DE3024015A1
(de)
*
|
1980-06-26 |
1982-01-07 |
Siemens AG, 1000 Berlin und 8000 München |
Steuerbarer halbleiterschalter
|
DD154049A1
(de)
*
|
1980-10-30 |
1982-02-17 |
Siegfried Wagner |
Steuerbares halbleiterbauelement
|
US4969028A
(en)
*
|
1980-12-02 |
1990-11-06 |
General Electric Company |
Gate enhanced rectifier
|
SE8107136L
(sv)
*
|
1980-12-02 |
1982-06-03 |
Gen Electric |
Styrelektrodforsedd likriktaranordning
|
GB2108758B
(en)
*
|
1981-10-26 |
1985-08-21 |
Intersil Inc |
Power field-effect transistor structures
|
US4677452A
(en)
*
|
1981-10-26 |
1987-06-30 |
Intersil, Inc. |
Power field-effect transistor structures
|
US4782379A
(en)
*
|
1981-11-23 |
1988-11-01 |
General Electric Company |
Semiconductor device having rapid removal of majority carriers from an active base region thereof at device turn-off and method of fabricating this device
|
US4571815A
(en)
*
|
1981-11-23 |
1986-02-25 |
General Electric Company |
Method of making vertical channel field controlled device employing a recessed gate structure
|
DE3200660A1
(de)
*
|
1982-01-12 |
1983-07-21 |
Siemens AG, 1000 Berlin und 8000 München |
Mis-feldeffekttransistor mit ladungstraegerinjektion
|
IE55992B1
(en)
*
|
1982-04-05 |
1991-03-13 |
Gen Electric |
Insulated gate rectifier with improved current-carrying capability
|
US4567641A
(en)
*
|
1982-04-12 |
1986-02-04 |
General Electric Company |
Method of fabricating semiconductor devices having a diffused region of reduced length
|
US4574209A
(en)
*
|
1982-06-21 |
1986-03-04 |
Eaton Corporation |
Split gate EFET and circuitry
|
JPS594077A
(ja)
*
|
1982-06-30 |
1984-01-10 |
Toshiba Corp |
電界効果トランジスタ
|
DE3224642A1
(de)
*
|
1982-07-01 |
1984-01-05 |
Siemens AG, 1000 Berlin und 8000 München |
Igfet mit injektorzone
|
DE3224618A1
(de)
*
|
1982-07-01 |
1984-01-05 |
Siemens AG, 1000 Berlin und 8000 München |
Igfet mit ladungstraegerinjektion
|
US4553151A
(en)
*
|
1982-09-23 |
1985-11-12 |
Eaton Corporation |
Bidirectional power FET with field shaping
|
US4577208A
(en)
*
|
1982-09-23 |
1986-03-18 |
Eaton Corporation |
Bidirectional power FET with integral avalanche protection
|
US4541001A
(en)
*
|
1982-09-23 |
1985-09-10 |
Eaton Corporation |
Bidirectional power FET with substrate-referenced shield
|
US4542396A
(en)
*
|
1982-09-23 |
1985-09-17 |
Eaton Corporation |
Trapped charge bidirectional power FET
|
US4743952A
(en)
*
|
1983-04-04 |
1988-05-10 |
General Electric Company |
Insulated-gate semiconductor device with low on-resistance
|
US4809047A
(en)
*
|
1983-09-06 |
1989-02-28 |
General Electric Company |
Insulated-gate semiconductor device with improved base-to-source electrode short and method of fabricating said short
|
US4551643A
(en)
*
|
1983-10-24 |
1985-11-05 |
Rca Corporation |
Power switching circuitry
|
JPS6115370A
(ja)
*
|
1984-06-30 |
1986-01-23 |
Toshiba Corp |
半導体装置
|
US5212396A
(en)
*
|
1983-11-30 |
1993-05-18 |
Kabushiki Kaisha Toshiba |
Conductivity modulated field effect transistor with optimized anode emitter and anode base impurity concentrations
|
GB2150753B
(en)
*
|
1983-11-30 |
1987-04-01 |
Toshiba Kk |
Semiconductor device
|
JPH0680831B2
(ja)
*
|
1983-11-30 |
1994-10-12 |
株式会社東芝 |
半導体装置
|
US4618872A
(en)
*
|
1983-12-05 |
1986-10-21 |
General Electric Company |
Integrated power switching semiconductor devices including IGT and MOSFET structures
