-06-19 Micron Technology, Inc. Error correction in ROM embedded DRAM
JP2003288800A (ja) * 2002-03-27 2003-10-10 Nec Electronics Corp 半導体記憶装置のテスト方法、半導体記憶装置及び半導体装置
US20030185062A1 (en) * 2002-03-28 2003-10-02 Micron Technology, Inc. Proximity lookup for large arrays
US6785167B2 (en) * 2002-06-18 2004-08-31 Micron Technology, Inc. ROM embedded DRAM with programming
US6781867B2 (en) * 2002-07-11 2004-08-24 Micron Technology, Inc. Embedded ROM device using substrate leakage
US6865100B2 (en) * 2002-08-12 2005-03-08 Micron Technology, Inc. 6F2 architecture ROM embedded DRAM
DE10245712A1 (de) * 2002-10-01 2004-04-22 Infineon Technologies Ag Speicherschaltung mit einem Testmodus zum Schreiben von Testdaten
US7174477B2 (en) * 2003-02-04 2007-02-06 Micron Technology, Inc. ROM redundancy in ROM embedded DRAM
US6836106B1 (en) * 2003-09-23 2004-12-28 International Business Machines Corporation Apparatus and method for testing semiconductors
US7152192B2 (en) * 2005-01-20 2006-12-19 Hewlett-Packard Development Company, L.P. System and method of testing a plurality of memory blocks of an integrated circuit in parallel

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Publication number Priority date Publication date Assignee Title
GB2002129B (en) * 1977-08-03 1982-01-20 Sperry Rand Corp Apparatus for testing semiconductor memories
US4196389A (en) * 1978-07-13 1980-04-01 International Business Machines Corporation Test site for a charged coupled device (CCD) array
US4253059A (en) * 1979-05-14 1981-02-24 Fairchild Camera & Instrument Corp. EPROM Reliability test circuit
JPS5736844A (en) * 1980-08-15 1982-02-27 Hitachi Ltd Semiconductor device
JPS5893347A (ja) * 1981-11-30 1983-06-03 Toshiba Corp Ｍｏｓ型半導体装置及びその製造方法
US4757503A (en) * 1985-01-18 1988-07-12 The University Of Michigan Self-testing dynamic ram
EP0193210A3 (en) * 1985-02-28 1988-12-14 Nec Corporation Semiconductor memory device with a built-in test circuit
JPS61260668A (ja) * 1985-05-15 1986-11-18 Seiko Epson Corp 半導体装置
JPS62169355A (ja) * 1986-01-21 1987-07-25 Sharp Corp 半導体集積回路素子
JPH01253266A (ja) * 1988-03-31 1989-10-09 Sharp Corp 半導体集積回路
GB2222461B (en) * 1988-08-30 1993-05-19 Mitsubishi Electric Corp On chip testing of semiconductor memory devices
GB2256279B (en) * 1988-08-30 1993-05-12 Mitsubishi Electric Corp Semiconductor memory device
JP2901188B2 (ja) * 1988-12-28 1999-06-07 株式会社東芝 半導体集積回路
JP2518401B2 (ja) * 1989-06-14 1996-07-24 三菱電機株式会社 半導体記憶装置
US5265100A (en) * 1990-07-13 1993-11-23 Sgs-Thomson Microelectronics, Inc. Semiconductor memory with improved test mode
JPH0372770A (ja) * 1990-07-17 1991-03-27 Seiko Epson Corp 読み取り装置

Also Published As

Publication number Publication date
FR2682521A1 (fr) 1993-04-16
GB2260618B (en) 1996-05-22
JPH05274899A (ja) 1993-10-22
ITMI920457A0 (it) 1992-02-28
JP2526344B2 (ja) 1996-08-21
KR940006676B1 (ko) 1994-07-25
IT1254651B (it) 1995-09-28
US5351213A (en) 1994-09-27
GB9204291D0 (en) 1992-04-08
DE4206344C2 (de) 1994-04-21
GB2260618A (en) 1993-04-21
FR2682521B1 (fr) 1996-03-15
KR930008868A (ko) 1993-05-22
DE4206344A1 (de) 1993-04-15

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