IT1218200B - Procedimento di fabbricazione di un dispositivo semiconduttore mos di poterza a modulazione di conducibilita' (himos) e dispositivi con esso ottenuti - Google Patents
Procedimento di fabbricazione di un dispositivo semiconduttore mos di poterza a modulazione di conducibilita' (himos) e dispositivi con esso ottenutiInfo
- Publication number
- IT1218200B IT1218200B IT20005/88A IT2000588A IT1218200B IT 1218200 B IT1218200 B IT 1218200B IT 20005/88 A IT20005/88 A IT 20005/88A IT 2000588 A IT2000588 A IT 2000588A IT 1218200 B IT1218200 B IT 1218200B
- Authority
- IT
- Italy
- Prior art keywords
- himos
- mos
- power device
- manufacturing procedure
- conductivity modulation
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/01—Manufacture or treatment
- H10D12/031—Manufacture or treatment of IGBTs
- H10D12/032—Manufacture or treatment of IGBTs of vertical IGBTs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
- H10D12/411—Insulated-gate bipolar transistors [IGBT]
- H10D12/441—Vertical IGBTs
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/126—Power FETs
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT20005/88A IT1218200B (it) | 1988-03-29 | 1988-03-29 | Procedimento di fabbricazione di un dispositivo semiconduttore mos di poterza a modulazione di conducibilita' (himos) e dispositivi con esso ottenuti |
| EP89200717A EP0335445B1 (en) | 1988-03-29 | 1989-03-21 | Method of manufacturing a conductivity modulation MOS semiconductor power device (Himos) |
| DE89200717T DE68910360T2 (de) | 1988-03-29 | 1989-03-21 | Methode zur Herstellung eines MOS-Halbleiter-Leistungsbauelementes (HIMOS) mit Leitfähigkeitsmodulation. |
| JP1074109A JP3012246B2 (ja) | 1988-03-29 | 1989-03-28 | 導電率変調mos半導体パワーデバイスの製造方法及びこの方法により得られるデバイス |
| US07/330,182 US5073511A (en) | 1988-03-29 | 1989-03-29 | Method for manufacturing a conductivity modulation mos semiconductor power device (himos) |
| KR1019890003978A KR890015353A (ko) | 1988-03-29 | 1989-03-29 | 도전율 변조 mos 반도체 전력 디바이스(himos) 및 그 제조방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT20005/88A IT1218200B (it) | 1988-03-29 | 1988-03-29 | Procedimento di fabbricazione di un dispositivo semiconduttore mos di poterza a modulazione di conducibilita' (himos) e dispositivi con esso ottenuti |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| IT8820005A0 IT8820005A0 (it) | 1988-03-29 |
| IT1218200B true IT1218200B (it) | 1990-04-12 |
Family
ID=11163042
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IT20005/88A IT1218200B (it) | 1988-03-29 | 1988-03-29 | Procedimento di fabbricazione di un dispositivo semiconduttore mos di poterza a modulazione di conducibilita' (himos) e dispositivi con esso ottenuti |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US5073511A (it) |
| EP (1) | EP0335445B1 (it) |
| JP (1) | JP3012246B2 (it) |
| KR (1) | KR890015353A (it) |
| DE (1) | DE68910360T2 (it) |
| IT (1) | IT1218200B (it) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5262336A (en) * | 1986-03-21 | 1993-11-16 | Advanced Power Technology, Inc. | IGBT process to produce platinum lifetime control |
| JPH0691263B2 (ja) * | 1988-10-19 | 1994-11-14 | 株式会社東芝 | 半導体装置の製造方法 |
| IT1241049B (it) * | 1990-03-08 | 1993-12-29 | Cons Ric Microelettronica | Dispositivo a semiconduttore igbt ad elevata tensione di rottura inversa e relativo processo di fabbricazione |
| HK1004077A1 (en) * | 1991-05-07 | 1998-11-13 | Sapir Itzhak | Apparatus for operating a conventional film camera in an electronic mode operation |
| JP2810821B2 (ja) * | 1992-03-30 | 1998-10-15 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
| EP0671770B1 (en) * | 1993-02-09 | 2000-08-02 | GENERAL SEMICONDUCTOR, Inc. | Multilayer epitaxy for a silicon diode |
| US5892787A (en) * | 1994-10-27 | 1999-04-06 | Hewlett-Packard Company | N-drive, p-common light-emitting devices fabricated on an n-type substrate and method of making same |
| EP0725446A1 (en) * | 1995-02-02 | 1996-08-07 | Motorola, Inc. | Insulated gate bipolar semiconductor device and method therefor |
| US5770880A (en) * | 1996-09-03 | 1998-06-23 | Harris Corporation | P-collector H.V. PMOS switch VT adjusted source/drain |
| US5872028A (en) * | 1996-09-05 | 1999-02-16 | Harris Corporation | Method of forming power semiconductor devices with controllable integrated buffer |
| DE19811297B4 (de) | 1997-03-17 | 2009-03-19 | Fuji Electric Co., Ltd., Kawasaki | MOS-Halbleitervorrichtung mit hoher Durchbruchspannung |
| KR20020045241A (ko) * | 2000-12-08 | 2002-06-19 | 윤종용 | 공기조화기의 표시부 전원제어장치 |
| US7755139B2 (en) * | 2003-05-19 | 2010-07-13 | Stmicroelectronics S.R.L. | Power device with high switching speed and manufacturing method thereof |
| JP5721308B2 (ja) * | 2008-03-26 | 2015-05-20 | ローム株式会社 | 半導体装置 |
| WO2021128435A1 (zh) * | 2019-12-28 | 2021-07-01 | 汪克明 | 新半导体电子原理技术与器件 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4364073A (en) * | 1980-03-25 | 1982-12-14 | Rca Corporation | Power MOSFET with an anode region |
| FR2535901A1 (fr) * | 1982-11-10 | 1984-05-11 | Silicium Semiconducteur Ssc | Thyristor asymetrique a forte tenue en tension inverse |
| JPS60260152A (ja) * | 1984-06-07 | 1985-12-23 | Nec Corp | 半導体装置 |
| JPS6134753A (ja) * | 1984-07-25 | 1986-02-19 | Hitachi Ltd | 回転ヘツド型磁気記録再生装置 |
| JPS6134753U (ja) * | 1984-07-31 | 1986-03-03 | 株式会社明電舎 | 半導体装置 |
| US4696701A (en) * | 1986-11-12 | 1987-09-29 | Motorola, Inc. | Epitaxial front seal for a wafer |
-
1988
- 1988-03-29 IT IT20005/88A patent/IT1218200B/it active
-
1989
- 1989-03-21 EP EP89200717A patent/EP0335445B1/en not_active Expired - Lifetime
- 1989-03-21 DE DE89200717T patent/DE68910360T2/de not_active Expired - Fee Related
- 1989-03-28 JP JP1074109A patent/JP3012246B2/ja not_active Expired - Fee Related
- 1989-03-29 US US07/330,182 patent/US5073511A/en not_active Expired - Lifetime
- 1989-03-29 KR KR1019890003978A patent/KR890015353A/ko not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| EP0335445B1 (en) | 1993-11-03 |
| JP3012246B2 (ja) | 2000-02-21 |
| IT8820005A0 (it) | 1988-03-29 |
| DE68910360D1 (de) | 1993-12-09 |
| EP0335445A1 (en) | 1989-10-04 |
| DE68910360T2 (de) | 1994-03-31 |
| KR890015353A (ko) | 1989-10-30 |
| US5073511A (en) | 1991-12-17 |
| JPH0210874A (ja) | 1990-01-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970329 |