|
US4644637A
(en)
*
|
1983-12-30 |
1987-02-24 |
General Electric Company |
Method of making an insulated-gate semiconductor device with improved shorting region
|
US4837606A
(en)
*
|
1984-02-22 |
1989-06-06 |
General Electric Company |
Vertical MOSFET with reduced bipolar effects
|
US4587713A
(en)
*
|
1984-02-22 |
1986-05-13 |
Rca Corporation |
Method for making vertical MOSFET with reduced bipolar effects
|
JPS60196974A
(ja)
*
|
1984-03-19 |
1985-10-05 |
Toshiba Corp |
導電変調型mosfet
|
JPH0618255B2
(ja)
*
|
1984-04-04 |
1994-03-09 |
株式会社東芝 |
半導体装置
|
DE3546745C2
(de)
*
|
1984-05-30 |
1994-06-30 |
Toshiba Kawasaki Kk |
Lateraler MOS-Feldeffekttransistor mit Leitfähigkeitsmodulation
|
US4672407A
(en)
*
|
1984-05-30 |
1987-06-09 |
Kabushiki Kaisha Toshiba |
Conductivity modulated MOSFET
|
US5286984A
(en)
*
|
1984-05-30 |
1994-02-15 |
Kabushiki Kaisha Toshiba |
Conductivity modulated MOSFET
|
JPS60260152A
(ja)
*
|
1984-06-07 |
1985-12-23 |
Nec Corp |
半導体装置
|
JPS6134753U
(ja)
*
|
1984-07-31 |
1986-03-03 |
株式会社明電舎 |
半導体装置
|
US4620211A
(en)
*
|
1984-08-13 |
1986-10-28 |
General Electric Company |
Method of reducing the current gain of an inherent bipolar transistor in an insulated-gate semiconductor device and resulting devices
|
US4641194A
(en)
*
|
1984-08-27 |
1987-02-03 |
Rca Corporation |
Kinescope driver in a digital video signal processing system
|
US4631564A
(en)
*
|
1984-10-23 |
1986-12-23 |
Rca Corporation |
Gate shield structure for power MOS device
|
US4593458A
(en)
*
|
1984-11-02 |
1986-06-10 |
General Electric Company |
Fabrication of integrated circuit with complementary, dielectrically-isolated, high voltage semiconductor devices
|
US4694313A
(en)
*
|
1985-02-19 |
1987-09-15 |
Harris Corporation |
Conductivity modulated semiconductor structure
|
JPS61191071A
(ja)
*
|
1985-02-20 |
1986-08-25 |
Toshiba Corp |
伝導度変調型半導体装置及びその製造方法
|
US4639754A
(en)
*
|
1985-02-25 |
1987-01-27 |
Rca Corporation |
Vertical MOSFET with diminished bipolar effects
|
EP0199293B2
(en)
*
|
1985-04-24 |
1995-08-30 |
General Electric Company |
Insulated gate semiconductor device
|
JPS62109366A
(ja)
*
|
1985-11-07 |
1987-05-20 |
Fuji Electric Co Ltd |
Mos電界効果トランジスタ
|
US4963951A
(en)
*
|
1985-11-29 |
1990-10-16 |
General Electric Company |
Lateral insulated gate bipolar transistors with improved latch-up immunity
|
US4779123A
(en)
*
|
1985-12-13 |
1988-10-18 |
Siliconix Incorporated |
Insulated gate transistor array
|
EP0229362B1
(en)
*
|
1986-01-10 |
1993-03-17 |
General Electric Company |
Semiconductor device and method of fabrication
|
US5262336A
(en)
*
|
1986-03-21 |
1993-11-16 |
Advanced Power Technology, Inc. |
IGBT process to produce platinum lifetime control
|
JPS62232167A
(ja)
*
|
1986-04-02 |
1987-10-12 |
Nissan Motor Co Ltd |
半導体装置
|
JPH07123166B2
(ja)
*
|
1986-11-17 |
1995-12-25 |
日産自動車株式会社 |
電導度変調形mosfet
|
JPS63141375A
(ja)
*
|
1986-12-03 |
1988-06-13 |
Fuji Electric Co Ltd |
絶縁ゲ−ト電界効果トランジスタ
|
US5338693A
(en)
*
|
1987-01-08 |
1994-08-16 |
International Rectifier Corporation |
Process for manufacture of radiation resistant power MOSFET and radiation resistant power MOSFET
|
US5237186A
(en)
*
|
1987-02-26 |
1993-08-17 |
Kabushiki Kaisha Toshiba |
Conductivity-modulation metal oxide field effect transistor with single gate structure
|
US5105243A
(en)
*
|
1987-02-26 |
1992-04-14 |
Kabushiki Kaisha Toshiba |
Conductivity-modulation metal oxide field effect transistor with single gate structure
|
JP2579979B2
(ja)
*
|
1987-02-26 |
1997-02-12 |
株式会社東芝 |
半導体素子の製造方法
|
US5144401A
(en)
*
|
1987-02-26 |
1992-09-01 |
Kabushiki Kaisha Toshiba |
Turn-on/off driving technique for insulated gate thyristor
|
JPH0821713B2
(ja)
*
|
1987-02-26 |
1996-03-04 |
株式会社東芝 |
導電変調型mosfet
|
US4847671A
(en)
*
|
1987-05-19 |
1989-07-11 |
General Electric Company |
Monolithically integrated insulated gate semiconductor device
|
US4888627A
(en)
*
|
1987-05-19 |
1989-12-19 |
General Electric Company |
Monolithically integrated lateral insulated gate semiconductor device
|
US4857983A
(en)
*
|
1987-05-19 |
1989-08-15 |
General Electric Company |
Monolithically integrated semiconductor device having bidirectional conducting capability and method of fabrication
|
US4866495A
(en)
*
|
1987-05-27 |
1989-09-12 |
International Rectifier Corporation |
High power MOSFET and integrated control circuit therefor for high-side switch application
|
US5023678A
(en)
*
|
1987-05-27 |
1991-06-11 |
International Rectifier Corporation |
High power MOSFET and integrated control circuit therefor for high-side switch application
|
JP2786196B2
(ja)
*
|
1987-07-21 |
1998-08-13 |
株式会社デンソー |
絶縁ゲート型半導体装置
|
JPH0766968B2
(ja)
*
|
1987-08-24 |
1995-07-19 |
株式会社日立製作所 |
半導体装置及びその製造方法
|
JP2594296B2
(ja)
*
|
1987-11-30 |
1997-03-26 |
富士電機株式会社 |
絶縁ゲート電界効果トランジスタ
|
IT1218200B
(it)
*
|
1988-03-29 |
1990-04-12 |
Sgs Thomson Microelectronics |
Procedimento di fabbricazione di un dispositivo semiconduttore mos di poterza a modulazione di conducibilita' (himos) e dispositivi con esso ottenuti
|
US4904609A
(en)
*
|
1988-05-06 |
1990-02-27 |
General Electric Company |
Method of making symmetrical blocking high voltage breakdown semiconductor device
|
US4910563A
(en)
*
|
1988-08-15 |
1990-03-20 |
General Electric Company |
Complementary circuit and structure with common substrate
|
US4898835A
(en)
*
|
1988-10-12 |
1990-02-06 |
Sgs-Thomson Microelectronics, Inc. |
Single mask totally self-aligned power MOSFET cell fabrication process
|
JPH0691263B2
(ja)
*
|
1988-10-19 |
1994-11-14 |
株式会社東芝 |
半導体装置の製造方法
|
JPH02163974A
(ja)
*
|
1988-12-16 |
1990-06-25 |
Mitsubishi Electric Corp |
絶縁ゲート型バイポーラトランジスタおよびその製造方法
|
US5313083A
(en)
*
|
1988-12-16 |
1994-05-17 |
Raytheon Company |
R.F. switching circuits
|
JP2701496B2
(ja)
*
|
1989-01-30 |
1998-01-21 |
富士電機株式会社 |
pチャネル型絶縁ゲートバイポーラトランジスタ
|
US5198688A
(en)
*
|
1989-03-06 |
1993-03-30 |
Fuji Electric Co., Ltd. |
Semiconductor device provided with a conductivity modulation MISFET
|
US5095343A
(en)
*
|
1989-06-14 |
1992-03-10 |
Harris Corporation |
Power MOSFET
|
TW399774U
(en)
*
|
1989-07-03 |
2000-07-21 |
Gen Electric |
FET, IGBT and MCT structures to enhance operating characteristics
|
US5237183A
(en)
*
|
1989-12-14 |
1993-08-17 |
Motorola, Inc. |
High reverse voltage IGT
|
US5766966A
(en)
*
|
1996-02-09 |
1998-06-16 |
International Rectifier Corporation |
Power transistor device having ultra deep increased concentration region
|
IT1247293B
(it)
*
|
1990-05-09 |
1994-12-12 |
Int Rectifier Corp |
Dispositivo transistore di potenza presentante una regione ultra-profonda, a maggior concentrazione
|
US5250450A
(en)
*
|
1991-04-08 |
1993-10-05 |
Micron Technology, Inc. |
Insulated-gate vertical field-effect transistor with high current drive and minimum overlap capacitance
|
US5122848A
(en)
*
|
1991-04-08 |
1992-06-16 |
Micron Technology, Inc. |
Insulated-gate vertical field-effect transistor with high current drive and minimum overlap capacitance
|
US6603173B1
(en)
|
1991-07-26 |
2003-08-05 |
Denso Corporation |
Vertical type MOSFET
|
US6015737A
(en)
*
|
1991-07-26 |
2000-01-18 |
Denso Corporation |
Production method of a vertical type MOSFET
|
WO1993003502A1
(en)
*
|
1991-07-26 |
1993-02-18 |
Nippondenso Co., Ltd. |
Method of producing vertical mosfet
|
EP1209751A3
(en)
*
|
1991-08-08 |
2002-07-31 |
Kabushiki Kaisha Toshiba |
Self turn-off insulated-gate power semiconductor device with injection-enhanced transistor structure
|
JP3417013B2
(ja)
*
|
1993-10-18 |
2003-06-16 |
株式会社デンソー |
絶縁ゲート型バイポーラトランジスタ
|
JP3275536B2
(ja)
*
|
1994-05-31 |
2002-04-15 |
三菱電機株式会社 |
半導体装置及びその製造方法
|
JP3399119B2
(ja)
|
1994-11-10 |
2003-04-21 |
富士電機株式会社 |
半導体装置およびその製造方法
|
US5665988A
(en)
*
|
1995-02-09 |
1997-09-09 |
Fuji Electric Co., Ltd. |
Conductivity-modulation semiconductor
|
JP3228093B2
(ja)
*
|
1995-06-28 |
2001-11-12 |
富士電機株式会社 |
高耐圧ic
|
US5929523A
(en)
*
|
1996-03-07 |
1999-07-27 |
3C Semiconductor Corporation |
Os rectifying Schottky and ohmic junction and W/WC/TiC ohmic contacts on SiC
|
US6388272B1
(en)
|
1996-03-07 |
2002-05-14 |
Caldus Semiconductor, Inc. |
W/WC/TAC ohmic and rectifying contacts on SiC
|
US5831318A
(en)
*
|
1996-07-25 |
1998-11-03 |
International Rectifier Corporation |
Radhard mosfet with thick gate oxide and deep channel region
|
JP3696352B2
(ja)
*
|
1996-12-17 |
2005-09-14 |
三菱電機株式会社 |
ライフタイム評価用teg
|
DE19707513A1
(de)
*
|
1997-02-25 |
1998-09-24 |
Siemens Ag |
Durch Feldeffekt steuerbares Halbleiterbauelement
|
US6351009B1
(en)
*
|
1999-03-01 |
2002-02-26 |
Fairchild Semiconductor Corporation |
MOS-gated device having a buried gate and process for forming same
|
DE10023115A1
(de)
|
2000-05-11 |
2001-11-29 |
Infineon Technologies Ag |
Halbleiter-Leistungsbauelement mit reduziertem parasitärem Bipolartransistor
|
DE10117483A1
(de)
|
2001-04-07 |
2002-10-17 |
Bosch Gmbh Robert |
Halbleiterleistungsbauelement und entsprechendes Herstellungsverfahren
|
DE10117801B4
(de)
*
|
2001-04-10 |
2005-12-22 |
Robert Bosch Gmbh |
Halbleiterleistungsbauelement und entsprechendes Herstellungsverfahren
|
DE10149777A1
(de)
|
2001-10-09 |
2003-04-24 |
Bosch Gmbh Robert |
Halbleiter-Schaltungsanordnung, insbesondere für Zündungsverwendungen, und Verwendung
|
DE102006003932B4
(de)
*
|
2006-01-26 |
2010-09-16 |
Infineon Technologies Austria Ag |
Feldeffekthalbleiterbauelement mit einem Minoritätsladungsträger emittierenden Sourcegebiet in eine Bodyzone
|
DE102006047244B4
(de)
*
|
2006-10-04 |
2018-01-18 |
Infineon Technologies Austria Ag |
Halbleiterbauelement mit einem monokristallinen Halbleiterkörper und Verfahren zur Herstellung desselben
|
US7951676B2
(en)
|
2008-08-29 |
2011-05-31 |
Infineon Technologies Ag |
Semiconductor device and method for the production of a semiconductor device
|
CN103221694B
(zh)
|
2010-04-09 |
2015-07-29 |
希普斯通公司 |
用于能量存储和回收的系统和方法
|
US9611868B2
(en)
|
2010-04-09 |
2017-04-04 |
Shipstone Corporation |
System and method for energy storage and retrieval
|
EP3823008A1
(en)
|
2019-11-12 |
2021-05-19 |
Paul Scherrer Institut |
Methods of manufacturing semiconductor devices
|